Ultra-thin wafer storage device
By designing an ultra-thin wafer storage device with optimized front and rear support areas, the problem of bending moments of ultra-thin wafers during storage is solved, achieving higher stability and convenience of robotic arm operation.
Patent Information
- Application Number
- CN202421696555.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-17
- Publication Date
- 2025-05-16
- Estimated Expiration
- 2034-07-17
AI Technical Summary
When stored in the wafer boat, ultra-thin wafers are prone to bending moments due to gravity, which increases the chance of damage, and excessively increasing the contact area between the support and the wafer is not conducive to the removal of the robotic arm.
An ultra-thin wafer storage device is designed, and the bearing portion includes a first side portion and a second side portion, respectively, having a front support area and a rear support area, and by optimizing the shape and position of these areas, it provides stable support while maintaining the operational convenience of the robot arm.
It effectively reduces the bending moment of ultra-thin wafers, improves its stability in storage devices, and ensures that the robotic arm can successfully remove and place the wafers.
Smart Images
Figure CN222883510U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to a wafer storage device, in particular to an ultra-thin wafer storage device. Background Art
[0002] Wafer processing is the foundation of the semiconductor manufacturing industry and is also one of the important processes. Usually, during the process of wafer storage or transportation, the wafers are placed in layers in a wafer boat to prevent the external environment from contaminating the wafers to ensure that the quality of the wafers meets the requirements of subsequent processes, and the wafers are taken out by a robotic arm when necessary. Generally speaking, the wafer boat for placing wafers supports the edges of the wafers through support members on both sides, while the center of the wafer is not supported, so as to facilitate the robotic arm to take out the wafers.
[0003] With the advancement of technology, ultra-thin wafers with relatively thin sizes have been developed to achieve the purpose of chip miniaturization. The contact area between the support members of the conventional wafer boat and the wafer is relatively small, and the support members are usually only extended along the placement direction on both sides of the wafer, so that the center part of the ultra-thin wafer is easily subjected to bending moment due to gravity, increasing the probability of wafer damage. If the contact area between the support members and the wafer is excessively increased, it will be difficult for the robot arm to remove the wafer from the wafer boat.
[0004] Therefore, how to stably place ultra-thin wafers in layers in a wafer boat is a problem that those skilled in the art want to solve. Utility Model Content
[0005] The main purpose of the utility model is to solve the problem that the conventional wafer carrier (wafer boat) placing ultra-thin wafers easily causes bending moment of the wafers.
[0006] To solve the above problems, the utility model provides an ultra-thin wafer storage device including a frame box, which includes a frame body and a plurality of supporting parts. The frame body defines a accommodating space, and the supporting part is located in the accommodating space and defines a plurality of wafer slots for placing a plurality of ultra-thin wafers. In which, the bearing portion includes a first side portion and a second side portion located on a different side from the first side portion and opposite to each other, the first side portion and the second side portion respectively include a front supporting area and a rear supporting area, the front supporting area and the rear supporting area respectively have a first side edge and a second side edge facing each other, a contour of the first side edge of the front supporting area extends from front to back from a center close to the frame body to away from the center, and a contour of the second side edge of the rear supporting area extends from back to front from close to the center to away from the center, a transfer space for a robot arm to enter is defined between the first side portion and the second side portion, and the front supporting areas of the first side portion and the second side portion are separated from each other to define a transfer port connected to the transfer space.
[0007] In one embodiment, there is a front end spacing and a rear end spacing between the front support area of the first side portion and the second side portion, the front end spacing is 0.44 times the outer diameter of the ultra-thin wafer, and the rear end spacing is 0.92 times the outer diameter of the ultra-thin wafer.
[0008] In one embodiment, when the ultra-thin wafer is placed on the supporting portion, the front support area of the first side portion is at an angle of 40° to 45° relative to the center of the ultra-thin wafer, and the front support area of the second side portion is at an angle of 40° to 45° relative to the center of the ultra-thin wafer.
[0009] In one embodiment, when the ultra-thin wafer is placed on the supporting portion, the angle of the rear support area of the first side portion relative to the center of the ultra-thin wafer is between 54° and 58°, and the angle of the rear support area of the second side portion relative to the center of the ultra-thin wafer is between 54° and 58°.
