Circuit board assembly and electronic equipment

Abstract

The utility model provides a circuit board assembly and electronic equipment. The circuit board assembly comprises a rigid circuit board, a flexible circuit board and an electronic component, the rigid circuit board is provided with a through hole, the flexible circuit board is fixed to one side of the rigid circuit board and covers the through hole, the flexible circuit board is electrically connected with the rigid circuit board, and at least part of the electronic component is located in the through hole and fixed to the flexible circuit board. The electronic component is electrically connected with the flexible circuit board. The flexible circuit board can be regarded as an intermediate carrier for connecting the rigid circuit board and the electronic component, and compared with the prior art that the rigid circuit board is adopted as the intermediate carrier, the rigid circuit board is difficult to thin, and the mass production of the thinner rigid circuit board is difficult to realize, the embodiment of the utility model has the advantages that the flexible circuit board is used as the intermediate carrier; the flexible circuit board is used as the intermediate carrier, and the thickness of the flexible circuit board is thinner, so that the overall thickness of the circuit board assembly is reduced, and the thinning of the circuit board assembly is realized.

Description

Technical Field

[0001] The present application relates to the technical field of electronic products, and in particular to a circuit board assembly and an electronic device. Background Art

[0002] With the continuous development of the demand for thinner electronic devices and diversified functions, the number of modules inside electronic devices is increasing, and the internal space of electronic devices is getting smaller and smaller, resulting in the need for thinning design of circuit board components in electronic devices. How to achieve thinning of circuit board components has become a technical problem that needs to be solved urgently. Utility Model Content

[0003] The present application provides a circuit board assembly and an electronic device. The circuit board assembly has a small thickness, which is conducive to the thin design of the electronic device.

[0004] In a first aspect, the implementation of the present application provides a circuit board assembly. The circuit board assembly includes a rigid circuit board, a flexible circuit board, and electronic components, wherein the rigid circuit board has a through hole; the flexible circuit board is fixed to one side of the rigid circuit board and covers the through hole, and the flexible circuit board is electrically connected to the rigid circuit board; the electronic component is at least partially located in the through hole and fixed to the flexible circuit board, and the electronic component is electrically connected to the flexible circuit board.

[0005] Among them, the electronic components can be installed on the flexible circuit board by welding or other methods, and then the structure formed by the electronic components and the flexible circuit board is welded to the rigid circuit board as a whole to form a circuit board assembly, and the electronic components can be electrically connected to the rigid circuit board through the flexible circuit board. That is, in the implementation of the present application, the flexible circuit board can be considered as an intermediate carrier for connecting the rigid circuit board and the electronic components. Compared with the prior art, a rigid circuit board with a thickness of at least 0.65 mm is used as an intermediate carrier, and the rigid circuit board has problems such as being difficult to thin, and it is difficult to achieve mass production of thinner rigid circuit boards. In the implementation of the present application, a flexible circuit board is used as an intermediate carrier, and the thickness of the flexible circuit board is thinner, which is conducive to reducing the overall thickness of the circuit board assembly and achieving a thin circuit board assembly.

[0006] At this time, the electronic components are at least partially located in the through holes, which improves the utilization rate of the space in the thickness direction of the circuit board assembly and is also conducive to miniaturization of the circuit board assembly.

[0007] In some possible implementations, the thickness of the flexible circuit board is in the range of 0.1 mm to 0.2 mm. For example, the thickness of the flexible circuit board can be 0.1 mm, 0.12 mm, 0.15 mm, 0.17 mm or 0.2 mm, etc. Alternatively, the number of conductor layers of the flexible circuit board is 2 or 3.

[0008] In this implementation, by setting the thickness or number of layers of the flexible circuit board, it is possible to avoid the flexible circuit board being too thin (for example, less than 0.1 mm), or when the number of conductor layers is less than 2 layers, the bearing capacity and structural strength of the flexible circuit board are small, thereby affecting the structural strength and reliability of the circuit board assembly. At the same time, it is also possible to avoid the flexible circuit board being too thick (for example, greater than 0.2 mm), or when the number of conductor layers is greater than 3 layers, resulting in the circuit board assembly being too thick, thereby affecting the thinning of the circuit board assembly.

[0009] In some possible implementations, the circuit board assembly also includes a first welding part and a second welding part; the first welding part welds the rigid circuit board and the flexible circuit board, and is arranged around the through hole; the second welding part welds the rigid circuit board and the flexible circuit board, and is arranged at a distance from the first welding part; the rigid circuit board and the flexible circuit board are electrically connected through the second welding part.

[0010] In the implementation method of the present application, the positions of the first welding part and the second welding part are set, for example, the first welding part is set around the through hole, and the electronic component is located inside the first welding part. At this time, the first welding part is located between the second welding part and the electronic component. After the electronic component is subjected to external pressure, the force acting on the flexible circuit board is mainly borne by the first welding part. Compared with the first welding part, the second welding part is far away from the electronic component, which can reduce the pulling force on the second welding part. In addition, by arranging the first welding part and the second welding part at an interval, the part of the flexible circuit board located between the first welding part and the second welding part can be deformed to absorb and buffer the force exerted on the flexible circuit board by the external force exerted on the electronic components, so that the pulling force transmitted to the second welding part can be released to a certain extent at the flexible circuit board located between the first welding part and the second welding part before being transmitted to the second welding part, thereby at least weakening the force transmitted to the second welding part to a certain extent, at least avoiding the separation of the second welding part from the rigid circuit board to a certain extent, making the second welding part less likely to fail, and by arranging the rigid circuit board and the flexible circuit board to be electrically connected through the second welding part, the structural characteristics of the circuit board assembly provided in the present application can be fully utilized, and the positions of the solder joints that realize the electrical connection function in the circuit board assembly can be reasonably arranged, thereby ensuring the reliability of the electrical connection between the rigid circuit board and the flexible circuit board.

[0011] In some possible implementations, the distance between the second welding member and the first welding member is in the range of 1.5 mm to 3 mm. For example, the distance between the second welding member and the first welding member can be 1.5 mm, 1.8 mm, 2 mm, 2.5 mm, 3 mm, etc.

[0012] In this implementation, by setting the spacing between the second welding part and the first welding part to be greater than 1.5 mm, the length of the portion of the flexible circuit board that is used to deform to absorb stress can be ensured, so as to fully weaken the force transmitted to the second welding part, reduce the risk of failure of the second welding part, and help improve the reliability of the second welding part, thereby improving the reliability of the circuit board assembly. In addition, by setting the spacing between the second welding part and the first welding part to be less than 3 mm, it is possible to avoid the width of the circuit board assembly being too long due to the excessive spacing, which has an adverse effect on the miniaturization of the circuit board assembly.

