Boost capacitor module assembly and integrated device
By designing a boost capacitor module component that integrates boost capacitor, power module and heat dissipation functions, the problem of poor space occupation and heat dissipation due to independent settings of existing Boost capacitors is solved, achieving more efficient heat dissipation and lower cost.
Patent Information
- Application Number
- CN202422018904.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-20
- Publication Date
- 2025-05-23
- Estimated Expiration
- 2034-08-20
AI Technical Summary
The existing Boost capacitors are independently set, occupying a large space and poor heat dissipation effect, which affects the cost, structure and power of the motor controller.
A boost capacitor module assembly is designed, including a first capacitor and a second capacitor in the housing, a capacitance copper bar, a power module, a module copper bar, a heat dissipation part and a support frame, and the heat dissipation part is integrated to improve the heat dissipation effect, and to reduce space occupation by optimizing the layout of the capacitor and power module.
It realizes the integration of boost capacitors, power modules and heat dissipation functions in a smaller volume, improves the capacity ratio and heat dissipation effect of the capacitor, reduces costs, and solves the problem of poor space occupation and heat dissipation effect caused by independent settings of existing Boost capacitors.
Smart Images
Figure CN222896606U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of motor controller structures, in particular to a boost capacitor module component and an integrated device. Background Art
[0002] With the rapid development of new energy vehicles, higher power requirements are placed on the core component motor controller. In order to meet the needs of motor controller integration and miniaturization, arranging Boost circuits inside the motor controller structure to increase power is the current main development trend.
[0003] The Boost capacitor component is the core component of the Boost module inside the controller. Its integration method determines the cost, structure, heat dissipation efficiency, etc. of the Boost module. However, the existing Boost capacitor is an independent installation part with a high packaging cost and requires an independent heat dissipation design. The heat dissipation effect is poor and it occupies a large space, thus affecting the cost, structure, power, etc. of the motor controller. Utility Model Content
[0004] In order to overcome the above technical defects, the purpose of the utility model is to provide a boost capacitor module assembly and an integrated device to solve the problem that the existing Boost capacitors are independently set, occupy a large space and have poor heat dissipation effect.
[0005] The utility model discloses a boost capacitor module assembly, comprising:
[0006] A boost capacitor module comprises a housing and a first capacitor and a second capacitor arranged in the housing, wherein the housing is further provided with a plurality of capacitor copper bars extending from the first capacitor and the second capacitor;
[0007] A power module, arranged on one side of the boost capacitor module, having a plurality of extended module copper bars;
[0008] A heat dissipation unit, arranged between the boost capacitor module and the power module;
[0009] A support frame is connected to the side of the housing so that the capacitor copper busbar and the module copper busbar are respectively extended to the support frame for fixing;
[0010] The width of the first capacitor is greater than the width of the second capacitor, so that the power module is arranged in the width direction of the second capacitor and is arranged in parallel with the first capacitor in the length direction.
[0011] Preferably, the boost capacitor module is provided with a plurality of extending connection parts.
[0012] Preferably, the heat dissipation portion covers the power module and extends out of two ends of the power module in the length direction to be fixed to the boost capacitor module.
[0013] Preferably, the heat dissipation portion comprises a water-cooling plate; a liquid inlet and a liquid outlet are respectively provided at two ends of the water-cooling plate extending out of the power module on a side away from the boost capacitor module.
[0014] Preferably, a water storage portion having an opening is provided on the water cooling plate, and the opening is closed by the outer wall of the shell;
[0015] A sealing ring surrounding the opening is provided between the water cooling plate and the shell.
[0016] Preferably, the boost capacitor module is further provided with at least one filter capacitor in the housing.
[0017] The utility model also provides an integrated device, comprising a housing, and:
[0018] The boost capacitor module assembly as described in any one of the above items;
[0019] A DC input copper busbar, connected to the boost capacitor module assembly;
[0020] A boost inductor module has one end connected to the first capacitor and the other end connected to the power module.
[0021] Preferably, the boost capacitor module assembly is also electrically connected to a DC input filter assembly.
[0022] Preferably, the DC input filter component and the boost inductor module are arranged in parallel and perpendicular to the region where the first capacitor of the boost capacitor module component is located.
[0023] Preferably, a current sensor is also included, which is electrically connected to the boost capacitor module assembly.