[0010] In one embodiment, the front support area has a front end width, a rear end width, and a depth between the front end width and the rear end width, the front end width is 0.32 times the outer diameter of the ultra-thin wafer, the rear end width is 0.05 times the outer diameter of the ultra-thin wafer, and the depth is 0.28 times the outer diameter of the ultra-thin wafer.
[0011] In one embodiment, the rear support area has a front width, a rear width, and a depth between the front width and the rear width, the front width is 0.05 times the outer diameter of the ultra-thin wafer, the rear width is 0.37 times the outer diameter of the ultra-thin wafer, and the depth is 0.42 times the outer diameter of the ultra-thin wafer.
[0012] In one embodiment, the first side portion and the second side portion further include an intermediate support area located between the front support area and the rear support area, respectively, and the intermediate support areas respectively have a third side edge facing each other, and a contour of the third side edge of the intermediate support area extends straight from back to front.
[0013] In one embodiment, the middle support region has a width and a depth, the width is 0.05 times the outer diameter of the ultra-thin wafer, and the depth is 0.26 times the outer diameter of the ultra-thin wafer.
[0014] In one embodiment, the ultra-thin wafer has a thickness between 30 μm and 250 μm. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 , is a schematic diagram of an ultra-thin wafer storage device according to an embodiment of the utility model;
[0016] Figure 2 , is a schematic diagram of a robot arm placing an ultra-thin wafer into an ultra-thin wafer storage device according to an embodiment of the utility model;
[0017] Figure 3 , is a schematic top view of a bearing portion of an embodiment of the utility model;
[0018] FIG. 4A to FIG. 4C , is a schematic diagram of placing an ultra-thin wafer on a supporting portion according to an embodiment of the utility model.
[0019]
Explanation of symbols
[0020] 10: Frame Box
[0021] 20: Frame body
[0022] 20a: Accommodation space
[0023] 21: Top wall
[0024] 22: Bottom wall
[0025] 23: Sidewall
[0026] 24: Load-bearing unit placement slot
[0027] 30: Bearing part
[0028] 30a: Wafer slot
[0029] 31: First side section
[0030] 311: Front support area
[0031] 311a: first side edge
[0032] 311b: First endpoint
[0033] 311c: Second endpoint
[0034] 312: rear support area
[0035] 312a: Second side edge
[0036] 312b: First endpoint
[0037] 312c: Second endpoint
[0038] 313: Intermediate support area
[0039] 313a: Third side edge
[0040] 32: Second side section
[0041] 321: Front support area
[0042] 321a: First side edge
[0043] 321b: First endpoint
[0044] 321c: Second endpoint
[0045] 322: rear support area
[0046] 322a: Second side edge
[0047] 322b: First endpoint
[0048] 322c: Second endpoint
[0049] 323: Intermediate support area
[0050] 323a: Third side edge
[0051] 33: Transfer space
[0052] 34: Transfer port
[0053] S11, S21: Front end spacing
[0054] S12, S22: rear end spacing
[0055] W11, W21, W31, W41: Front width
[0056] W12, W22, W32, W42: rear end width
[0057] W13, W23, W33, W43, W53, W63: Depth
[0058] W51, W61: Width
[0059] R: Robotic Arm
[0060] R1: load-bearing part
[0061] W: Ultra-thin wafer
[0062] C: Center of the circle
[0063] D: Outer diameter
[0064] t: thickness
[0065] θ1, θ2, θ3, θ4: angle DETAILED DESCRIPTION
[0066] The terms used herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention. Unless the context indicates otherwise, the singular forms "a", "an" and "the" used herein may also include plural forms.
[0067] Directional terms used herein, such as up, down, left, right, front, back and their derivatives or synonyms, refer to the orientation of the elements in the drawings and are not intended to limit the present invention unless otherwise clearly stated in the context. The detailed description and technical content of the present invention are now described as follows in conjunction with the drawings:
[0068] See also Figure 1 and Figure 2 The utility model discloses an ultra-thin wafer storage device, including a frame box 10, wherein a robot arm R is inserted into the frame box 10 to take and place an ultra-thin wafer W, wherein the ultra-thin wafer W has an outer diameter D and a thickness t. In one example, the thickness t of the ultra-thin wafer W is less than 300 μm, and in some other examples, the thickness t is not greater than 250 μm, for example, the thickness t may be between 50 μm and 250 μm, or the thickness t may be between 30 μm and 250 μm.
