Wafer detection device
By designing a wafer detection device including cavity, support, transmitter and receiver, the problem of existing devices being susceptible to external interference and inability to detect defects is solved, and higher accuracy and stability are achieved, and process interruptions and time losses are reduced.
Patent Information
- Application Number
- CN202421679668.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-16
- Publication Date
- 2025-05-16
- Estimated Expiration
- 2034-07-16
AI Technical Summary
Existing wafer detection devices are susceptible to external interference, resulting in measurement accuracy deviations and cannot detect whether the wafer has defects such as warping, deformation or notches, resulting in forced interruption of process operations in the cavity and time loss.
A wafer detection device is designed, including a cavity, a support, a transmitter and a plurality of receivers. Through the cooperation of the transmitter and receiver, it is possible to detect whether there is a wafer in the cavity, and to determine whether there is warping, deformation or notch in the wafer by detecting the reflection angle of the light. The transmitter is arranged in the cavity to avoid external interference.
It improves the accuracy and stability of the wafer detection device, can effectively detect the existence and defects of the wafer, avoid external interference, and reduce unnecessary process interruptions and time losses.
Smart Images

Figure CN222883490U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of semiconductors, and particularly relates to a wafer detection device. Background Art
[0002] As one of the important semiconductor equipment, the wafer detection device is used to detect whether there is a wafer in a closed chamber to facilitate the processing of the wafer. However, the current wafer detection device is easily affected by external interference, such as external light, vibration or accidental contact by the operator, which leads to a large deviation in the measurement accuracy of the wafer detection device. Moreover, the current wafer detection device can only confirm whether there is a wafer in the cavity, but cannot confirm whether the wafer has defects such as warping, deformation or cracks. When a warped, deformed or cracked wafer rotates in the cavity, the wafer is easy to detach from the support due to imbalance, resulting in the forced interruption of the process operation in the cavity, causing unnecessary time loss. Utility Model Content
[0003] The purpose of the utility model is to provide a wafer detection device, which can detect whether there is a wafer in a cavity, and whether the wafer has warping, deformation or notch, and can also prevent the wafer detection device from being interfered by the outside, thereby improving the accuracy and stability of the wafer detection device.
[0004] In order to solve the above technical problems, the utility model is realized by the following technical solutions:
[0005] The utility model provides a wafer detection device, which at least comprises:
[0006] Cavity;
[0007] A support member, arranged on the inner wall of the cavity to support the wafer to be tested;
[0008] a transmitter, disposed in the cavity on one side of the support member; and
[0009] A plurality of receivers are arranged opposite to the transmitter, and at least one of the receivers is located on a side of the support member away from the transmitter, and at least one of the receivers and the transmitter are located on the same side of the support member.
[0010] In an embodiment of the present invention, the plurality of receivers are respectively disposed inside or outside the cavity.
[0011] In an embodiment of the present invention, when the receiver is disposed outside the cavity, a portion of the cavity opposite to the receiver is a light-transmitting component.
[0012] In one embodiment of the utility model, there are two receivers, which include a first receiver and a second receiver. The first receiver is arranged on both sides of the support member opposite to the transmitter, and the first receiver is located outside the cavity, and the second receiver is arranged on the same side of the support member opposite to the transmitter, and the second receiver is located inside the cavity.
[0013] In an embodiment of the present invention, the transmitter is allowed to emit a first light to the position where the first receiver is located, and emit a second light to the wafer to be tested.
[0014] In an embodiment of the present invention, the second light falls on a side of the wafer to be tested close to the support member.
[0015] In an embodiment of the present invention, the wafer detection device further includes a fixing member, which is disposed on the inner wall of the cavity and connected to the transmitter.
[0016] In one embodiment of the utility model, the cavity includes a top and a bottom that are relatively arranged, and a side portion, the side portion connects the top and the bottom, the first receiver is fixedly connected to the cavity through the top, and the top is a light-transmitting component.
[0017] In an embodiment of the present invention, there are at least two support members.
[0018] In an embodiment of the present invention, the support member includes a support plate and a protrusion, and the protrusion extends from one end of the support plate in a direction away from the emitter.
