Structure for replacing active coupling with passive mounting

By setting positioning marking points on the printed circuit board, combining the positions of lasers and photodetectors, passive mounting technology is realized, which solves the cumbersome problem of position search in existing optical communication technologies, simplifies the packaging process and improves production capacity.

CN222884866UActive Publication Date: 2025-05-16HEFEI FENGZHIYI SEMICON CO LTD
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Patent Information

Application Number
CN202421878293.9
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-08-05
Publication Date
2025-05-16
Estimated Expiration
2034-08-05

AI Technical Summary

Technical Problem

In the existing optical communication technology, it is complicated to find the best position between the photodetector and the lens and between the laser and the lens, and is not convenient enough.

Method used

Passive mount instead of active coupling structure, by setting positioning marking point 1 and positioning marking point 2 on the printed circuit board, combining the positions of lasers and photodetectors, passive mount of lenses is realized, and the packaging process is simplified.

Benefits of technology

Through passive mounting technology, the packaging process is simplified, the dependence on coupling tables, source meters, light sources and power meters and other equipment is reduced, and production efficiency and capacity are improved.

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Abstract

The utility model relates to the technical field of optical communication, and discloses a structure for replacing active coupling with passive mounting, which comprises a printed circuit board, a laser chip and a photoelectric detector chip are mounted on the surface of the printed circuit board, a laser mounted on the printed circuit board is arranged at the bottom of the laser chip, and a photoelectric detector chip is arranged at the bottom of the photoelectric detector chip. A photoelectric detector located below the photoelectric detector chip is arranged on one side of the laser, a first positioning mark point is arranged on the other side of the laser, and a second positioning mark point is arranged on the side, away from the laser, of the photoelectric detector. A laser chip and a photoelectric detector chip are mounted according to the positions of the first positioning mark point, the second positioning mark point, the laser and the photoelectric detector, and then the optimal position of the lens is found according to the positions of the photoelectric detector and the photosensitive surface of the laser or the first positioning mark point and the second positioning mark point. Therefore, the packaging can be realized by a chip mounter without adopting equipment such as a coupling table, a source meter, a light source, a power meter and the like, the packaging scheme is greatly simplified, and the productivity is improved.
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Description

Technical Field

[0001] The utility model relates to the technical field of optical communication, and more specifically to a structure in which passive mounting replaces active coupling. Background Art

[0002] A lens and two chips, namely a laser chip, a photodetector chip, a photodetector, and a laser, are mounted on the printed circuit board. The laser and the photodetector are fixed to the printed circuit board by silver glue, and the lens is fixed to the printed circuit board by UV glue. In the existing scheme, an active coupling structure is used. The photodetector and the lens find the best position by monitoring the photocurrent of the photodetector, and the laser and the lens find the best position by monitoring the light output power. However, this way of finding is cumbersome and not convenient enough. Utility Model Content

[0003] In order to solve the problems raised in the above background technology, the utility model provides a structure in which passive mounting replaces active coupling.

[0004] The utility model provides a structure of passive mounting instead of active coupling, which adopts the following technical scheme: a structure of passive mounting instead of active coupling, comprising a printed circuit board, a laser chip and a photodetector chip are mounted on the surface of the printed circuit board, a laser mounted on the printed circuit board is provided at the bottom of the laser chip, a photodetector located below the photodetector chip is provided on one side of the laser, a positioning mark point one is provided on the other side of the laser, and a positioning mark point two is provided on the side of the photodetector away from the laser.

[0005] Preferably, the positioning mark point one, the positioning mark point two, the laser, and the photoelectric detector are on the same horizontal line.

[0006] Preferably, the positioning mark point one and the positioning mark point two are arranged symmetrically, and the laser and the photoelectric detector are located between the positioning mark point one and the positioning mark point two.

[0007] Preferably, the printed circuit board is fixed with a lens by UV glue.

[0008] In summary, the utility model includes the following beneficial technical effects:

[0009] The utility model first mounts the laser chip and the photodetector chip by locating the first and second positioning marking points and the positions of the laser and the photodetector, and then finds the best position of the lens by the positions of the photodetector and the laser photosensitive surface or the two positioning marking points one and two positioning marking points, thereby achieving the goal by relying on a chip mounter without the need to use a coupling table and source meter, light source, power meter and other equipment, thereby greatly simplifying the packaging solution and improving production capacity. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 It is a schematic diagram of the front three-dimensional structure in an embodiment of the utility model.

