Wafer cutting and clamping device
By using a combination design of suction cup and support ring in the wafer cutting and clamping device, the problem of friction between the wafer and the workbench due to the clamp push during the cutting process is solved, achieving higher safety and accuracy.
Patent Information
- Application Number
- CN202421593390.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-08
- Publication Date
- 2025-05-20
- Estimated Expiration
- 2034-07-08
AI Technical Summary
During wafer cutting, the first contact clamp will push the wafer to move, causing friction with the workbench and may cause scratches.
A wafer cutting and clamping device is designed to limit the wafer using a suction cup and provide support through a support ring to avoid direct friction between the wafer and the workbench.
It effectively avoids friction between the wafer and the workbench during clamping, reduces the risk of scratches, and improves cutting accuracy and safety through buffering mechanisms and limiting mechanisms.
Smart Images
Figure CN222886140U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of cutting and clamping, and particularly relates to a wafer cutting and clamping device. Background Art
[0002] A wafer, also known as a silicon wafer, is a basic material in the semiconductor manufacturing process. It is a circular silicon substrate, usually with a diameter of 100 mm, 150 mm, 200 mm or 300 mm.
[0003] In the semiconductor manufacturing process, in order to separate the integrated circuits (ICs) or discrete devices on a single wafer to form independent chips, the wafer needs to be cut. In the prior art, when cutting a wafer, the wafer is usually placed on a workbench and fixed by a fixture, and then the cutting is completed by a cutting device. However, during the clamping process, when one side of the fixture first contacts the wafer and the other side has not yet contacted, the first contacting fixture will push the wafer to move. At this time, the wafer will rub against the workbench. Once there are foreign particles on the workbench, it is very likely to cause scratches on the wafer. In view of this, we propose a wafer cutting and clamping device. Summary of the Utility Model
[0004] The purpose of the utility model is to solve at least one of the technical problems existing in the prior art, and provide a wafer cutting and clamping device, which can solve the problem that the first contacting fixture will push the wafer to move, and at this time the wafer will rub against the workbench.
[0005] To achieve the above purpose, the utility model provides the following technical solutions: A wafer cutting and clamping device includes a workbench, a cutting assembly is arranged on the upper surface of the workbench, a groove is opened on the upper surface of the workbench, a support column is arranged inside the groove, a suction cup is arranged on the upper surface of the support column, a connecting rod is fixedly connected to the outer surface of the support column, the other end of the connecting rod is fixedly connected to a bottom plate, a support ring is arranged above the bottom plate, three limiting rings are sleeved on the outer surface of the support column, first sliding grooves are opened on the front and rear inner walls of the groove, second sliding grooves are opened on the left and right inner walls of the groove, the first sliding grooves and the second sliding grooves are arranged in a vertically staggered manner, and a moving assembly is arranged inside the first sliding grooves.
[0006] Preferably, the moving assembly includes a limiting rod, the limiting rod is fixedly connected to the inner wall of the first sliding groove, the limiting rod is also fixedly connected to the inner wall of the second sliding groove, a first limiting frame is slidably connected inside the two first sliding grooves, and a second limiting frame is slidably connected inside the two second sliding grooves.
[0007] Preferably, the inner walls of the first limiting frame and the second limiting frame are both movably connected to the outer surface of the support column. The upper and lower side surfaces of the first limiting frame and the second limiting frame are both in contact with the limiting ring. The first limiting frame and the second limiting frame are respectively slidably sleeved on the outer surface of the limiting rod.
[0008] Preferably, a vacuum pump is fixedly connected to the bottom wall of the groove. The output end of the vacuum pump is fixedly connected to a transmission pipe. The transmission pipe penetrates through the upper surface of the support column and is connected to the suction cup.
[0009] Preferably, a first telescopic rod is fixedly connected to the upper surface of the bottom plate. A second telescopic rod is slidably sleeved inside the first telescopic rod. A spring is fixedly connected between the second telescopic rod and the first telescopic rod.
[0010] Preferably, the upper end of the second telescopic rod is fixedly connected to the lower surface of the support ring. A second limiting rod is fixedly connected to the lower surface of the support ring. The lower end of the second limiting rod slidably penetrates through the lower surface of the bottom plate.
[0011] Preferably, two limiting grooves are formed in the upper surface of the workbench. Displacement blocks are slidably connected inside the two limiting grooves. Clamping rings are respectively fixedly connected to the adjacent side surfaces of the two displacement blocks. Threaded rods are rotatably connected to the inner walls of the two limiting grooves.