[0024] Compared with the prior art, the above technical solution has the following beneficial effects:
[0025] The boost capacitor module assembly and integrated device provided by the utility model integrate a boost capacitor, a power module and a heat dissipation function, realize an integrated device with a boost circuit function in a smaller volume, improve the volume ratio of the capacitor, and at the same time improve the heat dissipation effect, reduce costs, and solve the problem that the existing Boost capacitor is independently set, occupies a large space and has a poor heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS
[0026] Figure 1 This is a structural schematic diagram of a boost capacitor module assembly and integrated device embodiment 1 of the utility model;
[0027] Figure 2 This is a schematic diagram of the structure of the first capacitor and the second capacitor in Embodiment 1 of a boost capacitor module assembly and an integrated device of the utility model;
[0028] Figure 3 This is a structural schematic diagram of a second embodiment of a boost capacitor module assembly and integrated device described in the utility model.
[0029] Reference numerals:
[0030] 1-boost capacitor module assembly; 11-boost capacitor module; 111-shell; 112-first capacitor; 113-second capacitor; 114-capacitor copper busbar; 12-power module; 121-module copper busbar; 13-heat dissipation part; 131-water storage part; 132-sealing ring; 14-support frame; 15-connecting part; 16-filter capacitor; 2-integrated device; 21-shell; 22-DC input copper busbar; 23-boost inductor module; 24-DC input filter assembly; 25-current sensor. DETAILED DESCRIPTION
[0031] The advantages of the present invention are further described below in conjunction with the accompanying drawings and specific embodiments.
[0032] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present disclosure. Instead, they are merely examples of devices and methods consistent with some aspects of the present disclosure as detailed in the appended claims.
[0033] The terms used in this disclosure are for the purpose of describing specific embodiments only and are not intended to limit the disclosure. The singular forms of "a", "said" and "the" used in this disclosure and the appended claims are also intended to include plural forms unless the context clearly indicates otherwise. It should also be understood that the term "and / or" used herein refers to and includes any or all possible combinations of one or more associated listed items.
[0034] It should be understood that although the terms first, second, third, etc. may be used in the present disclosure to describe various information, these information should not be limited to these terms. These terms are only used to distinguish the same type of information from each other. For example, without departing from the scope of the present disclosure, the first capacitor may also be referred to as the second capacitor, and similarly, the second capacitor may also be referred to as the first capacitor. Depending on the context, the word "if" as used herein may be interpreted as "at the time of" or "when" or "in response to determining".
[0035] In the description of the present invention, it should be understood that the terms "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.
[0036] In the description of the present utility model, unless otherwise specified and limited, it should be noted that the terms "installation", "connection" and "connection" should be understood in a broad sense. For example, it can be a mechanical connection or an electrical connection, or it can be the internal connection of two components. It can be a direct connection or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to the specific circumstances.
[0037] In the following description, the suffixes such as "module", "component" or "unit" used to represent elements are only used to facilitate the description of the present invention, and they themselves have no specific meaning. Therefore, "module" and "component" can be used interchangeably.
[0038] Embodiment 1: The utility model discloses a boost capacitor module assembly 1. The boost capacitor module assembly 1 provided by the present embodiment integrates a Boost capacitor, a power module 12, a copper bus and a heat dissipation part 13, improves the volume ratio of the capacitor, improves the heat dissipation effect, reduces the cost and maintains better working efficiency. For details, refer to Figure 1 and Figure 2 ,include:
[0039] A boost capacitor module 11 includes a housing 111 and a first capacitor 112 and a second capacitor 113 disposed in the housing 111. The housing 111 is further provided with a plurality of capacitor copper bars 114 extending from the first capacitor 112 and the second capacitor 113.
[0040] The power module 12 (IGBT) is arranged on one side of the boost capacitor module 11 and has a plurality of extended module copper bars 121;
[0041] The heat dissipation unit 13 is arranged between the boost capacitor module 11 and the power module 12 to dissipate heat for both modules at the same time; specifically, the heat dissipation unit 13 can be set to any structure, including but not limited to a water cooling plate, a radiator group or other existing integrated components that realize heat dissipation function;
[0042] The support frame 14 is connected to the side of the shell 111 and can also extend to the side of the power module 12, so that the capacitor copper bus 114 and the module copper bus 121 are respectively extended to the support frame 14 for fixation; specifically, the support frame 14 can be vertically arranged on the side of the shell 111, so that each capacitor copper bus 114 and the module copper bus 121 are bent to the surface of the support frame 14 for fixation, which is convenient for connection.