[0013] In some possible implementations, the width of the first welding member is in the range of 1 mm to 3 mm. For example, the width of the first welding member may be 1 mm, 1.5 mm, 2 mm, 2.5 mm, 3 mm, etc. When the first welding member is an annular welding rod structure, the width of the first welding member may be the size of the first welding member in a direction perpendicular to its extension direction. When the first welding member is a welding spot structure, the width of the first welding member may be the outer diameter of the welding spot.

[0014] In this implementation, by setting the width of the first welding member to be greater than 1 mm, the welding strength at the first welding member can be ensured, which is beneficial to improving the reliability of the connection between the flexible circuit board and the rigid circuit board. In addition, by setting the width of the first welding member to be less than 3 mm, it can be avoided that when the width of the first welding member is too large, the width of the circuit board assembly is too long, which affects the miniaturization of the circuit board assembly.

[0015] In some possible implementations, the circuit board assembly further includes a reinforcing sheet fixed to a side of the flexible circuit board facing away from the rigid circuit board; in the thickness direction of the circuit board assembly, the reinforcing sheet covers the through hole and the first welding part, and is staggered with the second welding part.

[0016] In this implementation, the stiffness of the reinforcing sheet is greater than the stiffness of the flexible circuit board. For example, the reinforcing sheet may be a steel sheet; or, in some other implementations, the reinforcing sheet may also be a polyimide resin, a fiberglass board, or the like. In this implementation, by providing a reinforcing sheet, the structural strength of the portion of the flexible circuit board that is directly opposite to the reinforcing sheet can be increased, and when the electronic components are subjected to force, the supporting capacity of the flexible circuit board is stronger, which is beneficial to improving the reliability of the circuit board assembly. In addition, by arranging the reinforcing sheet and the second welding part in a staggered manner, the deformability of the flexible circuit board between the first welding part and the second welding part is ensured, and the reinforcing sheet is prevented from hindering the deformation of this part of the flexible circuit board, thereby affecting the reliability of the second welding part.

[0017] In some possible implementations, in the board surface direction of the circuit board assembly, the periphery of the reinforcing sheet protrudes relative to the periphery of the first welding member, and the protruding width is greater than or equal to 0.3 mm. In this implementation, by setting the periphery of the reinforcing sheet to protrude relative to the periphery of the first welding member, it can be ensured that the reinforcing sheet can completely cover the first welding member, so as to ensure the supporting effect of the reinforcing sheet on the structure at the first welding member.

[0018] In some possible implementations, in the board surface direction of the circuit board assembly, the spacing between the reinforcing sheet and the second welding piece is in the range of 0.5 mm to 1 mm. For example, the spacing between the reinforcing sheet and the second welding piece can be 0.5 mm, 0.7 mm, 0.85 mm, 1 mm, etc. In this implementation, by setting the spacing range between the reinforcing sheet and the second welding piece, it is ensured that the corresponding flexible circuit board between the first welding piece and the second welding piece can have sufficient deformation space to improve the reliability of the second welding piece.

[0019] In some possible implementations, the reinforcing sheet is a steel sheet, and the thickness of the reinforcing sheet is in a range of 0.1 mm to 0.15 mm.

[0020] For example, the thickness of the reinforcing sheet may be 0.1 mm, 0.12 mm, 0.15 mm, etc. In this implementation, by setting the thickness range of the reinforcing sheet, the supporting effect of the reinforcing sheet on the structure connected thereto can be ensured while reducing the thickness of the reinforcing sheet, which is conducive to achieving a thin circuit board assembly.

[0021] In some possible implementations, the electronic component is an electrical connector, a card socket, or a cable connector.

[0022] In one possible implementation, the circuit board assembly also includes a first welding part, which welds the rigid circuit board and the flexible circuit board and is arranged around the through hole. The rigid circuit board and the flexible circuit board are electrically connected through the first welding part; the electronic components are capacitors, resistors, baseband chips or radio frequency chips.

[0023] In a second aspect, the implementation of the present application further provides an electronic device, wherein the electronic device comprises any of the above-mentioned circuit board components.

[0024] In a third aspect, the implementation of the present application also provides another electronic device. The electronic device includes a first circuit board assembly, a second circuit board assembly, and a connecting circuit board. In the thickness direction of the electronic device, the first circuit board assembly is higher than the second circuit board assembly. The first circuit board assembly adopts any of the above circuit board assemblies. One end of the connecting circuit board is electrically connected to the electronic components of the first circuit board assembly, and the other end of the connecting circuit board is electrically connected to the second circuit board assembly.

[0025] In the implementation of the present application, the first circuit board assembly and the second circuit board assembly can be understood as different chips or functional modules in the electronic device, etc., and by connecting the first circuit board assembly and the second circuit board assembly through the connecting circuit board, information exchange and signal transmission between different functional modules (the first circuit board assembly and the second circuit board assembly) in the electronic device can be realized, so that the various functional modules in the electronic device can work together. In some other examples, the first circuit board assembly and / or the second circuit board assembly can also be understood as a circuit module for realizing signal transmission, and other circuit modules can be electrically connected to the first circuit board assembly and / or the second circuit board assembly. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the background technology, the drawings required for use in the embodiments of the present application or the background technology will be described below.

[0027] Figure 1 is a schematic diagram of the cross-sectional structure of a circuit board assembly provided in some embodiments of the present application;

[0028] Figure 2 is a schematic diagram of the cross-sectional structure of the circuit board assembly provided in the embodiment of the present application in other embodiments;

[0029] Figure 3 is a schematic diagram of the structure of an electronic device provided in some embodiments of the present application;

[0030] Figure 4 yes Figure 3 The internal structure diagram of the electronic device shown in some embodiments;

[0031] Figure 5 yes Figure 4 A schematic diagram of application details of the first circuit board assembly shown;

[0032] Figure 6 is a schematic cross-sectional structure diagram of a circuit board assembly provided in another embodiment of the present application;

[0033] Figure 7 yes Figure 6 The schematic diagram of the application of the circuit board assembly in some embodiments is shown;

[0034] Figure 8 is a schematic cross-sectional structure diagram of a circuit board assembly provided in another embodiment of the present application;

[0035] Fig. 9 yes Figure 8 The illustrated schematic diagram is a schematic diagram of the application of a circuit board assembly in some embodiments. DETAILED DESCRIPTION

[0036] The embodiments of the present application are described below in conjunction with the drawings in the embodiments of the present application.

[0037] In the description of the embodiments of the present application, it should be noted that, unless otherwise clearly specified and limited, the terms "installation" and "connection" should be understood in a broad sense. For example, "connection" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium. In the embodiments of the present application, the terms "first", "second", "third", and "fourth" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first", "second", "third", and "fourth" may explicitly or implicitly include one or more of the features.

[0038] In the embodiments of the present application, "and / or" is only a description of the association relationship of the associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.

