Solid-state power amplifier

Abstract

The utility model provides a solid-state power amplifier, which comprises a frame body, a first power amplifier, a second power amplifier and a power amplifier, and is characterized in that the frame body forms an accommodating space, the accommodating space is provided with a channel extending along a first direction, and the frame body is provided with a heat dissipation window communicated with the accommodating space and the outside; the heat dissipation window comprises a first air inlet and a first air outlet, the first air inlet is located at one end of the channel, and the first air outlet is located at the other end of the channel and right faces the channel. The power amplifier main body is assembled in the accommodating space; the power supply assembly is accommodated in the accommodating space and comprises a power supply body which is parallel to the first direction and is arranged in the channel; the heat dissipation module is accommodated in the accommodating space; the heat dissipation module comprises a first fan and a first heat dissipation block, the first heat dissipation block is connected to the power source body and arranged on the heating face of the power source body, the first fan directly faces the first air outlet, the central axis of the first fan is parallel to the channel, and the first fan is further used for dissipating heat generated by the power amplifier body out of the frame through the heat dissipation window. And the occupied volume is reduced while the heat dissipation effect is ensured.

Description

Technical Field

[0001] The utility model belongs to the technical field of wireless communication, and in particular relates to a solid-state power amplifier. Background Art

[0002] Microwave and RF solid-state power amplifiers are components used to reproduce signals with greater power, current, and voltage. They can also be considered as circuits that convert self-current input into RF and microwave energy. Microwave and RF solid-state power amplifiers are usually composed of RF microwave power transistors, input and output matching circuits, DC feeds, bias circuits, control circuits, and switching power supplies. They are widely used in electronic countermeasures, wireless communications, radar, and radar jamming.

[0003] Microwave and radio frequency solid-state power amplifiers include indoor power amplifier products placed in standard cabinets in a machine room. The switching power supply in conventional indoor power amplifier products is fixed inside the product cavity. Therefore, the cavity of conventional indoor power amplifier products also includes a heat dissipation module for the switching power supply, which is used to dissipate the heat generated by the switching power supply to the outside of the product to reduce the temperature. However, the heat dissipation module used to reduce the heat of the switching power supply in the indoor power amplifier products in the related art is usually more complex in structure and occupies a larger space, making the entire indoor power amplifier product bulky and large in size. Utility Model Content

[0004] The technical purpose of the utility model is to provide a solid-state power amplifier, aiming to solve the technical problem in the related art that the heat dissipation module structure used to reduce the heat of the switching power supply in the indoor power amplifier product is relatively complex and occupies a large space, making the entire indoor power amplifier product relatively bulky and large in size.

[0005] To solve the above technical problems, the utility model is implemented as follows: a solid-state power amplifier comprises a frame, a power amplifier body, a power supply assembly and a heat dissipation module; a receiving space is formed inside the frame, the receiving space has a channel extending along a first direction, and the frame is provided with a heat dissipation window connecting the receiving space and the outside; the heat dissipation window comprises a first air outlet and a first air inlet, the first air inlet is located at one end of the channel, and the first air outlet is located at one end of the channel and directly opposite to the channel; the power amplifier body is assembled in the receiving space; the power supply assembly is accommodated in the receiving space, the power supply assembly comprises a power supply body parallel to the first direction and arranged in the channel; the heat dissipation module is accommodated in the receiving space; the heat dissipation module comprises a first fan and a first heat dissipation block, the first heat dissipation block is connected to the power supply body and arranged on the heating surface of the power supply body, the first fan is directly opposite to the first air outlet, and the central axis of the first fan is parallel to the channel, and the first fan is also used to dissipate the heat generated by the power amplifier body to the outside of the frame through the heat dissipation window.

[0006] Furthermore, the solid-state power amplifier further includes a first shell and a second shell assembled in the accommodating space, and the first shell and the second shell are connected and enclosed to form the channel.

