Wafer clamping mechanism and cleaning device with same

Abstract

The utility model provides a wafer clamping mechanism used for clamping a wafer, and relates to the technical field of wafer processing, the wafer clamping mechanism comprises a plurality of main clamping assemblies and a fixing seat used for installing the plurality of main clamping assemblies, each main clamping assembly comprises a plurality of main clamping pieces, the wafer is placed between the plurality of main clamping pieces, and the plurality of main clamping pieces are used for clamping the wafer. The cross section of each main clamping piece is circular, the circumferential side wall of each main clamping piece abuts against the side wall of the wafer, each main clamping piece can rotate, at least one main clamping piece is arranged to be a driving piece capable of providing rotating force, and the other main clamping pieces are arranged to be driven pieces; a rotating device for driving the driving part to rotate is mounted below the driving part; and the connecting shaft is arranged between the main clamping piece and the fixed seat in the vertical direction, so that the main clamping piece and the fixed seat rotate relatively. The objective of the utility model is to solve the problems of low wafer cleaning efficiency and large workload of workers in the prior art.

Description

Technical Field

[0001] The present application relates to the field of wafer processing technology, and in particular to a wafer clamping mechanism and a cleaning device having the clamping mechanism. Background Art

[0002] Chemical mechanical polishing is an ultra-precision surface processing technology for global flattening. Since a large amount of chemical reagents and abrasives are used in the chemical mechanical polishing process, which will cause contamination on the wafer surface, a post-processing process needs to be introduced after chemical mechanical polishing. The post-processing process generally consists of cleaning and drying to provide a smooth and clean wafer surface. Horizontal cleaning is more common in the post-processing process. The wafer to be cleaned is set horizontally, and the cleaning brushes are set on both sides of the wafer. Horizontal wet cleaning uses mechanical action to separate the contaminants on the wafer surface and enter the cleaning liquid. On the other hand, the cleaning liquid reacts chemically with the contaminants on the wafer surface to dissolve them into the cleaning liquid to remove the contaminants on the wafer surface.

[0003] In the prior art, the wafer clamping mechanism usually includes a placement table and a fixing clamp. The wafer is placed on the placement table, and the wafer is fixed to the placement table by the fixing clamp. A motor for driving the placement table to rotate is provided under the placement table. When cleaning the wafer, a cleaning liquid is sprayed on the surface of the wafer and the surface of the wafer is wiped by a rolling brush. After the cleaning is completed, the wafer is turned over and the above operation is repeated to clean the other side of the wafer.

[0004] The inventor believes that in the existing clamping mechanism, since the placement table blocks the lower surface of the wafer, the wafer needs to be turned over and the cleaning work on both sides is repeated, which not only increases the workload of the staff, but also has the defect of low wafer cleaning efficiency. Utility Model Content

[0005] The purpose of the present application is to provide a wafer clamping mechanism and a cleaning device having the same, aiming to solve the problems of low efficiency of wafer cleaning and heavy workload of staff in the related art.

[0006] Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.

[0007] According to a first aspect of the present application, a wafer clamping mechanism is provided for clamping a wafer, comprising: a plurality of sets of main clamping assemblies and a fixing seat for mounting the plurality of sets of main clamping assemblies, wherein the main clamping assemblies include:

[0008] A main clamping member, which is provided with a plurality of main clamping members, the wafer is placed between the plurality of main clamping members, the cross section of the main clamping member is circular, and the circumferential side wall of the main clamping member abuts against the side wall of the wafer, each of the main clamping members is rotatable and at least one of the main clamping members is provided as an active member capable of providing a rotational force, and the remaining main clamping members are provided as driven members, and a rotating device for driving the active member to rotate is installed below the active member;

[0009] The connecting shaft is arranged between the main clamping member and the fixing seat in a vertical direction, so that the main clamping member and the fixing seat can rotate relative to each other.

[0010] In an exemplary embodiment of the present application, the number of the fixing seats is two, the two fixing seats are arranged opposite to each other, the number of the main clamping assemblies is four, and the four groups of main clamping assemblies are arranged on the two fixing seats in pairs.

[0011] In an exemplary embodiment of the present application, the number of the active members is two, and the two active members are arranged at diagonal positions.

