Bonded wafer stripping device

Abstract

The utility model relates to the technical field of semiconductor manufacturing, in particular to a bonding wafer stripping device which comprises a wafer carrying table, a first adsorption assembly is arranged on the wafer carrying table, and the first adsorption assembly is used for adsorbing a lower wafer of a bonding wafer; the at least two groups of separation devices are arranged in the circumferential direction of the wafer carrying table, each separation device comprises a wafer clamping piece and a clamping driving device, and a separation structure is arranged on each wafer clamping piece; the clamping driving device can drive the wafer clamping piece to move towards the bonding wafer, so that the separation structure is at least partially embedded into the bonding surface; the lifting device comprises a lifting arm and a second adsorption assembly arranged on the lifting arm, the second adsorption assembly is used for adsorbing the upper wafer of the bonded wafer, and the lifting arm can drive the upper wafer to move in the direction of separating the lower wafer; according to the invention, the separation structure is arranged, and then the wafer clamping piece is driven by the clamping driving device to move towards the bonding wafer, so that the separation structure is at least partially embedded into the bonding surface, and the stripping efficiency is improved.

Description

Technical Field

[0001] The present application relates to the field of precision machinery and instrument technology, and in particular to a device for peeling a bonded wafer. Background Art

[0002] As the development of Moore's Law encounters bottlenecks, a single material can no longer meet the rapid development of semiconductor technology. The technology development route beyond Moore's Law has put forward an urgent need for heterogeneous integration technology, which integrates materials with different properties to achieve high-density integration of multiple functional devices. Different materials can be heterogeneously integrated through wafer bonding technology. Ion beam stripping technology, which combines bonding technology with ion implantation technology, can transfer high-quality functional films to different supporting substrates, while avoiding problems caused by mismatch of material lattice constants or thermal expansion coefficients. In ion beam stripping technology, after the functional film layer is peeled and transferred to the supporting substrate along the implanted damage layer, there is still a weak intermolecular force between the functional film layer and the remaining wafer, and it will not be separated from the remaining wafer immediately; at this time, an external force perpendicular to the bonding interface is required to separate the upper and lower wafers from the edge, and then the upper and lower wafers are taken out. Directly separating the upper and lower wafers may cause wafer breakage or scratches on the surface of the functional film layer. At the same time, this work generally needs to be done manually, which is inefficient in large-scale production, and there is a risk of scratching the surface of the bonded wafer and causing the bonded wafer to break.

[0003] Therefore, it is necessary to provide an improved bonded wafer peeling device to solve at least one of the above-mentioned prior art problems. Utility Model Content

[0004] The present application provides a peeling device for a bonded wafer, which is used to split and separate a bonded wafer from its bonding surface, wherein the bonded wafer includes an upper wafer and a lower wafer bonded up and down, including: a wafer carrier, on which a first adsorption component is arranged, the first adsorption component is used to adsorb the lower wafer; at least two groups of separation devices are arranged equidistantly along the circumference of the wafer carrier, the separation device includes a wafer clamp and a clamping drive device, and a separation structure is arranged on the wafer clamp; the clamping drive device can drive the wafer clamp to move toward the bonded wafer so that the separation structure is at least partially embedded in the bonding surface; a lifting device includes a lifting arm and a second adsorption component arranged on the lifting arm, the second adsorption component is located above the wafer carrier, the second adsorption component is used to adsorb the upper wafer, and when the bonded wafer is peeled, the lifting arm can drive the upper wafer adsorbed on the second adsorption component to move downward away from the lower wafer.

[0005] Furthermore, the wafer clamping member has a clamping groove, the opening of which faces the bonding wafer; and the width of the clamping groove is matched with the thickness of the bonding wafer.

[0006] Furthermore, the separation structure is protrudingly arranged at the groove bottom of the clamping groove, and a cutting end is arranged on a side of the separation structure away from the groove bottom.

[0007] Furthermore, the cross-sectional shape of the cutting end is a triangle, a trapezoid or an arc.

[0008] Furthermore, the clamping groove also has a first groove wall and a second groove wall, and the clamping groove is formed by the first groove wall, the second groove wall and the groove bottom; a first buffer slope is arranged on the first groove wall, and a second buffer slope is arranged on the second groove wall.