[0019] In summary, the utility model provides a wafer detection device that can detect whether there is a wafer in a cavity, and whether the wafer has defects such as warping, deformation or notch. Moreover, the wafer detection device provided by the utility model can avoid being affected by external interference such as light, vibration or accidental contact, thereby improving the accuracy and stability of the wafer detection device. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for describing the embodiments are briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.
[0021] Figure 1 Schematic diagram of a wafer inspection device in one embodiment.
[0022] Description of labels:
[0023] 10. Cavity; 101. Top; 102. Bottom; 103. Side; 11. Support; 111. Support plate 112. Protrusion; 12. Transmitter; 121. First light; 122. Second light; 13. First receiver; 14. Second receiver; 141. Reflected light; 15. Wafer; 16. Fixing member. DETAILED DESCRIPTION
[0024] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0025] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.
[0026] In the description of this specification, it should be understood that the directions or positional relationships indicated by the terms "center", "upper", "lower", "front", "back", "left", "right", etc. are based on the directions or positional relationships shown in the drawings, and are only for the convenience of describing this solution and simplifying the description, rather than indicating or implying that the device or component referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation on this solution. In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.
[0027] See also Figure 1 As shown, the utility model provides a wafer detection device, for example, including a cavity 10, a support 11, a transmitter 12 and a plurality of receivers. Among them, the support 11 is arranged on the inner wall of the cavity 10, and the support 11 is used to place a wafer 15. The transmitter 12 is arranged in the cavity 10 on one side of the support 11, and the plurality of receivers are arranged opposite to the transmitter 12, and the plurality of receivers are respectively located on both sides of the support 11. Through the wafer detection device provided by the utility model, it is possible to detect whether there is a wafer 15 in the cavity 10, and whether there are defects such as warping, deformation or notch of the wafer 15.
[0028] See also Figure 1As shown, in one embodiment of the utility model, the cavity 10 provides space for the wafer 15 to perform a process. The process is, for example, etching, deposition or photolithography, and the wafer 15 includes a front side and a back side that are relatively arranged. During the process, the front side of the wafer 15 will gradually form deposits or grooves and become rough, while the back side of the wafer 15 will always maintain a mirror-like smooth state. In this embodiment, the cavity 10 includes, for example, a top 101, a bottom 102 and a side 103, wherein the top 101 and the bottom 102 are relatively arranged, the side 103 connects the top 101 and the bottom 102, and the front side of the wafer 15 is placed toward the top 101.
[0029] See also Figure 1 As shown, in one embodiment of the utility model, a support member 11 is disposed on the inner wall of the cavity 10 to support the wafer 15. There are, for example, at least two support members 11 to improve the stability of the support member 11 in supporting the wafer 15. In this embodiment, there are, for example, two support members 11, and the two support members 11 are relatively disposed on the side portion 103. The support member 11 includes, for example, a support plate 111 and a protrusion 112. The support plate 111 is connected to the side portion 103, and the protrusion 112 extends from one end of the support plate 111 close to the side portion 103 in a direction away from the emitter 12. In the two support members 11, the distance between the two protrusions 112 is, for example, greater than or equal to the length of the wafer 15, and the height of the protrusion 112 is, for example, greater than or equal to the thickness of the wafer 15. The wafer 15 can be placed on the two support plates 111 to achieve the purpose of supporting the wafer 15. Please refer to Figure 1 As shown, in one embodiment of the utility model, the emitter 12 is arranged in the cavity 10 on one side of the support 11. Specifically, the emitter 12 is arranged between the support 11 and the bottom 102, and the emitter 12 emits various light rays such as infrared light. Among them, the emitter 12 can emit light rays of multiple different angles to realize different measurement functions of the wafer detection device. In this embodiment, the emitter 12 can emit light rays of two different angles, such as a first light 121 and a second light 122, to respectively realize the two measurement functions of the wafer detection device to detect whether there is a wafer 15 in the cavity 10, and whether the wafer 15 is warped, deformed or notched. By arranging the emitter 12 in the cavity 10, the environment in the cavity 10 is relatively clean, and no dust particles will fall, thereby avoiding the occurrence of optical fiber problems. It can also prevent the emitter 12 from being subjected to other external interferences such as vibration and accidental contact, thereby improving the accuracy and stability of the wafer detection device.
