Limiting carrier for film pasting process of scribing machine
By designing a limiting vehicle for scribing machines, the combination of chip insertion grooves, positioning holes and limiting pins is used to solve the problem of inconsistent position of the chip on the positioning ring and the film, and the efficient chip positioning and filming process is achieved, improving quality and efficiency.
Patent Information
- Application Number
- CN202421719877.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-19
- Publication Date
- 2025-05-16
- Estimated Expiration
- 2034-07-19
AI Technical Summary
There is no limit fixture in the prior art, which leads to inconsistent position of the positioning ring on the scriber and the posting film on the scriber, resulting in errors in the position of the scribed film.
A limiting vehicle for film-adding process of scribers is designed, including a limiting vehicle, a positioning ring and affixed film. Through the combination of chip insertion groove, positioning hole and limiting pin, the precise positioning and pasting of the chip is achieved.
Through the design of the limit vehicle, the consistency of the chip on the adhesive film is ensured, the quality of the cutting film is improved, the working time for repeated point-taking and positioning is reduced, and the number and cost of the vehicle is reduced.
Smart Images
Figure CN222883500U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of electronic manufacturing industry, in particular to a position limiting carrier used in a film pasting process of a dicing machine. Background Art
[0002] The dicing machine is used to cut electronic components such as semiconductor chips, LED chips, and power devices. The chips are loaded on a carrier and placed on the dicing machine for cutting and film pasting. They are often used in the production of various electronic products. Since there is no limiting fixture in the prior art, it is impossible to ensure that the same model of finished panels to be diced are posted in the same position on the positioning ring and the pasting film, which leads to a certain error in the position of dicing and pasting films of the same model. Repeated positioning and point selection are required during dicing and pasting to ensure the consistency of the posting position of the same model of finished panels to be diced on the positioning ring. Therefore, it is necessary to provide a limiting carrier for the film pasting process of the dicing machine, which can solve the problem of inconsistent posting positions of the panels to be diced on the positioning ring in the prior art. Summary of the invention
[0003] The utility model aims to provide a position limiting carrier for the film pasting process of a dicing machine, which can solve the problem of inconsistent pasting positions of each to-be-diced panel on a positioning ring in the prior art.
[0004] The utility model is achieved in this way:
[0005] A limiting carrier used in a film pasting process of a dicing machine comprises a limiting carrier, a positioning ring and an adhesive film; a chip embedding groove is formed on the limiting carrier, and the chip is embedded in the limiting carrier through the chip embedding groove; a plurality of first positioning holes are formed on the positioning ring, and a plurality of second positioning holes are formed on the adhesive film, so that the adhesive film is pasted on the positioning ring, and the plurality of second positioning holes are aligned one by one with the plurality of first positioning holes; a plurality of limiting pins are formed on the limiting carrier, and the limiting carrier is installed on the positioning ring, and the plurality of limiting pins respectively pass through the plurality of first positioning holes and the plurality of second positioning holes, so that the chip is pasted on the adhesive film.
[0006] The chip embedding groove comprises a first chip embedding groove and a second chip embedding groove which are overlapped, and the chip comprises a first chip and a second chip. The first chip is matched and embedded in the first chip embedding groove, and the second chip is matched and embedded in the second chip embedding groove.
[0007] The first chip embedding groove and the second chip embedding groove are both provided with a plurality of positioning pins, and the first chip and the second chip are both provided with a plurality of positioning pin holes, so that the plurality of positioning pins are correspondingly inserted into the plurality of positioning pin holes, so that the first chip is positioned and embedded in the first chip embedding groove, and the second chip is positioned and embedded in the second chip embedding groove.
[0008] The groove body depth of the first chip embedding groove is different from the groove body depth of the second chip embedding groove.
[0009] The number and arrangement of the first positioning holes, the second positioning holes and the limiting pins are consistent.
[0010] The first positioning hole, the second positioning hole and the limiting pin are each provided in three numbers and are arranged at three vertex angles of a triangle.