[0007] Furthermore, the first heat sink includes a plurality of first heat sinks, the power supply body includes a first side shell, the heat generating surface of the power supply body is formed on the first side shell, the plurality of first heat sinks are arranged at equal intervals on the first side shell, and the plate surfaces of the plurality of first heat sinks are parallel to the axial direction of the first fan.

[0008] Further, the first heat sink includes a first arc-shaped portion and a second arc-shaped portion close to both ends of the power supply body; wherein, the first arc-shaped portion is close to the first air outlet, and, along the first direction, from the first air outlet to the first air inlet, the first arc-shaped portion gradually expands; the second arc-shaped portion is close to the first air inlet, and, along the first direction, from the first air outlet to the first air inlet, the second arc-shaped portion gradually contracts.

[0009] Furthermore, the heat dissipation module also includes a second heat dissipation block, the second heat dissipation block includes a plurality of second heat sinks, the power supply body includes a second side shell arranged opposite to the first side shell, the heat generating surface of the power supply body is also formed on the second side shell, and the plurality of heat sinks are arranged on the second side shell at equal intervals, and the plate surfaces of the plurality of second heat sinks are parallel to the axial direction of the first fan.

[0010] Furthermore, the frame body includes a first sub-frame and a second sub-frame that are relatively arranged and orthogonal to the first direction, the first air outlet is opened in the first sub-frame, the first air inlet is opened in the second sub-frame, and the first air outlet is covered with a first protective net, and the first air inlet is covered with a second protective net.

[0011] Furthermore, the first protective net includes a plurality of hexagonal hole structures, which are stacked in sequence to form a honeycomb shape; and / or, the second protective net includes a plurality of hexagonal hole structures, which are stacked in sequence to form a honeycomb shape.

[0012] Furthermore, the first air inlet is also provided with a protective cover, and the protective cover covers a side of the second protection net facing away from the first air inlet.

[0013] Furthermore, the protective cover includes a base connected to the frame, and a plurality of baffles spaced apart from each other on the base.

[0014] Furthermore, the receiving space also includes a subspace adjacent to the channel, and the amplifier body is assembled in the subspace; the heat dissipation module also includes a third heat dissipation block and a second fan, and the heat dissipation window also includes a second air inlet and a second air outlet that are relatively arranged, and the first air outlet and the second air outlet are located on the same side of the frame, and the first air inlet and the second air inlet are located on the same side of the frame; the third heat dissipation block is arranged in the heating area of ​​the amplifier body, the second fan is opposite to the second air outlet and the central axis of the second fan is parallel to the channel.

[0015] Compared with the related art, the solid-state power amplifier in the utility model has the following beneficial effects:

[0016] In the utility model, the receiving space inside the frame is equipped with a power amplifier body, and the power amplifier body is used to realize the function of a solid-state power amplifier. In addition, since the first heat sink is directly installed on the heating surface of the power supply body, the first heat sink can directly take away the heat of the power supply body. In addition, the power supply body and the first heat sink are arranged in the channel, and the first air inlet and the first air outlet are respectively arranged at both ends of the channel, wherein the first air outlet is provided with a first fan, therefore, the first fan can drive the air flow from the first air inlet into the receiving space, and the first fan drives the air flow to flow to the channel, so that the air flow can take away the heat of the first heat sink, and finally the heat is taken out of the frame through the first air outlet, so that the channel can form an air duct. Since the channel extends along the first direction, that is, the air flow mainly flows along the first direction, the flow path of the air flow can be shortened, and the heat of the first heat sink can be taken out of the frame faster and better, so as to achieve a better heat dissipation effect. The channel is defined and formed in the receiving space, which can guide the air flow. The power supply body and the first heat sink are both arranged in the channel. While ensuring the heat dissipation effect, the space can be well planned to make the structure compact and reduce the occupied volume. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For those skilled in the art, other drawings can be obtained based on these drawings without paying creative work.

