Novel air circulation type heat dissipation power distribution cabinet

Abstract

The utility model relates to the technical field of power distribution cabinets, and discloses a novel air circulation type heat dissipation power distribution cabinet which comprises a cabinet body, a base is fixedly installed at the bottom of the cabinet body, an air inlet is formed in the bottom of the rear side of the cabinet body, two first fans are further fixedly installed on the rear side face of the cabinet body, the first fans are located at the air inlet, and the second fans are located at the air inlet. A bearing frame is embedded in the inner bottom wall of the cabinet body, a semiconductor chilling plate is installed on the bearing frame, and the refrigerating face of the semiconductor chilling plate is located at the air inlet. According to the novel air circulation type heat dissipation power distribution cabinet, the air inlet and the first fan are arranged at the bottom of the cabinet body, the speed of external air entering the cabinet body can be increased, meanwhile, the semiconductor chilling plate is arranged in the cabinet body, and the refrigeration surface of the semiconductor chilling plate is located at the air inlet; air entering the cabinet body can be cooled through the semiconductor chilling plate, and then electronic components in the cabinet body can be effectively cooled through the cooled air.

Description

Technical Field

[0001] The utility model relates to the technical field of power distribution cabinets, in particular to a novel air circulation type heat dissipation power distribution cabinet. Background Art

[0002] The distribution cabinet is divided into power distribution cabinet, lighting distribution cabinet and metering cabinet, which is the final equipment of the distribution system. The distribution cabinet is a general term for the motor control center. The distribution cabinet is suitable for occasions with relatively dispersed loads and fewer circuits; the motor control center is used in occasions with concentrated loads and more circuits. They distribute the power of a circuit of the upper-level distribution equipment to the nearest load. This level of equipment should provide protection, monitoring and control for the load, but the existing distribution cabinet still has shortcomings: first, there is no circulating heat dissipation mechanism inside, and the heat inside the distribution cabinet cannot be circulated and dissipated. The heat inside the distribution box is difficult to dissipate, which easily leads to thermal damage and aging of electrical components.

[0003] In order to solve the above technical problems, the Chinese utility model patent with authorization announcement number CN209608135U discloses an internal circulation type high-efficiency heat dissipation distribution cabinet, the utility model is provided with a circulation type heat dissipation mechanism inside, a blower and a blower blade are provided at the bottom center of the distribution cabinet, and a drainage baffle, a guide plate and a heat absorption plate are provided on the inner side of the distribution cabinet. When high temperature is generated inside the distribution cabinet, due to the principle of gas thermal motion, the hot air will rise to the vicinity of the guide plate, and due to the action of the blower, the hot air will be pushed to the gap between the drainage baffle and the heat absorption plate, and the heat absorption plate will absorb the heat of the hot air. The hot air after heat absorption treatment will be discharged through the second filter screen, and at the same time, the cold air from the outside will enter the interior of the distribution cabinet through the first filter screen due to the action of air flow. This structure can realize the circulation type heat dissipation treatment inside the distribution cabinet, which not only improves the heat dissipation performance of the distribution cabinet, but also prolongs the service life of the electrical components inside the distribution cabinet.

[0004] Although the technical solution provided by the utility model solves the problem that the heat inside the box is difficult to dissipate when the existing distribution cabinet is used, when the distribution cabinet is used in summer, the external weather temperature is high, which will cause the external air temperature to become high. If only a blower is used to send external air into the distribution cabinet for cooling, it cannot effectively cool the electronic components inside the distribution cabinet. When the temperature is high in summer, it may still cause the internal electronic components to malfunction or be damaged. Utility Model Content

[0005] The purpose of the utility model is to provide a novel air circulation type heat dissipation distribution cabinet to solve the problems raised in the above background technology.

[0006] The present application embodiment adopts the following technical solutions:

[0007] A novel air circulation heat dissipation distribution cabinet comprises a cabinet body, a base is fixedly installed on the bottom of the cabinet body, an air inlet is opened on the rear bottom of the cabinet body, two first fans are also fixedly installed on the rear side surface of the cabinet body, the first fans are located at the air inlet, a load-bearing frame is embedded on the inner bottom wall of the cabinet body, a semiconductor refrigeration plate is installed on the load-bearing frame, and the cooling surface of the semiconductor refrigeration plate is located at the air inlet.