[0030] See also Figure 1As shown, in one embodiment of the utility model, a fixing member 16 is further provided on one side of the transmitter 12 close to the side portion 103 . The fixing member 16 is provided on the side portion 103 and connected to the transmitter 12 to connect the transmitter 12 and the cavity 10 together, thereby improving the stability of the transmitter 12 in the cavity 10 .
[0031] See also Figure 1 As shown, in one embodiment of the utility model, a plurality of receivers are arranged opposite to the transmitter 12, and at least one receiver is located on the side of the support 11 away from the transmitter 12, and at least one receiver and the transmitter 12 are located on the same side of the support 11. The plurality of receivers are arranged inside or outside the cavity 10, and when the receiver is arranged outside the cavity 10, the part opposite to the receiver and the cavity 10 is a light-transmitting part. In this embodiment, there are two receivers, for example, and the two receivers are, for example, a first receiver 13 and a second receiver 14.
[0032] See also Figure 1 As shown, in one embodiment of the utility model, the first receiver 13 and the transmitter 12 are arranged on both sides of the support 11 opposite to each other, and the first receiver 13 is located outside the cavity 10, and is fixedly connected to the cavity 10 through the top 101, so as to save the internal space of the cavity 10 and leave enough space for the arrangement of other equipment in the cavity 10. In this embodiment, between the first receiver 13 and the transmitter 12, the transmitter 12 emits a first light 121 to the position where the first receiver 13 is located, and the first light 121 is, for example, perpendicular to the wafer 15. By detecting whether the first receiver 13 receives the first light 121, it is determined whether the wafer 15 is placed on the support 11. Specifically, when the wafer 15 is placed on the support 11, the wafer 15 will prevent the first light 121 from propagating to the position where the first receiver 13 is located, and the wafer 15 will refract the first light 121, so that the first receiver 13 cannot receive the first light 121. When the wafer 15 is not placed on the support 11, the first light 121 will directly enter the first receiver 13 from the transmitter 12, so that the first receiver 13 can receive the first light 121. Moreover, in this embodiment, the top 101 is a light-transmitting component to avoid hindering the first light 121 from propagating between the transmitter 12 and the first receiver 13, so as to ensure that the wafer detection device can normally detect whether there is a wafer 15 in the cavity 10. The material of the light-transmitting component includes at least one of glass, polycarbonate, acrylic and other light-transmitting materials.
[0033] See also Figure 1As shown, in one embodiment of the utility model, the second receiver 14 and the transmitter 12 are arranged on the same side of the support 11, and the second receiver 14 is located in the cavity 10, and is fixedly connected to the cavity 10 through the side portion 103. In this embodiment, between the second receiver 14 and the transmitter 12, the transmitter 12 emits a second light 122 to the wafer 15, and the incident angle of the second light 122 is α. Due to the reflection effect of the wafer 15, the wafer 15 reflects the reflected light 141 to the second receiver 14. The second receiver 14 detects whether the incident angle α of the second light 122 and the reflection angle β of the reflected light 141 are equal to confirm whether the wafer 15 has warping, deformation or notch. Specifically, when the wafer 15 is warped, deformed or has a notch, the surface of the wafer 15 is not smooth, and the wafer 15 will not totally reflect the second light 122. At this time, the incident angle α and the reflection angle β are not equal. When the wafer 15 is not warped, deformed or has a notch, the surface of the wafer 15 is in a smooth mirror state, and the wafer 15 totally reflects the second light 122. At this time, the incident angle α and the reflection angle β are equal.
[0034] See also Figure 1 As shown, in one embodiment of the present invention, since the back side of the wafer 15 is always maintained in a smooth mirror state, and the front side of the wafer 15 is not smooth due to the process technology, the second light 122 must fall on the back side of the wafer 15, that is, the back side of the wafer 15 is placed toward the emitter 12, so as to realize the function of the wafer detection device to detect whether there is warpage, deformation or notch in the wafer 15. Moreover, due to inertia, the edge of the wafer 15 is most likely to be warped, deformed or notched, so the second light 122, for example, falls on the back side of the wafer 15 close to the support 11, so as to improve the detection efficiency and accuracy of the wafer detection device.
