High-heat-dissipation high-speed connector shell assembly

Abstract

The utility model discloses a high-heat-dissipation high-speed connector shell assembly, which comprises an upper shell and a lower shell, the upper shell and the lower shell are covered and fixed, and a plurality of long raised heat dissipation strips extending left and right are formed on the top surface of a top plate of the upper shell; a mounting groove which extends leftwards and extends out of the left end of the lower shell is formed in the middle of the top surface of the lower shell, a connector mounting groove which extends downwards is formed in the middle of the top surface of the right part of the lower shell, a PCB is placed on the bottom surface of the mounting groove, and an insertion part at the left end of the PCB extends out of the mounting groove; the top surface of the upper shell is provided with a plurality of long protruding heat dissipation strips and kidney-shaped heat dissipation through holes, the heat dissipation effect can be greatly improved, the vertical positioning columns can position the PCB, the PCB is fixed through pressing of the upper shell and the lower shell, through holes and the like do not need to be preset, and the machining difficulty is reduced.

Description

Technical field:

[0001] The utility model relates to the technical field of network accessories, and more specifically to a high-heat dissipation and high-speed connector housing component. Background technology:

[0002] There are many kinds of connector shells, and their functions are also different. They are generally used to connect wire connectors, or network speed converters and other components to play a role in connection protection. The existing connector shell is generally fixed by an upper shell and a lower shell. However, when connected, its temperature will continue to rise and needs to be dissipated in time. The existing upper shell and lower shell are both flat, which greatly reduces its heat dissipation effect and affects its service life;

[0003] At the same time, in the existing internal installation cavity, the PCB board is generally placed, and then the upper shell and the lower shell are pressed and connected to the PCB board through vertical connecting holes on the PCB board. This requires reserved connecting holes when the PCB board is processed, which increases processing costs and difficulty. Utility model content:

[0004] The purpose of the utility model is to overcome the deficiencies of the prior art and provide a high-heat dissipation and high-speed connector housing component, the top surface of its upper shell is formed with a plurality of long raised heat dissipation strips and waist-shaped heat dissipation through holes, which can greatly improve its heat dissipation effect, and the vertical positioning column provided therein can position the PCB board, and fix the PCB board by pressing the upper shell and the lower shell, so that it does not need to preset through holes, etc., reducing the difficulty of processing.

[0005] The solution of the utility model to solve the technical problem is:

[0006] A high-heat dissipation high-speed connector housing component comprises an upper shell and a lower shell, the upper shell and the lower shell are covered and fixed to each other, and the top surface of the top plate of the upper shell is formed with a plurality of long raised heat dissipation strips extending left and right, which improves the heat dissipation effect.

[0007] A mounting groove extending leftward and extending out of the left end of the lower shell is formed in the middle of the top surface of the lower shell, and a connector mounting groove extending downward is formed in the middle of the top surface of the right part of the lower shell. A PCB board is placed on the bottom surface of the mounting groove, and the left end plug-in portion of the PCB board extends out of the mounting groove;

[0008] A rear installation groove extending downward is formed on the top surface of the right end of the lower shell at the right side of the connector installation groove, and the left end of the rear installation groove is connected to the right end of the connector installation groove;

[0009] The insulating baffle is clamped in the rear installation groove, and a threading through hole is provided in the middle of the insulating baffle, and the threading through hole corresponds to and communicates with the connector installation groove;

[0010] A plurality of vertical positioning columns are formed in the middle of the bottom surface of the installation groove, and the vertical positioning columns are inserted into corresponding through holes formed on the PCB board.

[0011] A side groove is formed on the front and rear inner walls of the left part of the installation groove, and a protrusion is formed on the bottom inner wall of the side groove and the lower part of the inner wall of the right part of the front and rear wall plates of the installation groove, and the front and rear edges of the PCB board are pressed against the top surface of the corresponding protrusion.

[0012] A left-side positioning groove is formed on the upper left-side wall of the front and rear side panels of the lower shell, an extended positioning portion extending downward is formed at the lower part of the left end of the front and rear side panels of the upper shell, a right raised positioning portion is formed on the right side of the extended positioning portion, the right raised positioning portion is clamped in the corresponding left-side positioning groove, and the top and bottom surfaces of the right raised positioning portion are pressed against the top and bottom surfaces of the left-side positioning groove.

[0013] The left part of the top plate of the upper shell is formed with a plurality of waist-shaped heat dissipation through holes, which further improves the heat dissipation effect.