[0012] In an exemplary embodiment of the present application, a base plate is arranged between the fixed seat and the connecting shaft, the connecting shaft is installed on one side of the center above the base plate, the connecting shaft is rotatably connected to the base plate, the base plate is installed on the fixed seat and rotatably connected to the fixed seat, and a fixing member for fixing the two is arranged between the base plate and the fixed seat.

[0013] In an exemplary embodiment of the present application, at least one of the driven members is configured as a speed measuring member, and the speed measuring member is equipped with a rotation speed sensor, and the rotation speed sensor is used to monitor the rotation speed of the speed measuring member.

[0014] In an exemplary embodiment of the present application, the two fixing seats slide in directions toward or away from each other, and a driving device for driving the two fixing seats to slide is provided between the two fixing seats.

[0015] In an exemplary embodiment of the present application, it further includes:

[0016] A plurality of support frames are provided for supporting the wafer, wherein the plurality of support frames are respectively provided above the two fixing seats, and the support frames are connected and fixed to the fixing seats on the opposite side;

[0017] The online detection sensor is located between the plurality of support frames and is used to detect whether the wafer exists on the support frame. When the wafer is detected, a start signal is sent out, and the driving device responds to the start signal and drives the two fixing seats to approach each other.

[0018] In an exemplary embodiment of the present application, at least one set of auxiliary clamping components is further included, and the auxiliary clamping components include:

[0019] An auxiliary clamping piece, which has a circular cross section and is located at the same height as the main clamping piece, and the circumferential side wall of the auxiliary clamping piece abuts against the circumferential side wall of the wafer;

[0020] The mounting plate is used to support the auxiliary clamping member, the auxiliary clamping member rotates relative to the mounting plate, and the position of the auxiliary clamping member can be moved along the length of the mounting plate.

[0021] According to a second aspect of the present application, a wafer cleaning device is provided, comprising the wafer clamping mechanism described above.

[0022] In an exemplary embodiment of the present application, a shell is further included, and the multiple groups of main clamping components and the fixing seats for installing the multiple groups of main clamping components are all located in the shell, and an opening for placing the wafer is opened on one side of the shell.

[0023] In an exemplary embodiment of the present application, two roller brushes for cleaning the surface of the wafer are arranged in the shell, and the two roller brushes are respectively located on the upper and lower sides of the opening, and the two ends of the roller brush are rotatably connected to the inner walls on both sides of the shell, and a first driving mechanism for driving the roller brush to rotate is arranged between one end of the roller brush and the shell.

[0024] In an exemplary embodiment of the present application, an adjustment mechanism for adjusting the distance between the two roller brushes is also included, and the adjustment mechanism includes:

[0025] There are four connecting seats, which are respectively arranged at the two ends of the two roller brushes. The ends of the roller brushes rotate relative to the connecting seats, and the connecting seats are slidably connected to the shell along the vertical direction.

[0026] Two bidirectional lead screws are provided, and the circumferential side walls of the bidirectional lead screws are provided with two sections of thread structures with opposite rotation directions along the middle part to the two ends. The two bidirectional lead screws are respectively threadedly connected to the two connecting seats at the same end of the roller brush along the vertical direction, and the two connecting seats located on the same side are respectively located on the two sections of the thread structures with opposite rotation directions of the bidirectional lead screw.

[0027] In an exemplary embodiment of the present application, a second driving structure for driving two bidirectional lead screws to rotate simultaneously is also included, and the second driving mechanism includes:

[0028] A driving motor for outputting rotational power;

[0029] An output wheel, wherein the output shaft of the driving motor is fixedly connected to the output wheel along the rotation axis of the output wheel, and the driving motor is used to drive the output wheel to rotate;

[0030] There are two follower wheels, each corresponding to the two bidirectional lead screws, and the ends of the bidirectional lead screws are fixedly connected to the follower wheels along the rotation axis of the follower wheels;

[0031] A synchronous belt is wound between the output wheel and the follower wheel.

[0032] In an exemplary embodiment of the present application, a spraying device is further included, wherein the spraying device includes at least two spraying heads, and the at least two spraying heads are used to spray the upper surface and the lower surface of the wafer respectively.

[0033] The exemplary embodiments of the present application may have some or all of the following beneficial effects:

[0034] 1. In the wafer clamping mechanism provided in the example implementation mode of the present application, multiple groups of main clamping components are abutted against the side walls of the wafer, so that the wafer is in a suspended state, and the upper and lower surfaces of the wafer are not blocked, wherein the active component itself rotates, and the wafer is also driven to rotate by friction, so that the upper and lower surfaces of the wafer can be cleaned simultaneously during the rotation process without flipping the wafer. Through the above structure, not only the work efficiency of wafer cleaning is improved, but also the workload of the staff is reduced.