[0008] Beneficial effects:

[0009] The utility model can accelerate the speed of external air entering the cabinet by arranging an air inlet and a first fan at the bottom of the cabinet, and at the same time a semiconductor refrigeration plate is arranged inside the cabinet, and the cooling surface of the semiconductor refrigeration plate is located at the air inlet, so that the air entering the cabinet can be cooled by the semiconductor refrigeration plate, and then the electronic components inside the cabinet can be effectively cooled by the cooled air.

[0010] Preferably, the load-bearing frame consists of a vertical portion and a horizontal portion, the vertical portion and the horizontal portion are integrally formed, the upper surface of the vertical portion is maintained on the same horizontal plane as the inner bottom wall of the cabinet, and the middle portion of the horizontal portion is a hollow structure.

[0011] Preferably, the heating surface of the semiconductor refrigeration plate is mounted on the horizontal part of the load-bearing frame, and a heat dissipation aluminum plate is fixedly connected to the heating surface of the semiconductor refrigeration plate. The heat dissipation aluminum plate is located in the hollow part of the load-bearing frame, one side of the heat dissipation aluminum plate is in contact with the heating surface of the semiconductor refrigeration plate, and the other side of the heat dissipation aluminum plate extends to the inside of the base.

[0012] Preferably, the interior of the base is a hollow structure, and a plurality of corresponding ventilation holes are provided on both sides of the base.

[0013] Preferably, an air outlet is provided at the top of the rear side surface of the cabinet, and two second fans are fixedly installed at the top of the rear side surface of the cabinet, and the second fans are located at the air outlet.

[0014] Preferably, a cabinet door is hinged on the front side of the cabinet body, a handle is fixedly installed on the outer side surface of the cabinet door, cross beams are fixedly installed on both sides of the inner wall of the cabinet body, two columns are fixedly installed on the rear side of the inner wall of the cabinet body, two L-shaped plates with adjustable heights are provided on the columns, and a mounting frame is fixedly installed in the middle of the rear side surface of the cabinet body. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0016] Figure 1 This is a schematic diagram of the main structure of the utility model;

[0017] Figure 2 It is a rear view structural schematic diagram of the utility model;

[0018] Figure 3 It is a schematic diagram of the cross-sectional structure of the rear view of the utility model;

[0019] Figure 4 For the utility model Figure 3 The enlarged structural diagram at A in the middle;

[0020] Figure 5 It is a schematic diagram of the top view of the load-bearing frame of the utility model.

[0021] In the figure: 1. cabinet body; 2. base; 3. cabinet door; 4. handle; 5. beam; 6. column; 7. mounting frame; 8. air inlet; 9. first fan; 10. air outlet; 11. second fan; 12. load-bearing frame; 13. semiconductor cooling plate; 14. heat dissipation aluminum plate; 15. vent. DETAILED DESCRIPTION

[0022] In order to make the purpose, technical solution and advantages of the present application clearer, the technical solution of the present application will be clearly and completely described below in conjunction with the specific embodiments of the present application and the corresponding drawings. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present application.

[0023] The technical solutions provided by various embodiments of the present application are described in detail below in conjunction with the accompanying drawings.

[0024] See also Figure 1-4 A novel air circulation type heat dissipation distribution cabinet; comprising a cabinet 1, a base 2 is fixedly installed at the bottom of the cabinet 1, an air inlet 8 is opened at the bottom of the rear side of the cabinet 1, two first fans 9 are fixedly installed on the rear side of the cabinet 1, and the first fans 9 are located at the air inlet 8. A load-bearing frame 12 is embedded on the inner bottom wall of the cabinet 1, and a semiconductor cooling sheet 13 is installed on the load-bearing frame 12, and the cooling surface of the semiconductor cooling sheet 13 is located at the air inlet 8;

[0025] The load-bearing frame 12 is composed of a vertical portion and a horizontal portion, which are integrally formed. The upper surface of the vertical portion is maintained at the same horizontal plane as the inner bottom wall of the cabinet 1, and the middle portion of the horizontal portion is a hollow structure. By setting the middle portion of the horizontal portion of the load-bearing frame 12 to be hollow, it is convenient for the heat dissipation aluminum plate 14 to maintain contact with the semiconductor refrigeration sheet 13, so that the semiconductor refrigeration sheet 13 can be better cooled;

[0026] The heating surface of the semiconductor refrigeration sheet 13 is mounted on the horizontal part of the load-bearing frame 12. A heat dissipation aluminum plate 14 is fixedly connected to the heating surface of the semiconductor refrigeration sheet 13. The heat dissipation aluminum plate 14 is located at the hollow part of the load-bearing frame 12. One side of the heat dissipation aluminum plate 14 is in contact with the heating surface of the semiconductor refrigeration sheet 13. The other side of the heat dissipation aluminum plate 14 extends to the inside of the base 2. By providing the heat dissipation aluminum plate 14, the high temperature generated by the semiconductor refrigeration sheet 13 can be quickly conducted to the inside of the base 2 to avoid affecting the temperature inside the cabinet 1.