[0039] References or "some embodiments" etc. described in this specification mean that one or more embodiments of the present application include specific features, structures or characteristics described in conjunction with the embodiment. Thus, the statements "in some embodiments", "in other embodiments", "in other embodiments", "in other embodiments", etc. that appear in different places in this specification do not necessarily refer to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized in other ways. The terms "including", "having" and their variations all mean "including but not limited to", unless otherwise specifically emphasized in other ways. The term "plurality" means at least two.

[0040] The terms "parallel" and "perpendicular" are defined in terms of the current technological level, rather than being absolutely strict definitions in a mathematical sense. A small amount of deviation is allowed, and approximately parallel, approximately perpendicular, etc. are all acceptable. For example, A and B are parallel, which means that A and B are parallel or approximately parallel, and the angle between A and B can be between 0° and 10°. For another example, A and B are perpendicular, which means that A and B are perpendicular or approximately perpendicular, and the angle between A and B can be between 80° and 100°.

[0041] It is to be understood that the specific embodiments described herein are only used to explain the relevant embodiments, rather than to limit the embodiments. It should also be noted that, for ease of description, only the parts related to the embodiments are shown in the accompanying drawings. It should be noted that, in the absence of conflict, the embodiments in this application and the features in the embodiments can be combined with each other.

[0042] The present application will be described below with reference to the accompanying drawings and in conjunction with embodiments.

[0043] The embodiment of the present application provides a circuit board assembly and an electronic device using the circuit board assembly. The circuit board assembly uses a flexible circuit board as a carrier, the carrier is used to weld electronic components, and then the carrier and the electronic components are welded to a rigid circuit board as a whole to form a circuit board assembly. The above-mentioned circuit board assembly utilizes the thin thickness of the flexible circuit board to obtain a smaller overall thickness, and can be arranged in an installation space with a smaller thickness, which is conducive to the thin design of electronic equipment.

[0044] See also Figure 1 , Figure 1 Schematic diagram of the cross-sectional structure of the circuit board assembly 10 provided in some embodiments of the present application.

[0045] In some embodiments, the circuit board assembly 10 may include a rigid circuit board 101 , a flexible circuit board 102 , and electronic components 103 .

[0046] For example, the rigid circuit board 101 (Printcd Circuit Board, PCB), commonly known as a hard board, is a printed circuit board with high strength and high rigidity formed by a rigid substrate that is not easily deformed, such as phenolic paper material, epoxy paper material, polyester glass felt material or epoxy glass cloth material, etc. It is not easy to bend and can provide good and reliable support for the structural parts installed thereon (such as flexible circuit board 102, electronic components 103, etc.).

[0047] Exemplarily, the rigid circuit board 101 may have a through hole 1011, and the through hole 1011 may penetrate the rigid circuit board 101 in the thickness direction of the rigid circuit board 101. The thickness direction of the rigid circuit board 101 may be parallel to the thickness direction of the circuit board assembly 10.

[0048] In the embodiment of the present application, the rigid circuit board 101 can be used to install other structural parts in the circuit board assembly 10. By opening a through hole 1011 on the rigid circuit board 101, other structural parts in the circuit board assembly 10 (such as electronic components 103, etc.) can be at least partially installed in the through hole 1011 to improve the utilization of the thickness of the rigid circuit board 101, which is beneficial to reducing the overall size of the circuit board assembly 10 in its thickness direction, so as to achieve the thinning of the circuit board assembly 10.

[0049] For example, the flexible printed circuit 102 (FPC), commonly known as a soft board, is a printed circuit board made of polyimide or polyester film as a substrate, and has the characteristics of high reliability, bendability, flexibility, light weight and thin thickness.

[0050] In some embodiments, the flexible circuit board 102 may be fixed to one side of the rigid circuit board 101 and cover the through hole 1011, the flexible circuit board 102 is electrically connected to the rigid circuit board 101, the electronic components 103 may be at least partially located in the through hole 1011 and fixed to the flexible circuit board 102, and the electronic components 103 are electrically connected to the flexible circuit board 102. Electronic components are a general term for elements and devices.

[0051] Among them, the electronic components 103 can be installed on the flexible circuit board 102 by welding or other methods, and then the structure formed by the electronic components 103 and the flexible circuit board 102 is welded to the rigid circuit board 101 as a whole to form the circuit board assembly 10, and the electronic components 103 are electrically connected to the rigid circuit board 101 through the flexible circuit board 102. That is, in the embodiment of the present application, the flexible circuit board 102 can be regarded as an intermediate carrier for connecting the rigid circuit board 101 and the electronic components 103. Compared with the prior art, a rigid circuit board with a thickness of at least 0.65 mm is used as the intermediate carrier, and the rigid circuit board has problems such as difficulty in thinning and difficulty in mass production of thinner rigid circuit boards. In the embodiment of the present application, the flexible circuit board 102 is used as the intermediate carrier, and the thickness of the flexible circuit board 102 is thinner, which is conducive to reducing the overall thickness of the circuit board assembly 10 and realizing the thinning of the circuit board assembly 10.

[0052] The flexible circuit board 102 and the rigid circuit board 101 may be roughly in a stacking relationship. For example, the rigid circuit board 101 and the flexible circuit board 102 may be stacked in the thickness direction of the circuit board assembly 10, and the thickness direction of the flexible circuit board 102 may also be parallel to the thickness direction of the circuit board assembly 10. The flexible circuit board 102 and the rigid circuit board 101 may be electrically connected by connecting with an anisotropic conductive adhesive film (ACF) or soldering.

[0053] At this time, the electronic component 103 is at least partially located in the through hole 1011 , which improves the utilization rate of the space in the thickness direction of the circuit board assembly 10 and is also conducive to miniaturization of the circuit board assembly 10 .

[0054] For example, the thickness of the flexible circuit board 102 is in the range of 0.1 mm to 0.2 mm. For example, the thickness of the flexible circuit board 102 can be 0.1 mm, 0.12 mm, 0.15 mm, 0.17 mm or 0.2 mm.

[0055] Exemplarily, the number of the conductor layers of the flexible circuit board 102 is 2 or 3.

[0056] In this embodiment, by setting the thickness or the number of layers of the flexible circuit board 102, it is possible to avoid the flexible circuit board 102 being too thin (for example, less than 0.1 mm), or the number of conductor layers being less than 2 layers, which results in the flexible circuit board 102 having a small bearing capacity and structural strength, thereby affecting the structural strength and reliability of the circuit board assembly 10. At the same time, it is also possible to avoid the flexible circuit board 102 being too thick (for example, greater than 0.2 mm), or the number of conductor layers being greater than 3 layers, which results in the circuit board assembly 10 being too thick, thereby affecting the thinness of the circuit board assembly 10.