[0035] 2. In the wafer clamping mechanism provided in the example implementation mode of the present application, by setting the main clamping member on one side of the center of the base plate, after rotating the base plate, the space between multiple main clamping components can be changed, thereby making the clamping mechanism applicable to more wafers of different sizes.

[0036] 3. In the wafer clamping mechanism provided in the example implementation mode of the present application, during the rotation of the wafer, when the positioning edge rotates to the main clamping member, the main clamping member will no longer abut against the side wall of the wafer, so the wafer may move toward the main clamping member. In order to eliminate this phenomenon, an auxiliary clamping assembly is added, which can make the wafer abut between the main clamping member and the auxiliary clamping member, so that the wafer is always in a clamped state, providing good stability for the wafer.

[0037] 4. In the wafer cleaning device provided in the example implementation mode of the present application, by providing two roller brushes, and respectively arranging the two roller brushes on the upper surface and the lower surface of the wafer, the upper surface and the lower surface of the wafer can be cleaned simultaneously during the rotation of the wafer, thereby providing convenience for the staff in cleaning the wafer.

[0038] 5. In the wafer clamping mechanism provided in the example implementation of the present application, the height of the two roller brushes can be adjusted through the adjustment mechanism, thereby achieving the change of the distance between the two roller brushes, which provides convenience for the staff to take and place the wafer.

[0039] It should be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] The drawings herein are incorporated into the specification and constitute a part of the specification, illustrate embodiments consistent with the present application, and together with the specification are used to explain the principles of the present application. Obviously, the drawings described below are only some embodiments of the present application, and for ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0041] Figure 1 An overall schematic diagram of a wafer clamping mechanism and a cleaning device having the clamping mechanism in an embodiment of the present application is shown;

[0042] Figure 2 A schematic diagram showing the structure of the main clamping assembly and the auxiliary clamping assembly in an embodiment of the present application is shown;

[0043] Figure 3 A schematic diagram showing a connection structure between a support frame and a fixing seat in an embodiment of the present application is shown;

[0044] Figure 4 A schematic diagram of the structure of the adjustment mechanism in the embodiment of the present application is shown;

[0045] Figure 5 A schematic diagram of the bottom structure of a wafer clamping mechanism and a cleaning device having the clamping mechanism in an embodiment of the present application is shown.

[0046] Description of reference numerals:

[0047] 1. Main clamping assembly; 11. Main clamping piece; 111. Rotating device; 12. Connecting shaft; 2. Fixed seat; 21. Bottom plate; 22. Support frame; 221. Connecting frame; 23. Driving device; 3. Online detection sensor; 4. Auxiliary clamping assembly; 41. Auxiliary clamping piece; 42. Mounting plate; 5. Shell; 51. Opening; 6. Roller brush; 7. First driving mechanism; 8. Adjusting mechanism; 81. Connecting seat; 82. Bidirectional lead screw; 9. Second driving mechanism; 91. Driving motor; 92. Follower wheel; 93. Synchronous belt; 94. Tensioning wheel; 10. Sprinkler head. DETAILED DESCRIPTION

[0048] Example embodiments will now be described more fully with reference to the accompanying drawings. However, the example embodiments can be implemented in a variety of forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that the present application will be comprehensive and complete and fully convey the concepts of the example embodiments to those skilled in the art. The same reference numerals in the figures represent the same or similar structures, and thus their detailed descriptions will be omitted. In addition, the drawings are only schematic illustrations of the present application and are not necessarily drawn to scale.

[0049] Although relative terms such as "upper" and "lower" are used in this specification to describe the relative relationship of one component of the diagram to another component, these terms are used in this specification only for convenience, such as according to the direction of the examples in the drawings. It is understood that if the device of the diagram is turned upside down, the component described as "upper" will become the component "lower". When a structure is "on" other structures, it may mean that the structure is formed integrally on the other structure, or that the structure is "directly" disposed on the other structure, or that the structure is "indirectly" disposed on the other structure through another structure.