[0069] The frame box 10 includes a frame body 20 and a plurality of bearing parts 30. The frame body 20 defines a receiving space 20a. The bearing part 30 is located in the receiving space 20a and defines a plurality of wafer slots 30a. The frame body 20 includes a top wall 21, a bottom wall 22, a side wall 23, and a plurality of bearing part placement slots 24. The top wall 21, the bottom wall 22, and the side wall 23 define the receiving space 20a together. The bearing part placement slots 24 are separated along a vertical direction and recessed in the side wall 23 along a horizontal direction. In this example, the plurality of bearing parts 30 are respectively placed in the plurality of bearing part placement slots 24 to separate the receiving space 20a, so as to form a plurality of wafer slots 30a for accommodating the ultra-thin wafer W.
[0070] The supporting portion 30 includes a first side portion 31 and a second side portion 32. The second side portion 32 and the first side portion 31 are located on different sides and opposite to each other. In this embodiment, the first side portion 31 and the second side portion 32 are symmetrically disposed in the frame body 20.
[0071] See also Figure 3The first side portion 31 includes a front support area 311, a rear support area 312 and an intermediate support area 313, and the intermediate support area 313 is located between the front support area 311 and the rear support area 312. The front support area 311 has a first side edge 311a, and the profile of the first side edge 311a extends from a central axis close to the frame body 20 from front to back, away from the central axis, that is, a front end of the first side edge 311a is close to the central axis relative to a rear end, and the profile of the first side edge 311a is an oblique line relative to the central axis. The rear support area 312 has a second side edge 312a, and the profile of the second side edge 312a extends from close to the central axis away from the central axis from back to front, that is, a rear end of the second side edge 312a is close to the central axis relative to a front end, and the profile of the second side edge 312a is an oblique line relative to the central axis. The middle supporting area 313 has a third side edge 313a, the contour of which extends straightly from back to front and is connected between the first side edge 311a and the second side edge 312a. The third side edge 313a is parallel to the central axis and is away from the central axis relative to the first side edge 311a and the second side edge 312a.
[0072] The second side portion 32 includes a front support area 321, a rear support area 322, and an intermediate support area 323, wherein the intermediate support area 323 is located between the front support area 321 and the rear support area 322. The front support area 321 has a first side edge 321a, wherein the profile of the first side edge 321a extends from the front to the rear from close to the central axis to away from the central axis, i.e., a front end of the first side edge 321a is close to the central axis relative to a rear end, and the profile of the first side edge 321a is an oblique line relative to the central axis. The rear support area 322 has a second side edge 322a, wherein the profile of the second side edge 322a extends from the rear to the front from close to the central axis to away from the central axis, i.e., a rear end of the second side edge 322a is close to the central axis relative to a front end, and the profile of the second side edge 322a is an oblique line relative to the central axis. The middle supporting area 323 has a third side edge 323a, the contour of which extends straightly from back to front and is connected between the first side edge 321a and the second side edge 322a. The third side edge 323a is parallel to the central axis and is away from the central axis relative to the first side edge 321a and the second side edge 322a.
[0073] A transfer space 33 is defined between the first side portion 31 and the second side portion 32. The transfer space 33 is for the robot R to enter. The front support area 311 of the first side portion 31 and the front support area 321 of the second side portion 32 are separated from each other to define a transfer port 34. The transfer port 34 is connected to the transfer space 33. The transfer space 33 and the transfer port 34 can accommodate a carrying portion R1 of the robot R, so that the carrying portion R1 can move along the vertical direction in the accommodating space 20a. The first side edge 311a, the second side edge 312a, and the third side edge 313a of the first side portion 31 and the first side edge 321a, the second side edge 322a, and the third side edge 323a of the second side portion 32 are respectively arranged on both sides of the transfer space 33 relative to the central axis.
