Heat dissipation structure of patch transistor

Abstract

The utility model relates to the technical field of heat dissipation of electronic components, in particular to a heat dissipation structure of a patch transistor, which comprises a PCB (printed circuit board), a patch transistor mounted on the PCB, a heat-conducting metal sheet and heat-conducting gel. According to the utility model, the heat-conducting metal sheet is arranged at the outer side of the patch transistor and is fixedly connected with the PCB, and the heat-conducting gel is arranged between the heat-conducting metal sheet and the patch transistor, so that the patch transistor can be protected by the heat-conducting metal sheet, the patch transistor can be assisted to dissipate heat to the outside, and the use effect is very good.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation of electronic components, in particular to a heat dissipation structure of a patch transistor. Background Art

[0002] With the development of SMD technology, the integration and miniaturization of circuit boards have been unprecedentedly improved. The resulting concentrated heating of electronic components has also brought great disadvantages to the working conditions and service life of components.

[0003] For example, chip transistors generate heat during operation. If the heat cannot be dissipated in time, the transistor will face the risk of damage. Therefore, it is necessary to design a heat dissipation structure for chip transistors. Summary of the invention

[0004] The utility model aims to solve the shortcomings in the prior art and proposes a heat dissipation structure for a chip transistor.

[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0006] A heat dissipation structure of a surface mount transistor comprises a PCB board and a surface mount transistor mounted on the PCB board, a heat conductive metal sheet is fixedly mounted on the PCB board and located outside the surface mount transistor, and a heat conductive gel is arranged between the heat conductive metal sheet and the surface mount transistor;

[0007] Among them, the heat conductive metal sheet is provided with mounting pins, and the PCB board is provided with mounting holes corresponding to the mounting pins. After the mounting pins are inserted into the mounting holes on the PCB board, the mounting pins are fixedly connected to the PCB board through glue.

[0008] As a further description of the above technical solution:

[0009] It also includes: a shell, the PCB board is fixedly installed on the inner side of the shell through a bracket, and a gap is formed between the PCB board and the shell, and the chip transistor and the heat-conducting metal sheet are both located in the gap.

[0010] As a further description of the above technical solution:

[0011] A heat dissipation hole is provided on the side of the shell at a position corresponding to the PCB board.

[0012] As a further description of the above technical solution:

[0013] The heat-conducting metal sheet comprises: a flat plate body, the flat plate body corresponds to the upper surface of the SMD transistor, a first side plate is fixedly connected to the side surface of the flat plate body, and the mounting pins are fixedly connected to the first side plate.

[0014] As a further description of the above technical solution:

[0015] The flat plate is rectangular, a second side plate is fixedly connected to a side surface of the flat plate, the second side plate is perpendicular to the first side plate, and a pin clearance notch corresponding to the pin of the SMD transistor is formed on the second side plate.

[0016] As a further description of the above technical solution:

[0017] A filling groove is provided on a surface of the flat plate body close to the SMD transistor.

[0018] As a further description of the above technical solution:

[0019] A heat sink is fixedly connected to a surface of the flat plate body facing away from the SMD transistor.

[0020] The utility model has the following beneficial effects:

[0021] Compared with the prior art, the heat dissipation structure of the chip transistor is designed with a heat-conducting metal sheet on the outside of the chip transistor and fixedly connected to the PCB board, and a heat-conducting gel is arranged between the heat-conducting metal sheet and the chip transistor. The heat-conducting metal sheet can protect the chip transistor and assist the chip transistor in dissipating heat to the outside, and has a good use effect.

[0022] Compared with the prior art, the heat dissipation structure of the chip transistor is provided with mounting pins on the heat-conducting metal sheet, and mounting holes corresponding to the mounting pins are opened on the PCB board. After the mounting pins are inserted into the mounting holes on the PCB board, the mounting pins are fixedly connected to the PCB board by glue. The fixing method is simple, the fixing effect is stable, and it is convenient to put it into use in batches. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 A schematic diagram of a heat dissipation structure of a chip transistor proposed in the utility model;

[0024] Figure 2 for Figure 1 A partial enlarged view in the middle;

[0025] Figure 3 A schematic diagram of a heat-conducting metal sheet and a SMD transistor of a heat dissipation structure of a SMD transistor proposed by the utility model;

[0026] Figure 4 This is a bottom-view stereoscopic image of a heat-conducting metal sheet of a heat dissipation structure of a patch transistor proposed in the utility model.

[0027] Legend:

[0028] 1. Shell; 2. PCB board; 3. Bracket; 4. SMD transistor; 5. Thermal conductive metal sheet; 501. First side panel; 502. Mounting pin; 503. Filling slot; 504. Flat plate; 505. Heat sink; 506. Second side panel; 507. Pin clearance notch; 6. Heat dissipation hole; 7. Thermal conductive gel. DETAILED DESCRIPTION

[0029] Reference Figure 1-Figure 4 The utility model provides a heat dissipation structure of a chip transistor, including a PCB board 2, a chip transistor 4 mounted on the PCB board 2, a heat-conducting metal sheet 5 and a heat-conducting gel 7.

[0030] Among them, a thermally conductive metal sheet 5 is fixedly installed on the PCB board 2 and located on the outside of the chip transistor 4, and a thermally conductive gel 7 is arranged between the thermally conductive metal sheet 5 and the chip transistor 4. The thermally conductive gel 7 can fit well with the thermally conductive metal sheet 5 and the chip transistor 4, thereby transferring the heat on the chip transistor 4 to the thermally conductive metal sheet 5.