[0043] In this embodiment, two capacitors (a first capacitor 112 and a second capacitor 113) are provided to provide a greater energy storage capacity, thereby smoothing the output voltage and reducing voltage fluctuations during the inductor charging and discharging process. Specifically, a plurality of capacitor copper bars 114 are provided, which may include capacitor copper bars (including T+ input and T- output) respectively connected to the first capacitor 112 and the second capacitor 113 to connect the module copper bar 121 (T+ input, T- output) or other modules / devices.
[0044] In this embodiment, the width of the first capacitor 112 is greater than the width of the second capacitor 113, so that the power module 12 is arranged in the width direction of the second capacitor 113 and is parallel to the first capacitor 112 in the length direction. Specifically, the width of the first capacitor 112 is set to exceed the sum of the width of the second capacitor 113 and the width of the power module 12, so that the whole forms a roughly rectangular parallelepiped structure. This arrangement can reduce the connection path between the copper bars on the one hand, and reduce the space occupied by the overall structure on the other hand. At the same time, the heat dissipation part 13 is integrated, so that the boost capacitor module 11 and the power module 12 can dissipate heat at the same time, thereby improving the heat dissipation efficiency. The specific size and arrangement can be adaptively adjusted according to the actual application scenario.
[0045] In a preferred embodiment, the boost capacitor module 11 is provided with a plurality of extended connection parts 15, which can be used to connect other modules or devices outside the boost capacitor module 11. For example, the connection parts 15 can be set to a plate shape with bolt holes, etc., and the specific distribution and orientation can be set according to the actual scenario.
[0046] In a preferred embodiment, the heat dissipation portion 13 completely covers the power module 12, and extends out of both ends of the power module 12 in the length direction to be fixed to the boost capacitor module 11. The heat dissipation portion 13 completely covers the surface of the power module 12, thereby improving the heat dissipation effect on the power module 12, realizing the integration of the heat dissipation portion 13, the boost capacitor module 11 and the power module 12, and effectively improving the space utilization while maintaining the heat dissipation effect.
[0047] In a preferred embodiment, specifically, the heat dissipation portion 13 is configured as a water-cooled plate; the water-cooled plate is provided with a liquid inlet and a liquid outlet (not shown in the figure) at both ends extending from the power module 12 on the side away from the boost capacitor module 11, that is, the liquid inlet and the liquid outlet are both arranged on the water-cooled plate toward the outside of the boost capacitor module assembly 1 to facilitate the entry and exit of the heat dissipation liquid. Optionally, an inclined surface can be provided near the liquid inlet and the liquid outlet to reduce the flow resistance of the heat dissipation liquid and further improve the heat dissipation effect.
[0048] In a preferred embodiment, a water storage portion 131 with an opening is provided on the water cooling plate, and the opening is closed by the outer wall of the shell 111, so that the shell 111 of the boost capacitor module constitutes a part of the side wall of the water cooling plate, thereby reducing the thermal resistance between the heat dissipation liquid and the first capacitor 112 / the second capacitor 113, and reducing the heat transfer loss. Furthermore, a sealing ring 132 surrounding the opening is provided between the water cooling plate and the shell 111, thereby reducing the risk of heat dissipation liquid flowing out and improving the safety of use.
[0049] In a preferred embodiment, at least one filter capacitor 16 may be arranged in the housing 111 of the boost capacitor module 11 to achieve a certain filtering effect and further reduce the internal inductance of the boost capacitor module 11 for application in corresponding implementation scenarios.
[0050] In this embodiment, the boost capacitor module assembly 1 integrates a boost capacitor (a first capacitor 112 and a second capacitor 113), a power module 12 and a heat dissipation part 13, and is also provided with a plurality of copper busbars and a connection part 15. The capacitor and the copper busbar are directly encapsulated in the shell 111, and the power module 12 is welded on the water cooling plate. The water cooling plate and the shell 111 are connected by bolts, and the electrical connection between the power module 12 and the capacitor is realized by the copper busbar. The integration of multiple functions and modules is realized in a smaller volume, the structure is simple, the cost is low, and it can be applied to a variety of motor control scenarios.
