Wafer surface atomization cleaning device and equipment

Abstract

The utility model provides a wafer surface atomization cleaning device and equipment, and is applied to the technical field of semiconductor cleaning equipment, the wafer surface atomization cleaning device comprises a first spraying arm, the side, facing a wafer, of the lower surface of a first spraying arm body is provided with a plurality of first liquid nozzles, and the first liquid nozzles are in fluid connection with cleaning medicine liquid through first liquid spraying pipes; a plurality of second liquid nozzles are arranged on the side, facing the wafer, of the lower surface of a second spraying arm body, and the second liquid nozzles are in fluid connection with the cleaning liquid medicine through second liquid spraying pipes; the first spraying arm connecting end and the second spraying arm connecting end are connected with each other to form a spraying arm connecting part, a plurality of gas nozzles are arranged, and an included angle larger than or equal to 120 degrees is formed among the first spraying arm free end, the spraying arm connecting part and the second spraying arm free end; the spraying range of the gas nozzle is at least partially overlapped with the spraying ranges of the first liquid nozzle and the second liquid nozzle. According to the cleaning device provided by the invention, the problem that wafer cleaning is not uniform enough in the wafer cleaning process can be solved, and the wafer cleaning quality and the wafer cleaning efficiency are improved.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductor cleaning equipment, and in particular to a wafer surface atomization cleaning device and equipment. Background Art

[0002] Wafer cleaning refers to the process of removing contaminants from the surface of silicon wafers (wafers) during the semiconductor manufacturing process. In integrated circuit manufacturing, during multiple processing steps such as film deposition, etching and polishing steps performed on semiconductor wafers, impurities, residues or metal particles may be attached to the chip surface. In the semiconductor manufacturing process, if there are particles on the wafer, it may cause short circuits, open circuits, signal interference and other problems, seriously affecting the performance and reliability of the device. Therefore, effective wafer cleaning is one of the key links in the entire chip manufacturing process, which directly affects the quality and production efficiency of the final product.

[0003] To ensure the performance and reliability of the circuits, the wafers need to be meticulously cleaned after each step. The cleaning process uses a variety of chemical solutions and physical methods, including wet cleaning (using solvents and ultrasound to remove stains), dry cleaning (such as cleaning after sputtering or chemical vapor deposition), and plasma cleaning (removing organic and inorganic materials through high-energy plasma).

[0004] In the prior art, the cleaning nozzle types of single-wafer cleaning machines are basically single-hole arm scanning spray liquid. Due to the concentrated spraying direction, it is difficult to ensure the uniformity of the liquid spraying on the wafer surface during cleaning, and the wafer Particleperformance (particle quality control index on the wafer surface) is poor, especially when entering higher-level processes, higher requirements are placed on product reliability (for example, uniformity is required to be ≤1.5%); in addition, the amount of acid used in the single-wafer cleaning liquid in the traditional cleaning mode is relatively high (about 2L / pcs) to ensure clean cleaning, which is costly and may cause wafer damage.

[0005] Therefore, in the semiconductor manufacturing process, especially in the wafer cleaning process, how to clean the wafer more evenly, improve the cleaning quality without damaging the wafer, and improve the cleaning efficiency is a crucial issue. Utility Model Content

[0006] In view of this, the embodiment of the present application provides a wafer surface atomization cleaning device, which can solve the problem of uneven wafer cleaning in the prior art, improve the wafer cleaning quality, and improve the cleaning efficiency. The technical solution is as follows:

[0007] The present application provides a wafer surface atomization cleaning device, the cleaning device comprising:

[0008] A first spray arm, the first spray arm comprising a first spray arm body, a first spray arm connecting end and a first spray arm free end; a plurality of first liquid nozzles are arranged on the lower surface of the first spray arm body facing the wafer side, and the first liquid nozzles are connected to the cleaning liquid fluid through a first liquid nozzle;

[0009] A second spray arm, the second spray arm comprising a second spray arm body, a second spray arm connecting end and a second spray arm free end; a plurality of second liquid nozzles are arranged on the lower surface of the second spray arm body facing the wafer side, and the second liquid nozzles are connected to the cleaning liquid fluid through a second liquid nozzle;

[0010] The first spray arm connection end and the second spray arm connection end are connected to each other to form a spray arm connection part, the spray arm connection part is provided with a plurality of gas nozzles, and an angle greater than or equal to 120° is formed between the first spray arm free end, the spray arm connection part and the second spray arm free end;

[0011] A spraying range of the gas nozzle at least partially overlaps with spraying ranges of the first liquid nozzle and the second liquid nozzle.