[0009] Furthermore, the separation device also includes a lifting mounting frame; the wafer clamping component is detachably mounted on the lifting mounting frame, and the clamping drive device can also drive the wafer clamping component to move up and down along the lifting mounting frame.

[0010] Furthermore, the bonded wafer peeling device also includes a control device, which is electrically connected to the lifting device; when the adsorption pressure of the second adsorption component meets the preset adsorption condition, the control device can control the lifting arm to rise to a preset height.

[0011] Furthermore, the lifting device also includes a pressure detection device, which is arranged on the second adsorption component and is used to detect the adsorption pressure between the second adsorption component and the bonding wafer; the pressure detection device is electrically connected to the control device.

[0012] Furthermore, the bonded wafer peeling device also includes a conveying device and a wafer loading module, the conveying device is arranged between the wafer carrier and the wafer loading module; the wafer loading module includes an upper wafer placing table and a lower wafer placing table, the upper wafer placing table is used to hold the upper wafer after peeling; the lower wafer placing table is used to hold the lower wafer; the conveying device includes a conveying drive device and a conveying arm; the control device is electrically connected to the conveying device; when the lifting arm drives the upper wafer to a preset height, the control device can control the conveying drive device to drive the conveying arm to move, and then the upper wafer and the lower wafer can be placed on the upper wafer placing table and the lower wafer placing table respectively through the conveying arm.

[0013] Furthermore, the conveying device also includes a conveying track and a displacement measuring device, the conveying arm and the conveying track are slidably matched through a connecting slider; the conveying track is fixedly arranged relative to the wafer loading module; the displacement measuring device is used to measure the displacement information of the connecting slider; the conveying drive device can also drive the conveying arm to move along the conveying track.

[0014] The present application provides a bonded wafer peeling device, which has at least the following technical effects:

[0015] The bonded wafer peeling device in the present application is used to split and separate the bonded wafer from its bonding surface. The bonded wafer includes an upper wafer and a lower wafer bonded up and down. The bonded wafer peeling device includes: a wafer carrier, a first adsorption component is arranged on the wafer carrier, and the first adsorption component is used to adsorb the lower wafer; at least two groups of separation devices are arranged equidistantly along the circumference of the wafer carrier, and the separation device includes a wafer clamping piece and a clamping drive device. The wafer clamping piece is provided with a separation structure; the clamping drive device can drive the wafer clamping piece to move toward the bonded wafer so that the separation structure is at least partially embedded in the bonding surface; a lifting device, including a lifting arm and a device A second adsorption component is arranged on the lifting arm, and the second adsorption component is located above the wafer carrier. The second adsorption component is used to adsorb the upper wafer. When the bonded wafer is peeled off, the lifting arm can drive the upper wafer adsorbed on the second adsorption component to move downward away from the lower wafer. The present application sets a separation structure, and then drives the wafer clamping part toward the bonded wafer through a clamping drive device, so that the separation structure is at least partially embedded in the bonding surface, and under the action of the lifting device, the upper wafer and the lower wafer are smoothly separated from the bonding surface, thereby improving the peeling efficiency of the bonded wafer, and at the same time improving the degree of automation of the bonded wafer peeling. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions and advantages in the embodiments of the present application or the prior art, the drawings required for use in the embodiments or the prior art descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0017] Figure 1 : A schematic diagram of the overall structure of a bonded wafer peeling device provided in an embodiment of the present application;

[0018] Figure 2 : A cross-sectional view of the wafer clamp provided in an embodiment of the present application in cooperation with a bonded wafer;

[0019] Figure 3 : A schematic diagram of the structure of the lifting device provided in the embodiment of the present application;

[0020] Figure 4 : A schematic diagram of the structure of the separation device provided in the embodiment of the present application;

[0021] Figure 5 : A schematic diagram of a structure in which a separation structure provided in an embodiment of the present application contacts a bonding wafer;

[0022] Figure 6 : A schematic diagram of another structure of the separation structure provided in an embodiment of the present application in contact with a bonded wafer;