[0012] Preferably, the opposite ends of the two threaded rods respectively rotatably penetrate through the left and right side surfaces of the workbench. Motors are respectively fixedly connected to the left and right side surfaces of the workbench. The output ends of the two motors are respectively fixedly connected to the two threaded rods.
[0013] Compared with the prior art, the beneficial effects of the present utility model are:
[0014] (1). When cutting the wafer, place the wafer on the upper surface of the suction cup, and limit the wafer through the suction cup. At the same time, use the support ring to provide support for the wafer. Subsequently, when the wafer is clamped and moves, the force on the wafer will be transmitted to the support column through the suction cup, thereby causing the support column to move synchronously. When the support column moves, it is supported by the moving component in cooperation with the limiting ring. Through the above structure, the support component of the wafer can move freely in the front, back, left, and right directions, so that when clamping, it can avoid the problem that the wafer moves and rubs against the upper surface of the workbench, thereby causing damage to the wafer.
[0015] (2) When the wafer cutting and clamping device is cutting, when the wafer is subjected to a downward pressure, it can be buffered by the second telescopic rod, the first telescopic rod and the spring, so as to avoid damage caused by excessive downward pressure. At the same time, with the help of the second limiting rod, the problem that the wafer drops unilaterally and then leads to a decrease in cutting accuracy is avoided. At the same time, when clamping, the motor drives the threaded rod to rotate. Since the movement track of the displacement block is restricted by the limiting groove, when the threaded rod rotates, it will drive the displacement block to move synchronously. After the displacement block moves, it drives the clamping ring to move synchronously, and then clamps and fixes the wafer with the clamping ring. Through the above structure, it can buffer the wafer during cutting, avoid damage caused by excessive pressure, and ensure the safety during the wafer cutting process. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] The following further describes the present invention in conjunction with the drawings and embodiments:
[0017] Figure 1 is a schematic structural diagram of a wafer cutting and clamping device of the present invention;
[0018] Figure 2 is a schematic diagram of the first limiting frame of the present invention;
[0019] Figure 3 is a schematic diagram of the groove of the present invention;
[0020] Figure 4 is a schematic diagram of the threaded rod of the present invention;
[0021] Figure 5 is a schematic cross-sectional view of the first telescopic rod of the present invention.
[0022] Reference numerals: 1, workbench; 2, groove; 3, support column; 4, suction cup; 5, connecting rod; 6, bottom plate; 7, support ring; 8, limiting ring; 9, first sliding groove; 10, second sliding groove; 11, limiting rod; 12, first limiting frame; 13, second limiting frame; 14, vacuum pump; 15, transmission pipe; 16, first telescopic rod; 17, second telescopic rod; 18, spring; 19, second limiting rod; 20, limiting groove; 21, displacement block; 22, clamping ring; 23, threaded rod; 24, motor. DETAILED DESCRIPTION OF THE EMBODIMENTS
[0023] This part will describe in detail the specific embodiments of the present invention. The preferred embodiments of the present invention are shown in the drawings. The function of the drawings is to supplement the description of the text part of the specification, enabling people to intuitively and vividly understand each technical feature and the overall technical solution of the present invention, but it cannot be understood as a limitation on the protection scope of the present invention.
[0024] Please refer to Figures 1-5, the present utility model provides a technical solution: a wafer cutting and clamping device, including a workbench 1. A cutting assembly is provided on the upper surface of the workbench 1. A groove 2 is opened on the upper surface of the workbench 1. A support column 3 is arranged inside the groove 2. A suction cup 4 is arranged on the upper surface of the support column 3. A connecting rod 5 is fixedly connected to the outer surface of the support column 3. The other end of the connecting rod 5 is fixedly connected to a bottom plate 6. A support ring 7 is arranged above the bottom plate 6. Three limiting rings 8 are sleeved on the outer surface of the support column 3. First sliding grooves 9 are opened on the front and rear inner walls of the groove 2. Second sliding grooves 10 are opened on the left and right inner walls of the groove 2. The first sliding grooves 9 and the second sliding grooves 10 are arranged in a vertically staggered manner. A moving assembly is arranged inside the first sliding grooves 9. When cutting the wafer, place the wafer on the upper surface of the suction cup 4, and limit the wafer through the suction cup 4. At the same time, use the support ring 7 to provide support for the wafer. Subsequently, when the wafer is clamped and moves, the wafer will transmit the force to the support column 3 through the suction cup 4, thereby causing the support column 3 to move synchronously. When the support column 3 moves, it is supported by the moving assembly in cooperation with the limiting rings 8. Through the above structure, the support components of the wafer can move freely back and forth, left and right, so that when clamping, the problem of damage to the wafer caused by friction between the wafer and the upper surface of the workbench 1 due to the movement of the wafer can be avoided.
