Radiator connecting device

Abstract

The utility model discloses a radiator connecting device which is used for enabling a radiator to make contact with a processor on a circuit board, the radiator connecting device comprises a supporting assembly, a first guiding assembly, a second guiding assembly and a connecting assembly, and the supporting assembly is used for being connected with the radiator; the first guide assembly is located between the supporting assembly and the circuit board; the second guide assembly is connected between the supporting assembly and the first guide assembly; the connecting assembly is connected with the supporting assembly, the first guiding assembly and the circuit board. According to the radiator connecting device, the problem of repeated installation due to inaccurate alignment of the connecting assemblies is reduced, the alignment efficiency is improved, and radiator installation is more simplified.

Description

Technical Field

[0001] The present application relates to the technical field of radiators, and in particular to a radiator connecting device. Background Art

[0002] The existing heat sink is connected to the circuit board by screw fixing, that is, the screw of the heat sink is fixedly connected with the screw sleeve on the circuit board, and then the heat sink is fitted with the processor (Central Processing Unit, CPU) on the circuit board, and the heat sink dissipates heat from the CPU. However, the screw fixing method requires the screw and the screw sleeve to be installed in alignment, and the alignment efficiency is low. Utility Model Content

[0003] The present application provides a heat sink connection device to solve the technical problem that the existing heat sink is connected to the circuit board by screw fixing, and the screw fixing method requires the screw and the screw sleeve to be installed in alignment, resulting in low alignment efficiency.

[0004] In order to solve the above technical problems, the present application proposes a radiator connecting device for contacting the radiator with the processor on the circuit board. The radiator connecting device includes: a support component for connecting to the radiator; a first guide component located between the support component and the circuit board; a second guide component connected between the support component and the first guide component; and a connecting component connecting the support component, the first guide component and the circuit board.

[0005] The second guide assembly includes a guide portion and a guide groove, and the guide portion slides in the guide groove; the guide portion is arranged on one of the support assembly and the first guide assembly, and the guide groove is arranged on the other of the support assembly and the first guide assembly.

[0006] Among them, the support component is provided with a guide part, and the first guide component is provided with a guide groove; the guide part is provided with a clamping groove, and the first guide component is provided with a clamping part, which is located on the inner side wall of the guide groove, slides in the guide groove, and is clamped with the clamping part and the clamping groove.

[0007] Among them, the radiator connecting device includes a first rotating member and a first elastic member, the first rotating member passes through a guide portion and is rotatably connected to a support assembly, the first elastic member is sleeved on the first rotating member, the first supporting foot of the first elastic member elastically abuts against the support assembly, and the second supporting foot of the first elastic member elastically abuts against the guide portion.

[0008] Among them, the radiator connecting device includes a second rotating member and a second elastic member, the second rotating member passes through the guide part and is rotatably connected to the support assembly, one end of the second elastic member is connected to the guide part, and the other end of the second elastic member is connected to the support assembly, and the setting direction of the second elastic member is the same as the extension direction of the guide part.

[0009] The first guide assembly includes a first guide member and second guide members vertically arranged at both ends of the first guide member, the guide portion or the guide groove is arranged on the first guide member, and the connecting assembly passes through the second guide member.

[0010] Among them, the support assembly includes: a base body for installing the radiator; a support frame connected to the base body, a first guide assembly is located between the support frame and the circuit board, and a guide portion or a guide groove is arranged on the support frame; or a guide portion or a guide groove is arranged on the base body.

[0011] The radiator connection device further comprises a back plate, which is arranged on a side of the circuit board away from the radiator, and the back plate is connected to the circuit board via a connection assembly.

[0012] Among them, a back panel portion is extended from the four corners of the back panel, and the connecting component includes a first connecting member and a second connecting member. The connecting position between the first connecting member and the second connecting member is located at the first guide component, and the second connecting member is sequentially passed through the back panel portion, the circuit board and at least part of the first guide component; the radiator connecting device also includes four locking members, which are sleeved on the back panel portion and the end of the second connecting member, and limit the second connecting member, and the locking member is clamped on the back panel portion.

[0013] A locking portion is provided at one end of the locking piece facing the center of the back plate, and at least two locking grooves are provided on the outer side wall of the back plate. The locking portion can be locked in different locking grooves to adapt to circuit boards of different sizes.