[0023] Figure 7 : A schematic diagram of another structure of the separation structure provided in an embodiment of the present application in contact with a bonded wafer;

[0024] Figure 8 : A schematic diagram of the structure of the two sets of separation devices provided in the embodiment of the present application, which are distributed relative to the wafer carrier;

[0025] Fig. 9 : A schematic diagram of the structure of the three groups of separation devices provided in the embodiment of the present application, which are distributed relative to the wafer stage;

[0026] Fig.10 : Schematic diagram of the structure of the four sets of separation devices provided in the embodiment of the present application relative to the wafer carrier

[0027] Among them, the reference numerals in the figure correspond to:

[0028] 1-wafer carrier, 2-lifting device, 3-separation device, 4-transport device, 6-wafer alignment module, 7-operation module, 10-base, 11-first adsorption component, 14-transport arm, 15-transport track, 16-connecting slider, 20-upper wafer, 21-lifting arm, 22-second adsorption component, 23-lifting frame, 30-lower wafer, 31-wafer clamping member, 32-mounting frame, 51-upper wafer holding platform, 52-lower wafer holding platform, 311-separation structure, 312-clamping groove. DETAILED DESCRIPTION

[0029] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0030] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions.

[0031] The following describes the embodiments with reference to the accompanying drawings, which do not limit the application contents described in the claims.

[0032] Please refer to Figure 1-10 As shown, the embodiment of the present application provides a bonded wafer peeling device for splitting and separating a bonded wafer from its bonding surface, wherein the bonded wafer includes an upper wafer 20 and a lower wafer 30 bonded up and down, and the bonded wafer peeling device includes: a wafer carrier 1, the wafer carrier 1 is provided with a first adsorption component 11, and the first adsorption component 11 is used to adsorb the lower wafer 30; at least two groups of separation devices 3 are arranged along the circumference of the wafer carrier 1, and the separation device 3 includes a wafer clamping member 31 and a clamping drive device, and the wafer clamping member 31 is provided with a A separation structure 311; a clamping drive device capable of driving the wafer clamping member 31 to move toward the bonded wafer, so that the separation structure 311 is at least partially embedded in the bonding surface; a lifting device 2, comprising a lifting arm 21 and a second adsorption component 22 arranged on the lifting arm 21, the second adsorption component 22 being located above the wafer carrier 1, the second adsorption component 22 being used to adsorb the upper wafer 20, when the bonded wafer is peeled off, the lifting arm 21 can drive the upper wafer 20 adsorbed on the second adsorption component 22 to move downward away from the lower wafer 30.

[0033] Specifically, the bonding surface is the bonding contact surface between the upper wafer 20 and the lower wafer 30 .

[0034] In the embodiment of the present application, at least two groups of separation devices 3 are provided and arranged along the circumference of the wafer carrier 1, and then the wafer clamping member 31 is driven by the clamping drive device to move toward the bonded wafer, so that the separation structure 311 is at least partially embedded in the bonding surface, and under the action of the lifting device 2, the upper wafer 20 and the lower wafer 30 are smoothly separated from the bonding surface, thereby improving the stripping efficiency of the bonded wafer and improving the degree of automation of the bonded wafer stripping device.

[0035] Specifically, the wafer carrier 1 may be a round table, on which a holding position for holding the bonding wafer is arranged.

[0036] Specifically, Figure 8As shown in the figure, two sets of separation devices 3 are symmetrically arranged along the geometric axis of the frustum; such that the two sets of separation devices 3 act on the bonded wafer simultaneously, improving the stability of the force on the bonded wafer and the peeling efficiency of the bonded wafer.

[0037] In some other embodiments, such as Figure 9-10 As shown in the figure, three or four sets of separation devices 3 are provided in the peeling device for the bonded wafer, and multiple sets of separation devices 3 are circumferentially equidistantly distributed along the geometric axis of the frustum; for three sets of separation devices 3, the included angle between two adjacent sets of separation devices 3 and the geometric axis of the frustum is 120°; for four sets of separation devices 3, the included angle between two adjacent sets of separation devices 3 and the geometric axis of the frustum is 90°. Further, the stability of the force on the bonded wafer and the peeling efficiency of the bonded wafer are improved. On the premise of ensuring the use effect, the number of separation devices 3 provided in the peeling device for the bonded wafer in this application is not limited.