[0025] Further, the moving component includes a limiting rod 11. The limiting rod 11 is fixedly connected to the inner wall of the first sliding groove 9. The inner wall of the second sliding groove 10 is also fixedly connected with the limiting rod 11. A first limiting frame 12 is slidably connected inside the two first sliding grooves 9. A second limiting frame 13 is slidably connected inside the two second sliding grooves 10. The inner walls of the first limiting frame 12 and the second limiting frame 13 are both movably connected to the outer surface of the support column 3. The upper and lower surfaces of the first limiting frame 12 and the second limiting frame 13 are both in contact with the limiting ring 8. The first limiting frame 12 and the second limiting frame 13 are respectively slidably sleeved on the outer surface of the limiting rod 11. The bottom wall of the groove 2 is fixedly connected with a vacuum pump 14. The output end of the vacuum pump 14 is fixedly connected with a transmission pipe 15. The transmission pipe 15 penetrates through the upper surface of the support column 3 and is connected to the suction cup 4. The upper surface of the bottom plate 6 is fixedly connected with a first telescopic rod 16. A second telescopic rod 17 is slidably sleeved inside the first telescopic rod 16. A spring 18 is fixedly connected between the second telescopic rod 17 and the first telescopic rod 16. The upper end of the second telescopic rod 17 is fixedly connected with the lower surface of the support ring 7. The lower surface of the support ring 7 is fixedly connected with a second limiting rod 19. The lower end of the second limiting rod 19 slidably penetrates through the lower surface of the bottom plate 6. Two limiting grooves 20 are opened on the upper surface of the workbench 1. Two displacement blocks 21 are slidably connected inside the two limiting grooves 20. The adjacent side surfaces of the two displacement blocks 21 are respectively fixedly connected with clamping rings 22. The inner walls of the two limiting grooves 20 are both rotatably connected with threaded rods 23. The opposite ends of the two threaded rods 23 respectively rotatably penetrate through the left and right side surfaces of the workbench 1. The left and right side surfaces of the workbench 1 are respectively fixedly connected with motors 24. The output ends of the two motors 24 are respectively fixedly connected with the two threaded rods 23. When the support column 3 moves, it will synchronously drive the first limiting frame 12 and the second limiting frame 13 to move. When the first limiting frame 12 and the second limiting frame 13 move, the limiting rod 11 is used to limit their movement trajectories. At the same time, the support column 3 is supported by the cooperation of the limiting ring 8. When using the suction cup 4 for limitation, the wafer is adsorbed by the cooperation of the vacuum pump 14, the transmission pipe 15 and the suction cup 4. At the same time, during cutting, when the wafer is subjected to a downward pressure, it can be buffered by the second telescopic rod 17, the first telescopic rod 16 and the spring 18, so as to avoid damage caused by excessive downward pressure. At the same time, the second limiting rod 19 is used to prevent the wafer from descending unilaterally, thereby avoiding the problem of reduced cutting accuracy. At the same time, during clamping, the motor 24 is used to drive the threaded rod 23 to rotate. Since the movement trajectory of the displacement block 21 is restricted by the limiting groove 20, when the threaded rod 23 rotates, it will synchronously drive the displacement block 21 to move. After the displacement block 21 moves, it will synchronously drive the clamping ring 22 to move, and then the wafer is clamped and fixed by the clamping ring 22. Through the above structure, it is possible to buffer the wafer to a certain extent during cutting, avoid damage caused by excessive pressure, and ensure the safety of the wafer during the cutting process.