[0012] Further, the number of the first liquid nozzles, the number of the second liquid nozzles and the number of the gas nozzles are equal.

[0013] Furthermore, the connection mode between the first spray arm connection end and the second spray arm connection end includes a fixed connection and a detachable connection.

[0014] Furthermore, the first liquid nozzle and the second liquid nozzle are arranged at the same level, and the gas nozzle is arranged at a higher level than the first liquid nozzle and the second liquid nozzle.

[0015] Furthermore, the first liquid nozzle, the second liquid nozzle and the gas nozzle are all arranged vertically downward toward the wafer to be cleaned.

[0016] Furthermore, the gas-liquid nozzle is a straight tube, a spiral tube or a Laval nozzle structure.

[0017] Furthermore, a gas delivery pipeline and a liquid delivery pipeline are also provided inside the main body, the gas delivery pipeline is connected to the gas nozzle, and the liquid delivery pipeline is connected to the first liquid nozzle and the second liquid nozzle.

[0018] On the other hand, an embodiment of the present application provides a wafer surface atomization cleaning device for performing atomization cleaning on a wafer placed on a rotating platform in a cleaning chamber, the cleaning device comprising:

[0019] Equipment body;

[0020] A rotating platform, connected to the equipment body, for placing the wafer to be cleaned;

[0021] A spray bracket, one end of which is connected to the equipment body;

[0022] As described in the above aspect, the wafer surface atomizing cleaning device is connected to the spray bracket, and the wafer surface atomizing cleaning device is arranged toward the rotating platform.

[0023] Compared with the prior art, the at least one technical solution adopted in the embodiments of this specification can achieve the following beneficial effects:

[0024] 1. The wafer surface atomization cleaning device is symmetrically arranged with a first spray arm and a second spray arm, which form an angle greater than or equal to 120°. The first liquid nozzle is arranged on the first spray arm, the second liquid nozzle is arranged on the second spray arm, and the gas nozzle is arranged on the spray arm connection portion formed by connecting the side walls of the first spray arm and the second spray arm. The device can effectively increase the atomization cleaning area and replace the scanning type wafer cleaning.

[0025] 2. By rationally designing the structure of the wafer surface atomization cleaning device, the atomization cleaning covers a large area and can spray the liquid more evenly. Under the same wafer uniformity requirements, the cleaning efficiency is higher and the amount of acid required for the liquid can be reduced accordingly, saving costs while protecting the wafer from damage.

[0026] 3. Through the design of the gas nozzle and the first and second liquid nozzles, the liquid sprayed from the nozzle collides with the high-pressure gas at the intersection to form atomized liquid, and accelerates downward to the wafer surface for atomization cleaning. Atomization effectively reduces the size of the liquid particles and also reduces the energy carried by the particles, thereby preventing damage to the wafer surface pattern. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0028] Figure 1 A front schematic diagram of a wafer surface cleaning device provided by an exemplary embodiment of the present application is shown;

[0029] Figure 2 A side schematic diagram of a wafer surface cleaning device provided by an exemplary embodiment of the present application is shown;

[0030] FIG. 3( a ) shows a particle quality analysis diagram of a wafer surface provided by the prior art;

[0031] FIG3( b ) shows a particle quality analysis diagram of a wafer surface provided by an exemplary embodiment of the present application; DETAILED DESCRIPTION

[0032] The specific implementation of the utility model is further described in detail below with reference to the accompanying drawings.