[0014] The beneficial effect of the present application is as follows: Different from the prior art, the present application provides a heat sink connection device. The heat sink connection device is used to contact the heat sink with the processor on the circuit board. The heat sink connection device includes a support assembly and a guide assembly. The support assembly is used to connect to the heat sink. The first guide assembly is located between the support assembly and the circuit board. The second guide assembly is connected between the support assembly and the first guide assembly. The connecting assembly connects the support assembly, the first guide assembly and the circuit board. The second guide assembly has a guiding function, which can enable the support assembly and the first guide assembly to have a pre-positioning function, and then facilitate the connecting assembly to connect the support assembly, the first guide assembly and the circuit board. Therefore, the heat sink connection device not only reduces the problem of repeated installation due to inaccurate alignment of the connection assembly and improves the alignment efficiency, but also simplifies the installation of the heat sink by adding the first guide assembly and the second guide assembly. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative work, among which:

[0016] Figure 1 It is a structural schematic diagram of the first embodiment of the radiator connection device of the present application;

[0017] Figure 2 is an exploded schematic diagram of a second embodiment of the radiator connection device of the present application;

[0018] Figure 3 yes Figure 2 A is a schematic diagram of the structure shown in FIG.

[0019] Figure 4 is an exploded schematic diagram of a third embodiment of the radiator connection device of the present application;

[0020] Figure 5 yes Figure 4 The structural schematic diagram shown in B is shown;

[0021] Figure 6 is a cross-sectional view of a first embodiment of the heat sink connection device of the present application;

[0022] Figure 7 yes Figure 6 The schematic diagram of the structure of C shown;

[0023] Figure 8 It is an exploded schematic diagram of a back plate and a locking member in the heat sink connection device of the present application;

[0024] Fig. 9 yes Figure 8 The structural schematic diagram of D shown;

[0025] Fig.10 yes Figure 8 Schematic diagram of the structure of E shown.

[0026] Figure numbers: 10, radiator connecting device; 11, supporting assembly; 111, seat; 112, supporting frame; 12, first guide assembly; 121, first guide member; 122, second guide member; 13, second guide assembly; 131, guide portion; 132, guide groove; 133, clamping groove; 134, clamping portion; 135, first rotating member; 136, first elastic member; 137, second rotating member; 138, second elastic member; 14, connecting assembly; 141, first connecting member; 142, second connecting member; 143, third elastic member; 15, locking member; 151, locking portion; 152, first connecting groove; 153, second connecting groove; 154, limiting groove; 16, back plate; 161, back plate portion; 1611, locking groove; 20, radiator; 30, circuit board. DETAILED DESCRIPTION

[0027] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0028] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0029] The radiator connection device provided by the utility model is described in detail below in conjunction with the embodiments.

[0030] See also Figures 1 to 3 , Figure 1 It is a structural schematic diagram of the first embodiment of the radiator connection device of the present application; Figure 2 is an exploded schematic diagram of a second embodiment of the radiator connection device of the present application; Figure 3 yes Figure 2 A is a schematic diagram of the structure shown in FIG. The present application provides a heat sink connection device. The heat sink connection device 10 is used to contact the heat sink 20 with the CPU (Central Processing Unit) on the circuit board 30. The heat sink 20 is used to dissipate heat from the CPU on the circuit board 30. The circuit board 30 can be a part of an electronic device (not shown in the figure). The electronic device can be, but is not limited to, a computer, a laptop computer, a tablet, etc.

[0031] The heat sink connection device 10 includes a support assembly 11, a first guide assembly 12 and a second guide assembly 13. The support assembly 11 is used to connect with the heat sink 20, and the support assembly 11 can provide a certain support to the heat sink 20. The first guide assembly 12 is located between the support assembly 11 and the circuit board 30. The second guide assembly 13 is connected between the support assembly 11 and the first guide assembly 12. The second guide assembly 13 can be a guide portion 131 and a guide groove 132, or a plug-in portion (not shown in the figure) and a plug-in groove (not shown in the figure). The connection assembly 14 connects the support assembly 11, the first guide assembly 12 and the circuit board 30, and is used to contact the heat sink 20 with the CPU on the circuit board 30. The connection assembly 14 can be a screw, a stud, etc.

[0032] The second guide assembly 13 has a guiding function, which can make the support assembly 11 and the first guide assembly 12 pre-positioned, and then facilitate the connection assembly 14 to connect the support assembly 11, the first guide assembly 12 and the circuit board 30. Therefore, the heat sink connection device 10 not only reduces the problem of repeated installation due to inaccurate alignment of the connection assembly 14 and improves the alignment efficiency, but also simplifies the installation of the heat sink 20 by adding the first guide assembly 12 and the second guide assembly 13.