[0038] Specifically, the first adsorption component 11 may include a vacuum generating device. A plurality of adsorption holes are provided on the bearing surface of the wafer stage 1. The bonded wafer is placed on the bearing surface of the wafer stage 1 and covers at least part of the adsorption holes. A sealed space is formed between the bonded wafer and the adsorption holes. The air in the sealed space is extracted by the vacuum generating device, thereby adsorbing and fixing the bonded wafer on the bearing surface of the wafer stage 1, improving the stability and reliability of the wafer stage 1 in carrying the bonded wafer.

[0039] Specifically, the second adsorption component 22 is a vacuum adsorption device. The vacuum adsorption device includes a vacuum chuck and a vacuum pump. The vacuum chuck is provided on the lifting arm 21. After the lifting arm 21 drives the vacuum chuck to move into contact with the bonded wafer, a sealed space is formed between the vacuum chuck and the bonded wafer. The air in the sealed space is extracted by the vacuum pump, thereby adsorbing and stably fixing the bonded wafer on the vacuum chuck.

[0040] In some embodiments, such as Figure 1-2 As shown in the figure, the wafer clamping member 31 has a clamping groove 312, and the opening of the clamping groove 312 faces the bonded wafer; the width of the clamping groove 312 is matched with the thickness of the bonded wafer.

[0041] Specifically, the clamping groove 312 also has a first groove wall and a second groove wall, and the clamping groove 312 is formed by enclosing the first groove wall, the groove bottom and the second groove wall in sequence.

[0042] Specifically, the clamping groove 312 is a U-shaped groove. The first groove wall can be the upper groove wall, and the second groove wall can be the lower groove wall, and the opening of the U-shaped groove faces the bonded wafer for clamping the bonded wafer.

[0043] Specifically, the width of the clamping groove 312 is greater than or equal to the overall thickness of the bonded wafer. Generally, the difference between the width of the clamping groove 312 and the overall thickness of the bonded wafer is not less than 0.5 mm.

[0044] Furthermore, as Figure 2 shown, in some embodiments, a first buffer inclined surface 3121 is provided on the first groove wall, and a second buffer inclined surface 3122 is provided on the second groove wall.

[0045] Specifically, both the first buffer inclined surface 3121 and the second buffer inclined surface 3122 are inclined away from the clamping groove 312, so that the groove width of the clamping groove 312 gradually decreases along the direction from its opening to the bottom of the groove.

[0046] In this embodiment, by providing the first buffer inclined surface 3121 on the first groove wall and the second buffer inclined surface 3122 on the second groove wall, it is possible to avoid the scratching and squeezing of the surface of the bonded wafer by the first groove wall and the second groove wall during the clamping process of the wafer clamping member 31, further ensuring the integrity of the bonded wafer after peeling.

[0047] In some embodiments, the separation structure 311 protrudes from the bottom of the clamping groove 312, and a cutting-in end is provided on the side of the separation structure 311 facing away from the bottom of the groove.

[0048] Specifically, as Figure 2 shown, the separation structure 311 divides the U-shaped groove into upper and lower parts. In some specific embodiments, it is required that the distance from the separation structure 311 to the lower groove wall is the same as the thickness of the lower wafer 30. Generally, the difference between the two does not exceed 0.2 mm, and it is required that the distance from the separation structure 311 to the lower groove wall is not greater than the distance from the separation structure 311 to the upper groove wall.

[0049] Specifically, in the specific operation, the wafer clamping member 31 can be selected according to different bonded wafers to make the clamping groove 312 of the wafer clamping member 31 meet the clamping requirements.

[0050] In some embodiments, as Figure 5-7 shown, the cross-sectional shape of the cutting-in end is triangular, trapezoidal or arc-shaped.

[0051] Specifically, the separation structure 311 can be a convex structure, and the preparation material of the convex structure can be polypropylene (PP) or polyether ether ketone (PEEK), etc., so as to avoid the phenomenon of scratching the surface of the bonded wafer due to the contact between the separation structure 311 and the bonded wafer.