[0033] The following describes the implementation methods of the present application through specific examples, and those skilled in the art can easily understand other advantages and effects of the present application from the contents disclosed in this specification. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. The present application can also be implemented or applied through other different specific implementation methods, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present application. It should be noted that, in the absence of conflict, the following embodiments and the features in the embodiments can be combined with each other. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work belong to the scope of protection of the present application.

[0034] It should be noted that the terms "first", "second", etc. in the specification, claims and drawings of the utility model are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the utility model described here can be implemented in an order other than those illustrated or described here. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions.

[0035] In the following specific implementation of the present invention, please refer to Figure 1 , Figure 1 This is a schematic diagram of the appearance and structure of a wafer surface atomization cleaning device according to a preferred embodiment of the utility model. Figure 1 As shown, a wafer surface atomization cleaning device of the utility model can be applied to, for example, a single-wafer wet cleaning device to perform atomization cleaning on a wafer placed on a rotating platform. The cleaning device of the utility model includes a first spray arm 11, a second spray arm 12, a spray arm connecting portion 13, a first liquid nozzle 21, a second liquid nozzle 22, a gas nozzle 23, a first and a second liquid nozzle and a gas nozzle (not shown in the figure).

[0036] Specifically, the first spray arm 11 includes a first spray arm 11 body, a first spray arm 11 connecting end and a first spray arm free end. A plurality of first liquid nozzles 21 are arranged on the lower surface of the first spray arm 11 body toward the wafer side, and the first liquid nozzles 21 are connected to the cleaning liquid fluid through a first liquid nozzle. The second spray arm 12 includes a second spray arm 12 body, a second spray arm 12 connecting end and a second spray arm 12 free end. A plurality of second liquid nozzles 22 are arranged on the lower surface of the second spray arm 12 body toward the wafer side. The second liquid nozzle 22 is connected to the cleaning liquid fluid through the second liquid nozzle; the connecting end of the first spray arm 11 and the connecting end of the second spray arm 12 are connected to each other to form a spray arm connecting part 13, and the spray arm connecting part 13 is provided with a plurality of gas nozzles 23, and an angle greater than or equal to 120° is formed between the free end of the first spray arm 11, the spray arm connecting part 13, and the free end of the second spray arm 12; the spraying range of the gas nozzle 23 at least partially overlaps with the spraying range of the first liquid nozzle 21 and the second liquid nozzle 22.

[0037] Further, the first spray arm 11 and the second spray arm 12 are symmetrically arranged downwardly, the side walls of the first spray arm 11 and the second spray arm 12 are connected to each other to form an angle, a spray arm connection portion 13 is formed at the place where the side walls of the first spray arm 11 and the second spray arm 12 are connected to each other, and the first spray arm 11 and the second spray arm 12 are axially symmetrical about the spray arm connection portion 13. Preferably, the first spray arm 11 and the second spray arm 12 further include a shell and a cavity, the shell can be used to install a nozzle, and the cavity can be used to accommodate components such as a gas delivery pipe and a liquid delivery pipe.

[0038] The nozzle 2 is arranged below the main body 1. Specifically, the nozzle 2 includes multiple first liquid nozzles 21, multiple second liquid nozzles 22 and multiple gas nozzles 23. The first liquid nozzle 21 is arranged on the first spray arm 11, the second liquid nozzle 22 is arranged on the second spray arm 12, and the gas nozzle 23 is arranged on the spray arm connecting part formed by connecting the side walls of the first spray arm 11 and the second spray arm 12.

[0039] Multiple gas nozzles and multiple liquid nozzles, the gas nozzles are connected to the gas nozzles 23 one by one, for introducing high-pressure gas, and the liquid nozzles are connected to the first liquid nozzles 21 and the second liquid nozzles 22 one by one, for introducing cleaning liquid. Exemplarily, the gas-liquid nozzles are straight tubes, spiral tubes or Laval nozzle structures, for pressurizing the introduced gas or liquid so that the nozzles release liquid droplets or release high-pressure gas.

