Internal drive type heat exchange radiator

Abstract

The utility model discloses an internal drive type heat exchange radiator which comprises a body and a patch portion located on one side of the body, and a heat conduction channel and a cooling channel which are not communicated with each other are arranged in the body. Wherein the heat source end of the heat conduction channel is close to the patch part, and the heat dissipation end of the heat conduction channel is far away from the patch part; the front end of the cooling channel is communicated with the outside through a first cooling connecting pipe, and the rear end of the cooling channel is communicated with the outside through a second cooling connecting pipe. The beneficial effects are that the heat source end rapidly disperses the heat of the integrated circuit to the heat dissipation end through the heat conduction channel, the temperature of the patch part and the integrated circuit is rapidly reduced, the heat conduction channel and the heat conduction working medium volume chamber are filled with the heat conduction working medium, the heat conductivity of the heat conduction channel and the heat conduction working medium volume chamber is enhanced, and the cooling speed of the patch part and the integrated circuit is accelerated. Meanwhile, the cooling medium rapidly circulates and flows with an external cold source through the cooling channel, heat on the body and the heat conduction channel is rapidly taken away, and sustainable heat dissipation of the radiator is guaranteed.

Description

Technical Field

[0001] The utility model relates to the technical field of heat exchange equipment, in particular to an internally driven heat exchange radiator. Background Art

[0002] With the development of science and technology, more and more electronic devices are developing towards miniaturization, multi-function and multi-chip integration. As a result, the high integration density leads to higher heat generated by the integrated circuits inside the electronic devices. As we all know, high temperature is the enemy of integrated circuits. High temperature will not only cause unstable system operation and shorten the service life, but may even burn some components. Continuous high temperature will greatly reduce the reliability of electronic devices and even cause electronic devices to fail. Therefore, the problem of fast and effective heat dissipation of integrated circuits has received more and more attention.

[0003] Currently, a radiator or heat exchanger is installed on the integrated circuit to absorb the heat and then dissipate it outside the electronic device to ensure that the temperature of the integrated circuit is normal.

[0004] Most of the current radiators or heat exchangers absorb the heat of the integrated circuit by flowing liquid or gas heat-absorbing materials back and forth in the radiator or heat exchanger. However, the heat dissipation effect of the current radiator or heat exchanger is general, resulting in the temperature of the integrated circuit being still relatively high. Utility Model Content

[0005] The utility model aims to provide an internally driven heat exchange radiator, which can quickly absorb the heat emitted by the integrated circuit and evenly distribute it, while efficiently and quickly dissipating the heat and enhancing the heat dissipation effect of the radiator.

[0006] The internal drive heat exchange radiator comprises a main body and a patch portion located on one side of the main body, wherein the main body is provided with heat conduction channels and cooling channels which are not connected to each other;

[0007] The heat source end of the heat conduction channel is close to the patch portion, and the heat dissipation end of the heat conduction channel is far away from the patch portion;

[0008] The front end of the cooling channel is communicated with the outside world through a first cooling connecting pipe, and the rear end of the cooling channel is communicated with the outside world through a second cooling connecting pipe.

[0009] The patch part is in contact with the integrated circuit, and the heat of the integrated circuit is quickly transferred to the heat source end, and the heat source end quickly disperses the heat to the heat dissipation end through the heat conduction channel, thereby quickly reducing the temperature of the patch part and the integrated circuit.

[0010] At the same time, the cooling medium circulates rapidly in the cooling channel and the external cold source, taking away the heat from the body and the heat conduction channel, thereby ensuring sustainable heat dissipation of the radiator.

[0011] The internally driven heat exchange radiator changes the working principle of the traditional radiator that relies on cooling fins and air cooling. Its smooth outer surface solves the problem that dust accumulation is difficult to remove, and dust and dirt are prone to heat accumulation. Relying on the internally driven heat exchange effect of the heat conduction channel and the cooling channel, it provides technical guarantee for achieving liquid cooling with full exchange with the outside world.

[0012] Furthermore, the heat source end of the heat conduction channel is a group of heat source tubes arranged in parallel and interconnected, the heat dissipation end of the heat conduction channel is a group of heat dissipation tubes arranged in parallel and interconnected, and the heat source tubes and the heat dissipation tubes are connected through a heat conduction connecting tube;

[0013] The cooling channel is a group of cooling pipes arranged in parallel and interconnected.

[0014] Furthermore, the cooling pipe is located between the heat source pipe and the heat dissipation pipe, and the three are parallel to each other.

[0015] The above structure ensures that the heat conduction channel is in full contact with the cooling channel, which can more quickly remove the heat from the body and the heat conduction channel, accelerate the reduction of the temperature of the body and the heat conduction channel, thereby increasing the heat dissipation speed and enhancing the heat dissipation effect.

[0016] Furthermore, the heat source pipe is close to the cooling pipe, and the distance between them is smaller than the sum of the pipe diameters of the two pipes;

[0017] The heat dissipation pipe is close to the cooling pipe, and the distance between them is smaller than the sum of the diameters of the two pipes.