[0011] The positioning ring is annular in structure, so that after the limiting carrier is installed on the positioning ring, the positioning ring surrounds the outer side of the chip embedding groove in the circumferential direction.
[0012] Compared with the prior art, the utility model has the following beneficial effects:
[0013] 1. The utility model is provided with a limiting carrier, a positioning ring and an adhesive film. The limiting carrier loads the chip through the chip embedding groove. The limiting carrier, the positioning ring and the adhesive film are assembled after positioning through three groups of first positioning holes, second positioning holes and limiting pins, thereby ensuring the consistency of each assembly position, thereby ensuring the consistency of the chip's pasting position on the adhesive film, thereby ensuring the quality of the cut film and avoiding repeated point positioning that wastes time.
[0014] 2. The utility model is provided with overlapping first chip embedding grooves and second chip embedding grooves, so that the limiting carrier can be used for loading different chips, thereby meeting the cutting and laminating requirements of different chips, without the need to replace the carrier, thereby reducing the number and cost of the carrier, and through the corresponding arrangement of several groups of positioning pins and positioning pin holes, the loading stability and accuracy of the chip in the corresponding chip embedding groove is guaranteed. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 This is a schematic diagram of the assembly of a position limiting carrier used in the film laminating process of a dicing machine according to the utility model from a side view;
[0016] Figure 2 It is a schematic assembly diagram of the limiting carrier used in the film laminating process of the dicing machine of the utility model from another side perspective;
[0017] Figure 3 It is a schematic diagram of the assembly of the positioning ring and the adhesive film in the limiting carrier used in the film pasting process of the dicing machine of the utility model;
[0018] Figure 4 It is an assembly schematic diagram of a limiting carrier loaded with a first chip in a limiting carrier used in a film attaching process of a dicing machine according to the utility model;
[0019] Figure 5 It is an assembly schematic diagram of a limiting carrier loaded with a second chip in a limiting carrier used in a film attaching process of a dicing machine according to the utility model;
[0020] Figure 6 It is a front view of a positioning ring in a limiting carrier used in a film pasting process of a dicing machine according to the utility model.
[0021] In the figure, 1 is a limiting carrier, 11 is a chip embedding groove, 111 is a first chip embedding groove, 112 is a second chip embedding groove, 113 is a positioning pin, 12 is a limiting pin, 2 is a positioning ring, 21 is a first positioning hole, 3 is an adhesive film, 31 is a second positioning hole, 41 is a first chip, 42 is a second chip, and 43 is a positioning pin hole. DETAILED DESCRIPTION
[0022] The utility model is further described below in conjunction with the accompanying drawings and specific embodiments.
[0023] Please see attached Figure 1 To Attachment Figure 6 A limiting carrier for a film pasting process of a dicing machine comprises a limiting carrier 1, a positioning ring 2 and an adhesive film 3; a chip embedding groove 11 is formed on the limiting carrier 1, and the chip is embedded in the limiting carrier 1 through the chip embedding groove 11; a plurality of first positioning holes 21 are formed on the positioning ring 2, and a plurality of second positioning holes 31 are formed on the adhesive film 3, so that the adhesive film 3 is pasted on the positioning ring 2, and the plurality of second positioning holes 31 are aligned one by one with the plurality of first positioning holes 21; a plurality of limiting pins 12 are formed on the limiting carrier 1, the limiting carrier 1 is installed on the positioning ring 2, and the plurality of limiting pins 12 respectively pass through the plurality of first positioning holes 21 and the plurality of second positioning holes 31, so that the chip is pasted on the adhesive film 3.
[0024] Preferably, the number of the first positioning hole 21, the second positioning hole 31 and the limiting pin 12 are the same, and three of them can be set. The three-point positioning is used to ensure that the limiting carrier 1, the positioning ring 2 and the adhesive film 3 have high positioning accuracy during assembly, avoid the error of the film position, and thus ensure the consistency of the pasting position of each chip of the same model on the adhesive film 3.