[0040] Among them, the cleaning liquid introduced by the liquid nozzle is accelerated by the liquid nozzle and then sprayed out from the first liquid nozzle 21 and the second liquid nozzle 22. At the same time, the high-pressure gas introduced by the gas nozzle is accelerated by the gas nozzle and then sprayed out from the gas nozzle 23. The liquid sprayed from the first liquid nozzle 21 and the second liquid nozzle 22 collides with the high-pressure gas sprayed from the gas nozzle 23 at the intersection to form atomized liquid, and is accelerated downward to the wafer surface for atomized cleaning.

[0041] In the above embodiment, by reasonably designing the structure of the wafer surface atomization cleaning device, the atomization cleaning area can be effectively increased, the wafer atomization cleaning coverage area is large, and the liquid medicine can be sprayed more evenly without scanning cleaning, the cleaning efficiency is higher, and the wafer uniformity requirements can be better met. In addition, through the design of the gas nozzle and the first and second liquid nozzles, the sprayed liquid medicine and the sprayed high-pressure gas collide at the intersection to form atomized liquid medicine, and accelerate downward to the wafer surface for atomization cleaning. Atomization effectively reduces the size of the liquid medicine particles, and also reduces the energy carried by the particles, thereby preventing damage to the wafer surface pattern.

[0042] In a possible implementation, Figure 2 As shown, Figure 2 A schematic side view of a wafer surface cleaning device provided by an exemplary embodiment of the present application is shown, showing a first spray arm 11, a second spray arm 12, a spray arm connection portion 13, a first liquid nozzle 21 provided on the first spray arm 11, a second liquid nozzle 22 provided on the second spray arm 12, and a gas nozzle 23 provided on the spray arm connection portion 13 formed by connecting the side walls of the first spray arm 11 and the second spray arm 12. Compared with the above-mentioned embodiment, the number of the first liquid nozzles 21, the number of the second liquid nozzles 22 and the number of the gas nozzles 23 in this scheme are all equal. By providing the same number of the first liquid nozzles 21, the second liquid nozzles 22 and the gas nozzles 23, it can be ensured that the sprayed liquid can be quantitatively and fully atomized with the high-pressure gas, and the atomized droplets will not be too large or too small, so that the atomized liquid sprayed on the wafer surface is more uniform and covers a larger area.

[0043] Preferably, the number of the first liquid nozzles 21, the number of the second liquid nozzles 22 and the number of the gas nozzles 23 is at least 20 and are evenly distributed in the horizontal direction. A wafer surface cleaning device with a reasonable number of nozzles can ensure that the sprayed atomized liquid fully covers the wafer surface without omission, and evenly cleans the wafer surface.

[0044] Preferably, the first liquid nozzle 21 and the second liquid nozzle 22 are arranged at the same horizontal height, and the horizontal height of the gas nozzle 23 is higher than that of the first liquid nozzle 21 and the second liquid nozzle 22. It is ensured that the liquid droplets sprayed by the first liquid nozzle 21 and the second liquid nozzle 22 can fully collide with the high-pressure gas sprayed by the gas nozzle 23 to generate atomized liquid medicine. Optionally, the high-pressure gas is an inert gas. Preferably, the inert gas can be selected from nitrogen, argon or helium. The pressure range can be from several hundred Pascals (Pa) to several thousand Pascals (kPa), which is set in advance according to the specific application environment. Preferably, the first liquid nozzle, the second liquid nozzle and the gas nozzle are all arranged vertically downward toward the wafer to be cleaned to ensure that the atomized liquid medicine can fully cover the wafer to be cleaned.

[0045] Preferably, a gas delivery pipeline and a liquid delivery pipeline (not shown) are further provided inside the main body, the gas delivery pipeline is connected to the gas nozzle, and the liquid delivery pipeline is connected to the first liquid nozzle and the second liquid nozzle. Preferably, the main body includes a shell and a cavity, and the gas delivery pipeline and the liquid delivery pipeline are accommodated inside the cavity.