[0018] Figure 1 It is a three-dimensional structural schematic diagram of a solid-state power amplifier in an embodiment of the utility model;

[0019] Figure 2 It is a schematic diagram of the first part of the structure of the solid-state power amplifier in the embodiment of the utility model;

[0020] Figure 3 It is a schematic diagram of the second part of the structure of the solid-state power amplifier in the embodiment of the utility model;

[0021] Figure 4 It is a schematic diagram of the structure of the power supply assembly in the embodiment of the utility model.

[0022] In the accompanying drawings, the reference numerals represent: 1. frame; 11. accommodation space; 111. channel; 112. subspace; 2. amplifier body; 3. power supply assembly; 31. power supply body; 4. heat dissipation module; 41. first fan; 42. first heat dissipation block; 421. first arc-shaped portion; 422. second arc-shaped portion; 43. second heat dissipation block; 44. third heat dissipation block; 45. second fan; 5. heat dissipation window; 51. first air outlet; 52. second air outlet; 53. first protective net; 54. second protective net; 55. protective cover. DETAILED DESCRIPTION

[0023] The embodiments of the utility model are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the utility model, and cannot be understood as limiting the utility model. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the utility model.

[0024] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "circumferential", "radial" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0025] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0026] See also Figure 1-4The embodiment of the utility model provides a solid-state power amplifier, comprising a frame 1, a power amplifier body 2, a power supply assembly 3 and a heat dissipation module 4; a receiving space 11 is formed inside the frame 1, and a channel 111 extending along a first direction is provided in the receiving space 11, and a heat dissipation window 5 connecting the receiving space 11 and the outside is opened in the frame 1; the heat dissipation window 5 comprises a first air inlet and a first air outlet, the first air inlet is located at one end of the channel 111, and the first air outlet 51 is located at one end of the channel 111 and directly opposite to the channel 111; the power amplifier body 2 is assembled in the receiving space 11; The power supply assembly 3 is accommodated in the accommodation space 11, and the power supply assembly 3 includes a power supply body 31 parallel to the first direction and arranged in the channel 111; the heat dissipation module 4 is accommodated in the accommodation space 11; the heat dissipation module 4 includes a first fan 41 and a first heat dissipation block 42, the first heat dissipation block 42 is connected to the power supply body 31 and is arranged on the heating surface of the power supply body 31, the first fan 41 is opposite to the first air outlet 51, and the central axis of the first fan 41 is parallel to the channel 111, and the first fan 41 is also used to dissipate the heat generated by the power amplifier body 2 to the outside of the frame 1 through the heat dissipation window 5.

[0027] In the embodiment of the utility model, the receiving space 11 inside the frame 1 is equipped with a power amplifier body 2, and the power amplifier body 2 is used to realize the function of a solid-state power amplifier. In addition, since the first heat sink 42 is directly mounted on the heating surface of the power source body 31, the first heat sink 42 can directly take away the heat of the power source body 31. In addition, the power source body 31 and the first heat sink 42 are arranged in the channel 111, and the first air inlet and the first air outlet 51 are respectively arranged at both ends of the channel 111, wherein the first fan 41 is arranged at the first air outlet 51, therefore, the first fan 41 can drive the air flow from the first air inlet into the receiving space 11, and the first fan 41 drives the air flow to flow to the channel 111, so that the air flow can take away the heat of the first heat sink 42, and finally the heat is taken out of the frame 1 through the first air outlet 51, so that the channel 111 can form an air duct. Since the channel 111 extends along the first direction, that is, the air flow mainly flows along the first direction, the flow path of the air flow can be shortened, and the heat of the first heat sink 42 can be brought out of the frame 1 faster and better, thereby achieving a better heat dissipation effect. The channel 111 is defined and formed in the receiving space 11, which can play a role in guiding the air flow. The power supply body 31 and the first heat sink 42 are both arranged in the channel 111. While ensuring the heat dissipation effect, the space can be well planned, making the structure compact and reducing the occupied volume.