[0035] See also Figure 1As shown, in one embodiment of the utility model, the transmitter 12 emits a first light 121 to the position where the first receiver 13 is located, and by detecting whether the first receiver 13 receives the first light 121, it is confirmed whether there is a wafer 15 in the cavity 10. The transmitter 12 emits a second light 122 with an incident angle α to the wafer 15. Due to the reflection of the wafer 15, the wafer 15 reflects a reflected light 141 to the second receiver 14. The second receiver 14 detects whether the incident angle α and the reflection angle β of the reflected light 141 are equal to confirm whether the wafer 15 is warped, deformed or notched. If a wafer 15 with warping, deformation or notch rotates in the cavity 10, the wafer 15 will be separated from the support 11 due to imbalance, so that the process in the cavity 10 must be interrupted and the cavity 10 must be maintained, resulting in unnecessary time loss. Therefore, by providing the second receiver 14 , before the process in the chamber 10 begins, it is possible to confirm whether the wafer 15 has warping, deformation or notch, thereby avoiding interruption of the process and unnecessary time loss.
[0036] In summary, the utility model provides a wafer detection device, which can detect whether there is a wafer in a cavity through a transmitter and a first receiver, and can detect whether there are defects such as warping, deformation or notch of the wafer through a transmitter and a second receiver. Moreover, the wafer detection device provided by the utility model can avoid the wafer detection device from being affected by external interference such as light, vibration or accidental collision by arranging the transmitter in the cavity, thereby improving the accuracy and stability of the wafer detection device.
[0037] The embodiments of the utility model disclosed above are only used to help illustrate the utility model. The embodiments do not describe all the details in detail, nor do they limit the utility model to the specific implementation methods described. Obviously, many modifications and changes can be made according to the content of this specification. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the utility model, so that technicians in the relevant technical field can well understand and use the utility model. The utility model is limited only by the claims and their full scope and equivalents.
Claims
1. A wafer inspection device, characterized in that: At least: Cavity; A support member, arranged on the inner wall of the cavity to support the wafer to be tested; A transmitter is disposed in the cavity on one side of the support member; as well as A plurality of receivers are arranged opposite to the transmitter, and at least one of the receivers is located on a side of the support member away from the transmitter, and at least one of the receivers and the transmitter are located on the same side of the support member.
2. The wafer inspection device according to claim 1, characterized in that: The plurality of receivers are respectively arranged inside or outside the cavity.
3. The wafer inspection device according to claim 2, characterized in that: When the receiver is disposed outside the cavity, a portion of the cavity opposite to the receiver is a light-transmitting component.
4. The wafer inspection device according to claim 1, characterized in that: There are two receivers, including a first receiver and a second receiver. The first receiver is arranged on both sides of the support member opposite to the transmitter, and the first receiver is located outside the cavity. The second receiver is arranged on the same side of the support member opposite to the transmitter, and the second receiver is located inside the cavity.
5. The wafer inspection device according to claim 4, characterized in that: The transmitter is allowed to emit a first light to the position where the first receiver is located, and emit a second light to the wafer to be tested.
6. The wafer inspection device according to claim 5, characterized in that: The second light falls on a side of the wafer to be tested close to the support member.
7. The wafer inspection device according to claim 1, characterized in that: The wafer detection device also includes a fixing component, which is arranged on the inner wall of the cavity and connected to the transmitter.
8. The wafer inspection device according to claim 4, characterized in that: The cavity includes a top and a bottom that are arranged opposite to each other, and a side portion, wherein the side portion connects the top and the bottom, and the first receiver is fixedly connected to the cavity through the top, and the top is a light-transmitting component.
9. The wafer inspection device according to claim 1, characterized in that: There are at least two supporting members.
10. The wafer inspection device according to claim 9, characterized in that: The support member includes a support plate and a protrusion, wherein the protrusion extends from one end of the support plate in a direction away from the emitter.