[0057] In some examples, the flexible circuit board 102 may include a flexible insulating layer (not shown in the figure) and a conductor layer (not shown in the figure) formed on its surface, wherein the conductor layer may be a metal film layer such as a copper film, and the conductor layer may be electrically connected to the rigid circuit board 101 to achieve electrical connection between the flexible circuit board 102 and the rigid circuit board 101; the conductor layer may also be electrically connected to the electronic components 103 to achieve electrical connection between the flexible circuit board 102 and the electronic components 103.

[0058] In the embodiment of the present application, the flexible circuit board 102 can be connected to the rigid circuit board 101 by welding. Exemplarily, the circuit board assembly 10 also includes a first welding member 104 and a second welding member 105. Exemplarily, the first welding member 104 and the second welding member 105 can be solder joints formed by solder such as tin after a welding process. Among them, the first welding member 104 welds the rigid circuit board 101 and the flexible circuit board 102, and is arranged around the through hole 1011. For example, the first welding member 104 can be a continuous annular welding rod to surround the through hole 1011; or, the first welding member 104 can include a plurality of solder joints, and the plurality of solder joints surround the four sides, three sides or two sides of the through hole 1011, and are arranged at intervals in the circumferential direction of the through hole 1011. Among them, the second welding member 105 welds the rigid circuit board 101 and the flexible circuit board 102, and is arranged at intervals from the first welding member 104.

[0059] The rigid circuit board 101 and the flexible circuit board 102 are electrically connected through the second welding piece 105. For example, the first welding piece 104 is an empty pad, which plays a structural connection role, connecting the rigid circuit board 101 and the flexible circuit board 102; the second welding piece 105 is a functional pad, which plays a structural connection role and an electrical connection role, and is used to connect the rigid circuit board 101 and the flexible circuit board 102, and also to realize the transmission of electrical signals between the rigid circuit board 101 and the flexible circuit board 102.

[0060] The electronic component 103 may be a force-bearing device, such as an electrical connector, a card seat or a cable connection seat. When the circuit board assembly 10 is connected to other structural parts, the other structural parts and the electronic component 103 are generally connected by snapping, crimping, etc. to ensure the reliability of the connection between the electronic component 103 and other structural parts, but at the same time, the electronic component 103 will be subjected to the force of other structural parts. At this time, the electronic component 103 presses the flexible circuit board 102, and the structure connected between the flexible circuit board 102 and the rigid circuit board 101 (such as the first welding part 104 and the second welding part 105) is subjected to a pulling force, resulting in the structure connected between the flexible circuit board 102 and the rigid circuit board 101 being easily separated from the rigid circuit board 101, and the structure connected between the flexible circuit board 102 and the rigid circuit board 101 being easily failed, thereby affecting the connection between the flexible circuit board 102 and the rigid circuit board 101 and the reliability of the circuit board assembly 10.

[0061] In an embodiment of the present application, by setting the positions of the first welding part 104 and the second welding part 105, for example, the first welding part 104 is arranged around the through hole 1011, and the electronic component 103 is located inside the first welding part 104. At this time, the first welding part 104 is located between the second welding part 105 and the electronic component 103, and the force of the electronic component 103 acting on the flexible circuit board 102 is mainly borne by the first welding part 104. Compared with the first welding part 104, the second welding part 105 is away from the electronic component 103, which can reduce the pulling force on the second welding part 105. In addition, by arranging the first welding part 104 and the second welding part 105 at an interval, the portion of the flexible circuit board 102 located between the first welding part 104 and the second welding part 105 can be deformed to absorb and buffer the force exerted on the flexible circuit board 102 by the external force exerted on the electronic component 103, so that the pulling force transmitted to the second welding part 105 can be released to a certain extent at the flexible circuit board 102 located between the first welding part 104 and the second welding part 105 before being transmitted to the second welding part 105, thereby at least weakening the force transmitted to the second welding part 105 to a certain extent, at least avoiding the separation of the second welding part 105 from the rigid circuit board 101 to a certain extent, making the second welding part 105 not easy to fail, and by arranging the rigid circuit board 101 and the flexible circuit board 102 to be electrically connected through the second welding part 105, the structural characteristics of the circuit board assembly 10 provided in the present application can be fully utilized, and the positions of the solder joints that realize the electrical connection function in the circuit board assembly 10 can be reasonably arranged, thereby ensuring the reliability of the electrical connection between the rigid circuit board 101 and the flexible circuit board 102.

[0062] Exemplarily, the distance L1 between the second welding member 105 and the first welding member 104 is in the range of 1.5 mm to 3 mm. For example, the distance L1 between the second welding member 105 and the first welding member 104 can be 1.5 mm, 1.8 mm, 2 mm, 2.5 mm, 3 mm, etc.

[0063] In this embodiment, by setting the interval L1 between the second welding member 105 and the first welding member 104 to be greater than 1.5 mm, the length of the portion of the flexible circuit board 102 that is used to deform to absorb stress can be ensured, so as to fully weaken the force transmitted to the second welding member 105, reduce the risk of failure of the second welding member 105, and help improve the reliability of the second welding member 105, thereby improving the reliability of the circuit board assembly 10. In addition, by setting the interval L1 between the second welding member 105 and the first welding member 104 to be less than 3 mm, it is possible to avoid the width of the circuit board assembly 10 being too long due to the excessive interval L1 between the second welding member 105 and the first welding member 104, which has an adverse effect on the miniaturization of the circuit board assembly 10.

[0064] Exemplarily, the width of the first welding member 104 is in the range of 1 mm to 3 mm. For example, the width of the first welding member 104 may be 1 mm, 1.5 mm, 2 mm, 2.5 mm, 3 mm, etc. When the first welding member 104 is an annular welding rod structure, the width of the first welding member 104 may be the size of the first welding member 104 in the vertical direction of its extension direction. When the first welding member 104 is a welding spot structure, the width of the first welding member 104 may be the outer diameter of the welding spot.

[0065] In this embodiment, by setting the width of the first welding member 104 to be greater than 1 mm, the welding strength at the first welding member 104 can be ensured, which is beneficial to improving the reliability of the connection between the flexible circuit board 102 and the rigid circuit board 101. In addition, by setting the width of the first welding member 104 to be less than 3 mm, it can be avoided that when the width of the first welding member 104 is too large, the width of the circuit board assembly 10 is too long, which affects the miniaturization of the circuit board assembly 10.

[0066] See also Figure 2 , Figure 2 It is a schematic diagram of the cross-sectional structure of the circuit board assembly 10 provided in the embodiment of the present application in other embodiments.

[0067] In some embodiments, the circuit board assembly 10 may further include a reinforcing sheet 106, which is fixed to the side of the flexible circuit board 102 facing away from the rigid circuit board 101. In the thickness direction of the circuit board assembly 10, the reinforcing sheet 106 covers the through hole 1011 and the first welding member 104, and is staggered with the second welding member 105.

