5G base station heat dissipation system

Abstract

The utility model relates to the field of communication, and particularly discloses a 5G base station heat dissipation system which comprises a machine room, a machine cabinet located in the machine room, a communication rod located outside the machine room, a power source for supplying power to the machine cabinet and the communication rod, a first cooling system for cooling the machine cabinet and a second cooling system for cooling an AAU in the communication rod. The first cooling system at least comprises a refrigeration air conditioner, the second cooling system comprises a shell, a liquid cooling pipeline installed in the shell, a cooling liquid storage box installed on a communication rod or in a machine room and a circulating pump providing power for cooling liquid circulation, the liquid cooling pipeline is bent back and forth in the shell, and a containing space is formed between every two adjacent pipe sections. Electronic components of the AAU are arranged in the shell and are arranged in the accommodating space; the second cooling system further comprises a semiconductor refrigeration plate, the semiconductor refrigeration plate is arranged in the shell and divides the shell into a cold chamber and a hot chamber, and the liquid cooling pipeline and electronic elements of the AAU are all located in the cold chamber.

Description

Technical Field

[0001] The present application relates to the field of communications, and in particular to a 5G base station cooling system. Background Art

[0002] At present, with the communication demand caused by the application of massive data, the more extensive and intensive deployment of 5G base stations has been put on the agenda. Compared with 4G base stations, 5G base stations carrying higher data volumes are bound to consume more power. Generally speaking, the energy consumption of 5G base stations is more than twice that of 4G.

[0003] The 5G base station is mainly composed of the base station cabinet (mainly BBU and transmission unit), power supply, and communication pole (mainly including AAU) in the equipment room 01. AAU generates more heat due to its high energy consumption, so the heat dissipation problem of AAU is the main solution.

[0004] However, the existing technology mainly adopts natural heat dissipation for AAUs with higher heat generation, which mainly accelerates heat dissipation by increasing the heat dissipation area by adding heat dissipation fins, or replacing local materials with materials with higher thermal conductivity. However, as more electronic components are arranged inside AAUs, the above methods are no longer suitable. Utility Model Content

[0005] In order to improve the heat dissipation problem, the present application provides a 5G base station heat dissipation system.

[0006] The 5G base station cooling system provided in this application adopts the following technical solutions:

[0007] The 5G base station heat dissipation system includes a machine room, a cabinet located in the machine room, a communication pole located outside the machine room, a power supply for supplying power to the cabinet and the communication pole, and also includes a first cooling system for cooling the cabinet and a second cooling system for cooling the AAU in the communication pole. The first cooling system at least includes a refrigeration air conditioner, and the second cooling system includes an outer shell, a liquid cooling pipeline installed in the outer shell, a coolant storage tank installed on the communication pole or in the machine room, and a circulating pump for providing power for the circulation of the coolant. The liquid cooling pipeline bends back and forth in the outer shell and an accommodation space is formed between adjacent pipe sections. The electronic components of the AAU are installed in the shell and arranged in the accommodation space. The second cooling system also includes a semiconductor refrigeration plate, which is arranged in the outer shell and divides the outer shell into a cold chamber and a hot chamber. The liquid cooling pipeline and the electronic components of the AAU are both located in the cold chamber.

[0008] By adopting the above technical solution, this solution ensures the stable operation of the entire base station by setting up independent cooling systems in the two parts of the base station. Since the equipment in the computer room has low power consumption, the heat dissipation efficiency can be guaranteed by using refrigeration and air conditioning; and the AAU has high heat, so this solution uses a combination of liquid cooling exchange + air cooling to dissipate the heat of the electronic components inside the AAU, thereby ensuring the normal operation of the AAU.

[0009] Optionally, two liquid cooling pipelines are arranged in parallel in the shell, so that a flow space is formed between the two liquid cooling pipelines. A fan is also provided in the cold chamber in the shell, and the air outlet of the fan corresponds to the flow space. The air outlet of the fan is staggered with the electronic components of the AAU, and a cold end air inlet and a cold end air outlet are provided on the shell.

[0010] By adopting the above technical solution, the setting of the fan accelerates the internal air flow, and the low-temperature gas generated by the cold end of the semiconductor refrigeration plate is quickly brought to various positions. The two liquid cooling pipelines are set up mainly to facilitate the location arrangement and installation of the fan.

[0011] Optionally, the fan includes a first fan and a second fan, the first fan is arranged close to the semiconductor refrigeration plate, and the second fan is arranged far away from the semiconductor refrigeration plate.