[0028] It can be understood that the power amplifier body 2 specifically includes RF microwave power transistors, input and output matching circuits, DC feed, bias circuit and control circuit, etc. The solid-state power amplifier of the embodiment of the utility model is the same as conventional microwave and RF solid-state power amplifiers in realizing basic functions, and can be considered as a component for reproducing signals with greater power, greater current and greater voltage, and can be considered as a circuit for converting self-flowing input into RF and microwave energy.

[0029] It should be noted that the frame 1 may be mainly in the shape of a square, and the first direction may be the length direction or the width direction of the frame 1. For example, Figure 1 The direction parallel to the X-axis is the first direction.

[0030] Furthermore, in some embodiments, the solid-state power amplifier also includes a first shell and a second shell assembled in the receiving space 11, and the first shell and the second shell are connected and enclosed to form a channel 111. In the embodiment, the first shell and the second shell can be integrally molded, or can be connected by a detachable method such as screw connection, snap connection, etc. In addition, the first shell and / or the second shell can be connected to the frame 1 by a detachable method such as screw connection, snap connection, etc. Therefore, the channel 111 can be defined in the receiving space 11 by the first shell and the second shell, which has a guiding effect on the airflow airway. The airflow can circulate in the channel 111 and quickly take away the heat, so that the overall space can be well planned, the structure is compact, and the occupied volume is reduced.

[0031] Furthermore, in some specific embodiments, the first heat sink 42 includes a plurality of first heat sinks, the power supply body 31 includes a first side shell, the heat generating surface of the power supply body 31 is formed on the first side shell, the plurality of first heat sinks are arranged at equal intervals on the first side shell, and the plate surfaces of the plurality of first heat sinks are parallel to the axial direction of the first fan 41.

[0032] Specifically, the first heat sink 42 can be connected to the power supply body 31 by means of screw connection. Exemplarily, the axial direction of the frame 1 is taken as the up-down direction, and the first direction is taken as the front-back direction. Therefore, the first side shell of the power supply body 31 can be a left shell, a right shell, or a top shell. The first heat sink extends in the first direction and is arranged orthogonally to the first side shell, and a plurality of first heat sinks are arranged at intervals. The first fan 41 drives the air flow to flow through the first heat sink 42. Under the blocking effect of the plurality of first heat sinks, the air flow flows through the gaps between the plurality of first heat sinks and contacts the first heat sink, so that the heat on the first heat sink is quickly dissipated, thereby realizing rapid heat dissipation of the power supply body 31.

[0033] Further, in some specific embodiments, the first heat sink includes a first arc-shaped portion 421 and a second arc-shaped portion 422 close to both ends of the power supply body 31; wherein the first arc-shaped portion 421 is close to the first air outlet 51, and, along the first direction, from the first air outlet 51 to the first air inlet, the first arc-shaped portion 421 gradually expands; the second arc-shaped portion 422 is close to the first air inlet, and, along the first direction, from the first air outlet 51 to the first air inlet, the second arc-shaped portion 422 gradually shrinks.

[0034] Specifically, the first heat sink is disposed on the power source body 31, and the two ends of the first heat sink are respectively close to the two ends of the power source body 31. The two ends of the first heat sink are respectively the first arc portion 421 and the second arc portion 422. Among them, the second arc portion 422 is close to the first air inlet, and the closer to the first air inlet, the smaller the projection surface area of ​​the first arc portion 421 along the first direction, so that the channel 111 can have a larger air inlet space near the first air inlet, so that more air flow can flow through the channel 111 continuously under the drive of the first fan 41. The first arc portion 421 is close to the first air outlet 51, and the closer to the first air outlet 51, the smaller the projection surface area of ​​the first arc portion 421 along the first direction, so that the channel 111 can have a larger air outlet space near the first air outlet 51, so that more heat can flow out of the channel 111 more quickly and finally out of the frame 1. Such a configuration can further improve the heat dissipation efficiency and heat dissipation effect while ensuring the reduction of occupied space.