[0051] Embodiment 2: The present invention also provides an integrated device 2, see Figure 3 , including a housing 21, the specific shape and size of the housing 21 can be determined according to the actual application scenario, and arranged in the housing 21:
[0052] The boost capacitor module assembly 1 according to any one of the above-mentioned embodiments;
[0053] A DC input copper bus 22 is connected to the boost capacitor module assembly 1. The DC input copper bus 22 is a conductor used in a power system to transmit current and connect electrical equipment. The specific thickness and quantity can be set according to the actual scenario. In this embodiment, the DC input copper bus 22 is fixed on the side of the boost capacitor module assembly 1 where the second capacitor 113 is located;
[0054] The boost inductor module 23 has one end connected to the first capacitor 112 and the other end connected to the power module 12, and a boost control circuit is formed by the boost inductor module 23, the first capacitor 112, and the second capacitor 113. In an optional embodiment, the DC input filter component and the boost inductor module 23 are arranged in parallel and perpendicular to the area where the first capacitor 112 of the boost capacitor module assembly 1 is located, thereby forming an approximate T-shaped arrangement to reduce space occupancy, and can also reduce electromagnetic interference and parasitic parameters between them and other circuit elements, and can also increase the air flow path, help heat dissipation, improve mechanical stability, and reduce damage risks.
[0055] In a preferred embodiment, the boost capacitor module component 1 is also electrically connected to a DC input filter component 24, which suppresses noise and ripple in the DC power supply to ensure stable operation of the circuit. As an example, the DC input filter component 24 may include but is not limited to a capacitor filter, an inductor filter, and a multi-stage filter, etc. Specifically, the specific component arrangement can be selected according to parameters such as the ripple factor, noise level, and transient response of the DC power supply.
[0056] In a preferred embodiment, a current sensor 25 is also included, which is electrically connected to the boost capacitor module assembly 1. The current sensor 25 can be selectively arranged between the boost capacitor module and the boost inductor module 23 to achieve functions including but not limited to current detection, overcurrent protection, feedback control, etc.
[0057] In this embodiment, the boost inductor module 23 is integrated with the boost capacitor module assembly 1 described in the above-mentioned embodiment 1 to realize an integrated module for forming a boost circuit, which can be used in a motor controller, specifically, in a motor controller for new energy vehicles, effectively reducing space occupancy, reducing the use of fasteners, and reducing costs. It can also be connected or integrated with other modules or devices to be suitable for applications in different scenarios.
[0058] It should be noted that the embodiments of the present invention have better practicability and do not impose any form of limitation on the present invention. Any technician familiar with the field may use the technical content disclosed above to change or modify it into an equivalent effective embodiment. However, any modification or equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention are still within the scope of the technical solution of the present invention.
Claims
1. A boost capacitor module assembly, characterized in that: include: A boost capacitor module comprises a housing and a first capacitor and a second capacitor arranged in the housing, wherein the housing is further provided with a plurality of capacitor copper bars extending from the first capacitor and the second capacitor; A power module, arranged on one side of the boost capacitor module, having a plurality of extended module copper bars; A heat dissipation unit, arranged between the boost capacitor module and the power module; A support frame is connected to the side of the housing so that the capacitor copper busbar and the module copper busbar are respectively extended to the support frame for fixing; The width of the first capacitor is greater than the width of the second capacitor, so that the power module is arranged in the width direction of the second capacitor and is arranged in parallel with the first capacitor in the length direction.
2. The boost capacitor module assembly according to claim 1, characterized in that: The boost capacitor module is provided with a plurality of extending connection parts.
3. The boost capacitor module assembly according to claim 1, characterized in that: The heat dissipation portion covers the power module and extends out of two ends of the power module in a length direction and is fixed to the boost capacitor module.
4. The boost capacitor module assembly according to claim 3, characterized in that: The heat dissipation part includes a water cooling plate; The water cooling plate is provided with a liquid inlet and a liquid outlet at two ends extending out of the power module on a side away from the boost capacitor module.
5. The boost capacitor module assembly according to claim 4, characterized in that: The water cooling plate is provided with a water storage portion having an opening, and the opening is closed by the outer wall of the shell; A sealing ring surrounding the opening is provided between the water cooling plate and the shell.
6. The boost capacitor module assembly according to claim 1, characterized in that: The boost capacitor module is also provided with at least one filter capacitor in the housing.
7. An integrated device, characterized in that: The invention comprises a housing, and: The boost capacitor module assembly according to any one of claims 1 to 6; A DC input copper busbar, connected to the boost capacitor module assembly; A boost inductor module has one end connected to the first capacitor and the other end connected to the power module.
8. The integrated device according to claim 7, characterized in that: The boost capacitor module assembly is also electrically connected to a DC input filter assembly.
9. The integrated device according to claim 8, characterized in that: The DC input filter component and the boost inductor module are arranged in parallel and perpendicular to the region where the first capacitor of the boost capacitor module component is located.
10. The integrated device according to claim 7, characterized in that: A current sensor is also included, which is electrically connected to the boost capacitor module assembly.