[0018] Furthermore, the spatial angle between the heat source pipe and the cooling pipe is an angle α of any degree, the spatial angle between the heat dissipation pipe and the cooling pipe is an angle β of any degree, and the spatial angle between the heat source pipe and the heat dissipation pipe is an angle θ of any degree.

[0019] Further, or the angle α is 30°, the angle β is 30°, and the angle θ is 0°;

[0020] Or the angle α is 45°, the angle β is 45°, and the angle θ is 0°;

[0021] Or the angle α is 45°, the angle β is 45°, and the angle θ is 90°;

[0022] Or the angle α is 60°, the angle β is 60°, and the angle θ is 0°;

[0023] Alternatively, the angle α is 90°, the angle β is 90°, and the angle θ is 180°.

[0024] Furthermore, the lower side of the main body protrudes to form the patch portion, and a heat-conducting medium volume chamber array is arranged in the patch portion.

[0025] The heat conducting medium is installed in the heat conducting medium volume chamber, which can enhance the heat conducting capacity of the patch part, thereby reducing the heat of the integrated circuit more quickly and realizing rapid cooling of the integrated circuit.

[0026] In addition to the above structure, the patch portion can also be formed by a depression on the lower side of the main body, or the lower side of the main body is the patch portion.

[0027] Furthermore, the heat source pipe is connected to the heat-conducting medium volume chamber through a volume chamber connecting pipe.

[0028] The volume chamber connecting pipes are connected to the heat conducting medium volume chambers in a one-to-one correspondence.

[0029] The above structure can realize the connection between the heat source tube and the heat-conducting medium volume chamber through the heat-conducting working medium, thereby accelerating the heat conduction speed and providing a strong guarantee for the rapid cooling of the integrated circuit.

[0030] Furthermore, the heat-conducting channel and the heat-conducting medium volume chamber are sealed and filled with heat-conducting working medium;

[0031] A cooling medium is arranged in the cooling channel, and the cooling medium circulates in the cooling channel and the outside through the first cooling connecting pipe and the second cooling connecting pipe.

[0032] The heat-conducting working medium can increase the heat conduction speed of the patch part and the main body, thereby realizing rapid cooling of the integrated circuit. The cooling medium can absorb more heat, thereby accelerating the heat dissipation speed of the main body and the heat-conducting channel, increasing the heat dissipation speed of the integrated circuit and enhancing the heat dissipation effect of the integrated circuit.

[0033] Furthermore, the main body and the patch portion have consistent metal thermal conductivity properties.

[0034] The consistent thermal conductivity of metals can not only improve the thermal conductivity speed, but also facilitate the production of internally driven heat exchange radiators.

[0035] Beneficial effects: The heat on the integrated circuit is quickly dispersed to the heat dissipation end through the heat conduction channel at the heat source end, thereby quickly reducing the temperature of the patch part and the integrated circuit, and the heat conduction channel and the heat conduction working medium are filled in the heat conduction channel and the heat conduction working medium volume chamber, which enhances the thermal conductivity of the heat conduction channel and the heat conduction working medium volume chamber, and accelerates the cooling speed of the patch part and the integrated circuit.

[0036] At the same time, the cooling medium circulates rapidly through the cooling channel and the external cold source, quickly taking away the heat from the body and the heat conduction channel, ensuring sustainable heat dissipation of the radiator. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1 It is a three-dimensional diagram of the utility model;

[0038] Figure 2This is a front view of the utility model;

[0039] Figure 3 for Figure 2 Sectional view at AA;

[0040] Figure 4 for Figure 2 Cross-section at the middle BB;

[0041] Figure 5 for Figure 2 Cross-section at mid-CC;

[0042] Figure 6 for Figure 2 Sectional view at DD;

[0043] Figure 7 for Figure 2 Cross-section at FF;

[0044] Figure 8 It is a bottom view of the utility model. DETAILED DESCRIPTION

[0045] The specific implementation manner and working principle of the utility model are further described in detail below with reference to the accompanying drawings.

[0046] like Figure 1-Figure 8 As shown, the internal drive heat exchange radiator comprises a body 1 and a patch portion 2 located on one side of the body 1, wherein a heat conduction channel 3 and a cooling channel 4 which are not connected to each other are arranged inside the body 1, a heat conduction working medium is sealed and filled in the heat conduction channel 3, and a cooling medium is arranged in the cooling channel 4;

[0047] The heat source end of the heat conduction channel 3 is a group of heat source tubes 32 arranged in parallel and interconnected, and the heat dissipation end of the heat conduction channel 3 is a group of heat dissipation tubes 31 arranged in parallel and interconnected, and the heat source tubes 32 and the heat dissipation tubes 31 are connected through a heat conduction connecting tube 33;

[0048] The heat source tube 32 is close to the patch part 2, and the heat dissipation tube 31 is far away from the patch part 2;

[0049] The cooling channel 4 is a group of cooling pipes 41 arranged in parallel and interconnected, the front end of the cooling pipe 41 is connected to the outside through a first cooling connecting pipe 42, and the rear end of the cooling pipe 41 is connected to the outside through a second cooling connecting pipe 43;

[0050] The cooling medium circulates between the cooling pipe 41 and the outside through the first cooling connecting pipe 42 and the second cooling connecting pipe 43 .