[0068] Exemplarily, the stiffness of the reinforcing sheet 106 is greater than the stiffness of the flexible circuit board 102. For example, the reinforcing sheet 106 may be a steel sheet; or, in some other embodiments, the reinforcing sheet 106 may also be a polyimide resin (PI), a fiber glass board (FR-4), etc. In this embodiment, by providing the reinforcing sheet 106, the structural strength of the portion of the flexible circuit board 102 that is directly opposite to the reinforcing sheet 106 can be increased. When the electronic components 103 are subjected to force, the supporting capacity of the flexible circuit board 102 is stronger, which is conducive to improving the reliability of the circuit board assembly 10. In addition, by arranging the reinforcing sheet 106 and the second welding piece 105 in a staggered manner, the deformability of the flexible circuit board 102 between the first welding piece 104 and the second welding piece 105 is ensured, and the reinforcing sheet 106 is prevented from hindering the deformation of this portion of the flexible circuit board 102, thereby affecting the reliability of the second welding piece 105.

[0069] For example, in the board surface direction of the circuit board assembly 10 (i.e., perpendicular to the thickness direction of the circuit board assembly 10), the periphery of the reinforcing sheet 106 may protrude relative to the periphery of the first welding member 104, and the protruding width L2 is greater than or equal to 0.3 mm. In this embodiment, by setting the periphery of the reinforcing sheet 106 to protrude relative to the periphery of the first welding member 104, it can be ensured that the reinforcing sheet 106 can completely cover the first welding member 104, so as to ensure the supporting effect of the reinforcing sheet 106 on the structure at the first welding member 104.

[0070] Exemplarily, in the board direction of the circuit board assembly 10, the spacing L3 between the reinforcing sheet 106 and the second welding member 105 is in the range of 0.5 mm to 1 mm. For example, the spacing L3 between the reinforcing sheet 106 and the second welding member 105 may be 0.5 mm, 0.7 mm, 0.85 mm, 1 mm, etc. In this embodiment, by setting the range of the spacing L3 between the reinforcing sheet 106 and the second welding member 105, it is ensured that the corresponding flexible circuit board 102 between the first welding member 104 and the second welding member 105 can have sufficient deformation space, so as to improve the reliability of the second welding member 105.

[0071] Exemplarily, the thickness of the reinforcing sheet 106 is in the range of 0.1 mm to 0.15 mm. Exemplarily, the thickness of the reinforcing sheet 106 may be 0.1 mm, 0.12 mm, 0.15 mm, etc. In this embodiment, by setting the thickness range of the reinforcing sheet 106, it is possible to ensure that the reinforcing sheet 106 supports the structure connected thereto while reducing the thickness of the reinforcing sheet 106, which is conducive to achieving a thinner circuit board assembly 10.

[0072] In the embodiment of the present application, the above-mentioned circuit board assembly 10 can be applied to the electronic device 1.

[0073] See also Figure 3 , Figure 3 It is a schematic diagram of the structure of the electronic device 1 provided in some embodiments of the present application.

[0074] In some embodiments, the electronic device 1 may be a mobile phone, a tablet personal computer, a laptop computer, a smart screen, a personal digital assistant (PDA), a camera, a personal computer, a notebook computer, a vehicle-mounted device, a wearable device, augmented reality (AR) glasses, an AR helmet, virtual reality (VR) glasses or a VR helmet, etc., which have a camera function. In the embodiment of the present application, the electronic device 1 is described as a mobile phone. Of course, other types of electronic devices may also adopt a similar structure, which will not be described in detail below. It is understandable that Figure 3 Only some components of the electronic device 1 are schematically shown, and the actual shapes, sizes, positions and structures of these components are not subject to the present invention. Figure 3 The electronic device 1 may also include Figure 3 More or fewer parts.

[0075] In some embodiments, the electronic device 1 may include a screen ( Figure 3 The electronic device 1 may include a middle frame 111 and a back cover 112, the screen may be fixed to one side of the middle frame 111, the back cover 112 may be fixed to the other side of the middle frame 111, and the back cover 112 may be located between the screen and the back cover 112 and on the inner side of the middle frame 111. The middle frame 111 may be fixedly connected to the back cover 112 by adhesive, or the middle frame 111 may be an integrally formed structure with the back cover 112. In some other embodiments, the electronic device 1 may also not include a screen.

[0076] Exemplarily, the electronic device 1 may include a first circuit board assembly 12, a second circuit board assembly 13 and a connecting circuit board 14. The first circuit board assembly 12, the second circuit board assembly 13 and the connecting circuit board 14 may all be accommodated in the accommodating inner cavity 11a, and the connecting circuit board 14 may be connected between the first circuit board assembly 12 and the second circuit board assembly 13. It is understandable that in the electronic device 1, the first circuit board assembly 12 and / or the second circuit board assembly 13 may include at least one circuit board ( Figure 3 ) and at least one electronic component ( Figure 3(not shown), electronic components such as resistors, capacitors, inductors, transistors, connectors, etc. can be used to implement various signal processing, including amplification, filtering, mixing and other functions, so as to realize various functions of electronic device 1, and circuit boards can be used to support electronic components and provide mechanical support for fixing and assembling electronic components. Circuit boards can also be used to transmit power signals, realize wiring and electrical connections between multiple electronic components, and provide power and ground wires for the electronic components installed thereon to meet their electrical characteristics. By making the first circuit board assembly 12 and / or the second circuit board assembly 13 in the electronic device 1, it is beneficial to realize the industrialized production of the electronic device 1, so that the manufacture of the electronic device 1 becomes more standardized and reliable, thereby improving the stability and reliability of the electronic device 1.

[0077] In some examples, the first circuit board assembly 12 and the second circuit board assembly 13 can be understood as different chips or functional modules in the electronic device 1. By connecting the first circuit board assembly 12 and the second circuit board assembly 13 through the connecting circuit board 14, information exchange and signal transmission between different functional modules (the first circuit board assembly 12 and the second circuit board assembly 13) in the electronic device 1 can be realized, so that the various functional modules in the electronic device 1 can work together. In some other examples, the first circuit board assembly 12 and / or the second circuit board assembly 13 can also be understood as a circuit module for realizing signal transmission, and other circuit modules can be electrically connected to the first circuit board assembly 12 and / or the second circuit board assembly 13.