[0052] In the embodiment of the present application, by making the cross-sectional shape of the cutting end triangular, trapezoidal or arc-shaped, the cutting end can be smoothly embedded in the bonding surface of the bonded wafer, thereby improving the efficiency and integrity of the bonded wafer peeling, thereby solving the problem of wafer breakage or scratches on the surface of the functional film layer caused by directly separating the upper wafer 20 from the lower wafer 30 in the prior art.

[0053] In some embodiments, Figure 4 As shown, the separation device 3 further includes a mounting frame 32 ; the wafer clamping member 31 is detachably mounted on the mounting frame 32 , and the clamping driving device can drive the wafer clamping member 31 to move up and down along the mounting frame 32 .

[0054] Specifically, the mounting frame 32 is also provided with a slidably connected lifting rail and a lifting slider, and the wafer clamp 31 is detachably connected to the lifting slider, so that the operator can replace the wafer clamp 31 with different groove widths according to different usage conditions.

[0055] Specifically, a limit member is also provided on the mounting frame 32. When the clamping drive device drives the lifting slider to move along the lifting guide rail to the limit member, the lower groove wall of the wafer clamping member 31 on the lifting slider is aligned with the bottom surface of the bonded wafer or the lower groove wall of the wafer clamping member 31 on the lifting slider is aligned with the bearing surface of the wafer carrier 1.

[0056] In other embodiments, the moving position of the lifting slider can be identified by setting an identification device, and then the lifting slider can be controlled to move to the set position. Under the premise of ensuring that the use function can be realized, the present application does not limit the specific movement control method of the lifting slider.

[0057] Specifically, the bonded wafer peeling device further includes a base 10 , and the wafer carrier 1 , the separation device 3 and the lifting device 2 are all arranged on the base 10 .

[0058] Specifically, a movable guide rail is also provided on the base 10, and the mounting frame 32 is slidably connected to the movable guide rail. The clamping drive device can also drive the mounting frame 32 to move along the movable guide rail, thereby driving the wafer clamping member 31 to move toward the direction of the wafer carrier 1.

[0059] Specifically, a detection device is provided on the wafer clamp 31, and the detection device is used to detect the pressure value of the separation structure 311 in contact with the bonding surface. When the detected pressure value of the separation structure 311 in contact with the bonding surface meets the set pressure value, the clamping drive device can also drive the mounting frame 32 to move to the initial position along the movable guide rail, so that the separation structure 311 is separated from the bonding surface.

[0060] In some embodiments, the bonded wafer peeling device further includes a control device, which is electrically connected to the lifting device 2; when the adsorption pressure of the second adsorption component 22 meets the preset adsorption condition, the control device can control the lifting arm 21 to rise to a preset height.

[0061] Specifically, the lifting device 2 also includes a pressure detection device, which is arranged on the second adsorption component 22 and is used to detect the adsorption pressure between the second adsorption component 22 and the bonding wafer; the pressure detection device is electrically connected to the control device.

[0062] Specifically, Figure 3 As shown, the lifting device 2 further includes a lifting frame 23 and a lifting drive device. A lifting guide rail is provided on the lifting frame 23, and the lifting arm 21 is slidably connected to the lifting guide rail.

[0063] Furthermore, when the clamping drive device drives the mounting frame 32 to move to the initial position, the lifting drive device can drive the lifting arm 21 to move upward. When the adsorption pressure between the second adsorption component 22 and the bonded wafer detected by the pressure detection device exceeds the set pressure threshold, it indicates that the bonded wafer is not successfully peeled off, and the lifting drive device is controlled to stop driving the lifting arm 21 to move upward; and then the bonded wafer is separated again by the separation device 3.

[0064] When the adsorption pressure between the second adsorption component 22 and the bonded wafer detected by the pressure detection device is less than the set pressure threshold, the preset adsorption condition is met, indicating that the bonded wafer is successfully peeled off. The lifting drive device is then controlled to further drive the lifting arm 21 to move upward and lift it to a preset height.