[0033] In some embodiments, the second guide assembly 13 includes a guide portion 131 and a guide groove 132. The guide portion 131 slides in the guide groove 132. The guide portion 131 is disposed on one of the support assembly 11 and the first guide assembly 12. The guide groove 132 is disposed on the other of the support assembly 11 and the first guide assembly 12. The guide portion 131 and the guide groove 132 cooperate with each other to achieve a pre-positioning effect. When the support assembly 11 is installed on the first guide assembly 12, the problem of repeated installation due to inaccurate alignment of the connecting assembly 14 can be reduced, the alignment efficiency can be improved, and the installation of the radiator 20 can be simplified.

[0034] In a specific embodiment, the guide portion 131 is disposed on the support assembly 11, the guide slot 132 is disposed on the first guide assembly 12, and the guide portion 131 can slide in the guide slot 132. The guide portion 131 is fixed to or detachable from the support assembly 11.

[0035] In another specific embodiment, the guide portion 131 is disposed on the first guide assembly 12, the guide groove 132 is disposed on the support assembly 11, and the guide portion 131 can slide in the guide groove 132. The guide portion 131 is fixed or detachable to the first guide assembly 12. The specific arrangement positions of the guide portion 131 and the guide groove 132 can be determined according to requirements and are not limited here.

[0036] In some embodiments, the support assembly 11 is provided with a guide portion 131. The first guide assembly 12 is provided with a guide groove 132. During the sliding movement of the guide portion 131 in the guide groove 132, a pre-fixing structure (not shown in the figure) may be provided between the guide portion 131 and the guide groove 132 to achieve pre-fixation between the support assembly 11 and the first guide assembly 12.

[0037] Specifically, the guide portion 131 is provided with a snap-in groove 133. The first guide assembly 12 is provided with a snap-in portion 134. The snap-in portion 134 is located on the inner side wall of the guide groove 132. The pre-fixing structure includes the above-mentioned snap-in groove 133 and the snap-in portion 134. When the guide portion 131 slides in the guide groove 132, that is, when the support assembly 11 and the first guide assembly 12 are pre-positioned, the snap-in portion 134 snaps into the snap-in groove 133, so that the support assembly 11 and the first guide assembly 12 are pre-fixed, thereby improving the installation stability between the support assembly 11 and the first guide assembly 12, and further improving the stability of the heat sink connecting device 10, so that the heat sink 20 fits the CPU on the circuit board 30 more closely.

[0038] In some embodiments, when the guide portion 131 and the guide groove 132 are engaged with each other through the above-mentioned engaging portion 134 and the engaging groove 133, a clamping structure (not shown in the figure) may be provided between the guide portion 131 and the support assembly 11. The clamping structure can press the guide portion 131 into the guide groove 132, and lock the connection between the engaging groove 133 and the engaging portion 134, thereby improving the stability of the heat sink connection device 10, and further improving the stability of the installation of the heat sink 20, and reducing the shaking of the heat sink 20.

[0039] The above-mentioned clamping structure may be, but is not limited to, spring clamping, torsion spring clamping, fixing member clamping, etc. In a specific embodiment, the radiator connection device 10 includes a first rotating member 135 and a first elastic member 136. The clamping structure may include the above-mentioned first rotating member 135 and the first elastic member 136. The first rotating member 135 is penetrated by a guide portion 131. Both ends of the first rotating member 135 are arranged on the support assembly 11 and can be rotatably connected to the support assembly 11. That is, the guide portion 131 rotates relative to the support assembly 11 through the first rotating member 135. The first elastic member 136 is sleeved on the first rotating member 135. The first supporting foot (not shown in the figure) of the first elastic member 136 elastically abuts against the support assembly 11. The second supporting foot (not shown in the figure) of the first elastic member 136 elastically abuts against the guide portion 131. When the guide portion 131 slides in the guide groove 132 and the clamping portion 134 is clamped in the clamping groove 133, the first elastic member 136 can press the guide portion 131 in the guide groove 132, thereby improving the stability of the connection between the clamping portion 134 and the clamping groove 133, thereby improving the stability of the heat sink connection device 10 and reducing the shaking of the heat sink 20; it is also convenient for installation and disassembly. The first rotating member 135 can be, but not limited to, a first rotating shaft. The first elastic member 136 can be, but not limited to, a torsion spring.