[0012] By adopting the above technical solution, the air flow rate is made faster by using the first fan and the second fan in combination. Due to the internal space problem, the fan volume cannot be too large, so two groups of fans are set to work together. The air blown out by the first fan is sucked in by the second fan, and the synergy is achieved by a one-blowing and one-sucking method.

[0013] Optionally, a cold fin is fixed to the cold end of the semiconductor refrigeration plate, and the cold fin includes a long fin and a short fin, the short fin is located behind the first fan, and the long fin is staggered with the first fan.

[0014] By adopting the above technical solution, the setting of the cold fins increases the contact area with the air, making it easier for the air at the cold end to be cooled and then sucked out by the first fan, and the fin length is adjusted according to the spatial position.

[0015] Optionally, the fan is installed on a liquid cooling pipeline, and a U-shaped or C-shaped clamp is sleeved on the liquid cooling pipeline. The clamp is integrally formed to form an extension portion, and a fastener is installed on the extension portion. The extension portion abuts against the fan housing, and the fastener connects the extension portion and the fan housing.

[0016] By adopting the above technical solution and in the above manner, the U-shaped or C-shaped clamp is directly put on the liquid cooling pipeline, and then the fastener is directly installed to complete the installation of the fan, which is quick and convenient.

[0017] Optionally, a through hole is provided on the cooling fin, and both ends of the through hole are expanded structures.

[0018] By adopting the above technical solution, the arrangement increases the contact area on the one hand, and facilitates the mutual connection of the air inlet ends of multiple fans on the other hand.

[0019] Optionally, the cross-section of the liquid cooling pipeline is rectangular.

[0020] By adopting the above technical solution, the cross-section of the liquid cooling pipeline is set to a rectangle, and the end surface opposite to the electronic component is enlarged, thereby improving the heat exchange efficiency.

[0021] Optionally, the cold end air inlet and the cold end air outlet are both arranged at the bottom of the shell, and a filter is arranged at the cold end air inlet, and the longitudinal section of the filter is in an outwardly convex arc shape.

[0022] By adopting the above technical solution, the filter is set to reduce the entry of dust as much as possible, thereby reducing the impact on the operation of the system. The filter is set at the bottom, and dust is not easy to enter through natural sedimentation. The arc shape is mainly set to increase the filtration area and extend the replacement time.

[0023] Optionally, a second cooling system is also installed on the cabinet, and the electronic components in the cabinet are installed in a shell.

[0024] In summary, the present application includes at least one of the following beneficial technical effects: through the combination of refrigeration air conditioning, semiconductor refrigeration plates and liquid cooling, the base station system has good heat dissipation and stable operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a schematic diagram of the overall structure of an embodiment of the present application;

[0026] Figure 2 is a front view of the housing;

[0027] Figure 3 This is a schematic diagram of the connection between the liquid cooling pipeline and the fan as viewed from direction A;

[0028] Figure 4 This is a schematic diagram of the connection between the liquid cooling pipeline and the fan as viewed from direction B;

[0029] Figure 5 It is a cross-sectional view of the cooling fin.

[0030] Figure numerals: 1. machine room; 2. cabinet; 3. communication pole; 4. power supply; 5. battery; 6. pole body; 7. AAU; 8. refrigeration and air conditioning; 9. awning; 10. electronic components; 11. semiconductor refrigeration plate; 12. shell; 13. liquid cooling pipeline; 14. coolant storage tank; 15. circulation pump; 16. cold room; 17. hot room; 18. first fan; 19. flow space; 20. cold end air inlet; 21. cold end air outlet; 22. filter; 23. cooling fan; 24. second fan; 25. hot end air inlet; 26. hot end air outlet; 27. long fins; 28. short fins; 29. ​​through hole; 30. clamp; 31. extension; 32. bolt; 33. auxiliary pipeline; 34. nozzle; 35. auxiliary pump; 36. tap water pipe. DETAILED DESCRIPTION

[0031] The following is combined with Figure 1-5 This application is described in further detail.

[0032] The present application discloses a 5G base station heat dissipation system, including a machine room 1, a cabinet 2 located in the machine room 1, a communication pole 3 located outside the machine room 1, a power supply 4 (mains electricity) for supplying power to the cabinet 2 and the communication pole 3, and a battery 5. The communication pole 3 mainly includes a pole body 6 and an AAU 7, and the pole body 6 is fixed to the AAU 7 by a connecting rod, and the pole body 6 and the connecting rod are generally steel structures.