[0046] As an optional implementation, the main body of the wafer surface atomization cleaning device can be connected to the spray bracket of the cleaning equipment through a fixed bracket. Specifically, the main body and the fixed bracket can be provided with threaded holes and bolts for screw connection, so as to facilitate the separation of the cleaning device and the cleaning equipment. The main body and the spray bracket can also be connected by riveting, gluing or welding, or the main body and the spray bracket can be fixed by other fixing methods. Optionally, the spray bracket can be a fixed bracket or a movable bracket, which is selected according to the actual implementation environment.

[0047] In practical applications, such as Figure 3(a) , 3(b)As shown, FIG3(a) shows a wafer surface particle quality analysis diagram provided by the prior art, and FIG3(b) shows a wafer surface particle quality analysis diagram provided by an exemplary embodiment of the present application. Specifically, FIG3(a) is a 12-inch single-wafer cleaning machine, which adopts a single-hole spray arm scanning method to spray liquid on the wafer surface. The amount of acid used when cleaning a single wafer / substrate is 2L / pcs. The left figure of FIG3(a) is a schematic diagram of liquid distribution. It can be seen from the figure that the liquid is not sprayed evenly, and is mainly concentrated in the middle and lower part of the wafer. Less liquid is sprayed on the edge of the wafer. The right figure of FIG3(a) is a schematic diagram of residual particles on the wafer surface. It can be seen that after one cleaning, there are still many residual particles on the wafer surface. FIG3(b) uses the wafer surface atomization cleaning device of the embodiment of the present application to clean the wafer, spraying liquid on the wafer surface in a comprehensive coverage manner, reducing the amount of acid used by 50% compared to the traditional technology for cleaning a single wafer / substrate. The left figure of FIG3(b) is a schematic diagram of liquid distribution. It can be seen from the figure that the liquid spray is evenly scattered from the center to the surroundings, and the spraying is relatively uniform. The right figure of FIG3(b) is a schematic diagram of residual particles on the wafer surface. It can be seen that after one cleaning, the particles on the wafer surface are less residual than those in FIG3(a). Through technical analysis, compared with the traditional method of cleaning the wafer, the use of a wafer surface atomization device for cleaning can improve the uniformity of the wafer surface by more than 60%; the number of particles (particle quality control indicators on the wafer surface) can be reduced by 30%, which can meet the semiconductor manufacturing process with higher requirements for product reliability (for example, requiring the uniformity of the wafer after cleaning to be Uniformity≤1.5%).

[0048] In the above embodiment, the wafer surface atomization cleaning device of the present application can increase the wafer atomization cleaning area, replace the scanning type wafer cleaning, the operation is simpler and more convenient, and the wafer is cleaned more evenly. At the same time, due to the improved cleaning efficiency, the amount of acid used in the cleaning solution can be appropriately reduced, further protecting the wafer from damage during cleaning and reducing the cost of wafer cleaning.

[0049] An embodiment of the present application provides a wafer surface atomization cleaning device for performing atomization cleaning on a wafer placed on a rotating platform in a cleaning chamber. The cleaning device includes: an equipment body, a rotating platform, a spray bracket, and the wafer surface atomization cleaning device in the above embodiment.

[0050] The rotating platform is connected to the equipment body and is used to place the wafers to be cleaned; one end of the spray bracket is connected to the equipment body; the wafer surface atomization cleaning device is connected to the spray bracket, and the wafer surface atomization cleaning device is arranged toward the rotating platform.