[0050] The terms "a", "an", "the" and "at least one" are used to indicate the presence of one or more elements / components / etc.; the terms "including" and "having" are used to express an open-ended inclusive meaning and mean that additional elements / components / etc. may exist in addition to the listed elements / components / etc.; the terms "first" and "second" are used merely as labels and are not intended to limit the quantity of their objects.

[0051] Example 1

[0052] Reference Figure 1 and Figure 2 In the embodiment of the present application, a wafer clamping mechanism is disclosed for clamping a wafer, comprising: a plurality of main clamping assemblies 1 and a fixing seat 2 for mounting the plurality of main clamping assemblies 1, wherein the main clamping assemblies 1 include:

[0053] A main clamping member 11 is provided in plurality, the wafer is placed between the plurality of the main clamping members 11, the cross section of the main clamping member 11 is circular, and the circumferential side wall of the main clamping member 11 abuts against the side wall of the wafer, each of the main clamping members 11 is rotatable and at least one of the main clamping members 11 is provided as an active member capable of providing a rotational force, and the remaining main clamping members 11 are provided as driven members, and a rotating device 111 for driving the active member to rotate is installed below the active member;

[0054] The connecting shaft 12 is disposed between the main clamping member 11 and the fixing seat 2 along the vertical direction, so that the main clamping member 11 and the fixing seat 2 can rotate relative to each other.

[0055] In the embodiment of the present application, two fixing seats 2 are provided, the fixing seats 2 are rounded rectangles, and the two fixing seats 2 are parallel to each other. Of course, this is not restrictive, and the fixing seats 2 can also be triangular, square, heterogeneous, etc. The main clamping components 1 are provided in four groups, and the main clamping components 1 installed on each fixing seat 2 are provided in two groups, and the main clamping components 1 above the two fixing seats 2 are arranged oppositely.

[0056] In an embodiment of the present application, a wafer clamping mechanism is provided, which can significantly improve the efficiency and convenience of wafer surface treatment. The core of the mechanism is to use multiple main clamping parts 11 to form a stable and flexible wafer support platform and abut the side wall of the wafer. Among them, the driving source of the active part is a motor, and the output shaft of the motor is closely connected to the end of the connecting shaft 12 away from the active part, ensuring efficient transmission of power. The operation of the motor drives the connecting shaft 12 and the active part to rotate synchronously. Through friction, the active part can smoothly drive the wafer clamped therein to rotate, thereby realizing the rotation of the wafer.

[0057] It is worth mentioning that the rotating device 111 is not limited to the motor, and can be flexibly selected according to the specific application scenario to meet the needs under different conditions. The friction between the driven member and the wafer plays a synergistic role, so that the wafer can remain stable during rotation and avoid unnecessary shaking or deviation. Placing the wafer between the active member and the driven member not only ensures the smooth rotation of the wafer, but also realizes the suspended state of the wafer, which means that the upper and lower surfaces of the wafer are unobstructed.

[0058] The staff can clean or polish the upper and lower surfaces of the wafer at the same time without repeatedly flipping the wafer, which significantly improves the work efficiency of wafer surface treatment. In addition, the suspended state of the wafer also ensures the uniformity of the cleaning process, avoiding the problem of incomplete surface treatment due to uneven contact surface. In short, the wafer clamping mechanism provided in the embodiment of the present application not only improves the work efficiency of wafer surface treatment, but also optimizes the entire process of wafer processing, bringing significant benefits to the semiconductor manufacturing industry.

[0059] In the specific implementation of the present application, in order to ensure that the wafer has sufficient power during the rotation process, and to maintain continuous rotational power when the positioning edge of the wafer rotates to the active part. Therefore, among the four main clamping parts 11, the number of active parts is very important, and there should be at least two to form an effective power transmission chain. Of course, according to actual needs, the number of active parts can be further increased to three or four to adapt to more complex or higher-load wafer processing scenarios.

[0060] In this application document, a configuration scheme of two active components is selected, which not only balances the power demand and structural complexity, but also ensures the stability and efficiency of wafer rotation. Furthermore, the two active components are set at diagonal positions. This layout not only achieves uniformity of power transmission, but also effectively avoids eccentricity or shaking of the wafer during rotation, ensuring the accuracy and reliability of wafer processing.