[0040] As in another specific embodiment, the heat sink connection device 10 includes a second rotating member 137 and a second elastic member 138. The clamping structure may include the second rotating member 137 and the second elastic member 138. The second rotating member 137 is provided with a guide portion 131. Both ends of the second rotating member 137 are arranged on the support assembly 11, and can be rotatably connected to the support assembly 11. That is, the guide portion 131 rotates relative to the support assembly 11 through the second rotating member 137. One end of the second elastic member 138 is connected to the guide portion 131. The other end of the second elastic member 138 is connected to the support assembly 11. The setting direction of the second elastic member 138 is the same as the extension direction of the guide portion 131. When the guide portion 131 slides in the guide groove 132 and the clamping portion 134 is clamped in the clamping groove 133, the second elastic member 138 can lock the guide portion 131 in the guide groove 132, thereby improving the stability of the connection between the clamping portion 134 and the clamping groove 133, thereby improving the stability of the heat sink connection device 10 and reducing the shaking of the heat sink 20; it is also convenient for installation and disassembly. The second rotating member 137 can be, but not limited to, a second rotating shaft. The second elastic member 138 can be, but not limited to, a spring.

[0041] In some embodiments, the first guide assembly 12 includes a first guide member 121 and a second guide member 122 vertically disposed at both ends of the first guide member 121. A guide portion 131 or a guide groove 132 is disposed on the first guide member 121. When the guide portion 131 is disposed on the support assembly 11, the guide groove 132 is disposed on the first guide member 121. Alternatively, when the guide groove 132 is disposed on the support assembly 11, the guide portion 131 is disposed on the first guide member 121. Whether the first guide member 121 is provided with the guide portion 131 or the guide groove 132 can be determined according to requirements. The connecting assembly 14 is provided with the second guide member 122. The connecting assembly 14 limits the second guide member 122 between the support assembly 11 and the circuit board 30. The first guide member 121 and the second guide member 122 cooperate with each other to support the heat sink 20 and the support assembly 11 so that the heat sink 20 is just in contact with the CPU on the circuit board 30. The first guide member 121 and the second guide member 122 are fixedly connected or integrally connected.

[0042] In some embodiments, the support assembly 11 includes a base 111 and a support frame 112. The base 111 can be used to install the heat sink 20. The base 111 can be a part of the outer shell of the heat sink 20. Alternatively, the base 111 is an independent component, which is detachably connected or fixedly connected to the outer shell of the heat sink 20. The support frame 112 is connected to the base 111. The support frame 112 is used to support the base 111 and the heat sink 20. When the base 111 is a part of the outer shell of the heat sink 20, the support frame 112 is used to install the heat sink 20 on the circuit board 30.

[0043] The first guide assembly 12 is located between the support frame 112 and the circuit board 30. The guide portion 131 or the guide groove 132 can be disposed on the support frame 112. Alternatively, the guide portion 131 or the guide groove 132 can be disposed on the seat body 111. Figure 1 As shown, the guide portion 131 can be disposed on the seat body 111. The guide groove 132 is disposed on the first guide assembly 12. Alternatively, as Figure 2 As shown, the guide portion 131 can be provided on the support frame 112. The guide groove 132 is provided on the first guide assembly 12, etc. Among them, the support frame 112 or the seat body 111 can be provided with the above-mentioned guide portion 131 or the guide groove 132, etc. according to actual needs. Through the above-mentioned seat body 111 and the support frame 112 cooperate with each other, the installation of the heat sink connection device 10 is simplified.

[0044] In some embodiments, the heat sink connection device 10 also includes a back plate 16. The back plate 16 is disposed on the side of the circuit board 30 away from the heat sink 20. The back plate 16 is connected to the circuit board 30 through a connecting component 14. The connecting component 14 connects the back plate 16 to the side of the circuit board 30 away from the heat sink 20, thereby improving the installation strength of the circuit board 30 and further improving the strength of the heat sink connection device 10. Among them, the back plate 16 can be connected to the side of the circuit board 30 away from the heat sink 20 by fixing glue, etc., to improve the installation strength of the circuit board 30. The back plate 16 can be made of a rigid material to provide higher strength and reduce deformation. Among them, the rigid material can be but is not limited to metal materials, etc.