[0027] The interior of the base 2 is a hollow structure, and a plurality of vents 15 corresponding to each other are provided on both sides of the base 2. By providing the vents 15 corresponding to each other, the circulation speed of the air inside the base 2 can be increased, so that the temperature on the heat dissipation aluminum plate 14 can be quickly reduced through the circulation of air;

[0028] An air outlet 10 is provided at the top of the rear side of the cabinet 1. Two second fans 11 are also fixedly installed at the top of the rear side of the cabinet 1. The second fans 11 are located at the air outlet 10.

[0029] A cabinet door 3 is hingedly connected to the front side of the cabinet body 1, a handle 4 is fixedly installed on the outer side of the cabinet door 3, beams 5 are fixedly installed on both sides of the inner wall of the cabinet body 1, two columns 6 are fixedly installed on the rear side of the inner wall of the cabinet body 1, two height-adjustable L-shaped plates are arranged on the columns 6, and a mounting frame 7 is fixedly installed in the middle of the rear side of the cabinet body 1;

[0030] When the utility model is in use, the staff first starts the first fan 9, the second fan 11 and the semiconductor refrigeration sheet 13. The rotation of the first fan 9 can accelerate the speed at which the external air enters the cabinet 1 through the air inlet 8. After the external air enters the cabinet 1, the low temperature emitted by the semiconductor refrigeration sheet 13 can first cool the air entering the cabinet 1, and then the cooled air is sent to the top of the cabinet 1, so as to bring out the hot air in the cabinet 1, and finally the hot air is discharged to the outside of the cabinet 1 through the air outlet 10 by the second fan 11, so as to achieve the cooling effect on the inside of the cabinet 1.

[0031] The above is only an embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various changes and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the scope of the claims of the present application.

Claims

1. A novel air circulation type heat dissipation distribution cabinet, comprising a cabinet body, a base is fixedly installed at the bottom of the cabinet body, characterized in that: An air inlet is provided at the rear bottom of the cabinet, and two first fans are fixedly installed on the rear side of the cabinet, the first fans are located at the air inlet, a load-bearing frame is embedded on the inner bottom wall of the cabinet, a semiconductor refrigeration plate is installed on the load-bearing frame, and the cooling surface of the semiconductor refrigeration plate is located at the air inlet.

2. The novel air circulation heat dissipation distribution cabinet according to claim 1 is characterized in that: The load-bearing frame is composed of a vertical part and a horizontal part, the vertical part and the horizontal part are integrally formed, the upper surface of the vertical part and the inner bottom wall of the cabinet are maintained on the same horizontal plane, and the middle part of the horizontal part is a hollow structure.

3. The novel air circulation heat dissipation distribution cabinet according to claim 2 is characterized in that: The heating surface of the semiconductor refrigeration plate is mounted on the horizontal part of the load-bearing frame, and a heat dissipation aluminum plate is fixedly connected to the heating surface of the semiconductor refrigeration plate. The heat dissipation aluminum plate is located in the hollow part of the load-bearing frame, one side of the heat dissipation aluminum plate is in contact with the heating surface of the semiconductor refrigeration plate, and the other side of the heat dissipation aluminum plate extends to the inside of the base.

4. The novel air circulation type heat dissipation distribution cabinet according to claim 3 is characterized in that: The interior of the base is a hollow structure, and a plurality of corresponding vents are provided on both sides of the base.

5. The novel air circulation type heat dissipation distribution cabinet according to claim 1 is characterized in that: An air outlet is provided on the top of the rear side surface of the cabinet body, and two second fans are fixedly mounted on the top of the rear side surface of the cabinet body, wherein the second fans are located at the air outlet.

6. The novel air circulation heat dissipation distribution cabinet according to claim 1 is characterized in that: A cabinet door is hinged on the front side of the cabinet body, a handle is fixedly installed on the outer side surface of the cabinet door, cross beams are fixedly installed on both sides of the inner wall of the cabinet body, two columns are fixedly installed on the rear side of the inner wall of the cabinet body, two L-shaped plates with adjustable heights are arranged on the columns, and a mounting frame is fixedly installed in the middle of the rear side surface of the cabinet body.

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