[0051] In summary, in the embodiment of the present application, the wafer surface atomization cleaning device is symmetrically inclined downwardly and is provided with a first spray arm and a second spray arm, the two forming an angle greater than or equal to 120°, the first liquid nozzle is arranged on the first spray arm, the second liquid nozzle is arranged on the second spray arm, and the gas nozzle is arranged on the spray arm connection portion formed by the side walls of the first spray arm and the second spray arm. The device can effectively increase the atomization cleaning area, replace the scanning type wafer cleaning, and the cleaning liquid introduced by the liquid nozzle is accelerated by the liquid nozzle and ejected from each first liquid nozzle and the second liquid nozzle. At the same time, the high-pressure gas introduced by the gas nozzle is accelerated by the gas nozzle and ejected from the gas nozzle. The liquid sprayed from the nozzle collides with the ejected high-pressure gas at the intersection to form an atomized liquid, and accelerates downward to the wafer surface for atomization cleaning. The atomization cleaning coverage area of ​​the cleaning device is large, and the liquid can be sprayed more evenly. Under the same wafer uniformity requirements, the cleaning efficiency is higher, and the problem of uneven wafer cleaning is solved, which improves the wafer cleaning quality and the cleaning efficiency. At the same time, due to the improvement in cleaning efficiency, the amount of acid used in the cleaning solution can be appropriately reduced, further protecting the wafer from damage during cleaning while reducing costs.

[0052] In this specification, the same or similar parts between the various embodiments can be referred to each other, and each embodiment focuses on the differences from other embodiments. In particular, for the embodiments described later, the description is relatively simple, and the relevant parts can be referred to the partial description of the previous embodiments.

[0053] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed in the present application should be included in the protection scope of the present application. Therefore, the protection scope of the present application shall be based on the protection scope of the claims.

Claims

1. A wafer surface atomization cleaning device, characterized in that: The wafer surface atomization cleaning device comprises: A first spray arm, the first spray arm comprising a first spray arm body, a first spray arm connecting end and a first spray arm free end; a plurality of first liquid nozzles are arranged on the lower surface of the first spray arm body facing the wafer side, and the first liquid nozzles are connected to the cleaning liquid fluid through a first liquid nozzle; A second spray arm, the second spray arm comprising a second spray arm body, a second spray arm connecting end and a second spray arm free end; a plurality of second liquid nozzles are arranged on the lower surface of the second spray arm body facing the wafer side, and the second liquid nozzles are connected to the cleaning liquid fluid through a second liquid nozzle; The first spray arm connection end and the second spray arm connection end are connected to each other to form a spray arm connection part, the spray arm connection part is provided with a plurality of gas nozzles, and an angle greater than or equal to 120° is formed between the first spray arm free end, the spray arm connection part and the second spray arm free end; A spraying range of the gas nozzle at least partially overlaps with spraying ranges of the first liquid nozzle and the second liquid nozzle.

2. The wafer surface atomization cleaning device according to claim 1, characterized in that: The number of the first liquid nozzles, the number of the second liquid nozzles, and the number of the gas nozzles are equal.

3. The wafer surface atomization cleaning device according to claim 1, characterized in that: The connection modes of the first spray arm connection end and the second spray arm connection end include fixed connection and detachable connection.

4. The wafer surface atomization cleaning device according to claim 1, characterized in that: The first liquid nozzle and the second liquid nozzle are arranged at the same level, and the gas nozzle is arranged at a higher level than the first liquid nozzle and the second liquid nozzle.

5. The wafer surface atomization cleaning device according to claim 1, characterized in that: The first liquid nozzle, the second liquid nozzle and the gas nozzle are all arranged vertically downward toward the wafer to be cleaned.

6. The wafer surface atomization cleaning device according to claim 1, characterized in that: The cleaning device also includes a gas nozzle, which is connected to the gas nozzle in a one-to-one correspondence. The gas nozzle, the first liquid nozzle and the second liquid nozzle are straight tube-shaped, spiral tube-shaped or Laval nozzle structures.

7. The wafer surface atomization cleaning device according to claim 6, characterized in that: A gas delivery pipeline and a liquid delivery pipeline are also provided inside the main body. The gas delivery pipeline is communicated with the gas nozzle, and the liquid delivery pipeline is communicated with the first liquid nozzle and the second liquid nozzle.

8. A wafer surface atomization cleaning device, characterized in that: include: Equipment body; A rotating platform, connected to the equipment body, for placing the wafer to be cleaned; A spray bracket, one end of which is connected to the equipment body; As described in any one of claims 1 to 7, the wafer surface atomizing cleaning device is connected to the spray bracket, and the wafer surface atomizing cleaning device is arranged toward the rotating platform.

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