[0025] The chip embedding groove 11 can be adaptively set according to the size and shape of the chip to be cut and pasted on the film, thereby ensuring the stability of the chip on the limiting carrier 1 through the chip embedding groove 11, avoiding slippage and displacement, and further ensuring the consistency of the chip's pasting position on the adhesive film 3.
[0026] Please see attached Figure 4 and attached Figure 5 The chip embedding groove 11 includes a first chip embedding groove 111 and a second chip embedding groove 112 that are overlapped, and the chip includes a first chip 41 and a second chip 42. The first chip 41 is matched and embedded in the first chip embedding groove 111, and the second chip 42 is matched and embedded in the second chip embedding groove 112.
[0027] According to the thickness of the limiting carrier 1 and the thickness of the chip, two chip embedding grooves 11 are set, namely the first chip embedding groove 111 and the second chip embedding groove 112. The number of chip embedding grooves 11 can also be appropriately increased or decreased according to actual production needs to load corresponding chips.
[0028] Please see attached Figure 4 and attached Figure 5 The first chip embedding groove 111 and the second chip embedding groove 112 are both provided with a plurality of positioning pins 113, and the first chip 41 and the second chip 42 are both provided with a plurality of positioning pin holes 43, so that the plurality of positioning pins 113 are correspondingly inserted into the plurality of positioning pin holes 43, so that the first chip 41 is positioned and embedded in the first chip embedding groove 111, and the second chip 42 is positioned and embedded in the second chip embedding groove 112.
[0029] The locating pins 113 and the locating pin holes 43 are arranged in pairs. Preferably, three pairs of locating pins 113 and locating pin holes 43 are arranged in a triangle, so that the chips can be positioned quickly and accurately, so that the first chip 41 is positioned and embedded in the first chip embedding groove 111, and the second chip 42 is positioned and embedded in the second chip embedding groove 112.
[0030] Please see attached Figure 1 , Attachment Figure 4 and attached Figure 5 , the groove depth of the first chip embedding groove 111 is different from the groove depth of the second chip embedding groove 112.
[0031] The groove depth of the first chip embedding groove 111 can be adaptively set according to the thickness of the first chip 41 , and the groove depth of the second chip embedding groove 112 can be adaptively set according to the thickness of the second chip 42 .
[0032] The number and arrangement of the first positioning holes 21, the second positioning holes 31 and the limiting pins 12 are consistent to ensure the consistency of each assembly of the limiting carrier 1, the positioning ring 2 and the adhesive film 3, thereby ensuring the consistency of the pasting position of the chip in the limiting carrier 1 on the adhesive film 3.
[0033] Please see attached Figure 1 and attached Figure 2 The first positioning hole 21, the second positioning hole 31 and the limiting pin 12 are each provided in three numbers, and are arranged at three vertices of a triangle.
[0034] The positioning ring 2 is annular in structure, so that after the limiting carrier 1 is installed on the positioning ring 2, the positioning ring 2 surrounds the outside of the chip embedding groove 11 in the circumferential direction to ensure that the chip in the chip embedding groove 11 located in the middle of the limiting carrier 1 can be reliably attached to the adhesive film 3.
[0035] Please see attached Figure 1 To Attachment Figure 6 The method of using the utility model in the film cutting process of the dicing machine is:
[0036] When the product to be cut is the first chip 41, the adhesive film 3 is first pasted on the positioning ring 2 by aligning the three second positioning holes 31 with the three first positioning holes 21 to ensure the consistency of the pasting position of the adhesive film 3 and the positioning ring 2 each time. The first chip 41 is embedded in the first chip embedding groove 111 and is positioned and fixed by three positioning pins 113 penetrating the three positioning pin holes 43.
[0037] The limiting carrier 1 is assembled with the positioning ring 2 through the three limiting pins 12 and the first positioning hole 21. Since the adhesive film 3 is sticky, the adhesive film 3 is adhered to the first chip 41 on the limiting carrier 1, and then the cutting operation is performed.
