Heat flow sensor array device

Abstract

The utility model provides a heat flow sensor array structure, which comprises a rack, a lifting assembly and a plurality of heat flow sensors, and is characterized in that the lifting assembly is connected with the rack and comprises a lifting plate capable of vertically moving up and down; the plurality of heat flow sensors are connected with the bottom surface of the lifting plate, are positioned at the vertexes of the same polygon, and are used for detecting the heat conductivity coefficient of the vacuum insulated panel or the vacuum glass; wherein the bottom surface of the heat flow sensor is parallel to the bottom surface of the lifting plate; the lifting plate can drive the multiple heat flow sensors to synchronously move downwards so that the heat flow sensors can be attached to a vacuum heat insulation plate or vacuum glass. Therefore, multi-point heat conductivity coefficient detection can be carried out on the vacuum insulated panel or the vacuum glass at the same time.

Description

Technical Field

[0001] The embodiment of the utility model relates to the technical field of thermal conductivity detection devices, and in particular to a thermal flux sensor array device. Background Art

[0002] Heat flow sensor is a basic tool for measuring heat transfer (heat flux density or heat flux) and is the most critical component of heat flow meter. In related technologies, a single heat flow sensor is generally used to detect the thermal conductivity of vacuum insulation panels or vacuum glass. However, the thermal conductivity of vacuum insulation panels or vacuum glass at different positions is different, and single-point testing is likely to lead to inaccurate test results.

[0003] It should be noted that the information disclosed in the above background technology section is only used to enhance the understanding of the background of the utility model, and therefore may include information that does not constitute the prior art known to ordinary technicians in the field. Utility Model Content

[0004] The utility model aims to provide a heat flux sensor array device, which at least to a certain extent overcomes the problem that single-point testing in the related art easily leads to inaccurate detection results.

[0005] Other features and advantages of the present invention will become apparent from the following detailed description, or may be learned in part by the practice of the present disclosure.

[0006] According to one aspect of the utility model, a heat flux sensor array structure is provided, comprising a frame, a lifting assembly and four heat flux sensors, wherein the lifting assembly is connected to the frame and comprises a lifting plate that can move vertically up and down; a plurality of heat flux sensors are connected to the bottom surface of the lifting plate and are located at each vertex of the same polygon, and are used to detect the thermal conductivity of a vacuum insulation panel or vacuum glass; wherein the bottom surface of the heat flux sensor is parallel to the bottom surface of the lifting plate; and the lifting plate can drive a plurality of the heat flux sensors to move downward synchronously, so that the heat flux sensors are fitted with the vacuum insulation panel or vacuum glass.

[0007] According to an embodiment of the utility model, four heat flow sensors are provided, and the four heat flow sensors are located at four vertices of the same rectangle.

[0008] According to one embodiment of the utility model, a connecting component is provided on the top of each of the heat flux sensors, and a plurality of sets of tracks are provided on the lifting plate; one end of each of the connecting components is slidably connected to each set of the tracks, and the other end is connected to the top surface of the heat flux sensor.

[0009] According to an embodiment of the utility model, the connecting assembly includes a telescopic rod and an elastic member, the elastic member is sleeved on the middle part of the telescopic rod, and the two ends of the telescopic rod are respectively connected to the track and the thermal flow sensor.

[0010] According to an embodiment of the utility model, each group of the rails includes a plurality of slide grooves, and the slide grooves are in a straight line shape.

[0011] According to one embodiment of the utility model, the lifting assembly also includes a driving member, the frame includes a fixed plate, the fixed end of the driving member is connected to the middle of the fixed plate, the driving end of the driving member is connected to the middle of the lifting plate, and the driving member is used to drive the lifting plate to move up and down in a vertical direction.

[0012] According to one embodiment of the utility model, the lifting assembly also includes a guide rod, the fixed plate is provided with a through hole for the guide rod to move up and down, the bottom of the guide rod is connected to the lifting plate, and the top of the guide rod passes through the through hole.