[0035] Furthermore, in some specific embodiments, the heat dissipation module 4 also includes a second heat dissipation block 43, the second heat dissipation block 43 includes a plurality of second heat sinks, the power supply body 31 includes a second side shell arranged opposite to the first side shell, the heating surface of the power supply body 31 is also formed on the second side shell, and the plurality of heat sinks are arranged at equal intervals on the second side shell, and the plate surfaces of the plurality of second heat sinks are parallel to the axial direction of the first fan 41.

[0036] Specifically, the axial direction of the frame 1 is taken as the up-down direction, and the first direction is taken as the front-back direction. Therefore, both the left and right shells of the power source body 31 may be provided with heat dissipation blocks. The left shell may be provided with the first heat dissipation block 42 or the second heat dissipation block 43, and the right shell may be provided with the second heat dissipation block 43 or the first heat dissipation block 42. No specific limitation is made. By directly installing the first heat dissipation block 42 and the second heat dissipation block 43 on the two heating surfaces of the power source body 31, the heat generated by the power source body 31 can be taken away from the frame 1 more quickly. The first heat dissipation block 42 and the second heat dissipation block 43 are relatively arranged on both sides of the power source body 31 and are both located in the channel 111. Therefore, while further improving the heat dissipation effect, it will not generate excessive occupied space.

[0037] Furthermore, in some specific embodiments, the first heat dissipation block 42 and the second heat dissipation block 43 are symmetrically arranged, that is, the first arc portion 421 and the second arc portion 422 may also be arranged at both ends of the second heat dissipation block 43, thereby further improving the heat dissipation efficiency and heat dissipation effect while ensuring that the occupied space is reduced.

[0038] Further, in some embodiments, the frame 1 includes a first subframe and a second subframe that are arranged opposite to each other and orthogonal to the first direction, the first air outlet 51 is opened in the first subframe, the first air inlet is opened in the second subframe, and the first air outlet 51 is covered with a first protective net 53, and the first air inlet is covered with a second protective net 54. By providing the first protective net 53 and the second protective net 54, dust, debris, etc. can be effectively prevented from being blown into the receiving space 11 through the first air outlet 51 and the first air inlet, and the devices in the receiving space 11 can be ensured not to be affected.

[0039] Furthermore, the first protection net 53 includes a plurality of hexagonal hole structures, which are stacked in sequence to form a honeycomb shape; and / or, the second protection net 54 includes a plurality of hexagonal hole structures, which are stacked in sequence to form a honeycomb shape.

[0040] In some specific embodiments, the first protection net 53 and the second protection net 54 are both honeycomb-shaped, so as to improve the structural strength of the first protection net 53 and the second protection net 54 while ensuring smooth air flow.

[0041] It should be noted that the present invention does not limit the specific structure of the first protective net 53 and the second protective net 54. For example, the first protective net 53 may include a plurality of circular holes arranged in an array; the second protective net 54 may include a plurality of square holes arranged in an array.

[0042] Furthermore, in some embodiments, the first air inlet is further provided with a protective cover 55, which covers the side of the second protection net 54 away from the first air inlet. By providing the protective cover 55 at the position of the first air inlet, the protection effect of the components in the receiving space 11 can be further improved, and excessive dust can be prevented from falling on the second protection net 54, thereby increasing the service life of the second protection net 54 and reducing the number of times the second protection net 54 is replaced.

[0043] Furthermore, in some specific embodiments, the protective cover 55 includes a base connected to the frame 1, and a plurality of baffles spaced apart on the base. The baffles can play a blocking role, preventing dust from falling into the second protective net 54 and the receiving space 11, and preventing external bases from damaging the product. In addition, the baffles are spaced apart, so that air can flow between the baffles without affecting the flow of air.

