Flexible circuit board assembly

Abstract

The utility model provides a flexible circuit board assembly which comprises a flexible circuit substrate and a reinforcing plate bonded on the flexible circuit board, and the flexible circuit substrate comprises a first non-bending area, a bending area and a second non-bending area which are sequentially connected along a first direction. The reinforcing plate comprises a first part and a second part, and the first part is arranged in the bending area and extends to the first non-bending area and the second non-bending area in the first direction. The first part is in a long strip shape, and the length direction of the first part is the first direction. The first part is provided with a first end face deviating from the second non-bending area and a side face arranged in the first direction, and the second part protrudes from the side face and is arranged in the first non-bending area. In the second direction perpendicular to the first direction and parallel to the first non-bending area, the sum of the maximum width of the second portion and the width of the first end face is at least two times of the maximum width of the overlapping portion of the first portion and the bending area, and the risk of plate explosion layering between the flexible circuit substrate and the reinforcing plate can be reduced.

Description

Technical Field

[0001] The present application relates to the field of circuit boards, and in particular to a flexible circuit board assembly. Background Art

[0002] As electronic products develop towards being thinner, higher-density, and more multifunctional, not only are higher requirements placed on assembly and packaging technology, but components are also becoming more sophisticated. For example, the space available for circuit boards is also reduced, and circuit boards usually need to be bent and deformed before assembly. Flexible circuit boards have the property of being bendable, but when used alone, they cannot meet the rigidity requirements and are not conducive to installation, so they usually need to be used with reinforcement plates. However, the existing structure of flexible circuit boards and reinforcement plates is prone to bursting and delamination after bending. Utility Model Content

[0003] In order to solve the above technical problems, the purpose of this application is to provide a flexible circuit board assembly, which is conducive to reducing the risk of board explosion and delamination between the flexible circuit substrate and the reinforcement plate, thereby facilitating the subsequent installation of the flexible circuit board assembly.

[0004] A flexible circuit board assembly of the present application includes a flexible circuit substrate and a reinforcement plate bonded to the flexible circuit substrate, wherein the flexible circuit substrate includes a first non-bending area, a bending area, and a second non-bending area connected in sequence along a first direction. The reinforcement plate includes a first part and a second part, wherein the first part is arranged in the bending area and extends to the first non-bending area and the second non-bending area respectively along the first direction. The first part is in the shape of an elongated strip, and the length direction of the first part is the first direction. The first part has a first end face away from the second non-bending area and a side face arranged along the first direction, wherein the second part protrudes from the side face and is arranged in the first non-bending area. In a second direction perpendicular to the first direction and parallel to the first non-bending area, the sum of the maximum width of the second part and the width of the first end face is at least twice the maximum width of the first part overlapping the bending area.

[0005] As a solution of the present application, the second portion is directly connected to the first end surface.

[0006] As a solution of the present application, the length of overlap between the first portion and the first non-bending zone in the first direction is greater than the maximum width of overlap between the first portion and the bending zone in the second direction.

[0007] As a solution of the present application, the overlapping length of the first portion and the second non-bending zone in the first direction is greater than the maximum overlapping width of the first portion and the bending zone in the second direction.

[0008] As a solution of the present application, the reinforcing plate further includes a third portion, which protrudes from the side surface and is disposed in the second non-bending area.

[0009] As a solution of the present application, the first part has a second end face facing away from the first non-bending zone, and in the second direction, the sum of the maximum width of the third part and the width of the second end face is at least twice the maximum width of the overlap between the first part and the bending zone.

[0010] As a solution of the present application, the third portion is directly connected to the second end surface.

[0011] As a solution of the present application, the reinforcement plate is a metal reinforcement plate.

[0012] As a solution of the present application, the thickness of the metal reinforcement plate is 25 microns to 150 microns.

[0013] As a solution of the present application, the metal reinforcement plate is selected from any one of an aluminum plate, an iron plate, a copper plate, and a steel plate.

[0014] The flexible circuit board assembly of the present application is beneficial to improving the bonding strength between the reinforcement plate and the flexible circuit substrate, since the sum of the maximum width of the second part and the width of the first end face in the second direction perpendicular to the first direction and parallel to the first non-bending zone is at least twice the maximum width of the overlap between the first part and the bending zone, thereby helping to reduce the risk of delamination between the flexible circuit substrate and the reinforcement plate, and facilitating the subsequent installation of the flexible circuit board assembly. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic structural diagram of a flexible circuit board assembly according to an embodiment of the present application.