[0013] According to an embodiment of the present utility model, the fixed plate and the lifting plate are parallel to each other, and the guide rod is perpendicular to the fixed plate and the lifting plate.

[0014] According to an embodiment of the utility model, a plurality of the guide rods and the through holes are provided, and the guide rods and the through holes correspond to each other one by one, and the plurality of guide rods are provided around the driving member.

[0015] It can be seen from the above technical solution that the advantages and positive effects of the thermal flow sensor array device of the utility model are:

[0016] The heat flow sensor array device provided by the utility model is connected to the bottom surface of the lifting plate by setting four heat flow sensors, and the four heat flow sensors are located at the four vertices of the same quadrilateral. The heat flow sensors are used to detect the thermal conductivity of the vacuum insulation panel or vacuum glass, so that multiple heat flow sensors can be arranged in an array to perform multiple point detections. By setting the bottom surface of the heat flow sensor parallel to the bottom surface of the lifting plate, the lifting plate can drive the four heat flow sensors to move downward synchronously, so that the heat flow sensors are attached to the vacuum insulation panel or vacuum glass, so that the thermal conductivity of the vacuum insulation panel or vacuum glass can be detected at multiple points at the same time.

[0017] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The above and other features and advantages of the present invention will become more apparent by describing in detail example embodiments thereof with reference to the attached drawings.

[0019] Figure 1 A schematic structural diagram of a thermal flow sensor array device in an embodiment of the present disclosure at a first viewing angle is shown.

[0020] Figure 2 A schematic structural diagram of a thermal flow sensor array device in an embodiment of the present disclosure at a second viewing angle is shown.

[0021] Figure 3 A schematic structural diagram of a thermal flux sensor array device in an embodiment of the present disclosure at a third viewing angle is shown.

[0022] Figure 4 A schematic structural diagram of a thermal flow sensor array device in an embodiment of the present disclosure at a fourth viewing angle is shown.

[0023] Figure 5 A schematic diagram of the structure of the connection between the heat flow sensor and the lifting plate in an embodiment of the present disclosure is shown.

[0024] Figure 6 A schematic diagram of the structure of a thermal flow sensor in an embodiment of the present disclosure is shown.

[0025] The reference numerals are described as follows:

[0026] 100, lifting assembly; 110, lifting plate; 111, track; 112, slideway; 120, driving member; 121, base; 122, driving shaft; 130, guide rod;

[0027] 200, thermal flow sensor; 210, connecting assembly; 211, telescopic rod; 212, elastic member; 213, groove;

[0028] 300. Fixed plate. DETAILED DESCRIPTION

[0029] Example embodiments will now be described more fully with reference to the accompanying drawings. However, example embodiments can be implemented in a variety of forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that the present invention will be comprehensive and complete and fully convey the concepts of the example embodiments to those skilled in the art. The same reference numerals in the figures represent the same or similar structures, and thus their detailed description will be omitted.

[0030] refer to Figures 1 to 6 The present embodiment provides a heat flux sensor array device, which includes a frame, a lifting assembly 100 and a plurality of heat flux sensors 200. The lifting assembly 100 is connected to the frame, and the plurality of heat flux sensors 200 are connected to a lifting plate 110 in the lifting assembly 100. The heat flux sensor array device can perform multi-point thermal conductivity detection on a vacuum insulation panel or vacuum glass.

[0031] The frame includes a base (not shown) and a fixing plate 300 . The base can be placed on an operating table or a flat surface. The fixing plate 300 is connected to the base 121 , and the base 121 can fix the fixing plate 300 to prevent the fixing plate 300 from shaking.