[0044] Furthermore, in some embodiments, the accommodating space 11 also includes a subspace 112 adjacent to the channel 111, and the amplifier body 2 is assembled in the subspace 112; the heat dissipation module 4 also includes a third heat dissipation block 44 and a second fan 45, the heat dissipation window 5 also includes a second air inlet and a second air outlet arranged relatively to each other, and the first air outlet 51 and the second air outlet 52 are located on the same side of the frame 1, and the first air inlet and the second air inlet are located on the same side of the frame 1; the third heat dissipation block 44 is arranged in the heating area of ​​the amplifier body 2, the second fan 45 is opposite to the second air outlet 52 and the central axis of the second fan 45 is parallel to the channel 111.

[0045] Specifically, a third heat sink 44 is directly installed in the heating area of ​​the amplifier body 2, so that the third heat sink 44 can directly take away the heat of the amplifier body 2. In addition, a first air outlet 51 and a second air outlet 52 are provided on the first subframe at the same time, and a first air inlet and a second air inlet are provided on the second subframe at the same time. Among them, the second fan 45 can drive the air flow from the second air inlet into the receiving space 11, and can drive the air flow to the subspace 112 at the same time, so that the air flow can take away the heat of the third heat sink 44, and finally the heat is taken out to the frame 1 through the second air outlet 52. The amplifier body 2 is all concentrated in the subspace 112. Therefore, while ensuring the heat dissipation effect, the space is well planned to make the structure compact and reduce the occupied volume. In addition, the first air outlet 51 is opposite to the channel 111 and the first fan 41, and the second air outlet 52 is aligned with the subspace 112 and the second fan 45. Therefore, the airflow direction in the channel 111 and the airflow direction in the subspace 112 are in the same direction, which can improve the air utilization rate and achieve a better overall heat dissipation effect.

[0046] It should be noted that the first air inlet can be directly opposite to the channel 111 or offset to the channel 111. Similarly, the second air inlet can be aligned with the subspace 112 or offset to the subspace 112. In some embodiments, the first air inlet and the second air inlet can also be the same air inlet. In this way, driven by the first fan 41 and the second fan 45. The air flow enters the receiving space 11 from the air inlet, and part of the air flow enters the channel 111. The first heat sink 42 is cooled by the guiding effect of the channel 111; part of the air flow flows to the subspace 112 to cool the second heat sink 43.

[0047] In addition, in some embodiments, the second air outlet 52 and the second air inlet may be provided with a protective net, and the second air inlet may be further provided with a protective cover 55, which can play a role in preventing dust and dirt and protecting the devices in the receiving space 11 from damage.

[0048] Furthermore, in some embodiments, the amplifier body 2 includes a heating area, the third heat sink 44 includes a plurality of third heat sinks, the plurality of third heat sinks are evenly spaced and distributed in the heating area, and the plate surfaces of the plurality of third heat sinks are parallel to the axial direction of the second fan 45 .

[0049] Specifically, the third heat sink 44 can be connected to the amplifier body 2 by screw connection. Exemplarily, with the axial direction of the frame 1 as the up-down direction and the first direction as the front-back direction, the third heat sink can be arranged at the top or bottom of the amplifier body 2, and a plurality of third heat sinks are arranged at intervals. The second fan 45 drives the air flow to flow through the third heat sink 44. Under the blocking effect of the plurality of third heat sinks, the air flow flows through the gaps between the plurality of third heat sinks and contacts the third heat sink, so that the heat on the third heat sink is quickly dissipated, thereby realizing the rapid heat dissipation of the amplifier body 2.

[0050] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0051] The above is a description of the technical solution provided by the utility model. For technicians in this field, according to the ideas of the embodiments of the utility model, there will be changes in the specific implementation methods and application scopes. In summary, the content of this specification should not be understood as a limitation on the utility model.