[0033] The 5G base station heat dissipation system also includes a first cooling system for cooling the cabinet 2 and a second cooling system for cooling the AAU7 in the communication pole.

[0034] The first cooling system at least includes a refrigeration air conditioner 8 , and a power source 4 supplies power to the refrigeration air conditioner 8 . The refrigeration air conditioner 8 is located on the top of the machine room 1 , and a sunshade 9 is provided above the outside of the machine room 1 .

[0035] The second cooling system includes a shell 12, a liquid cooling pipeline 13 installed in the shell 12, a coolant storage tank 14 installed on a communication pole or in a machine room, and a circulation pump 15 that provides power for the circulation of the coolant. The liquid cooling pipeline 13 bends back and forth in the shell 12 and a receiving space is formed between adjacent pipe sections. The electronic components 10 of AAU7 are installed in the shell and arranged in the receiving space.

[0036] The second cooling system also includes a semiconductor refrigeration plate 11, which is arranged in the outer shell 12 and divides the outer shell 12 into a cold chamber 16 and a hot chamber 17, wherein the volume of the cold chamber 16 is much larger than the volume of the hot chamber 17, the liquid cooling pipeline 13 and the electronic components 10 of AAU7 are both located in the cold chamber 16, and the power supply 4 is electrically connected to the semiconductor refrigeration plate 11.

[0037] Two liquid cooling pipes 13 are arranged in parallel in the housing 12, so that a flow space 19 is formed between the two liquid cooling pipes 13. The height of the electronic component 10 is equal to the distance between the two farthest end surfaces of the two liquid cooling pipes 13. A fan is also arranged in the cold chamber 16 in the housing 12, and the air outlet 21 of the fan corresponds to the flow space 19. The air outlet of the fan is staggered with the electronic component 10 of AAU7. A cold end air inlet 20 and a cold end air outlet 21 are provided on the housing 12. The cold end air inlet 20 and the cold end air outlet 21 are both arranged at the bottom of the housing 12, and a filter screen 22 is arranged at the cold end air inlet 20, and the longitudinal section of the filter screen 22 is in the shape of an outwardly convex arc. A cooling fan 23 is also fixed on the housing 12 and is located in the heat chamber 17. The heat chamber 17 has a hot end air inlet 25 at the bottom and a hot end air outlet 26 at the top. In this way, the cold end air inlet 20 and the hot end air outlet 26 are staggered, which will not affect heat dissipation.

[0038] The fan includes a first fan 18 and a second fan 24. The first fan 18 is arranged close to the semiconductor refrigeration plate 11, and the second fan 24 is arranged far away from the semiconductor refrigeration plate 11. A cold fin is fixed to the cold end of the semiconductor refrigeration plate 11. The cold fin includes a long fin 27 and a short fin 28. The short fin 28 is located behind the first fan 18, and the long fin 27 is staggered with the first fan 18. A through hole 29 is opened on the cold fin, and both ends of the through hole 29 are flared structures.

[0039] The fan is mounted on the liquid cooling pipe 13, and the cross section of the liquid cooling pipe 13 is preferably rectangular, and of course it can be circular in another solution. A U-shaped or C-shaped clamp 30 is sleeved on the liquid cooling pipe 13, and the clamp 30 is integrally formed to form an extension 31, and a fastener is installed on the extension 31, and the fastener is preferably a bolt 32, and the extension 31 abuts against the housing of the fan, and the bolt 32 passes through the extension 31 and is threadedly connected to the housing of the fan.

[0040] The coolant in the coolant storage tank 14 is tap water. The coolant storage tank 14 has a first pipe interface and a second pipe interface. The first pipe interface is connected to a tap water pipe 36. The second pipe interface extends into the shell through an auxiliary pipeline 33 and is connected to a nozzle 34. The nozzle 34 is tilted toward the filter 22, and an auxiliary pump 35 is connected to the auxiliary pipeline 33. In this way, the filter 22 can be cleaned, and the AAU7 stops working during flushing to prevent the fan from bringing in water mist. In a further optimized solution, a thermometer and a water level gauge can be set in the coolant storage tank 14. Heat dissipation fins can be attached to the coolant storage tank 14 to accelerate its own cooling. This solution is to restore the cooling of the heated coolant by externally connecting to tap water. The coolant storage tank 14 can also be externally connected to the CDU through the first pipe interface and the second pipe interface, and the CDU is externally connected to a water cooling tower.