[0014] The outstanding effects of the utility model are:

[0015] The top surface of its upper shell is formed with multiple long raised heat dissipation strips and waist-shaped heat dissipation holes, which can greatly improve its heat dissipation effect. The vertical positioning columns it is provided with can position the PCB board and fix the PCB board by pressing the upper and lower shells, so that it does not need preset through holes, etc., reducing the difficulty of processing. Description of the drawings:

[0016] Figure 1 It is a structural schematic diagram of the utility model;

[0017] Figure 2 It is a schematic diagram of the local structure between the lower shell and the PCB board of the utility model;

[0018] Figure 3 It is a schematic diagram of the local structure at the upper shell;

[0019] Figure 4 It is a partial structural schematic diagram of the lower shell of the utility model;

[0020] Figure 5 It is a schematic diagram of the partial structure of the angle-changing device of the present invention. Specific implementation method:

[0021] For example, see Figures 1 to 5As shown, a high-heat dissipation and high-speed connector shell assembly includes an upper shell 10 and a lower shell 20. The upper shell 10 and the lower shell 20 are covered and fixed to each other. The top surface of the top plate of the upper shell 10 is formed with a plurality of long raised heat dissipation strips 11 extending left and right; the long raised heat dissipation strips 11 increase the external contact area of ​​the upper shell 10 and improve the heat exchange and heat dissipation effect.

[0022] A mounting groove 21 extending leftward and extending out of the left end of the lower shell 20 is formed in the middle of the top surface of the lower shell 20, and a connector mounting groove 22 extending downward is formed in the middle of the top surface of the right part of the lower shell 20. A PCB board 40 is placed on the bottom surface of the mounting groove 21, and the left end plug-in portion of the PCB board 40 extends out of the mounting groove 21.

[0023] A rear mounting groove 23 extending downward is formed on the top surface of the right end of the lower shell 20 at the right side of the connector mounting groove 22, and the left end of the rear mounting groove 23 is connected to the right end of the connector mounting groove 22; the distance between the front and rear wall surfaces of the right end of the connector mounting groove 22 is smaller than the distance between the front and rear inner side walls of the rear mounting groove 23;

[0024] The insulating baffle 50 is clamped in the rear installation groove 23. The middle of the insulating baffle 50 has a threading hole 51. The threading hole 51 corresponds to and communicates with the connector installation groove 22.

[0025] The insulating baffle 50 can prevent external objects from passing through the insulating baffle 50 and extending into the connector mounting groove 22, and has a protective effect. A connector can be installed in the connector mounting groove 22, which can be electrically connected to the PCB board 40, and the external electrical connection wire of the connector can extend from the wire threading hole 51 of the insulating baffle 50.

[0026] Furthermore, a plurality of vertical positioning columns 220 are formed in the middle of the bottom surface of the mounting groove 21, and the vertical positioning columns 220 are inserted into corresponding through holes formed on the PCB board 40, and the outer side walls of the vertical positioning columns 220 are closely attached to the inner side walls of the corresponding through holes of the PCB board 40. The PCB board 40 is positioned by the vertical positioning columns 220.

[0027] Furthermore, a side groove 211 is formed on the front and rear inner walls of the left portion of the mounting groove 21, and a protrusion 212 is formed on the bottom inner wall of the side groove 211 and the lower portion of the inner wall of the right portion of the front and rear wall panels of the mounting groove 21, and the front and rear edges of the PCB board 40 are pressed against the top surfaces of the corresponding protrusions 212.

[0028] Further, a left positioning groove 230 is formed on the upper left side wall of the front and rear side plates of the lower shell 20, and an extended positioning portion 12 extending downward is formed at the lower part of the left end of the front and rear side plates of the upper shell 10, and a right protruding positioning portion 13 is formed on the right side of the extended positioning portion 12. The right protruding positioning portion 13 is clamped in the corresponding left positioning groove 230, and the top and bottom surfaces of the right protruding positioning portion 13 are pressed against the top and bottom surfaces of the left positioning groove 230. This structure improves the connection firmness of the left part of the upper shell 10 and the lower shell 20.

[0029] Furthermore, a lower semicircular groove 24 extending downward is formed in the middle of the top surface of the right end surface of the lower shell 20 , and the lower semicircular groove 24 is communicated with the rear installation groove 23 .

[0030] Furthermore, a plurality of waist-shaped heat dissipation through holes 14 are formed on the left portion of the top plate of the upper shell 10, which further improves the heat dissipation effect.

[0031] Furthermore, an upper groove is formed on the top surface of the top plate of the upper shell 10 directly above the connector mounting groove 22 and the rear mounting groove 23, the upper part of the insulating baffle 50 is inserted into the upper groove, and the top surface of the insulating baffle 50 is pressed against the top surface of the upper groove, and an upper semicircular groove extending upward is formed in the middle of the bottom surface of the right side plate of the upper shell 10, the upper semicircular groove is connected to the upper groove, and is aligned with the lower semicircular groove 24 up and down to form a circular through hole.

[0032] Furthermore, the front and rear portions of the left and right portions of the bottom surface of the top plate of the upper shell 10 are formed with an upper support plate 15 extending downward, and the bottom surface of the upper support plate 15 is pressed against the top surface of the front and rear portions of the PCB board 40. A side wall of the upper support plate 15 on the left is formed at the inner side of the corresponding extended positioning portion 12.