Claims

1. A solid-state power amplifier, characterized in that: include: A frame body, wherein a receiving space is formed inside, wherein the receiving space has a passage extending along a first direction, and the frame body is provided with a heat dissipation window connecting the receiving space and the outside; the heat dissipation window comprises a first air inlet and a first air outlet, wherein the first air inlet is located at one end of the passage, and the first air outlet is located at one end of the passage and directly opposite to the passage; A power amplifier body is assembled in the receiving space; A power supply assembly is accommodated in the accommodation space, wherein the power supply assembly comprises a power supply body parallel to the first direction and arranged in the channel; A heat dissipation module is accommodated in the accommodation space; the heat dissipation module includes a first fan and a first heat dissipation block, the first heat dissipation block is connected to the power supply body and is arranged on the heating surface of the power supply body, the first fan is directly opposite to the first air outlet, and the central axis of the first fan is parallel to the channel, and the first fan is also used to dissipate the heat generated by the power amplifier body to the outside of the frame through the heat dissipation window.

2. The solid-state power amplifier according to claim 1, characterized in that: The solid-state power amplifier further includes a first shell and a second shell assembled in the receiving space, wherein the first shell and the second shell are connected and enclosed to form the channel.

3. The solid-state power amplifier according to claim 1, characterized in that: The first heat sink includes a plurality of first heat sinks, the power supply body includes a first side shell, the heat generating surface of the power supply body is formed on the first side shell, the plurality of first heat sinks are arranged at equal intervals on the first side shell, and the plate surfaces of the plurality of first heat sinks are parallel to the axial direction of the first fan.

4. The solid-state power amplifier according to claim 3, characterized in that: The first heat sink includes a first arc-shaped portion and a second arc-shaped portion close to both ends of the power supply body; wherein the first arc-shaped portion is close to the first air outlet, and along the first direction, from the first air outlet to the first air inlet, the first arc-shaped portion gradually expands; the second arc-shaped portion is close to the first air inlet, and along the first direction, from the first air outlet to the first air inlet, the second arc-shaped portion gradually shrinks.

5. The solid-state power amplifier according to claim 3, characterized in that: The heat dissipation module also includes a second heat dissipation block, which includes a plurality of second heat dissipation fins. The power supply body includes a second side shell arranged opposite to the first side shell. The heat generating surface of the power supply body is also formed on the second side shell. The plurality of heat dissipation fins are arranged on the second side shell at equal intervals, and the plate surfaces of the plurality of second heat dissipation fins are parallel to the axial direction of the first fan.

6. The solid-state power amplifier according to claim 1, characterized in that: The frame body includes a first sub-frame and a second sub-frame which are arranged opposite to each other and orthogonal to the first direction, the first air outlet is opened in the first sub-frame, the first air inlet is opened in the second sub-frame, and the first air outlet is covered with a first protective net, and the first air inlet is covered with a second protective net.

7. The solid-state power amplifier according to claim 6, characterized in that: The first protection net includes a plurality of hexagonal hole structures, which are stacked in sequence to form a honeycomb shape; and / or, the second protection net includes a plurality of hexagonal hole structures, which are stacked in sequence to form a honeycomb shape.

8. The solid-state power amplifier according to claim 6, characterized in that: The first air inlet is also provided with a protective cover, which covers a side of the second protection net facing away from the first air inlet.

9. The solid-state power amplifier according to claim 8, characterized in that: The protective cover comprises a base body connected to the frame body and a plurality of blocking pieces spaced and distributed on the base body.

10. The solid-state power amplifier according to claim 1, characterized in that: The receiving space also includes a subspace adjacent to the channel, and the amplifier body is assembled in the subspace; the heat dissipation module also includes a third heat dissipation block and a second fan, and the heat dissipation window also includes a second air inlet and a second air outlet arranged opposite to each other, and the first air outlet and the second air outlet are located on the same side of the frame, and the first air inlet and the second air inlet are located on the same side of the frame; the third heat dissipation block is arranged in the heating area of ​​the amplifier body, the second fan is opposite to the second air outlet and the central axis of the second fan is parallel to the channel.

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