[0045] In some embodiments, the back plate 16 is provided with a back plate portion 161 extending from the four corners. The connection assembly 14 includes a first connection member 141 and a second connection member 142. The first connection member 141 sequentially passes through the support assembly 11 and at least a portion of the first guide assembly 12. The second connection member 142 sequentially passes through the back plate portion 161, the circuit board 30 and at least a portion of the first guide assembly 12. The connection position between the first connection member 141 and the second connection member 142 is located in the first guide assembly 12. The first connection member 141 and the second connection member 142 can be connected in a threaded manner or a clamping manner. In this embodiment, the first connection member 141 is a screw. The second connection member 142 is a screw column. The screw and the screw column are threadedly connected and the threaded connection position is located in the second guide member 122. Thus, the connection between the support assembly 11, the first guide assembly 12, the circuit board 30 and the back plate 16 is achieved through the cooperation of the first connection member 141 and the second connection member 142, so that the heat sink 20 contacts the CPU on the circuit board 30.

[0046] In some embodiments, the heat sink connection device 10 further includes a third elastic member 143. The third elastic member 143 passes through the first connection member 141. The third elastic member 143 is located between the end of the first connection member 141 and the support assembly 11. Through the cooperation between the first connection member 141, the second connection member 142 and the third elastic member 143, the hard collision between the heat sink 20 and the CPU on the circuit board 30 can be reduced, and a certain buffering effect can be played, thereby reducing the risk of CPU damage.

[0047] In some embodiments, the heat sink connection device 10 further includes four locking members 15. The locking members 15 are sleeved on the back plate portion 161 and the end of the second connection member 142, and the locking members 15 limit the second connection member 142. The locking members 15 are clamped on the back plate portion 161. By the above-mentioned locking members 15 cooperating with the back plate portion 161, the second connection member 142 is limited on the back plate portion 161, which can not only install the back plate 16 on the circuit board 30; but also lock the second connection member 142, thereby improving the stability of the installation of the heat sink connection device 10.

[0048] Specifically, a locking portion 151 is provided at one end of the locking member 15 facing the center of the back plate 16. At least two locking grooves 1611 are provided on the outer side wall of the back plate portion 161. The locking portion 151 can be locked in different locking grooves 1611 to adapt to circuit boards 30 of different sizes. When the sizes of the circuit boards 30 are different, by changing the locking position relationship between the locking portion 151 and the locking groove 1611 in the locking member 15, the second connecting member 142 is located at different positions along with the locking member 15, which can meet the requirements of circuit boards 30 of different sizes, and there is no need to replace the back plate 16, etc.

[0049] The number of the locking grooves 1611 can be two, three or four. As in the present embodiment, two locking parts 151 are provided at one end of the locking member 15 facing the center of the back plate 16. The two locking parts 151 are arranged opposite to each other. A locking hook (not shown in the figure) is provided at the end of the locking part 151. Two locking grooves 1611 are provided on both sides of the outer side wall of the back plate 16. The locking hook can be locked in different locking grooves 1611. The locking member 15 can at least meet the requirements of circuit boards 30 of two different sizes.

[0050] In some embodiments, the locking member 15 is penetrated by a first connecting groove 152 and a second connecting groove 153. The first connecting groove 152 is located above the second connecting groove 153. At the same time, the first connecting groove 152 is connected to the second connecting groove 153. The locking member 15 passes through the back plate 161 and the end of the second connecting member 142 through the first connecting groove 152 and the second connecting groove 153 respectively. Among them, the second connecting member 142 passes through the back plate 161. The back plate 161 passes through the first connecting groove 152. The second connecting member 142 passes through the second connecting groove 153. The first connecting groove 152 and the second connecting groove 153 cooperate with each other to improve the stability of the connection of the second connecting member 142.

[0051] And / or, a limiting groove 154 is provided on one side of the locking member 15 facing the circuit board 30. The limiting groove 154 is used to limit the second connecting member 142. The back plate portion 161 is provided through the second connecting member 142, and the second connecting groove 153 in the locking member 15 is sleeved on the end of the second connecting member 142, and the limiting groove 154 limits the movement of the second connecting member 142. Through the above-mentioned limiting groove 154, not only the movement of the second connecting member 142 can be limited, and the stability of the connection of the second connecting member 142 can be improved; but also a certain avoidance effect can be played.