[0061] In the further optimization of the present application, it is aimed to improve the flexibility and adaptability of the wafer clamping mechanism. Specifically, a base plate 21 is provided between the connecting shaft 12 and the fixed seat 2, and the connecting shaft 12 is rotatably connected to one side of the center of the upper surface of the base plate 21. The base plate 21 and the fixed plate are also rotatably connected, and a fixing member for fixing the two is provided between the base plate 21 and the fixed seat 2. The fixing member is not particularly limited in the embodiment of the present application, and can be a bolt, or a fixing pin or other structure. When the size of the wafer clamping mechanism needs to be adjusted, it is only necessary to simply rotate the base plate 21. Since the main clamping member 11 is not in the center position of the base plate 21, this operation will directly change the relative distance between the four main clamping members 11, thereby easily achieving adaptation to wafers of different sizes, greatly improving the scope of application and flexibility of the clamping mechanism.

[0062] In the further optimization of this application, in order to achieve precise speed control during wafer processing. When the number of active members is set to two, the other two main clamping members 11 are naturally converted into driven members, and are also set diagonally. Among the two driven members, at least one should be set as a speed measuring member to achieve accurate monitoring of the wafer rotation speed. In this application document, in order to further improve the accuracy and reliability of speed measurement, both driven members are set as speed measuring members, which not only enhances the accuracy of speed detection, but also provides more abundant data support for subsequent speed adjustment.

[0063] A speed sensor is installed on the speed measuring part. The staff can adjust the rotating device 111 according to the speed information fed back by the speed sensor, and then accurately adjust the rotation speed of the active part to ensure that the rotation speed of the wafer reaches the optimal state during the processing.

[0064] In the embodiment of the present application, the wafer clamping mechanism further includes a driving device 23, which is used to drive the two fixing seats 2 to move closer to or farther from each other. In the present application, the driving device 23 is a bidirectional cylinder, which is arranged between the two fixing seats 2, and its two ends are respectively connected and fixed to the two fixing seats 2. Of course, the structure of the driving device 23 is not limited to this.

[0065] Reference Figure 2 and Figure 3Furthermore, the wafer clamping mechanism also includes a plurality of support frames 22 for supporting the wafer. The support frames 22 are intended to provide a stable support for the wafer to ensure its balance when placed. The number of support frames 22 is not limited. In the embodiment of the present application, four support frames 22 are provided. The four support frames 22 are distributed above the two fixed seats 2 in a symmetrical manner in pairs. The bottoms of the two support frames 22 located on the same fixed seat 2 are fixedly connected. Two connecting frames 221 are provided between the two fixed seats 2, one of which is located inside the other connecting frame 221. The two connecting frames 221 slide in relative or divergent directions. One end of the connecting frame 221 is fixedly connected to one of the fixed seats 2, and the other end is fixedly connected to the bottoms of the two support frames 22 relative to the fixed seat 2.

[0066] Reference Figure 1 The wafer clamping mechanism also includes an online detection sensor 3, which is located between multiple support frames 22 and is used to monitor in real time whether there is a wafer on the support frame 22. When the presence of a wafer on the support frame 22 is detected, a start signal is sent out, and the output end of the online detection sensor 3 is connected to the input end of the driving device 23. The driving device 23 (i.e., the bidirectional cylinder) drives the two fixing seats 2 to move closer to each other in response to the start signal.

[0067] When the wafer has not yet been placed in the clamping mechanism, the two fixed seats 2 are in a state of being away from each other. This initial layout reserves sufficient space for the stable placement of the wafer. When the wafer is placed on the support frame 22, at this time, the online detection sensor immediately sends a start signal to the drive device 23. During the process of the fixed seats 2 moving toward each other, the support frames 22 move away from each other, providing the necessary space for the clamping of the wafer. At the same time, the main clamping member 11 is driven by the drive device 23 to approach each other until it is tightly abutted against the side wall of the wafer, thereby achieving precise clamping of the wafer. At this time, the support frame 22 has completely left the lower surface of the wafer and no longer participates in the support of the wafer.

[0068] Reference Figure 1 and Figure 2 In the embodiment of the present application, the wafer clamping mechanism further includes at least one auxiliary clamping member 41 and a mounting plate 42 for mounting the auxiliary clamping member 41. The auxiliary clamping member 41 is located at the same height as the main clamping member 11, ensuring the balance and consistency of the wafer during the processing. In the specific implementation of the present application, the auxiliary clamping member 41 is set as one, and the auxiliary clamping member 41 can also rotate and is completely identical to the main clamping member 11 in structure.