[0031] In this solution, the thermally conductive metal sheet 5 is directly fixed to the PCB board 2, which can protect the chip transistor 4. The thermally conductive gel 7 is flexible, which can prevent the force acting on the thermally conductive metal sheet 5 from damaging the chip transistor 4, and the thermally conductive metal sheet 5 can better dissipate heat to the outside.

[0032] Specifically, the heat-conducting metal sheet 5 has a mounting pin 502, and the PCB board 2 has a mounting hole corresponding to the mounting pin 502. After the mounting pin 502 is inserted into the mounting hole on the PCB board 2, the mounting pin 502 is fixedly connected to the PCB board 2 by glue. This fixing method is simple, the fixing effect is stable, and it is convenient for batch use.

[0033] In one embodiment, it also includes: a shell 1, a PCB board 2 is fixedly installed on the inner side of the shell 1 through a bracket 3, and a gap is formed between the PCB board 2 and the shell 1, and the SMD transistor 4 and the thermal conductive metal sheet 5 are both located in the gap, so that the SMD transistor 4 and the thermal conductive metal sheet 5 are relatively close to the side of the shell 1, and a heat dissipation hole 6 is opened on the side of the shell 1 and at a position corresponding to the PCB board 2, so as to facilitate the heat dissipation of the SMD transistor 4 and the thermal conductive metal sheet 5 to the outside.

[0034] In one embodiment, the heat-conducting metal sheet 5 includes: a flat plate 504 , the flat plate 504 corresponds to the upper surface of the SMD transistor 4 , a first side plate 501 is fixedly connected to the side of the flat plate 504 , and a mounting pin 502 is fixedly connected to the first side plate 501 .

[0035] Generally, the chip transistor 4 is in a cubic shape, with pins on both sides in the horizontal direction and no pins on both sides in the vertical direction. In order to ensure that the mounting pin 502 does not contact the pin of the mounting pin 502, the first side plate 501 can be set on the longitudinal side of the chip transistor 4.

[0036] In one embodiment, the flat plate body 504 is rectangular and corresponds to the SMD transistor 4. A second side plate 506 is fixedly connected to the side of the flat plate body 504. The second side plate 506 is perpendicular to the first side plate 501. A pin clearance notch 507 corresponding to the pin of the SMD transistor 4 is opened on the second side plate 506, thereby preventing the second side plate 506 from contacting the pin of the SMD transistor 4.

[0037] In one embodiment, a filling groove 503 is formed on a surface of the flat plate 504 close to the SMD transistor 4 , so as to increase the connection stability between the thermal conductive gel 7 and the flat plate 504 .

[0038] In one embodiment, a heat sink 505 is fixedly connected to a surface of the flat plate 504 facing away from the SMD transistor 4 , so as to assist in dissipating heat from the flat plate 504 .

[0039] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A heat dissipation structure for a surface mount transistor, comprising a PCB board (2) and a surface mount transistor (4) mounted on the PCB board (2), characterized in that: A heat-conducting metal sheet (5) is fixedly mounted on the PCB board (2) and located outside the SMD transistor (4), and a heat-conducting gel (7) is provided between the heat-conducting metal sheet (5) and the SMD transistor (4); The heat-conducting metal sheet (5) is provided with a mounting pin (502), and a mounting hole corresponding to the mounting pin (502) is provided on the PCB board (2). After the mounting pin (502) is inserted into the mounting hole on the PCB board (2), the mounting pin (502) is fixedly connected to the PCB board (2) by means of glue.

2. The heat dissipation structure of a chip transistor according to claim 1, characterized in that: Also includes: The housing (1) is provided with a PCB board (2) fixedly mounted on the inner side of the housing (1) via a bracket (3), and a gap is formed between the PCB board (2) and the housing (1), and the surface-mount transistor (4) and the heat-conducting metal sheet (5) are both located in the gap.

3. The heat dissipation structure of a chip transistor according to claim 2, characterized in that: A heat dissipation hole (6) is provided on the side of the housing (1) at a position corresponding to the PCB board (2).

4. The heat dissipation structure of a chip transistor according to claim 1, characterized in that: The heat-conducting metal sheet (5) comprises a flat plate body (504), the flat plate body (504) corresponds to the upper surface of the SMD transistor (4), a first side plate (501) is fixedly connected to the side surface of the flat plate body (504), and the mounting pins (502) are fixedly connected to the first side plate (501).

5. The heat dissipation structure of a chip transistor according to claim 4, characterized in that: The flat plate (504) is rectangular, a second side plate (506) is fixedly connected to a side surface of the flat plate (504), the second side plate (506) is perpendicular to the first side plate (501), and a pin clearance notch (507) corresponding to a pin of the surface-mount transistor (4) is provided on the second side plate (506).

6. The heat dissipation structure of a chip transistor according to claim 4, characterized in that: A filling groove (503) is provided on a surface of the flat plate body (504) close to the chip transistor (4).

7. The heat dissipation structure of a chip transistor according to claim 4, characterized in that: A heat sink (505) is fixedly connected to a surface of the flat plate body (504) that faces away from the SMD transistor (4).

Images