[0016] Figure 2 It is a schematic diagram of a bending state of a flexible circuit board assembly according to an embodiment of the present application.

[0017] Figure 3 A schematic structural diagram of a flexible circuit board assembly according to another embodiment of the present application.

[0018] Main component symbols

[0019]

[0020]

[0021] The following specific implementation methods will further illustrate the present application in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0022] The technical solution of the present application will be described clearly and completely in conjunction with specific embodiments below. Obviously, the described implementation is only a part of the implementation of the present application, not all implementations.

[0023] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The names of the technical means used in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0024] In the absence of conflict, the following embodiments and features of the embodiments may be combined with each other.

[0025] See also Figure 1 The present application provides a flexible circuit board assembly 100 according to an embodiment of the present invention, comprising a flexible circuit substrate 10 and a reinforcing plate 30 bonded to the flexible circuit substrate 10 .

[0026] The flexible circuit substrate 10 includes a first non-bending area 11 , a bending area 13 , and a second non-bending area 15 sequentially connected along a first direction X. Figure 2 This is a state of the flexible circuit board assembly 100 after being bent through the bending area 13 .

[0027] The reinforcing plate 30 is disposed on one side of the flexible circuit substrate 10. In some embodiments, the reinforcing plate 30 may be a metal reinforcing plate, for example, any one of an aluminum plate, an iron plate, a copper plate, and a steel plate may be selected from but not limited to. The thickness of the reinforcing plate 30 may be but not limited to 25 microns to 150 microns.

[0028] The reinforcing plate 30 includes a first portion 31 and a second portion 33. The first portion 31 may be substantially in the shape of a long strip, and the first portion 31 is disposed in the bending area 13 and extends along the first direction X to the first non-bending area 11 and the second non-bending area 15, respectively. The length direction of the first portion 31 is the same as the first direction X.

[0029] The first portion 31 has a first end surface 311 away from the second non-bending zone 15 , a side surface 313 arranged along the first direction X, and a second end surface 315 away from the first non-bending zone 11 .

[0030] The second portion 33 protrudes from the side surface 313 and is disposed in the first non-bending area 11. Further, in a second direction Y perpendicular to the first direction X and parallel to the first non-bending area 11, the sum W of the maximum width W1 of the second portion 33 and the width W2 of the first end surface 311 is at least twice the maximum width W3 of the first portion 31 overlapping the bending area 13, which is beneficial to improving the bonding strength between the reinforcing plate 30 and the flexible circuit substrate 10, thereby reducing the risk of delamination between the flexible circuit substrate 10 and the reinforcing plate 30, and facilitating the subsequent installation of the flexible circuit board assembly 100.

[0031] In some embodiments, the second portion 33 may also be directly connected to the first end surface 311, that is, the second portion 33 protrudes from the connection between the side surface 313 and the first end surface 311, which is beneficial to further reduce the risk of delamination of the reinforcement plate 30 from the first end surface 311 and the first non-bending area 11, thereby further facilitating the subsequent installation of the flexible circuit board assembly 100.

[0032] In some embodiments, the overlapping length L1 of the first portion 31 and the first non-bending area 11 in the first direction X may be greater than the maximum overlapping width W3 of the first portion 31 and the bending area 13 in the second direction Y, thereby facilitating further improving the bonding strength between the reinforcing plate 30 and the flexible circuit substrate 10, and facilitating further reducing the risk of delamination between the flexible circuit substrate 10 and the reinforcing plate 30.

[0033] In some embodiments, the overlapping length L2 of the first portion 31 and the second non-bending area 15 in the first direction X may be greater than the maximum overlapping width W3 of the first portion 31 and the bending area 13 in the second direction Y, thereby facilitating further improving the bonding strength between the reinforcing plate 30 and the flexible circuit substrate 10, and facilitating further reducing the risk of delamination between the flexible circuit substrate 10 and the reinforcing plate 30.

[0034] See also Figure 3 The reinforcing plate 30 may further include a third portion 35, which protrudes from the side surface 313 and is disposed in the second non-bending area 15. The second portion 33 and the third portion 35 may be located on the same side of the first portion 31. In some embodiments, the second portion 33 and the third portion 35 may also be located on opposite sides of the first portion 31.