[0065] In other embodiments, the wafer carrier 1 can drive the bonded wafer to rotate relative to the base 10. When the bonded wafer is not successfully peeled off, the bonded wafer can be rotated and then separated by the separation device 3.

[0066] In some embodiments, Figure 1 As shown, the bonded wafer peeling device also includes a conveying device 4 and a wafer loading module, the conveying device 4 is arranged between the wafer carrier 1 and the wafer loading module; the wafer loading module includes an upper wafer placing table 51 and a lower wafer placing table 52, the upper wafer placing table 51 is used to hold the upper wafer 20 after peeling; the lower wafer placing table 52 is used to hold the lower wafer 30; the conveying device 4 includes a conveying drive device and a conveying arm 14; the control device is electrically connected to the conveying device; when the lifting arm 21 drives the upper wafer 20 to a preset height, the control device can control the conveying drive device to drive the conveying arm 14 to move, and then the upper wafer 20 and the lower wafer 30 can be placed on the upper wafer placing table 51 and the lower wafer placing table 52 respectively through the conveying arm 14.

[0067] Specifically, the conveying device 4 also includes a conveying track 15 and a displacement measuring device. The conveying arm 14 and the conveying track 15 are slidably matched through a connecting slider 16; the conveying track 15 is fixed relative to the wafer loading module; the displacement measuring device is used to measure the displacement information of the connecting slider 16; the conveying drive device can also drive the conveying arm 14 to move along the conveying track 15.

[0068] Specifically, Figure 1 As shown, the upper wafer holding platform 51 and the lower wafer holding platform 52 are adjacently arranged on one side of the conveying track 15 .

[0069] Specifically, the displacement measuring device may include a reading head and a grating scale that are communicatively connected. The reading head is arranged on the connecting slider 16, and the grating scale is fixedly arranged on the conveying track 15. In the process of the connecting slider 16 moving along the conveying track 15, the reading head reads the displacement data information on the grating scale, and then accurately locates the moving position of the connecting slider 16, so as to coordinately move the conveying arm 14 to the upper wafer placing table 51 or the lower wafer placing table 52, so that the conveying arm 14 can place the separated upper wafer 20 and lower wafer 30 on the upper wafer placing table 51 and the lower wafer placing table 52 respectively.

[0070] Specifically, a wafer cassette for loading wafers and a lower wafer placing table 52 are placed on the upper wafer placing table 51 and the lower wafer placing table 52; in order to limit the movement of the wafer cassette, a plurality of movable limit blocks 53 are provided on the upper wafer placing table 51 and the lower wafer placing table 52, and then the wafer cassette is limited by moving the position of the limit blocks 53 to ensure that its placement position is fixed.

[0071] Specifically, one end of the connecting slider 16 is slidably connected to the conveying track 15, and the other end of the connecting slider 16 is connected to the conveying arm 14. The conveying drive device can also drive the conveying arm 14 to rotate relative to the connecting slider 16, thereby placing the separated upper wafer 20 in the wafer card box of the upper wafer holding table 51, and placing the lower wafer 30 in the wafer card box of the lower wafer holding table 52.

[0072] In some embodiments, the bonded wafer peeling device further includes a wafer alignment module 6 and an operation panel 7; the control device is electrically connected to the wafer alignment module 6 and the operation panel 7, respectively.

[0073] Specifically, the wafer alignment module 6 is used to perform image recognition on the bonded wafer, so as to identify the mark (such as notch) on the bonded wafer and accurately move the bonded wafer to the preset position; when the bonded wafer is accurately moved to the preset position, the control device can control the transfer arm 14 to move the bonded wafer to the wafer carrier 1.

[0074] Specifically, the wafer alignment module 6 includes a wafer alignment table, an alignment drive device and an image recognition device; the wafer alignment table is arranged on the base 10, the wafer alignment table is used to carry the bonded wafer, the image recognition device can identify the marks (such as notches) on the bonded wafer, and the alignment drive device can drive the wafer alignment table to rotate relative to the base 10, thereby accurately moving the bonded wafer to a preset position.