[0069] The auxiliary clamp 41 is rotatably connected to the mounting plate 42, and the auxiliary clamp 41 can also move along the length direction of the mounting plate 42. In a possible embodiment, a connecting plate is provided between the auxiliary clamp 41 and the mounting plate 42, the auxiliary clamp 41 is rotatably connected to the connecting plate, the connecting plate is slidably connected to the mounting plate 42, and the two are connected and fixed by bolts. After the size of the wafer changes, the staff can adjust the position of the auxiliary clamp 41 so that the auxiliary clamp 41 is suitable for wafers of different sizes. Of course, the connection structure between the auxiliary clamp 41 and the mounting plate 42 is not limited to the above-mentioned embodiment.

[0070] In the embodiment of the present application, the auxiliary clamping member 41 plays a significant role in improving the stability of the wafer during rotation. During the wafer rotation process, the auxiliary clamping member 41 works in coordination with the main clamping member 11 to ensure that the wafer can obtain stable clamping forces in at least four directions at any rotation position. Even if the positioning edge rotates to the position of the main clamping member 11 or the auxiliary clamping member 41 during the wafer rotation process, the wafer can still maintain a uniform and stable clamping force in at least four directions, ensuring that the wafer will not move or deviate during the rotation process, thereby improving the stability of the wafer during the rotation process.

[0071] The wafer clamping mechanism also includes a shell 5, in which the main clamping member 11, the auxiliary clamping member 41 and the fixing seat 2 are all located. The shell 5 is used to protect the clamping mechanism. The mounting plate 42 is fixed to the inner wall of the shell 5, and an opening 51 for placing the wafer is opened on one side of the shell 5.

[0072] Example 2

[0073] Reference Figure 1 and Figure 4 In an embodiment of the present application, a wafer cleaning device is disclosed, including the wafer clamping mechanism in Example 1.

[0074] The wafer cleaning device also includes a roller brush 6, which is provided with two roller brushes 6, which are respectively located at the upper and lower sides of the opening 51, so that after the wafer is placed in the housing 5, it is located between the two roller brushes 6, and the two ends of the roller brush 6 rotate relative to the inner wall of the housing 5, and a first driving mechanism 7 for driving the roller brush 6 to rotate is provided between one end of the roller brush 6 and the housing 5. When the wafer rotates horizontally, the two roller brushes 6 rotate on the upper and lower surfaces of the wafer respectively, thereby achieving the effect of cleaning the wafer surface.

[0075] In one embodiment of the present application, the two roller brushes 6 share a first driving mechanism 7, for example, a structure of a motor and a gear set, the ends of the two roller brushes 6 are respectively fixedly connected to a gear in the gear set, and then any one of the gears can be driven to rotate by a point motor.

[0076] In another embodiment of the present application, the two roller brushes 6 are each independently equipped with a first driving mechanism 7, which can be a motor, and the motor is directly connected to the end of the roller brush 6. This not only simplifies the structure of the wafer cleaning device, but also, according to the requirements of spatial layout or transmission adjustment, a transmission device such as a gear set, a belt and a transmission wheel can be added between the motor and the roller brush 6.

[0077] In an embodiment of the present application, the wafer cleaning device further includes an adjusting mechanism 8 for adjusting the distance between the two roller brushes 6. When placing the wafer, the two roller brushes 6 are away from each other to reserve sufficient space for the wafer, so that the wafer is not easily bumped against the roller brushes 6. After the wafer is placed, the adjusting device drives the two roller brushes 6 to approach each other and abut against the upper and lower surfaces of the wafer to clean the wafer.

[0078] It should be noted that after using the adjustment mechanism 8, the two roller brushes 6 should be respectively equipped with a first drive mechanism 7. By respectively equipping the two roller brushes 6 with the first drive mechanism 7, the two roller brushes 6 will not be interfered with when adjusting their positions. There is no special restriction on the specific structure of the adjustment mechanism 8.