[0038] The above method is used when each first chip 41 is cut and film-bonded, so that the cutting and film-bonding positions of the first chip 41 each time have good consistency.
[0039] Similarly, when the product to be cut is the second chip 42, the adhesive film 3 is first pasted on the positioning ring 2 by aligning the three second positioning holes 31 with the three first positioning holes 21, ensuring the consistency of the pasting position of the adhesive film 3 and the positioning ring 2 each time. The second chip 42 is embedded in the second chip embedding groove 112, and is positioned and fixed by three positioning pins 113 penetrating the three positioning pin holes 43.
[0040] The limiting carrier 1 is assembled with the positioning ring 2 through the three limiting pins 12 and the first positioning hole 21. Since the adhesive film 3 is sticky, the adhesive film 3 is adhered to the first chip 41 on the limiting carrier 1, and then the cutting operation is performed.
[0041] The above method is used when each second chip 42 is cut and film-bonded, so that the cutting and film-bonding positions of the second chip 42 each time have good consistency.
[0042] The above are only preferred embodiments of the present invention and are not intended to limit the scope of protection of the present invention. Therefore, any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.
Claims
1. A limiting carrier for a film attaching process of a dicing machine, characterized by: The invention comprises a limiting carrier (1), a positioning ring (2) and an adhesive film (3); a chip embedding groove (11) is formed on the limiting carrier (1), and the chip is embedded in the limiting carrier (1) through the chip embedding groove (11); a plurality of first positioning holes (21) are formed on the positioning ring (2), and a plurality of second positioning holes (31) are formed on the adhesive film (3), so that the adhesive film (3) is attached to the positioning ring (2), and the plurality of second positioning holes (31) are aligned one by one with the plurality of first positioning holes (21); a plurality of limiting pins (12) are formed on the limiting carrier (1), and the limiting carrier (1) is mounted on the positioning ring (2), and the plurality of limiting pins (12) respectively pass through the plurality of first positioning holes (21) and the plurality of second positioning holes (31), so that the chip is attached to the adhesive film (3).
2. The position limiting carrier for the film attaching process of a dicing machine according to claim 1 is characterized in that: The chip embedding groove (11) comprises a first chip embedding groove (111) and a second chip embedding groove (112) which are arranged in an overlapping manner, and the chip comprises a first chip (41) and a second chip (42), the first chip (41) is matched and embedded in the first chip embedding groove (111), and the second chip (42) is matched and embedded in the second chip embedding groove (112).
3. The position limiting carrier for the film attaching process of a dicing machine according to claim 2, characterized in that: The first chip embedding groove (111) and the second chip embedding groove (112) are both provided with a plurality of positioning pins (113), and the first chip (41) and the second chip (42) are both provided with a plurality of positioning pin holes (43), so that the plurality of positioning pins (113) are correspondingly inserted into the plurality of positioning pin holes (43), so that the first chip (41) is positioned and embedded in the first chip embedding groove (111), and the second chip (42) is positioned and embedded in the second chip embedding groove (112).
4. The position limiting carrier for the film attaching process of a dicing machine according to claim 2 or 3, characterized in that: The groove body depth of the first chip embedding groove (111) is different from the groove body depth of the second chip embedding groove (112).
5. The position limiting carrier for the film attaching process of a dicing machine according to claim 1, characterized in that: The number and arrangement of the first positioning holes (21), the second positioning holes (31) and the limiting pins (12) are consistent.
6. The position limiting carrier for the film attaching process of a dicing machine according to claim 5, characterized in that: The first positioning hole (21), the second positioning hole (31) and the limiting pin (12) are each provided in three numbers and are arranged at three vertices of a triangle.
7. The position limiting carrier for the film attaching process of a dicing machine according to claim 1, characterized in that: The positioning ring (2) is in an annular structure, so that after the limiting carrier (1) is installed on the positioning ring (2), the positioning ring (2) surrounds the outer side of the chip embedding groove (11) in the circumferential direction.