[0011] Explanation of the accompanying drawings: 1. printed circuit board; 2. laser chip; 3. photodetector chip; 4. laser; 5. photodetector; 6. positioning mark point one; 7. positioning mark point two; 8. lens. DETAILED DESCRIPTION

[0012] The following is combined with Figure 1 The utility model is described in further detail.

[0013] It should be noted that the drawings are schematic and not to scale. For the sake of clarity and convenience, the relative sizes and proportions of the parts shown in the drawings are exaggerated or reduced in size, and any size is only illustrative and not restrictive. In addition, the same reference symbol is used for the same structure, element or accessory appearing in more than two figures to reflect similar features.

[0014] The utility model embodiment discloses a structure in which passive mounting replaces active coupling. Figure 1 A structure in which passive mounting replaces active coupling comprises a printed circuit board 1, a laser chip 2 and a photodetector chip 3 are mounted on the surface of the printed circuit board 1, a laser 4 mounted on the printed circuit board 1 is arranged at the bottom of the laser chip 2, a photodetector 5 located below the photodetector chip 3 is arranged on one side of the laser 4, and a positioning mark point 1 6 is arranged on the other side of the laser 4, a positioning mark point 2 7 is arranged on the side of the photodetector 5 away from the laser 4, the positioning mark point 1 6, the positioning mark point 2 7, the laser 4, and the photodetector 5 are on the same horizontal line, the positioning mark point 1 6 and the positioning mark point 2 7 are arranged symmetrically, and the laser 4 and the photodetector 5 are located between the positioning mark point 1 6 and the positioning mark point 2 7, and a lens 8 is fixedly mounted on the printed circuit board 1 by UV glue;

[0015] Specifically, the laser chip 2 and the photodetector 3 are mounted first by locating the first mark point 6, the second mark point 7, the laser 4, and the photodetector 5, and then the best position of the lens is found by the position of the photodetector 5 and the photosensitive surface of the laser 4 or the two positioning mark points 1 6 and the second mark point 7;

[0016] Through the above structural design, it can be achieved by relying on a placement machine without the need to use a coupling table and source meter, light source, power meter and other equipment. The packaging solution is greatly simplified and the production capacity is improved.

[0017] Finally, a few points should be explained: First, in the description of the present utility model, it should be noted that, unless otherwise specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, which may refer to mechanical connection or electrical connection, or internal communication between two components, or direct connection. "upper", "lower", "left", "right", etc. are only used to indicate relative positional relationships. When the absolute position of the object being described changes, the relative positional relationship may change;

[0018] Secondly: In the drawings of the embodiments disclosed in the present utility model, only the structures related to the embodiments disclosed in the present utility model are involved, and other structures can refer to the general design. In the absence of conflict, the same embodiment and different embodiments of the present utility model can be combined with each other;

[0019] Finally: The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present utility model should be included in the protection scope of the present utility model.

Claims

1. A structure for replacing active coupling with passive mounting, comprising a printed circuit board (1), characterized in that: A laser chip (2) and a photodetector chip (3) are mounted on the surface of the printed circuit board (1); a laser (4) mounted on the printed circuit board (1) is provided at the bottom of the laser chip (2); a photodetector (5) located below the photodetector chip (3) is provided on one side of the laser (4); a positioning mark point 1 (6) is provided on the other side of the laser (4); and a positioning mark point 2 (7) is provided on the side of the photodetector (5) away from the laser (4).

2. The structure of passive mounting instead of active coupling according to claim 1, characterized in that: The positioning mark point one (6), the positioning mark point two (7), the laser (4) and the photoelectric detector (5) are located on the same horizontal line.

3. The structure of passive mounting instead of active coupling according to claim 1, characterized in that: The positioning mark point one (6) and the positioning mark point two (7) are arranged symmetrically, and the laser (4) and the photoelectric detector (5) are located between the positioning mark point one (6) and the positioning mark point two (7).

4. The structure of passive mounting instead of active coupling according to claim 1, characterized in that: The printed circuit board (1) is fixedly mounted with a lens (8) by means of UV glue.