[0078] In some embodiments, the electronic device 1 may further include other functional devices 15, and the functional devices 15 may be used to implement one or more functions of the electronic device 1. The functional device 15 may include the aforementioned screen and / or middle frame 111, and the functional device 15 may also include but is not limited to a camera module, a speaker, a receiver, a microphone, etc. The number of functional devices 15 may be one, two, or more. Generally speaking, in the electronic device 1, the functional device 15 will first be installed in the receiving cavity 11a, and the installation of structural parts such as the first circuit board assembly 12, the second circuit board assembly 13, and the connecting circuit board 14 needs to comprehensively consider the remaining space in the electronic device 1, and also avoid the functional devices 15 in the electronic device 1. For example, in Figure 3 In the figure, when the functional device 15 needs to be placed in the middle of the electronic device 1, the first circuit board assembly 12 and the second circuit board assembly 13 can be located on both sides of the functional device 15, respectively, wherein the first circuit board assembly 12, the functional device 15 and the first circuit board assembly 12 can be arranged in the length direction of the electronic device 1, and the connecting circuit board 14 can be located on the side of the functional device 15 away from the back cover 112, and the first circuit board assembly 12 and the second circuit board assembly 13 are respectively connected at both ends.

[0079] See also Figure 4 , Figure 4 yes Figure 3 The shown figure is a schematic diagram of the internal structure of the electronic device 1 in some embodiments.

[0080] In some embodiments, the plurality of functional devices 15 of the electronic device 1 may include a first functional device 151, a second functional device 152, a third functional device 153, and a fourth functional device 154. The first functional device 151, the second functional device 152, and the third functional device 153 may be arranged in the length direction of the electronic device 1, and the height of the second functional device 152 is greater than the height of the first functional device 151 and the height of the third functional device 153. The fourth functional device 154 and the third functional device 153 are arranged in a thickness direction of the first circuit board assembly 12. The first circuit board assembly 12 may be located above the first functional device 151, and the second circuit board assembly 13 may be located between the third functional device 153 and the fourth functional device 154. The connecting circuit board 14 connects the first circuit board assembly 12 and the second circuit board assembly 13, and is located above the second functional device 152 to avoid the second functional device 152.

[0081] It is understandable that the surface of the first circuit board assembly 12 facing the connection circuit board 14 and the surface of the second circuit board assembly 13 facing the connection circuit board 14 are not on the same plane, for example, the first circuit board assembly 12 is higher than the second circuit board assembly 13. In the electronic device 1, if the first functional device 151 is a screen or the like, which has a chip structure at a specific position and has a certain thickness, the circuit board assembly installed near the first functional device 151, such as the first circuit board assembly 12, needs to avoid it, resulting in a drop of less than 2mm (0.Xmm-1.Xmm) between the first circuit board assembly 12 and the second circuit board assembly 13 in the thickness direction of the first circuit board assembly 12; for another example, if the first functional device 151 is the middle frame 111 (such as Figure 3 For example, some structures of the electronic device 1 (as shown) need to be locally thickened in places that are susceptible to force and are more vulnerable. Circuit board components installed near the first functional device 151, such as the first circuit board component 12, need to be partially avoided, which will also result in a drop of less than 2mm (0.Xmm-1.Xmm) between the first circuit board component 12 and the second circuit board component 13; for another example, if the first circuit board component 12 is arranged with an antenna function, in order to meet the antenna clearance requirement, there is an avoidance gap requirement with other metals of the electronic device 1, which will also result in a drop of less than 2mm (0.Xmm-1.Xmm) between the first circuit board component 12 and the second circuit board component 13, that is, the surface of the first circuit board component 12 facing the connecting circuit board 14 and the surface of the second circuit board component 13 facing the connecting circuit board 14 are not on the same plane, and the first circuit board component 12 is higher than the second circuit board component 13.

[0082] In some examples, the first circuit board assembly 12 can be higher than the second circuit board assembly 13, one end of the connecting circuit board 14 can be electrically connected to the electronic components 103 of the first circuit board assembly 12, and the other end of the connecting circuit board 14 can be electrically connected to the second circuit board assembly 13. Figure 1 or Figure 2 The circuit board assembly 10 shown, that is, the first circuit board assembly 12 may also include components such as a rigid circuit board 101, a flexible circuit board 102 and electronic components 103. The structure of the first circuit board assembly 12 can refer to Figure 1 or Figure 2 As described in the above related content. The structure and function of the second circuit board assembly 13 can be the same as or different from the first circuit board assembly 12, and the present application does not limit the structure of the second circuit board assembly 13. Among them, the thickness direction of the second circuit board assembly 13 can be parallel to the thickness direction of the first circuit board assembly 12. In other embodiments, the first circuit board assembly 12 can also be lower than or flush with the second circuit board assembly 13, and the present application does not limit this.

[0083] The connecting circuit board 14 may include a board body 141 and a connecting portion 142, wherein the connecting portion 142 is connected to one end of the board body 141, and the connecting portion 142 may be connected to the second circuit board assembly 13, and the other end of the board body 141 may be connected to the first circuit board assembly 12. The connecting portion 142 may be a solder joint formed by solder such as tin after a welding process, and the connecting portion 142 may also be a structural member such as an electrical connector, a card seat or a cable connection seat for connecting to the second circuit board assembly 13, and the present application does not limit this.

[0084] See also Figure 5 , Figure 5 yes Figure 4 A schematic diagram of application details of the first circuit board assembly 12 is shown.

[0085] In some embodiments, the connecting circuit board 14 may also have a mating piece 143, and the mating piece 143 is connected to one end of the board body 141. The mating piece 143 is connected to the electronic component 103 of the first circuit board assembly 12 to achieve the connection between the connecting circuit board 14 and the first circuit board assembly 12. Among them, the electronic component 103 is a structural part such as an electrical connector, a card socket or a cable connection socket, and the mating piece 143 can be an electrical connector, a plug-in, etc. The mating piece 143 can be connected to the electronic component 103 by snapping or welding, so that the connection between the connecting circuit board 14 and the electronic component 103 has strong reliability, which is conducive to ensuring the reliability of signal transmission in the electronic device 1. At this time, the mating piece 143 can extend into the through hole 1011 of the rigid circuit board 101 to utilize the space in the through hole 1011 for mating, thereby absorbing the first circuit board assembly 12 and the second circuit board assembly 13 (such as Figure 4 The height difference between the two parts is shown in the figure, so as to realize the connection between the matching part 143 and the electronic component 103, which is beneficial to improve the space utilization and realize the thinning of the electronic device 1.

[0086] In the above embodiments, the circuit board assembly 10 includes the first welding piece 104 and the second welding piece 105, and the electronic component 103 is an electrical connector, a card seat or a cable connection seat and other structural parts that are subject to external forces, and the circuit board assembly 10 is designed accordingly. Of course, in some other embodiments, the electronic component 103 can also be a structural part that is not subject to external forces.

[0087] In other embodiments, the circuit board assembly 10 may include the first welding member 104 but not the second welding member 105, and the electronic component 103 may also be a non-force-bearing electronic component 103 such as a common capacitor, resistor, baseband chip or radio frequency chip. For example:

[0088] See also Figure 6 , Figure 6 1 is a schematic cross-sectional view of a circuit board assembly 10 provided in another embodiment of the present application. This embodiment may include most of the technical solutions of the previous embodiment, and the differences between the two are mainly described below, and most of the same contents between the two are not repeated.