[0075] Specifically, a bonding wafer holding table is also provided on the base 10 for holding the bonding wafer. The transfer arm 14 can also grab the bonding wafer and transfer it to the wafer alignment module 6. The bonding wafer is aligned through the wafer alignment module 6 and the bonding wafer is accurately moved to a preset position.

[0076] Furthermore, the operation panel 7 is mainly used for multiple aspects including wafer loading and unloading, program editing and external computer module support, separation program formulation and status reminder, ensuring the accuracy and reliability of the bonded wafer peeling process.

[0077] Specifically, the operation panel 7 can accurately select the wafer at a specific position through Cassette recognition and mapping for the wafer loading and unloading operations. This process involves precise mechanical control and motion systems to ensure accurate positioning and safe handling during the process of bonding wafer peeling. In addition, the placement of the wafer cassette and the definition of the wafer type (i.e., the lower wafer 30 and the upper wafer 20) are also important links in the loading and unloading process, which is related to the accuracy and efficiency of subsequent processing steps.

[0078] Specifically, formulating the separation program is another key function of the operation panel 7, including defining the position, force, sensitivity of sensors and other parameters of each component in the separation device. The precise setting of these parameters directly affects the quality and efficiency of the bonded wafer separation process. Therefore, the parameter setting function provided by the operation panel 7 can ensure the separation accuracy and improve the separation efficiency.

[0079] Specifically, the operation panel 7 also has alarm and program completion status reminder functions. These functions can timely feedback the operating status of the equipment and possible problems in the processing process to the operator, so that corresponding measures can be taken to avoid losses or failures. Instant status updates and alarm mechanisms are indispensable safety guarantees in modern automation equipment.

[0080] The present application also provides a workflow of a stripping device stripping a bonded wafer, which is as follows:

[0081] a) The conveying drive device drives the conveying arm 14 to transfer the bonded wafer on the bonded wafer holding table to the wafer alignment table, and the control device controls the alignment drive device to drive the wafer alignment table to rotate until the mark on the bonded wafer is accurately moved to the preset position;

[0082] b) The conveying drive device drives the conveying arm 14 to transfer the aligned bonded wafer from the wafer alignment stage to the wafer carrier 1, and the lower wafer 30 of the bonded wafer is adsorbed and fixed by the first adsorption component 11;

[0083] c) The lifting drive device drives the lifting arm 21 to descend until the vacuum suction cup on the lifting arm 21 is completely adsorbed on the upper wafer 20 of the bonded wafer;

[0084] d) the clamping drive device drives the wafer clamping member 31 to move toward the bonded wafer, so that the separation structure on the wafer clamping member 31 is embedded in the bonding surface of the bonded wafer, until the pressure value of the separation structure 311 in contact with the bonding surface meets the set pressure value, and the clamping drive device drives the wafer clamping member 31 to move to the initial position, so that the separation structure 311 is separated from the bonding surface;

[0085] e) The lifting drive device drives the lifting arm 21 to move upward, and then the upper wafer 20 is moved upward by the vacuum suction cup until the adsorption pressure between the vacuum suction cup and the bonded wafer is less than the set pressure threshold, indicating that the bonded wafer is successfully peeled off, and then the lifting arm 21 is controlled to drive the upper wafer 20 to move up to a preset height.

[0086] f) The conveying drive device drives the conveying arm 14 to grab the upper wafer 20 and transfer it to the wafer card box of the upper wafer holding table 51 , and drives the conveying arm 14 to grab the lower wafer 30 and transfer it to the wafer card box of the lower wafer holding table 52 .

[0087] The various embodiments in this specification are described in a progressive manner, and the same or similar parts between the various embodiments can be referenced to each other, and each embodiment focuses on the differences from other embodiments.

[0088] It should be noted that all the features recorded in this application (including technical features recorded in different embodiments) can be combined arbitrarily under reasonable circumstances, and new technical solutions formed by the combination are all within the protection scope of this application.