[0079] The following is a specific structure of the adjustment mechanism 8, which includes four connecting seats 81 and two bidirectional lead screws 82. The four connecting seats 81 are respectively arranged at the two ends of the two roller brushes 6. The ends of the roller brushes 6 rotate relative to the connecting seats 81. A connecting rod can also be arranged between the connecting seat 81 and the ends of the roller brush 6. One end of the connecting rod is fixedly connected to the connecting seat 81, and the other end of the connecting rod is rotationally connected to the roller brush 6. Alternatively, the ends of the roller brush 6 can be directly rotationally connected to the connecting seat 81. The two bidirectional lead screws 82 are respectively arranged at the two ends of the roller brush 6 in the vertical direction. The circumferential side wall of the bidirectional lead screw 82 is provided with two sections of thread structures with opposite rotation directions along the middle part to the two ends. The two connecting seats 81 on the same side are respectively threadedly connected to the two opposite threads of the bidirectional lead screw 82. Then, by rotating the two bidirectional lead screws 82 at the same time, the two roller brushes 6 can be driven to move closer to or away from each other.

[0080] Reference Figure 4 and Figure 5 The wafer cleaning device also includes a second driving structure for driving two bidirectional lead screws 82 to rotate simultaneously, and the second driving mechanism 9 includes:

[0081] A driving motor 91, for outputting rotational power;

[0082] An output wheel (not shown in the figure), the output shaft of the drive motor 91 is fixedly connected to the output wheel along the rotation axis of the output wheel, and the drive motor 91 is used to drive the output wheel to rotate;

[0083] There are two follower wheels 92, which correspond to the two bidirectional lead screws 82 respectively, and the ends of the bidirectional lead screws 82 are fixedly connected to the follower wheels 92 along the rotation axis of the follower wheels 92;

[0084] The synchronous belt 93 is wound between the output wheel and the driven wheel 92 .

[0085] To ensure that the synchronous belt 93 is in a taut state, the second drive mechanism 9 may further include a plurality of tensioning wheels 94 , and the synchronous belt 93 is wrapped around the plurality of tensioning wheels 94 . Through precise adjustment of the tensioning wheels 94 , the synchronous belt 93 is in a taut state to ensure a good transmission effect of the synchronous belt 93 .

[0086] Reference Figure 1 The wafer cleaning device also includes a spray device, which includes at least two spray heads 10. The at least two spray heads 10 are respectively located on the upper surface and the lower surface of the wafer and spray the cleaning liquid on the wafer. When cleaning the wafer, the cleaning liquid is transported to the spray device by the liquid supply device. The liquid supply device can be a water pump or directly connected to a water pipe. The liquid is then sprayed on the surface of the wafer by the spray head 10, thereby effectively improving the cleaning effect of the wafer and improving the efficiency of the wafer cleaning work.

[0087] Those skilled in the art will easily think of other embodiments of the present application after considering the specification and practicing the embodiments of the present application. The present application is intended to cover any modification, use or adaptation of the present application, which follows the general principles of the present application and includes common knowledge or customary techniques in the art that the present application does not apply for. The specification and embodiments are only regarded as exemplary, and the true scope and spirit of the present application are pointed out by the appended claims.

Claims

1. A wafer clamping mechanism for clamping a wafer, characterized in that: include: A plurality of sets of main clamping assemblies (1) and a fixing seat (2) for mounting the plurality of sets of main clamping assemblies (1), wherein the main clamping assemblies (1) comprise: A main clamping member (11) is provided in plurality, the wafer is placed between the plurality of the main clamping members (11), the cross section of the main clamping member (11) is circular, and the circumferential side wall of the main clamping member (11) abuts against the side wall of the wafer, each of the main clamping members (11) is rotatable and at least one of the main clamping members (11) is provided as an active member capable of providing a rotational force, and the remaining main clamping members (11) are provided as driven members, and a rotating device (111) is installed below the active member for driving the active member to rotate; A connecting shaft (12) is arranged between the main clamping member (11) and the fixing seat (2) along a vertical direction, so that the main clamping member (11) and the fixing seat (2) can rotate relative to each other; The number of the fixing seats (2) is two, the two fixing seats (2) are arranged opposite to each other, the number of the main clamping components (1) is four, the four groups of main clamping components (1) are arranged on the two fixing seats (2) in a manner of being opposite to each other in pairs; The two fixing seats (2) slide in directions towards or away from each other, and a driving device (23) is provided between the two fixing seats (2) for driving the two fixing seats (2) to slide. The wafer clamping mechanism also includes: A plurality of support frames (22) are provided for supporting the wafer, the plurality of support frames (22) are respectively provided above the two fixing seats (2), and the support frames (22) are connected and fixed to the fixing seats (2) on the opposite side; An online detection sensor (3) is located between the plurality of support frames (22) and is used to detect whether the wafer is present on the support frame (22). When the wafer is detected, a start signal is sent out, and the drive device (23) responds to the start signal and drives the two fixing seats (2) to move closer to each other.