[0033] The bottom edge of the right end plate of the upper shell 10 is formed with a trapezoidal groove extending upward, and the corresponding top edge of the right end plate of the lower shell 20 is formed with a trapezoidal protrusion extending upward, which is clamped in the corresponding trapezoidal groove, and the front and rear side walls of the trapezoidal protrusion are pressed against the front and rear inner walls of the corresponding trapezoidal groove, thereby realizing the positioning of the right ends of the upper shell 10 and the lower shell 20.

[0034] Among them, in this embodiment, a movable shell 300 and a handle 400 are installed on the upper shell 10 and the lower shell 20. This structure is basically consistent with the structure and effect described in a high-speed connector shell component with Chinese patent announcement number CN218386028U. Therefore, it can be inserted into the port and locked, and the movable shell 300 can be pulled out by moving it to the right, which is convenient for plugging and unplugging. Since it is basically the same as the structure of a high-speed connector shell component with Chinese patent announcement number CN218386028U, it is a well-known content and therefore will not be described in detail here.

[0035] The above implementation modes are only used to illustrate the present invention, but not to limit the present invention. Ordinary technicians in the relevant technical field can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, all equivalent technical solutions also belong to the scope of the present invention. The scope of patent protection of the present invention should be limited by the claims.

Claims

1. A high heat dissipation and high-speed connector housing assembly, comprising an upper housing (10) and a lower housing (20), wherein the upper housing (10) and the lower housing (20) are covered and fixed to each other, characterized in that: The top surface of the top plate of the upper shell (10) is formed with a plurality of long raised heat dissipation strips (11) extending left and right; A mounting groove (21) extending leftward and extending out of the left end of the lower shell (20) is formed in the middle of the top surface of the lower shell (20); a connector mounting groove (22) extending downward is formed in the middle of the top surface of the right part of the lower shell (20); a PCB board (40) is placed on the bottom surface of the mounting groove (21); and a plug-in portion at the left end of the PCB board (40) extends out of the mounting groove (21); A rear mounting groove (23) extending downward is formed on the top surface of the right end of the lower shell (20) at the right side of the connector mounting groove (22); the left end of the rear mounting groove (23) is connected to the right end of the connector mounting groove (22); the distance between the front and rear wall surfaces of the right end of the connector mounting groove (22) is smaller than the distance between the front and rear inner side walls of the rear mounting groove (23); The insulating baffle (50) is clamped in the rear installation groove (23), and a wire threading through hole (51) is provided in the middle of the insulating baffle (50), and the wire threading through hole (51) corresponds to and communicates with the connector installation groove (22); A plurality of vertical positioning columns (220) are formed in the middle of the bottom surface of the installation groove (21), and the vertical positioning columns (220) are inserted into corresponding through holes formed on the PCB board (40), and the outer side walls of the vertical positioning columns (220) are closely attached to the inner side walls of the corresponding through holes of the PCB board (40).

2. A high heat dissipation and high-speed connector housing assembly according to claim 1, characterized in that: A side groove (211) is formed on the front and rear inner side walls of the left portion of the installation groove (21), and a protrusion (212) is formed on the bottom inner side wall of the side groove (211) and the lower part of the inner side wall of the right portion of the front and rear wall plates of the installation groove (21), and the front and rear edges of the PCB board (40) are pressed against the top surfaces of the corresponding protrusions (212).

3. The high heat dissipation and high-speed connector housing assembly according to claim 1, characterized in that: A left positioning groove (230) is formed on the upper left side wall of the front and rear side plates of the lower shell (20); an extended positioning portion (12) extending downward is formed at the lower part of the left end of the front and rear side plates of the upper shell (10); a right protruding positioning portion (13) is formed on the right side of the extended positioning portion (12); the right protruding positioning portion (13) is clamped in the corresponding left positioning groove (230), and the top surface and bottom surface of the right protruding positioning portion (13) are pressed against the top surface and bottom surface of the left positioning groove (230).

4. The high heat dissipation and high-speed connector housing assembly according to claim 1, characterized in that: A lower semicircular groove (24) extending downward is formed in the middle of the top surface of the right end surface of the lower shell (20), and the lower semicircular groove (24) is communicated with the rear installation groove (23).

5. The high heat dissipation and high-speed connector housing assembly according to claim 1, characterized in that: A plurality of waist-shaped heat dissipation through holes (14) are formed on the left portion of the top plate of the upper shell (10).

6. The high heat dissipation and high-speed connector housing assembly according to claim 1, characterized in that: An upper groove is formed on the top surface of the top plate of the upper shell (10) directly above the connector mounting groove (22) and the rear mounting groove (23), the upper part of the insulating baffle (50) is inserted into the upper groove, and the top surface of the insulating baffle (50) is pressed against the top surface of the upper groove.

7. A high heat dissipation and high-speed connector housing assembly according to claim 6, characterized in that: The front and rear parts of the left and right parts of the bottom surface of the top plate of the upper shell (10) are both formed with upper support plates (15) extending downward, and the bottom surface of the upper support plate (15) is pressed against the top surfaces of the front and rear parts of the PCB board (40).

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