[0032] A plurality of heat flow sensors 200 are connected to the bottom surface of the lifting plate 110 and are located at the vertices of the same polygon, and are used to detect the thermal conductivity of the vacuum insulation panel or vacuum glass. In one example, four heat flow sensors 200 may be provided, and the four heat flow sensors 200 are connected to the bottom surface of the lifting plate 110, and the four heat flow sensors 200 are located at the four vertices of the same quadrilateral. For example, the four heat flow sensors 200 may be connected in sequence to form a rectangle, a square, a diamond, and the like. Among them, the center position between the four heat flow sensors 200 may coincide with the center of gravity of the lifting plate 110. It should be noted that the number of heat flow sensors 200 provided is not limited to four, and may also be three, five, six, and the like.

[0033] A connecting assembly 210 is disposed on the top of each heat flow sensor 200 , and a plurality of rails 111 are provided on the lifting plate 110 ; one end of each connecting assembly 210 is slidably connected to each rail 111 , and the other end is connected to the top surface of the heat flow sensor 200 .

[0034] The connecting assembly 210 may include a plurality of telescopic rods 211 and a plurality of elastic members 212, wherein the middle portion of each telescopic rod 211 is provided with an elastic member 212, and the elastic member 212 may be a coil spring. The bottom end of the telescopic rod 211 is fixedly connected to the top surface of the heat flux sensor 200, and the top of the telescopic rod 211 is slidably connected to the lifting plate 110. The bottom surface of the heat flux sensor 200 is parallel to the bottom surface of the lifting plate 110, and the lifting plate 110 can drive the four heat flux sensors 200 to move downward synchronously so that the heat flux sensor 200 fits the vacuum insulation panel or vacuum glass. By arranging a spring on the telescopic rod 211, during the detection process, it is possible to avoid uneven force on the probes of the plurality of heat flux sensors 200, and inconsistent contact areas between the plurality of heat flux sensors 200 and the sample, which affects the error of the heat flux density and leads to inaccurate measurement results.

[0035] Multiple sets of tracks 111 may be provided on the lifting plate 110. In one example, four sets of tracks 111 are provided on the lifting plate 110, and the four sets of tracks 111 are respectively slidably connected with the telescopic rods 211 on the four heat flow sensors 200. Each set of tracks 111 may be composed of three slide grooves 112, and the slide grooves 112 may be in a straight line shape, and the slide grooves 112 in the same set of tracks 111 are arranged parallel to each other. The tops of the four telescopic rods 211 on each heat flow sensor 200 may be respectively slidably connected with the slide grooves 112 in each set of tracks 111, and the heat flow sensor 200 moves synchronously during the movement of the telescopic rods 211 in the slide grooves 112. In this way, the positions of the four heat flow sensors 200 can be adjusted to adapt to the detection of samples of different sizes. At the same time, the cooperation of the four telescopic rods 211 and the three slide grooves 112 can enable the heat flow sensor 200 to slide along the straight line direction of the slide groove 112 to prevent the heat flow sensor 200 from rotating. There are grooves 213 on both sides of the top of the telescopic rod 211 , and the grooves 213 can cooperate with both sides of the slide slot 112 to limit the top of the telescopic rod 211 from leaving the slide slot 112 .

[0036] In addition to the lifting plate 110, the lifting assembly 100 also includes a driving member 120. The driving member 120 includes a base 121 and a driving shaft 122. The base 121 is a fixed end, and the driving shaft 122 is a driving end. The base 121 is fixedly connected to the upper surface of the fixed plate 300, and the base 121 can be set at the center of the fixed plate 300. The driving shaft 122 passes through the center of the fixed plate 300 and is connected to the middle of the lifting plate 110. Through the upward and downward extension of the driving shaft 122, the lifting plate 110 can move up and down in the vertical direction. Among them, the lifting plate 110 and the fixed plate 300 are parallel to each other, and the driving member 120 can be a telescopic cylinder.