[0089] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. A bonded wafer peeling device, used for splitting and separating a bonded wafer from its bonding surface, wherein the bonded wafer comprises an upper wafer (20) and a lower wafer (30) bonded up and down, characterized in that: include: A wafer carrier (1), wherein the wafer carrier (1) is provided with a first adsorption component (11), and the first adsorption component (11) is used to adsorb the lower wafer (30); At least two groups of separation devices (3) are arranged along the circumference of the wafer carrier (1), the separation device (3) comprising a wafer clamping member (31) and a clamping drive device, the wafer clamping member (31) being provided with a separation structure (311); the clamping drive device is capable of driving the wafer clamping member (31) to move toward the bonded wafer, so that the separation structure (311) is at least partially embedded in the bonding surface; The lifting device (2) comprises a lifting arm (21) and a second adsorption component (22) arranged on the lifting arm (21), wherein the second adsorption component (22) is located above the wafer carrier (1), and the second adsorption component (22) is used to adsorb the upper wafer (20). When the bonded wafer is peeled off, the lifting arm (21) can drive the upper wafer (20) adsorbed on the second adsorption component (22) to move downward away from the lower wafer (30).

2. The bonded wafer peeling device according to claim 1, characterized in that: The wafer clamping member (31) has a clamping groove (312), and the opening of the clamping groove (312) faces the bonding wafer; The width of the clamping groove (312) is set to match the thickness of the bonding wafer.

3. The bonded wafer peeling device according to claim 2, characterized in that: The separation structure (311) is protrudingly arranged at the bottom of the clamping groove (312), and a cutting end is arranged on a side of the separation structure (311) facing away from the bottom of the groove.

4. The bonded wafer peeling device according to claim 3, characterized in that: The cross-sectional shape of the cutting end is a triangle, a trapezoid or an arc.

5. The bonded wafer peeling device according to claim 3, characterized in that: The clamping groove (312) further comprises a first groove wall and a second groove wall, and the clamping groove (312) is formed by enclosing the first groove wall, the second groove wall and the groove bottom; A first buffer slope (3121) is provided on the first groove wall, and a second buffer slope (3122) is provided on the second groove wall.

6. The bonded wafer peeling device according to claim 1, characterized in that: The separation device (3) further comprises a mounting frame (32); The wafer clamping component (31) is detachably mounted on the mounting frame (32), and the clamping drive device can also drive the wafer clamping component (31) to move up and down along the mounting frame (32).

7. The bonded wafer peeling device according to claim 1, characterized in that: It also includes a control device, which is electrically connected to the lifting device (2); When the adsorption pressure of the second adsorption component (22) meets the preset adsorption condition, the control device can control the lifting arm (21) to be lifted to a preset height.

8. The bonded wafer peeling device according to claim 7, characterized in that: The lifting device (2) further comprises a pressure detection device, which is arranged on the second adsorption component (22) and is used to detect the adsorption pressure between the second adsorption component (22) and the bonding wafer; The pressure detection device is electrically connected to the control device.

9. The bonded wafer peeling device according to any one of claims 1 to 8, characterized in that: It also includes a conveying device (4) and a wafer loading module, wherein the conveying device (4) is arranged between the wafer carrier (1) and the wafer loading module; The wafer loading module comprises an upper wafer holding platform (51) and a lower wafer holding platform (52), wherein the upper wafer holding platform (51) is used to hold the upper wafer (20) after peeling; and the lower wafer holding platform (52) is used to hold the lower wafer (30); The conveying device (4) comprises a conveying drive device and a conveying arm (14); the control device is electrically connected to the conveying device; When the lifting arm (21) drives the upper wafer (20) to be lifted to a preset height, the control device can control the conveying drive device to drive the conveying arm (14) to move, and then the upper wafer (20) and the lower wafer (30) can be placed on the upper wafer holding platform (51) and the lower wafer holding platform (52) respectively through the conveying arm (14).

10. The bonded wafer peeling device according to claim 9, characterized in that: The conveying device (4) further comprises a conveying track (15) and a displacement measuring device, and the conveying arm (14) and the conveying track (15) are slidably matched via a connecting slider (16); The conveying track (15) is fixedly arranged relative to the wafer loading module; The displacement measuring device is used to measure the displacement information of the connecting slider (16); the conveying drive device can also drive the conveying arm (14) to move along the conveying track (15).

Images