[0074] See also Figure 4A There is a front end spacing S11 and a rear end spacing S12 between the front support area 311 of the first side portion 31 and the front support area 321 of the second side portion 32. The front end spacing S11 is between 0.35 times and 0.55 times the outer diameter D of the ultra-thin wafer W, and in one example is between 0.4 times and 0.5 times, and preferably is 0.44 times. The rear end spacing S12 is between 0.85 times and 0.95 times the outer diameter D of the ultra-thin wafer W, and in one example is between 0.88 times and 0.93 times, and preferably is 0.92 times.
[0075] There is a front end spacing S21 and a rear end spacing S22 between the rear support area 312 of the first side portion 31 and the rear support area 322 of the second side portion 32. The front end spacing S21 is between 0.85 times and 0.95 times the outer diameter D of the ultra-thin wafer W, and in one example is between 0.88 times and 0.93 times, and preferably 0.92 times. The rear end spacing S22 is between 0.25 times and 0.45 times the outer diameter D of the ultra-thin wafer W, and in one example is between 0.3 times and 0.4 times, and preferably 0.34 times.
[0076] See also Figure 4BThe front support area 311 of the first side portion 31 has a front width W11, a rear width W12, and a depth W13, and the depth W13 is located between the front width W11 and the rear width W12. The front support area 321 of the second side portion 32 has a front width W21, a rear width W22, and a depth W23, and the depth W23 is located between the front width W21 and the rear width W22. The front end width W11, W21 is between 0.25 times and 0.45 times the outer diameter D of the ultra-thin wafer W, and in one example is between 0.3 times and 0.4 times, and preferably 0.32 times. The rear end width W12, W22 is between 0.02 times and 0.08 times the outer diameter D of the ultra-thin wafer W, and in one example is between 0.04 times and 0.06 times, and preferably 0.05 times. The depth W13, W23 is between 0.2 times and 0.35 times the outer diameter D of the ultra-thin wafer W, and in one example is between 0.25 times and 0.3 times, and preferably 0.28 times.
[0077] The rear support area 312 of the first side portion 31 has a front width W31, a rear width W32, and a depth W33, and the depth W33 is located between the front width W31 and the rear width W32. The rear support area 322 of the second side portion 32 has a front width W41, a rear width W42, and a depth W43, and the depth W43 is located between the front width W41 and the rear width W42. The front end width W31, W41 is between 0.02 times and 0.08 times the outer diameter D of the ultra-thin wafer W, and in one example is between 0.04 times and 0.06 times, and preferably 0.05 times. The rear end width W32, W42 is between 0.3 times and 0.45 times the outer diameter D of the ultra-thin wafer W, and in one example is between 0.35 times and 0.4 times, and preferably 0.37 times. The depth W33, W43 is between 0.35 times and 0.5 times the outer diameter D of the ultra-thin wafer W, and in one example is between 0.45 times and 0.5 times, and preferably 0.42 times.
[0078] The middle support area 313 of the first side portion 31 has a width W51 and a depth W53. The middle support area 323 of the second side portion 32 has a width W61 and a depth W63. The widths W51 and W61 are between 0.02 and 0.08 times the outer diameter D of the ultra-thin wafer W, in one example between 0.04 and 0.06 times, preferably 0.05 times, and the depths W53 and W63 are between 0.2 and 0.3 times the outer diameter D of the ultra-thin wafer W, in one example between 0.23 and 0.28 times, preferably 0.26 times.
[0079] See also Figure 4CThe front support area 311 of the first side portion 31 has an angle θ1 relative to a center C of the ultra-thin wafer W, and the angle θ1 is between 35° and 50°, preferably between 40° and 45°. The front support area 321 of the second side portion 32 has an angle θ2 relative to the center C of the ultra-thin wafer W, and the angle θ2 is between 35° and 50°, preferably between 40° and 45°. Specifically, the angle θ1 refers to an intersection angle of a line connecting a first end point 311b and a second end point 311c of the front support area 311 at the first side edge 311a and the center C, respectively, and the angle θ2 refers to an intersection angle of a line connecting a first end point 321b and a second end point 321c of the front support area 321 at the first side edge 321a and the center C, respectively.