[0052] The installation principle of the heat sink connection device 10 is as follows. A screw column is installed on the back plate 16, and the screw column is passed through the circuit board 30. The back plate 16 is bonded to the side of the circuit board 30 facing the back plate 16 by fixing glue. The first guide component 12 passes through the screw column and is installed on the circuit board 30 by interference fit. Since the guide part 131 and the guide groove 132 have a guiding structure, the heat sink 20 is guided and assembled. The screws on the heat sink 20 are tightened and fixed with the screw columns of the back plate 16 to complete the installation of the above heat sink connection device 10.

[0053] The terms "first", "second", "third" in this application are only used for descriptive purposes and cannot be understood as indicating the quantity of the indicated technical features. Thus, the features defined as "first", "second", "third" can expressly or implicitly include at least one of these features. In the embodiments of the present application, all directional indications (such as up, down, left, right, front, back ...) are only used to explain the relative positional relationship, motion conditions, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication also changes accordingly. In addition, the terms "include" and "have" and any of their variations are intended to cover non-exclusive inclusions. The process, method, system, product or equipment such as including a series of steps or units is not limited to the listed steps or units, but optionally also includes steps or units that are not listed, or optionally also includes other steps or units inherent to these processes, methods, products or equipment.

[0054] The above descriptions are merely embodiments of the present application and are not intended to limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A heat sink connection device for contacting a heat sink with a processor on a circuit board, characterized in that: The radiator connecting device comprises: A support assembly, used for connecting with the radiator; A first guide assembly, located between the support assembly and the circuit board; a second guide assembly connected between the support assembly and the first guide assembly; A connecting component, connecting the supporting component, the first guiding component and the circuit board; The support assembly comprises: A seat body, used for mounting the radiator; The support frame is connected to the base body, and the first guide component is located between the support frame and the circuit board.

2. The radiator connection device according to claim 1, characterized in that: The second guide assembly includes a guide portion and a guide groove, and the guide portion slides in the guide groove; Wherein, the guide portion is arranged on one of the support component and the first guide component, and the guide groove is arranged on the other of the support component and the first guide component.

3. The radiator connection device according to claim 2, characterized in that: The support assembly is provided with the guide portion, and the first guide assembly is provided with the guide groove; The guide portion is provided with a clamping groove, and the first guide assembly is provided with a clamping portion, the clamping portion is located on the inner side wall of the guide groove, and the guide portion slides in the guide groove, and the clamping portion is clamped with the clamping groove.

4. The radiator connection device according to claim 3, characterized in that: The radiator connecting device includes a first rotating member and a first elastic member, the first rotating member passes through the guide portion and is rotatably connected to the support assembly, the first elastic member is sleeved on the first rotating member, the first supporting foot of the first elastic member elastically abuts against the support assembly, and the second supporting foot of the first elastic member elastically abuts against the guide portion.

5. The radiator connection device according to claim 3, characterized in that: The radiator connecting device includes a second rotating member and a second elastic member, the second rotating member passes through the guide portion and is rotatably connected to the support assembly, one end of the second elastic member is connected to the guide portion, and the other end of the second elastic member is connected to the support assembly, and the setting direction of the second elastic member is the same as the extension direction of the guide portion.

6. The radiator connection device according to claim 2, characterized in that: The first guide assembly includes a first guide member and second guide members vertically arranged at two ends of the first guide member, the guide portion or the guide groove is arranged on the first guide member, and the connecting assembly passes through the second guide member.

7. The radiator connection device according to any one of claims 2 to 6, characterized in that: The guide portion or the guide groove is arranged on the support frame; or the guide portion or the guide groove is arranged on the seat body.

8. The radiator connection device according to any one of claims 1 to 6, characterized in that: The heat sink connection device further comprises a back plate, which is arranged on a side of the circuit board away from the heat sink, and the back plate is connected to the circuit board via the connection assembly.

9. The radiator connection device according to claim 8, characterized in that: The back plate is provided with a back plate portion extending from the four corners, the connecting assembly includes a first connecting member and a second connecting member, the connecting position between the first connecting member and the second connecting member is located at the first guide assembly, and the second connecting member passes through the back plate portion, the circuit board and at least a part of the first guide assembly in sequence; The heat sink connection device also includes four locking members, which are sleeved on the back plate portion and the end of the second connecting member, and define the second connecting member and the back plate portion.

10. The heat sink connection device according to claim 9, characterized in that: A locking portion is provided at one end of the locking member toward the center of the back plate, and at least two locking grooves are provided on the outer side wall of the back plate. The locking portion can be locked in different locking grooves to adapt to circuit boards of different sizes.

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