[0089] In some embodiments, the circuit board assembly 10 may include a rigid circuit board 101, a flexible circuit board 102, an electronic component 103 and a first welding piece 104. The rigid circuit board 101 may have a through hole 1011. The through hole 1011 may penetrate the rigid circuit board 101 in the thickness direction of the rigid circuit board 101. The rigid circuit board 101 and the flexible circuit board 102 may be stacked in the thickness direction of the circuit board assembly 10. The first welding piece 104 welds the rigid circuit board 101 and the flexible circuit board 102 and is arranged around the through hole 1011. The rigid circuit board 101 and the flexible circuit board 102 are electrically connected through the first welding piece 104. The electronic component 103 is a capacitor, a resistor, a baseband chip or a radio frequency chip. The thickness direction of the rigid circuit board 101 may be parallel to the thickness direction of the circuit board assembly 10.

[0090] Among them, the electronic components 103 can be installed on the flexible circuit board 102 by welding or other methods, and then the structure formed by the electronic components 103 and the flexible circuit board 102 can be connected to the rigid circuit board 101 through the first welding member 104 to form the circuit board assembly 10, and the electronic components 103 can be electrically connected to the rigid circuit board 101 through the flexible circuit board 102 and the first welding member 104. That is, in the embodiment of the present application, the flexible circuit board 102 can be considered as an intermediate carrier for connecting the rigid circuit board 101 and the electronic components 103. Compared with the prior art, the rigid circuit board 101 with a thickness of at least 0.65 mm is used as the intermediate carrier, and the rigid circuit board 101 has the problems of being difficult to reduce the thickness and difficult to achieve mass production of the thinner rigid circuit board 101. In the embodiment of the present application, the flexible circuit board 102 is used as the intermediate carrier, and the thickness of the flexible circuit board 102 is thinner, which is conducive to reducing the overall thickness of the circuit board assembly 10 and achieving the thinning of the circuit board assembly 10.

[0091] See also Figure 7 , Figure 7 yes Figure 6 The illustrated schematic diagram is a schematic diagram of the application of the circuit board assembly 10 in some embodiments.

[0092] In some embodiments, the electronic device 1 may further include a first functional device 151 and a second functional device 152. The first functional device 151 and the second functional device 152 may be arranged in the thickness direction of the electronic device 1 and spaced apart, and the circuit board assembly 10 may be located between the first functional device 151 and the second functional device 152. For example, in the electronic device 1, the first functional device 151 may be a screen, and the circuit board assembly 10 is located between the first functional device 151 (such as a screen) and the second functional device 152 (such as another screen or a middle frame 111, etc.). The thickness of the overall installation space of the circuit board assembly 10 is limited, and the electronic components 103 that realize specific baseband or antenna functions are relatively high. By providing a through hole 1011 in the circuit board assembly 10 to accommodate the electronic components 103, the thickness of the circuit board assembly 10 can be reduced, which is conducive to realizing the thinning of the circuit board assembly 10, so that the circuit board assembly 10 can be installed between the first functional device 151 and the second functional device 152. The flexible circuit board 102 is an intermediate carrier connecting the rigid circuit board 101 and the electronic components 103. Compared with the prior art, a rigid circuit board 101 with a thickness of at least 0.65 mm is used as an intermediate carrier, and the rigid circuit board 101 has the problems of being difficult to thin, and it is difficult to achieve mass production of thinner rigid circuit boards 101. In the embodiment of the present application, a flexible circuit board 102 is provided as an intermediate carrier, and the thickness of the flexible circuit board 102 is thinner, which is also beneficial to reducing the overall thickness of the circuit board assembly 10, realizing the thinning of the circuit board assembly 10, and realizing the thinning design of the electronic device 1.

[0093] In the above embodiments, the circuit board assembly 10 includes the first welding member 104, and the first welding member 104 is arranged around the through hole 1011 of the rigid circuit board 101, and the electronic component 103 is located in the through hole 1011 of the rigid circuit board 101. The circuit board assembly 10 is designed accordingly. In other embodiments, the circuit board assembly 10 may also have other structures. For example:

[0094] See also Figure 8 , Figure 8 It is a schematic cross-sectional structure diagram of a circuit board assembly 10 provided in another embodiment of the present application.

[0095] In some embodiments, the circuit board assembly 10 may include a rigid circuit board 101, a flexible circuit board 102 and electronic components 103. The electronic components 103, the flexible circuit board 102 and the rigid circuit board 101 are stacked and arranged in sequence in the thickness direction of the circuit board assembly 10. The circuit board assembly 10 may also include a first welding part 104. The first welding part 104 welds the rigid circuit board 101 and the flexible circuit board 102, and the rigid circuit board 101 and the flexible circuit board 102 are electrically connected through the first welding part 104.

[0096] Among them, the electronic components 103 can be installed on the flexible circuit board 102 by welding or other methods, and then the structure formed by the electronic components 103 and the flexible circuit board 102 is connected to the rigid circuit board 101 through the first welding member 104 to form the circuit board assembly 10, and the electronic components 103 can be electrically connected to the rigid circuit board 101 through the flexible circuit board 102 and the first welding member 104. That is, in the embodiment of the present application, the flexible circuit board 102 can be considered as an intermediate carrier for connecting the rigid circuit board 101 and the electronic components 103. Compared with the prior art, a rigid circuit board with a thickness of at least 0.65 mm is used as the intermediate carrier, and the rigid circuit board has problems such as difficulty in thinning and difficulty in mass production of thinner rigid circuit boards. In the embodiment of the present application, the flexible circuit board 102 is used as the intermediate carrier, and the thickness of the flexible circuit board 102 is thinner, which is conducive to reducing the overall thickness of the circuit board assembly 10 and realizing the thinning of the circuit board assembly 10.

[0097] See also Fig. 9 , Fig. 9 yes Figure 8 The illustrated schematic diagram is a schematic diagram of the application of the circuit board assembly 10 in some embodiments.

[0098] In some embodiments, the electronic device 1 may further include a first functional device 151 and a second functional device 152 . The first functional device 151 and the second functional device 152 may be spaced apart along the thickness direction of the electronic device 1 , and the circuit board assembly 10 may be located between the first functional device 151 and the second functional device 152 .

[0099] For example, in the electronic device 1, the first functional device 151 can be a screen, and the circuit board assembly 10 is located between the first functional device 151 (such as a screen) and the second functional device 152 (such as a battery cover); for another example, the first functional device 151 can be a camera module, and the circuit board assembly 10 is located between the first functional device 151 (such as a camera module) and the second functional device 152 (such as a battery cover or a middle frame 111), both of which will result in the thickness of the installation space of the circuit board assembly 10 being limited.

