Dual-emission TO-CAN laser
By setting up a semi-transmitter in the TO-CAN laser and integrating two optical paths, the problem of optical device production difficulty and yield in the fiber-to-home network is solved, and higher yield and lower production costs are achieved.
Patent Information
- Application Number
- CN202421925360.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-08
- Publication Date
- 2025-05-16
- Estimated Expiration
- 2034-08-08
AI Technical Summary
In the evolution of fiber to home networks, especially in the transition from 10G PON to 50G PON, the manufacturing difficulty of optical devices increases, and the integration problems of different lasers and detectors are complex, resulting in a decrease in the yield of optical devices.
A dual-emitting TO-CAN laser is designed. By setting a semi-transmitter, the laser light emitted from the first laser chip is passed through and reflected the laser light emitted from the second laser chip, so that its propagation direction coincides with the central axis of the tube seat, thereby integrating the two optical paths, reducing the number of device coupling times and improving yield.
By integrating the two optical paths, the number of device coupling is reduced, the yield of optical devices is improved, and the overall size and production cost of optical devices are reduced.
Smart Images
Figure CN222884083U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of optical fiber communication, in particular to a double-emitting TO-CAN laser. Background Art
[0002] When the fiber-to-the-home network evolves from GPON to 10G PON, in order to be compatible with the original network, the combo PON structure is often used for networking. This solution will have two signal transmitters and two signal receivers (single-fiber four-way coaxial optical devices) at the OLT end, which increases the difficulty of manufacturing optical devices. In the actual production process, four optical path couplings are required, and the yield of optical devices is greatly reduced. The next-generation 50G PON OLT end has three signal transmitters and three signal receivers. At that time, the difficulty of manufacturing optical devices will be further increased, and the integration of different lasers and detectors needs to be solved urgently. Utility Model Content
[0003] Based on the above description, the utility model provides a dual-emission TO-CAN laser, which is provided with a half-mirror, which is used to allow the laser emitted by the first laser chip to pass through and reflect the laser emitted by the second laser chip, so that the propagation direction of the laser emitted by the second laser chip coincides with the central axis of the tube holder after being reflected, thereby integrating two optical paths. Since the two lasers are synthesized into one laser, the number of device coupling times is reduced and the yield is increased.
[0004] The utility model solves the above technical problems with the following technical solutions: a dual-emission TO-CAN laser, comprising a tube seat, a tube cap, a first laser chip, a second laser chip and a half-mirror; the tube cap is arranged on the top surface of the tube seat, so that a sealed space is formed between the tube cap and the tube seat;
[0005] The first laser chip, the second laser chip and the half mirror are all arranged in the sealed space, and the optical axis of the light emitted by the first laser chip coincides with the central axis of the tube holder, and the optical axis of the light emitted by the second laser chip intersects with the optical axis of the light emitted by the first laser chip;
[0006] The semi-transparent mirror is arranged at the intersection of the optical axis of the light emitting from the first laser chip and the optical axis of the light emitting from the second laser chip. The semi-transparent mirror is used to allow the laser emitted from the first laser chip to pass through and reflect the laser emitted from the second laser chip so that the propagation direction of the laser emitted from the second laser chip coincides with the central axis of the tube seat after being reflected.
[0007] On the basis of the above technical solution, the present invention can also be improved as follows.
[0008] Furthermore, the optical axis of light emitted by the second laser chip is arranged perpendicular to the optical axis of light emitted by the first laser chip.
[0009] Furthermore, a TEC cooler and a tungsten copper block are also provided in the sealed space, the TEC cooler is mounted on the top surface of the tube holder, and the tungsten copper block is arranged on the top of the TEC cooler; the first laser chip is arranged on the front side surface of the tungsten copper block, the second laser chip is arranged on the top surface of the tungsten copper block, and the semi-mirror is arranged on the top of the front side surface of the tungsten copper block.
[0010] Furthermore, the semi-transparent mirror is block-shaped and has an inclined surface on the top. The angle between the inclined surface and the central axis of the tube seat is 45°. The inclined surface is provided with a mirror coating, which is used to allow the laser emitted by the first laser chip to pass through and reflect the laser emitted by the second laser chip.
[0011] Furthermore, the first laser chip is mounted on the front side of the tungsten copper block via a first heat sink.
[0012] Furthermore, the first heat sink is provided with a thermistor for detecting the temperature of the first laser chip, a plated capacitor for matching the input impedance of the high-speed modulation signal of the first laser chip, and a filter capacitor for filtering and voltage stabilization.
[0013] Furthermore, the second laser chip is mounted on the top surface of the tungsten copper block via a second heat sink.
[0014] Furthermore, a backlight detector is arranged on the tungsten copper block, and the backlight detector is arranged below the first laser chip.
[0015] Furthermore, an aspheric lens is disposed on the top of the tube cap, and the aspheric lens is located at the central axis of the tube seat.
[0016] Furthermore, a plurality of pins are arranged on the bottom surface of the tube holder.