2. The wafer clamping mechanism according to claim 1, characterized in that: A bottom plate (21) is provided between the fixing seat (2) and the connecting shaft (12); the connecting shaft (12) is mounted on one side of the center above the bottom plate (21); the connecting shaft (12) is rotatably connected to the bottom plate (21); the bottom plate (21) is mounted on the fixing seat (2) and is rotatably connected to the fixing seat (2); and a fixing member for fixing the bottom plate (21) and the fixing seat (2) is provided between the bottom plate (21) and the fixing seat (2).

3. The wafer clamping mechanism according to claim 1, characterized in that: At least one of the driven members is configured as a speed measuring member, and the speed measuring member is provided with a rotation speed sensor, and the rotation speed sensor is used to monitor the rotation speed of the speed measuring member.

4. The wafer clamping mechanism according to claim 1, characterized in that: It also includes at least one set of auxiliary clamping components (4), wherein the auxiliary clamping components (4) include: An auxiliary clamping piece (41) having a circular cross section and located at the same height as the main clamping piece (11), wherein the circumferential side wall of the auxiliary clamping piece (41) abuts against the circumferential side wall of the wafer; The mounting plate (42) is used to support the auxiliary clamping member (41); the auxiliary clamping member (41) rotates relative to the mounting plate (42); and the position of the auxiliary clamping member (41) can be moved along the length of the mounting plate (42).

5. A wafer cleaning device, comprising the wafer clamping mechanism according to any one of claims 1 to 4.

6. The wafer cleaning device according to claim 5, characterized in that: It also comprises a shell (5), wherein the plurality of sets of main clamping components (1) and a fixing seat (2) for mounting the plurality of sets of main clamping components (1) are all located inside the shell (5), and an opening (51) for placing the wafer is provided on one side of the shell (5).

7. The wafer cleaning device according to claim 6, characterized in that: Two roller brushes (6) for cleaning the surface of the wafer are arranged in the shell (5); the two roller brushes (6) are respectively located on the upper and lower sides of the opening (51); the two ends of the roller brush (6) are respectively rotatably connected to the inner walls on both sides of the shell (5); and a first driving mechanism (7) for driving the roller brush (6) to rotate is arranged between one end of the roller brush (6) and the shell (5).

8. The wafer cleaning device according to claim 7, characterized in that: It also includes an adjustment mechanism (8) for adjusting the distance between the two roller brushes (6), and the adjustment mechanism (8) includes: Four connecting seats (81) are provided, and the four connecting seats (81) are respectively provided at the two ends of the two roller brushes (6), the ends of the roller brushes (6) rotate relative to the connecting seats (81), and the connecting seats (81) are slidably connected to the housing (5) along the vertical direction; Two bidirectional lead screws (82) are provided, and the circumferential side walls of the bidirectional lead screws (82) are provided with two sections of thread structures with opposite rotation directions along the middle part to the two ends. The two bidirectional lead screws (82) are respectively threadedly connected to the two connecting seats (81) at the same end of the roller brush (6) along the vertical direction, and the two connecting seats (81) located on the same side are respectively located on the two sections of the thread structures with opposite rotation directions of the bidirectional lead screw (82).

9. The wafer cleaning device according to claim 8, characterized in that: It also includes a second driving mechanism (9) for driving the two bidirectional lead screws (82) to rotate simultaneously, the second driving mechanism (9) comprising: A driving motor (91) for outputting rotational power; An output wheel, wherein the output shaft of the drive motor (91) is fixedly connected to the output wheel along the rotation axis of the output wheel, and the drive motor (91) is used to drive the output wheel to rotate; There are two follower wheels (92), which correspond to the two bidirectional lead screws (82) respectively, and the ends of the bidirectional lead screws (82) are fixedly connected to the follower wheels (92) along the rotation axis of the follower wheels (92); A synchronous belt (93) is wound between the output wheel and the follower wheel (92).

10. The wafer cleaning device according to claim 5, characterized in that: It also comprises a spraying device, wherein the spraying device comprises at least two spraying heads (10), and the at least two spraying heads (10) are respectively used to spray the upper surface and the lower surface of the wafer.

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