[0035] In some embodiments, in the second direction Y, the sum W' of the maximum width W4 of the third portion 35 and the width of the second end surface W5 may be at least twice the maximum width W3 of the overlap between the first portion 31 and the bending zone 13, thereby facilitating further improving the bonding strength between the reinforcement plate 30 and the flexible circuit substrate 10, and facilitating further reducing the risk of delamination between the flexible circuit substrate 10 and the reinforcement plate 30.

[0036] In some embodiments, the third portion 35 may also be directly connected to the second end face 315, that is, the third portion 35 protrudes from the connection between the side surface 313 and the second end face 315, which is beneficial to further reduce the risk of delamination of the reinforcement plate 30 from the second end face 315 and the second non-bending area 15, thereby further facilitating the subsequent installation of the flexible circuit board assembly 100.

[0037] In the flexible circuit board assembly 100 of the present application, in the second direction Y perpendicular to the first direction X and parallel to the first non-bending zone 11, the sum W of the maximum width W1 of the second part 33 and the width W2 of the first end surface 311 is at least twice the maximum width W3 of the overlap between the first part 31 and the bending zone 13, which is beneficial to improve the bonding strength between the reinforcement plate 30 and the flexible circuit substrate 10, thereby helping to reduce the risk of delamination between the flexible circuit substrate 10 and the reinforcement plate 30, and facilitating the subsequent installation of the flexible circuit board assembly 100.

[0038] The above embodiments are preferred implementations of the present application, but the implementations of the present application are not limited by the above embodiments, and the above implementations are only used to interpret the claims. However, the protection scope of the present application is not limited to the specification. Any changes or substitutions that can be easily thought of by any technician familiar with the technical field within the technical scope disclosed in the present application are included in the protection scope of the present application.

Claims

1. A flexible circuit board assembly, comprising a flexible circuit substrate and a reinforcing plate bonded to the flexible circuit substrate, wherein the flexible circuit substrate comprises a first non-bending area, a bending area, and a second non-bending area sequentially connected along a first direction, characterized in that: The reinforcing plate includes a first part and a second part, the first part is arranged in the bending zone and extends to the first non-bending zone and the second non-bending zone respectively along the first direction, the first part is in the shape of an elongated strip, and the length direction of the first part is the first direction, the first part has a first end face away from the second non-bending zone and a side face arranged along the first direction, the second part protrudes from the side face and is arranged in the first non-bending zone, and in a second direction perpendicular to the first direction and parallel to the first non-bending zone, the sum of the maximum width of the second part and the width of the first end face is at least twice the maximum width of the overlap between the first part and the bending zone.

2. The flexible circuit board assembly according to claim 1, characterized in that: The second portion is directly connected to the first end surface.

3. The flexible circuit board assembly according to claim 1, characterized in that: The overlapping length of the first portion and the first non-bending zone in the first direction is greater than the maximum overlapping width of the first portion and the bending zone in the second direction.

4. The flexible circuit board assembly according to any one of claims 1 to 3, characterized in that: The overlapping length of the first portion and the second non-bending zone in the first direction is greater than the maximum overlapping width of the first portion and the bending zone in the second direction.

5. The flexible circuit board assembly according to claim 4, characterized in that: The reinforcing plate further includes a third portion, which protrudes from the side surface and is disposed in the second non-bending area.

6. The flexible circuit board assembly according to claim 5, characterized in that: The first portion has a second end surface away from the first non-bending zone, and in the second direction, the sum of the maximum width of the third portion and the width of the second end surface is at least twice the maximum width of the first portion overlapping the bending zone.

7. The flexible circuit board assembly according to claim 6, characterized in that: The third portion is directly connected to the second end surface.

8. The flexible circuit board assembly according to claim 1, characterized in that: The reinforcing plate is a metal reinforcing plate.

9. The flexible circuit board assembly according to claim 8, characterized in that: The thickness of the metal reinforcement plate is 25 micrometers to 150 micrometers.

10. The flexible circuit board assembly according to claim 8 or 9, characterized in that: The metal reinforcement plate is selected from any one of an aluminum plate, an iron plate, a copper plate, and a steel plate.

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