[0017] Compared with the prior art, the technical solution of this application has the following beneficial technical effects:
[0018] 1. The utility model provides a half mirror, which is used to allow the laser emitted by the first laser chip to pass through and reflect the laser emitted by the second laser chip, so that the propagation direction of the laser emitted by the second laser chip coincides with the central axis of the tube holder after being reflected, thereby integrating two optical paths. Since the two lasers are combined into one laser, the number of device couplings is reduced and the yield is increased;
[0019] 2. By providing at least two half-mirrors, the technical solution of the utility model can also be extended to integrate the optical path of at least three lasers;
[0020] 3. Since two lasers are combined into one laser, the overall size of the optical device is reduced, and the total cost of the combined laser is reduced, and the production cost of the optical device is reduced. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] Figure 1 A schematic diagram of the structure of a dual-emission TO-CAN laser provided in an embodiment of the utility model;
[0022] Figure 2 for Figure 1 A cross-sectional view of the pipe cap hidden behind the pipe cap;
[0023] Figure 3 for Figure 1 Schematic diagram of the structure behind the hidden pipe cap;
[0024] Figure 4 for Figure 3 A partial enlarged schematic diagram of the middle A area;
[0025] In the accompanying drawings, the components represented by the reference numerals are listed as follows:
[0026] 1. Tube socket; 11. Tube pin; 2. Tube cap; 21. Aspherical lens; 3. TEC cooler; 4. Tungsten copper block; 5. First laser chip; 51. First heat sink; 52. Thermistor; 53. Coating capacitor; 54. Filter capacitor; 6. Second laser chip; 61. Second heat sink; 7. Half mirror; 71. Mirror coating; 8. Backlight detector. DETAILED DESCRIPTION
[0027] In order to facilitate understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. Embodiments of the present application are provided in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present application more thorough and comprehensive.
[0028] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.
[0029] It will be appreciated that spatial relationship terms such as "under," "beneath," "below," "under," "above," "above," etc., may be used herein to describe the relationship of an element or feature shown in the figures to other elements or features. It will be appreciated that, in addition to the orientations shown in the figures, spatial relationship terms also include different orientations of the device in use and operation. For example, if the device in the accompanying drawings is flipped, an element or feature described as "under other elements" or "under it" or "under it" will be oriented as being "above" the other elements or features. Thus, the exemplary terms "under" and "under" may include both upper and lower orientations. In addition, the device may also include additional orientations (e.g., rotated 90 degrees or other orientations), and the spatial descriptors used herein are interpreted accordingly.
[0030] A dual-emission TO-CAN laser comprises a tube base 1, a tube cap 2, a first laser chip 5, a second laser chip 6 and a half mirror 7. The tube cap 2 is arranged on the top surface of the tube base 1, so that a sealed space is formed between the tube cap 2 and the tube base 1.
[0031] The first laser chip 5 , the second laser chip 6 and the semi-transparent mirror 7 are all arranged in a sealed space, and the optical axis of the light emitted by the first laser chip 5 coincides with the central axis of the tube holder 1 , and the optical axis of the light emitted by the second laser chip 6 is perpendicular to the optical axis of the light emitted by the first laser chip 5 .
[0032] The semi-transparent mirror 7 is arranged at the intersection of the optical axis of the light emitting from the first laser chip 5 and the optical axis of the light emitting from the second laser chip 6. The semi-transparent mirror 7 is used to allow the laser emitted by the first laser chip 5 to pass through and reflect the laser emitted by the second laser chip 6 so that the propagation direction of the laser emitted by the second laser chip 6 coincides with the central axis of the tube seat 1 after being reflected.
[0033] Specifically, a TEC cooler 3 and a tungsten copper block 4 are further arranged in the sealed space, and the TEC cooler 3 is mounted on the top surface of the tube base 1 .
[0034] The first laser chip 5 is mounted on the front side of the tungsten copper block 4 through the first heat sink 51. The first heat sink 51 is also provided with a thermistor 52 for detecting the temperature of the first laser chip 5, a plated capacitor 53 for matching the input impedance of the high-speed modulation signal of the first laser chip 5, and a filter capacitor 54 for filtering and voltage stabilization.
[0035] The second laser chip 6 is mounted on the top surface of the tungsten copper block 4 via a second heat sink 61 .
[0036] The semi-mirror 7 is arranged at the top of the front side of the tungsten copper block 4. The semi-mirror 7 is block-shaped and has an inclined surface on the top. The angle between the inclined surface and the central axis of the tube holder 1 is 45°. The inclined surface is provided with a mirror coating 71. The mirror coating 71 is used to allow the laser emitted by the first laser chip 5 to pass through and reflect the laser emitted by the second laser chip 6.
[0037] A backlight detector 8 is also arranged on the tungsten copper block 4 , and the backlight detector 8 is arranged below the first laser chip 5 .