[0100] Exemplarily, the electronic component 103 may be a crystal oscillator structure, which has temperature requirements. If the electronic component 103 is directly placed on the rigid circuit board 101, when the rigid circuit board 101 and the structures on the back thereof generate heat, the electronic component 103 is easily affected by the heat, resulting in performance damage, affecting reliability and service life. By adding a flexible circuit board 102 as an intermediate carrier between the rigid circuit board 101 and the electronic component 103, the heat transfer path can be increased, which is beneficial to improving the reliability of the electronic device 1.

[0101] Exemplarily, the electronic component 103 may also be a plate-vibration capacitor-type structural component, which is sensitive to physical factors such as vibration. If it is directly arranged on the rigid circuit board 101, the rigid circuit board 101 and other components arranged thereon may be easily damaged when vibration is caused by the flow of large currents. By adding a flexible circuit board 102 as an intermediate carrier between the rigid circuit board 101 and the electronic component 103, the flexible circuit board 102 can block the plate-vibration capacitor-type electronic component 103 from the rigid circuit board 101, and the first welding part 104 between the flexible circuit board 102 and the rigid circuit board 101 can also absorb at least part of the vibration to avoid affecting the reliability of the rigid circuit board 101 and other structural components thereon.

[0102] Exemplarily, the electronic components 103 may also be antenna components with clearance requirements, such as antenna feed shrapnel, antenna switch, and matching components of antenna feed. The electronic device 1 also includes some components or structures that need to be separated from the antenna. They need to be separated from the electronic components 103 by sufficient space to avoid mutual influence. However, the overall thickness of the circuit board assembly 10 is limited. The flexible circuit board 102 is used as an intermediate carrier, and the electronic components 103 are arranged on the surface of the flexible circuit board 102. The components or structures that need to be separated from the antenna are arranged below the rigid circuit board 101. The thickness of the flexible circuit board 102 and the rigid circuit board 101 can be used to increase the clearance space, improve the utilization rate of the space in the circuit board assembly 10, and facilitate the thinning of the circuit board assembly 10, so as to facilitate the installation of the circuit board assembly 10 between the first functional device 151 and the second functional device 152. At this time, the rigid circuit board 101 can also support the structure connected thereto to avoid deformation, which is conducive to improving the reliability of the circuit board assembly 10. At the same time, compared with the solution of stacking two rigid circuit boards 101 , the stacked rigid circuit board 101 and the flexible circuit board 102 can have a smaller component thickness while meeting the clearance height, which is conducive to a thin design.

[0103] It should be noted that all the above drawings are illustrative illustrations of the present application and do not represent the actual size of the product. Moreover, the size ratio relationship between the components in the drawings is not intended to limit the actual product of the present application.

[0104] The above are only some implementation methods of the present application, and the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present invention can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A circuit board assembly (10), characterized in that: include: A rigid circuit board (101) having a through hole (1011); a flexible circuit board (102) fixed to one side of the rigid circuit board (101) and covering the through hole (1011), the flexible circuit board (102) being electrically connected to the rigid circuit board (101); and The electronic component (103) is at least partially located in the through hole (1011) and fixed to the flexible circuit board (102); the electronic component (103) is electrically connected to the flexible circuit board (102).

2. The circuit board assembly (10) according to claim 1, characterized in that: The thickness of the flexible circuit board (102) is in the range of 0.1 mm to 0.2 mm; Alternatively, the number of conductor layers of the flexible circuit board (102) is 2 or 3.

3. The circuit board assembly (10) according to claim 1, characterized in that: The circuit board assembly (10) further comprises a first welding member (104) and a second welding member (105); The first welding member (104) welds the rigid circuit board (101) and the flexible circuit board (102), and is arranged around the through hole (1011); The second welding member (105) welds the rigid circuit board (101) and the flexible circuit board (102), and is spaced apart from the first welding member (104); The rigid circuit board (101) and the flexible circuit board (102) are electrically connected via the second welding member (105).

4. The circuit board assembly (10) according to claim 3, characterized in that: The distance between the second welding part (105) and the first welding part (104) is in the range of 1.5 mm to 3 mm.

5. The circuit board assembly (10) according to claim 3, characterized in that: The width of the first welding piece (104) is in the range of 1 mm to 3 mm.

6. The circuit board assembly (10) according to any one of claims 3 to 5, characterized in that: The circuit board assembly (10) further comprises a reinforcing sheet (106), wherein the reinforcing sheet (106) is fixed to a side of the flexible circuit board (102) facing away from the rigid circuit board (101); In the thickness direction of the circuit board assembly (10), the reinforcing sheet (106) covers the through hole (1011) and the first welding piece (104), and is arranged staggered with the second welding piece (105).

7. The circuit board assembly (10) according to claim 6, characterized in that: In the board surface direction of the circuit board assembly (10), the periphery of the reinforcing sheet (106) protrudes relative to the periphery of the first welding piece (104), and the protruding width is greater than or equal to 0.3 mm.

8. The circuit board assembly (10) according to claim 6, characterized in that: In the board surface direction of the circuit board assembly (10), the distance between the reinforcing sheet (106) and the second welding piece (105) is in the range of 0.5 mm to 1 mm.

9. The circuit board assembly (10) according to claim 6, characterized in that: The reinforcing sheet (106) is a steel sheet, and the thickness of the reinforcing sheet (106) is in the range of 0.1 mm to 0.15 mm.

10. The circuit board assembly (10) according to any one of claims 3 to 5, characterized in that: The electronic component (103) is an electrical connector, a card socket or a cable connection socket.

11. The circuit board assembly (10) according to claim 1 or 2, characterized in that: The circuit board assembly (10) further comprises a first welding member (104), the first welding member (104) welding the rigid circuit board (101) and the flexible circuit board (102), and being arranged around the through hole (1011), the rigid circuit board (101) and the flexible circuit board (102) being electrically connected via the first welding member (104); The electronic component (103) is a capacitor, a resistor, a baseband chip or a radio frequency chip.

12. An electronic device (1), characterized in that: A circuit board assembly (10) comprising any one of claims 1 to 11.

13. An electronic device (1), characterized in that: The electronic device (1) comprises a first circuit board assembly (12), a second circuit board assembly (13) and a connecting circuit board (14); in the thickness direction of the electronic device (1), the first circuit board assembly (12) is higher than the second circuit board assembly (13); the first circuit board assembly (12) adopts the circuit board assembly (10) described in any one of claims 1 to 10; one end of the connecting circuit board (14) is electrically connected to the electronic components (103) of the first circuit board assembly (12); and the other end of the connecting circuit board (14) is electrically connected to the second circuit board assembly (13).

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