[0051] like Figure 3As shown, the cooling tube 41 is located between the heat source tube 32 and the heat dissipation tube 31, and the three are parallel to each other;

[0052] The heat source tube 32 is close to the cooling tube 41, and the distance between them is smaller than the sum of the tube diameters of the two tubes; the heat dissipation tube 31 is close to the cooling tube 41, and the distance between them is smaller than the sum of the tube diameters of the two tubes.

[0053] The spatial angle between the heat source tube 32 and the cooling tube 41 is α, which is an arbitrary angle; the spatial angle between the heat dissipation tube 31 and the cooling tube 41 is β, which is an arbitrary angle; the spatial angle between the heat source tube 32 and the heat dissipation tube 31 is θ, which is an arbitrary angle;

[0054] The combination of α, β and θ can be α=30°, β=30°, θ=0°; α=45°, β=45°, θ=0°; α=45°, β=45°, θ=90°; α=60°, β=60°, θ=0°; α=90°, β=90°, θ=0°.

[0055] like Figure 2 , Figure 3 , Figure 7 As shown, the lower side of the body 1 protrudes to form the patch portion 2, and the patch portion 2 is provided with an array of heat-conducting medium volume chambers 21, and the array of heat-conducting medium volume chambers 21 is sealed and filled with heat-conducting working medium;

[0056] The heat-conducting medium volume chamber 21 is connected to the heat source pipe 32 via a volume chamber connecting pipe 22 , and the volume chamber connecting pipe 22 corresponds to the heat-conducting medium volume chamber 21 one by one.

Claims

1. An internal drive heat exchange radiator, comprising a body (1), and a patch portion (2) located on one side of the body (1), characterized in that: The body (1) is provided with a heat conduction channel (3) and a cooling channel (4) which are not connected to each other; The heat source end of the heat conducting channel (3) is close to the patch portion (2), and the heat dissipation end of the heat conducting channel (3) is far away from the patch portion (2); The front end of the cooling channel (4) is communicated with the outside world via a first cooling connecting pipe (42), and the rear end of the cooling channel (4) is communicated with the outside world via a second cooling connecting pipe (43).

2. The internal drive heat exchange radiator according to claim 1, characterized in that: The heat source end of the heat conducting channel (3) is a group of heat source tubes (32) arranged in parallel and interconnected, the heat dissipation end of the heat conducting channel (3) is a group of heat dissipation tubes (31) arranged in parallel and interconnected, and the heat source tubes (32) and the heat dissipation tubes (31) are connected via a heat conducting connecting tube (33); The cooling channel (4) is a group of cooling pipes (41) arranged in parallel and interconnected.

3. The internal drive heat exchange radiator according to claim 2, characterized in that: The cooling pipe (41) is located between the heat source pipe (32) and the heat dissipation pipe (31), and the three are parallel to each other.

4. The internal drive heat exchange radiator according to claim 3, characterized in that: The heat source pipe (32) is close to the cooling pipe (41), and the distance between them is smaller than the sum of the diameters of the two pipes; The heat dissipation pipe (31) is close to the cooling pipe (41), and the distance between them is smaller than the sum of the diameters of the two pipes.

5. The internal drive heat exchange radiator according to claim 3, characterized in that: The spatial angle between the heat source tube (32) and the cooling tube (41) is an angle α of any degree, the spatial angle between the heat dissipation tube (31) and the cooling tube (41) is an angle β of any degree, and the spatial angle between the heat source tube (32) and the heat dissipation tube (31) is an angle θ of any degree.

6. The internal drive heat exchange radiator according to claim 5, characterized in that: Or the angle α is 30°, the angle β is 30°, and the angle θ is 0°; Or the angle α is 45°, the angle β is 45°, and the angle θ is 0°; Or the angle α is 45°, the angle β is 45°, and the angle θ is 90°; Or the angle α is 60°, the angle β is 60°, and the angle θ is 0°; Alternatively, the angle α is 90°, the angle β is 90°, and the angle θ is 180°.

7. The internal drive heat exchange radiator according to claim 2, characterized in that: The lower side of the body (1) protrudes to form the patch portion (2), and an array of heat-conducting medium volume chambers (21) is arranged in the patch portion (2).

8. The internal drive heat exchange radiator according to claim 7, characterized in that: The heat source pipe (32) is connected to the heat-conducting medium volume chamber (21) via a volume chamber connecting pipe (22).

9. The internal drive heat exchange radiator according to claim 1 or 7, characterized in that: The heat-conducting channel (3) and the heat-conducting medium volume chamber (21) are sealed and filled with a heat-conducting working medium; A cooling medium is arranged in the cooling channel (4), and the cooling medium circulates in the cooling channel (4) and the outside through the first cooling connecting pipe (42) and the second cooling connecting pipe (43).

10. The internal drive heat exchange radiator according to claim 1, characterized in that: The main body (1) and the patch part (2) have the same metal thermal conductivity properties.

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