[0041] It should be noted that: fans and other electrical equipment are electrically connected to the power supply 4 and the battery 5 and are electrically or communicatively connected to the equipment in the cabinet 2. The housing 12 actually serves as the shell part of the AAU. The second cooling system can also be attached to the cabinet 2. One way is that the housing 12 serves as the shell of the cabinet, and all the internal electronic components are installed in the housing 12. Another way is that the second cooling system is also attached to a module in the cabinet 2, such as a BBU module, and the housing 12 serves as the shell of the BBU module.

[0042] The implementation principle of the 5G base station heat dissipation system in the embodiment of the present application is: cooling the equipment in the computer room 1 through the refrigeration air conditioner 8, and cooling the AAU 7 through the combination of semiconductor refrigeration plate 11 + liquid cooling.

[0043] Special note: The coolant is output through the liquid outlet pipe and is divided into two when entering the housing 12 to form two parallel liquid cooling pipes 13, and finally merges into one after exiting the housing 12 and flows back to the coolant storage tank 14. Finally, a few points should be explained: First, in the description of this application, it should be noted that, unless otherwise specified and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense, which can be mechanical connection or electrical connection, or the internal connection of two components, or direct connection, "up", "down", "left" and "right" are only used to indicate relative position relationship, and when the absolute position of the described object changes, the relative position relationship may change;

[0044] Secondly: In the drawings of the embodiments disclosed in the present utility model, only the structures related to the embodiments disclosed in the present utility model are involved, and other structures can refer to the general design. In the absence of conflict, the same embodiment and different embodiments of the present utility model can be combined with each other;

[0045] Finally: The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present utility model should be included in the protection scope of the present utility model.

[0046] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

The 1.5G base station heat dissipation system includes a machine room, a cabinet located in the machine room, a communication pole located outside the machine room, and a power supply for supplying power to the cabinet and the communication pole, and is characterized by: It also includes a first cooling system for cooling the cabinet and a second cooling system for cooling the AAU in the communication pole, the first cooling system at least includes a refrigeration air conditioner, the second cooling system includes an outer shell, a liquid cooling pipeline installed in the outer shell, a coolant storage tank installed on the communication pole or in the machine room, and a circulating pump for providing power for the circulation of the coolant, the liquid cooling pipeline bends back and forth in the outer shell and a receiving space is formed between adjacent pipe sections, the electronic components of the AAU are installed in the shell and arranged in the receiving space; the second cooling system also includes a semiconductor refrigeration plate, the semiconductor refrigeration plate is arranged in the outer shell and divides the outer shell into a cold chamber and a hot chamber, the liquid cooling pipeline and the electronic components of the AAU are both located in the cold chamber.

2. The 5G base station heat dissipation system according to claim 1, characterized in that: Two liquid cooling pipelines are arranged in parallel in the shell, so that a flow space is formed between the two liquid cooling pipelines. A fan is also arranged in the cold chamber in the shell, and the air outlet of the fan corresponds to the flow space. The air outlet of the fan is staggered with the electronic components of the AAU. A cold end air inlet and a cold end air outlet are provided on the shell.

3. The 5G base station heat dissipation system according to claim 2, characterized in that: The fan comprises a first fan and a second fan, wherein the first fan is arranged close to the semiconductor refrigeration plate, and the second fan is arranged far away from the semiconductor refrigeration plate.

4. The 5G base station heat dissipation system according to claim 3, characterized in that: A cooling fin is fixed to the cold end of the semiconductor refrigeration plate. The cooling fin includes a long fin and a short fin. The short fin is located behind the first fan, and the long fin is staggered with the first fan.

5. The 5G base station heat dissipation system according to claim 4, characterized in that: The cooling fin is provided with a through hole, and both ends of the through hole are expanded structures.

6. The 5G base station heat dissipation system according to claim 2, characterized in that: The fan is installed on a liquid cooling pipeline, a U-shaped or C-shaped clamp is sleeved on the liquid cooling pipeline, the clamp is integrally formed to form an extension portion, a fastener is installed on the extension portion, the extension portion abuts against the fan housing, and the fastener connects the extension portion and the fan housing.

7. The 5G base station heat dissipation system according to claim 1, characterized in that: The cross section of the liquid cooling pipeline is rectangular.

8. The 5G base station heat dissipation system according to claim 2, characterized in that: The cold end air inlet and the cold end air outlet are both arranged at the bottom of the shell. A filter screen is arranged at the cold end air inlet, and the longitudinal section of the filter screen is in an outwardly convex arc shape.

9. The 5G base station heat dissipation system according to claim 1, characterized in that: The cabinet is also equipped with a second cooling system, and the electronic components in the cabinet are installed in the housing.

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