[0080] The rear support area 312 of the first side portion 31 has an angle θ3 relative to a center C of the ultra-thin wafer W, and the angle θ3 is between 50° and 60°, preferably between 54° and 58°. The rear support area 322 of the second side portion 32 has an angle θ4 relative to the center C of the ultra-thin wafer W, and the angle θ4 is between 50° and 60°, preferably between 54° and 58°. Specifically, the angle θ3 refers to an intersection angle of a line connecting a first end point 312b and a second end point 312c of the second side edge 312a of the rear support area 312 with the center C, and the angle θ4 refers to an intersection angle of a line connecting a first end point 322b and a second end point 322c of the second side edge 322a of the rear support area 322 with the center C.
[0081] In summary, the utility model supports the ultra-thin wafer through the first side portion and the second side portion of the supporting portion, and further designs the relevant parameters of the front supporting area, the rear supporting area and the middle supporting area relative to the outer diameter and thickness of the ultra-thin wafer, which can increase the stability of the ultra-thin wafer supported by the supporting portion, and can take and place the ultra-thin wafer without limiting the movement of the robot arm extending into the transfer space.
Claims
1. An ultra-thin wafer storage device, characterized in that: include: A frame box, comprising a frame body and a plurality of bearing parts, wherein the frame body defines a containing space, and the bearing part is located in the containing space and defines a plurality of wafer slots for placing a plurality of ultra-thin wafers; In which, the bearing portion includes a first side portion and a second side portion located on a different side from the first side portion and opposite to each other, the first side portion and the second side portion respectively include a front supporting area and a rear supporting area, the front supporting area and the rear supporting area respectively have a first side edge and a second side edge facing each other, a contour of the first side edge of the front supporting area extends from front to back from a center close to the frame body to away from the center, and a contour of the second side edge of the rear supporting area extends from back to front from close to the center to away from the center, a transfer space for a robot arm to enter is defined between the first side portion and the second side portion, and the front supporting areas of the first side portion and the second side portion are separated from each other to define a transfer port connected to the transfer space.
2. The ultra-thin wafer storage device according to claim 1, characterized in that: There is a front end spacing and a rear end spacing between the front support area of the first side portion and the second side portion, the front end spacing is 0.44 times the outer diameter of the ultra-thin wafer, and the rear end spacing is 0.92 times the outer diameter of the ultra-thin wafer.
3. The ultra-thin wafer storage device according to claim 1, characterized in that: When the ultra-thin wafer is placed on the supporting portion, the front support area of the first side portion is at an angle of 40° to 45° relative to the center of the ultra-thin wafer, and the front support area of the second side portion is at an angle of 40° to 45° relative to the center of the ultra-thin wafer.
4. The ultra-thin wafer storage device according to claim 1, characterized in that: When the ultra-thin wafer is placed on the supporting portion, the angle of the rear support area of the first side portion relative to the center of the ultra-thin wafer is between 54° and 58°, and the angle of the rear support area of the second side portion relative to the center of the ultra-thin wafer is between 54° and 58°.
5. The ultra-thin wafer storage device according to claim 1, characterized in that: The front support area has a front end width, a rear end width and a depth between the front end width and the rear end width, the front end width is 0.32 times the outer diameter of the ultra-thin wafer, the rear end width is 0.05 times the outer diameter of the ultra-thin wafer, and the depth is 0.28 times the outer diameter of the ultra-thin wafer.
6. The ultra-thin wafer storage device according to claim 1, characterized in that: The rear support area has a front end width, a rear end width and a depth between the front end width and the rear end width, the front end width is 0.05 times the outer diameter of the ultra-thin wafer, the rear end width is 0.37 times the outer diameter of the ultra-thin wafer, and the depth is 0.42 times the outer diameter of the ultra-thin wafer.
7. The ultra-thin wafer storage device according to claim 1, characterized in that: The first side portion and the second side portion also respectively include an intermediate support area located between the front support area and the rear support area, and the intermediate support areas respectively have a third side edge facing each other, and a contour of the third side edge of the intermediate support area extends straight from back to front.
8. The ultra-thin wafer storage device according to claim 7, characterized in that: The middle support area has a width and a depth, wherein the width is 0.05 times the outer diameter of the ultra-thin wafer, and the depth is 0.26 times the outer diameter of the ultra-thin wafer.
9. The ultra-thin wafer storage device according to claim 1, characterized in that: The ultra-thin wafer has a thickness between 30 microns and 250 microns.