[0038] In this embodiment, a half mirror 7 is provided, which is used to allow the laser emitted by the first laser chip 5 to pass through and reflect the laser emitted by the second laser chip 6, so that the propagation direction of the laser emitted by the second laser chip 6 coincides with the central axis of the tube holder 1 after being reflected, thereby integrating two optical paths. Since the two lasers are combined into one laser, the number of device couplings is reduced and the yield is increased. In addition, the overall size of the optical device is reduced, and the total cost of the laser after integration is reduced, and the production cost of the optical device is reduced.
[0039] By providing at least two half-mirrors 7 , the technical solution of this embodiment can also be extended to an optical path for integrating at least three lasers.
[0040] An aspheric lens 21 is provided on the top of the tube cap 2, and the aspheric lens 21 is located at the central axis of the tube base 1. The combined optical signals are emitted and converged through the aspheric lens 21 on the tube cap 2, and then are emitted into the optical fiber for total reflection, thereby realizing optical fiber communication.
[0041] In this embodiment, the first laser chip 5 is used to emit a laser with a wavelength of 1490nm, and the second laser chip 6 is used to emit a laser with a wavelength of 1577nm. The original 1490nm laser operates at 25°C. Now it is necessary to adjust the chip wavelength so that it meets the 1490nm wavelength requirement at 45° (the operating temperature of the 1577nm laser).
[0042] In addition, a plurality of pins 11 are provided on the bottom surface of the tube holder 1 for electrical connection with an external system. The plurality of pins include a ground pin, and the remaining pins are respectively connected to the positive pole of the TEC cooler 3, the negative pole of the TEC cooler 3, the thermistor 52, the backlight detector 8, the filter capacitor 54, the coating capacitor 53, the first laser chip 5 and the second laser chip 6, so as to ensure the normal operation of the laser. In order to meet the power supply pins of the two laser chips, a larger size tube shell such as TO56, TO60 or TO62 is required to accommodate multiple pins 11.
[0043] The tube shell is made of varable material to meet the airtightness requirements.
[0044] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.
Claims
1. A dual-emission TO-CAN laser, characterized in that: It comprises a tube seat, a tube cap, a first laser chip, a second laser chip and a half mirror; the tube cap is arranged on the top surface of the tube seat so that a sealed space is formed between the tube cap and the tube seat; The first laser chip, the second laser chip and the half mirror are all arranged in the sealed space, and the optical axis of the light emitted by the first laser chip coincides with the central axis of the tube holder, and the optical axis of the light emitted by the second laser chip intersects with the optical axis of the light emitted by the first laser chip; The semi-transparent mirror is arranged at the intersection of the optical axis of the light emitting from the first laser chip and the optical axis of the light emitting from the second laser chip. The semi-transparent mirror is used to allow the laser emitted from the first laser chip to pass through and reflect the laser emitted from the second laser chip so that the propagation direction of the laser emitted from the second laser chip coincides with the central axis of the tube seat after being reflected.
2. A dual-emission TO-CAN laser according to claim 1, characterized in that: The optical axis of light emitted by the second laser chip is arranged perpendicular to the optical axis of light emitted by the first laser chip.
3. A dual-emission TO-CAN laser according to claim 2, characterized in that: A TEC cooler and a tungsten copper block are also arranged in the sealed space. The TEC cooler is installed on the top surface of the tube holder, and the tungsten copper block is arranged on the top of the TEC cooler; the first laser chip is arranged on the front side surface of the tungsten copper block, the second laser chip is arranged on the top surface of the tungsten copper block, and the semi-mirror is arranged on the top of the front side surface of the tungsten copper block.
4. A dual-emission TO-CAN laser according to claim 3, characterized in that: The semi-mirror is block-shaped and has an inclined surface on the top. The angle between the inclined surface and the central axis of the tube seat is 45°. A mirror coating is provided on the inclined surface. The mirror coating is used to allow the laser emitted by the first laser chip to pass through and reflect the laser emitted by the second laser chip.
5. A dual-emission TO-CAN laser according to claim 3, characterized in that: The first laser chip is mounted on the front side of the tungsten copper block via a first heat sink.
6. A dual-emission TO-CAN laser according to claim 5, characterized in that: The first heat sink is provided with a thermistor for detecting the temperature of the first laser chip, a plated capacitor for matching the input impedance of the high-speed modulation signal of the first laser chip, and a filter capacitor for filtering and voltage stabilization.
7. A dual-emission TO-CAN laser according to claim 3, characterized in that: The second laser chip is mounted on the top surface of the tungsten copper block via a second heat sink.
8. A dual-emission TO-CAN laser according to claim 3, characterized in that: A backlight detector is arranged on the tungsten copper block, and the backlight detector is arranged below the first laser chip.
9. A dual-emission TO-CAN laser according to claim 1, characterized in that: An aspheric lens is arranged on the top of the tube cap, and the aspheric lens is located at the central axis of the tube seat.
10. A dual-emission TO-CAN laser according to claim 1, characterized in that: A plurality of tube pins are arranged on the bottom surface of the tube seat.