[0026] Working principle: When cutting a wafer, the wafer is placed on the upper surface of the chuck 4, and the chuck 4 is used to limit the position of the wafer. At the same time, the support ring 7 provides support for the wafer. Subsequently, when the wafer is clamped and causes it to move, the wafer will transfer the force to the support column 3 through the chuck 4, thereby causing the support column 3 to move synchronously. When the support column 3 moves, it is supported by the moving component in cooperation with the limit ring 8. When the support column 3 moves, it will synchronously drive the first limit frame 12 and the second limit frame 13 to move. When the first limit frame 12 and the second limit frame 13 move, the limit rod 11 is used to limit their movement trajectories, and at the same time, the limit ring 8 is used to support the support column 3. When using the chuck 4 for limitation, the wafer is adsorbed by the vacuum pump 14 in cooperation with the transmission pipe 15 and the chuck 4. At the same time, during cutting, when the wafer is subjected to a downward pressure, it can be buffered by the second telescopic rod 17, the first telescopic rod 16 and the spring 18, so as to avoid damage caused by excessive downward pressure. At the same time, the second limit rod 19 is used to prevent the wafer from descending unilaterally, thereby avoiding the problem of reduced cutting accuracy. At the same time, during clamping, the motor 24 is used to drive the threaded rod 23 to rotate. Since the movement trajectory of the displacement block 21 is restricted by the limit groove 20, when the threaded rod 23 rotates, it will synchronously drive the displacement block 21 to move. After the displacement block 21 moves, it will synchronously drive the clamping ring 22 to move, and then the wafer is clamped and fixed by the clamping ring 22.
[0027] The embodiments of the present invention have been described in detail above in conjunction with the accompanying drawings. However, the present invention is not limited to the above embodiments. Within the scope of knowledge possessed by those of ordinary skill in the art in the technical field, various changes can be made without departing from the purpose of the present invention.
Claims
1. A wafer cutting and clamping device, comprising a workbench (1), characterized in that: The upper surface of the workbench (1) is provided with a cutting assembly, the upper surface of the workbench (1) is provided with a groove (2), a support column (3) is provided inside the groove (2), a suction cup (4) is provided on the upper surface of the support column (3), a connecting rod (5) is fixedly connected to the outer surface of the support column (3), the other end of the connecting rod (5) is fixedly connected to a bottom plate (6), a support ring (7) is provided above the bottom plate (6), and three limiting rings (8) are sleeved on the outer surface of the support column (3), the front and rear inner walls of the groove (2) are provided with a first sliding groove (9), the left and right inner walls of the groove (2) are provided with a second sliding groove (10), the first sliding groove (9) and the second sliding groove (10) are staggered up and down, and a moving assembly is provided inside the first sliding groove (9).
2. A wafer cutting and clamping device according to claim 1, characterized in that: The moving assembly comprises a limiting rod (11), wherein the limiting rod (11) is fixedly connected to the inner wall of the first sliding groove (9), and the inner wall of the second sliding groove (10) is also fixedly connected to the limiting rod (11), the two first sliding grooves (9) are internally slidably connected to a first limiting frame (12), and the two second sliding grooves (10) are internally slidably connected to a second limiting frame (13).
3. A wafer cutting and clamping device according to claim 2, characterized in that: The inner walls of the first limit frame (12) and the second limit frame (13) are movably connected to the outer surface of the support column (3); the upper and lower side surfaces of the first limit frame (12) and the second limit frame (13) are in contact with the limit ring (8); and the first limit frame (12) and the second limit frame (13) are respectively slidably mounted on the outer surface of the limit rod (11).
4. The wafer cutting and clamping device according to claim 1, characterized in that: The bottom wall of the groove (2) is fixedly connected to a vacuum pump (14), the output end of the vacuum pump (14) is fixedly connected to a transmission pipe (15), and the transmission pipe (15) passes through the upper surface of the support column (3) and is connected to the suction cup (4).
5. The wafer cutting and clamping device according to claim 1, characterized in that: A first telescopic rod (16) is fixedly connected to the upper surface of the bottom plate (6); a second telescopic rod (17) is slidably sleeved inside the first telescopic rod (16); and a spring (18) is fixedly connected between the second telescopic rod (17) and the first telescopic rod (16).
6. The wafer cutting and clamping device according to claim 5, characterized in that: The upper end of the second telescopic rod (17) is fixedly connected to the lower surface of the support ring (7), the lower surface of the support ring (7) is fixedly connected to a second limiting rod (19), and the lower end of the second limiting rod (19) slides through the lower surface of the bottom plate (6).
7. The wafer cutting and clamping device according to claim 1, characterized in that: The upper surface of the workbench (1) is provided with two limit grooves (20), the interiors of the two limit grooves (20) are slidably connected with displacement blocks (21), the adjacent side surfaces of the two displacement blocks (21) are respectively fixedly connected with clamping rings (22), and the inner walls of the two limit grooves (20) are rotatably connected with threaded rods (23).
8. The wafer cutting and clamping device according to claim 7, characterized in that: The opposite ends of the two threaded rods (23) are rotated to penetrate the left and right side surfaces of the workbench (1), and the left and right side surfaces of the workbench (1) are respectively fixedly connected with motors (24), and the output ends of the two motors (24) are respectively fixedly connected to the two threaded rods (23).