[0037] The lifting assembly 100 also includes four guide rods 130, which surround the driving member 120. The bottom of the guide rods 130 is fixedly connected to the lifting plate 110, and the top of the guide rods 130 is movably connected to the fixed plate 300. Among them, the fixed plate 300 is provided with four through holes (not shown) for the guide rods 130 to move up and down. The four guide rods 130 correspond to the four through holes one by one, and the top of the guide rods 130 passes through the through holes. The lifting plate 110 is driven to move up and down by the driving member 120, and the guide rods 130 also move up and down with the lifting plate 110. The guide rods 130 play a guiding role in the up and down movement of the lifting plate 110, and can also limit the rotation of the lifting plate 110 during the up and down movement. Among them, the fixed plate 300 and the lifting plate 110 are parallel to each other, and the guide rods 130 are perpendicular to the fixed plate 300 and the lifting plate 110.

[0038] In this embodiment, the multiple heat flux sensors 200 in the heat flux sensor array device are arranged in an array, which can simultaneously perform multiple point detection on the vacuum insulation panel or vacuum glass, and finally analyze a more accurate thermal conductivity value from the multiple data detected simultaneously.

[0039] In the description of the utility model embodiments, it needs to be understood that the directions or positional relationships indicated by terms such as "up", "down", "left", "right", "front", and "back" are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the utility model embodiments and simplifying the description, rather than indicating or implying that the device or unit referred to must have a specific direction, be constructed and operated in a specific orientation, and therefore, cannot be understood as a limitation on the utility model embodiments.

[0040] The above are only preferred embodiments of the utility model embodiments, and are not intended to limit the utility model embodiments. For those skilled in the art, the utility model embodiments may have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model embodiments shall be included in the protection scope of the utility model embodiments.

Claims

1. A thermal flow sensor array device, characterized in that: include: frame; A lifting assembly connected to the frame, comprising a lifting plate capable of vertically moving up and down; and A plurality of heat flow sensors are connected to the bottom surface of the lifting plate and are located at each vertex of the same polygon, and are used to detect the thermal conductivity of the vacuum insulation panel or the vacuum glass; The bottom surface of the heat flux sensor is parallel to the bottom surface of the lifting plate; the lifting plate can drive the plurality of heat flux sensors to move downward synchronously, so that the heat flux sensors are attached to the vacuum insulation panel or vacuum glass.

2. The thermal flow sensor array device according to claim 1, characterized in that: There are four heat flow sensors, and the four heat flow sensors are located at four vertices of the same rectangle.

3. The thermal flow sensor array device according to claim 1, characterized in that: A connecting assembly is provided on the top of each of the heat flux sensors, and a plurality of tracks are provided on the lifting plate; one end of each of the connecting assemblies is slidably connected to each set of the tracks, and the other end is connected to the top surface of the heat flux sensor.

4. The thermal flow sensor array device according to claim 3, characterized in that: The connecting assembly comprises a telescopic rod and an elastic member, wherein the elastic member is sleeved on the middle part of the telescopic rod, and two ends of the telescopic rod are respectively connected to the track and the heat flow sensor.

5. The thermal flow sensor array device according to claim 4, characterized in that: Each group of the tracks includes a plurality of slide grooves, and the slide grooves are in a straight line shape.

6. The thermal flow sensor array device according to claim 1, characterized in that: The lifting assembly also includes a driving member, the frame includes a fixed plate, the fixed end of the driving member is connected to the middle of the fixed plate, the driving end of the driving member is connected to the middle of the lifting plate, and the driving member is used to drive the lifting plate to move up and down in the vertical direction.

7. The thermal flow sensor array device according to claim 6, characterized in that: The lifting assembly also includes a guide rod. The fixing plate is provided with a through hole for the guide rod to move up and down. The bottom of the guide rod is connected to the lifting plate, and the top of the guide rod passes through the through hole.

8. The thermal flow sensor array device according to claim 7, characterized in that: The fixing plate and the lifting plate are parallel to each other, and the guide rod is perpendicular to the fixing plate and the lifting plate.

9. The thermal flow sensor array device according to claim 7, characterized in that: A plurality of guide rods and through holes are provided, and the guide rods and the through holes correspond to each other one by one, and the plurality of guide rods are provided around the driving member.

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