Air-cooled fiber laser tube shell

Abstract

The utility model discloses an air-cooled optical fiber laser tube shell, the laser tube shell is used for packaging an optical fiber laser or other laser generating assemblies, the lower surface of a bottom plate of the laser tube shell is integrally provided with cooling fins for air cooling, and a phase change refrigerant accommodating cavity is arranged in the bottom plate.

Description

Technical Field

[0001] The utility model relates to an air-cooled optical fiber laser tube shell, in particular to a packaging tube shell of a high-power air-cooled optical fiber laser. Background Art

[0002] The heat dissipation demand of lasers is increasing. Conventional lasers mostly use semiconductor modules packaged / sealed in tube shells as pump sources, and multiple semiconductor laser chips are installed on the base of the tube shell to form a pump module. The heat generated by the semiconductor laser chip is transferred to the base of the tube shell. The tube shell of the pump module is installed on a cold plate. The base of the tube shell transfers the heat to the cold plate, and then the heat is conducted and dissipated through the cold plate. At the same time, the gain cavity fiber and the tube shell of the pump module are not an integral structure. We realize that this type of heat dissipation will form heat accumulation at the contact position of the tube shell and the cold plate due to the effect of the tube shell and the thermal conductivity gradient of heat conduction, resulting in a high temperature of the semiconductor laser chip, and excessive temperature can easily damage the semiconductor laser chip. Utility Model Content

[0003] The utility model aims to provide an air-cooled fiber laser tube shell, which can have a better heat dissipation capacity while having a good sealing package.

[0004] In order to solve the above problems, the utility model provides an air-cooled fiber laser tube shell, including a bottom plate of the laser tube shell, the bottom plate supports a laser generating component; the laser generating component includes a plurality of semiconductor laser chips and a gain cavity fiber part; the bottom plate of the laser tube shell includes a semiconductor laser chip placement area and a gain cavity fiber placement area, the gain cavity fiber part and the semiconductor laser chip are installed on the bottom plate of the laser tube shell, characterized in that: the bottom plate of the laser tube shell includes a plate-shaped body, the first surface of the body is used to receive the heat generated by the heat source and conduct it downward, the second surface of the body forms a heat dissipation fin, which can take away the heat on the heat dissipation fin on the lower surface of the body by air cooling, the body and the heat dissipation fin are integrally formed, and the body and the heat dissipation fin are made of heat conductive material; a phase change refrigerant accommodating chamber is sealed in the body, and the phase change refrigerant is sealed in the accommodating chamber.

[0005] Preferably, at least one semiconductor chip packaging top plate is disposed on the semiconductor chip placement area; the at least one semiconductor chip packaging top plate cooperates with the bottom plate to form a package for a plurality of semiconductor laser chips.

[0006] Preferably, the transverse cross section of the accommodating cavity covers more than half of the area of ​​the upper surface of the body.

[0007] Preferably, a plurality of semiconductor laser chips are divided into N semiconductor laser chip groups, each semiconductor laser chip group outputs a pump laser together, the chips in each chip group have the same wavelength, and the chips between each chip group have different wavelengths. Multiple pump lasers enter the active optical fiber after being combined through spatial photosynthesis or a beam combiner. There are N semiconductor chip packaging top plates, each of which is used to cover a corresponding semiconductor laser chip group, that is, the N semiconductor chip packaging top plates and the laser tube shell bottom plate cooperate to package the N semiconductor laser chip groups; N is an integer greater than 1.

[0008] Preferably, at least one semiconductor laser chip is mounted on the surface of the semiconductor laser chip placement area and is in thermal contact with the semiconductor laser chip, and active optical fiber and passive components are mounted on the surface of the gain cavity fiber placement area and are in thermal contact with them. At least one semiconductor laser chip outputs pump light through an output pigtail, and the pump light couples the pump light of the output pigtail into the gain cavity fiber through a coupler, and fiber laser is generated and output through the gain cavity part; the gain cavity fiber packaging top plate covers the active optical fiber and passive component parts.

[0009] Preferably, a second fin area is provided at the lower side of the gain cavity fiber placement area, and a first fin area is provided at the lower side of the semiconductor laser chip placement area. The length of the fins of the first fin area extending downward is twice or more than the length of the fins of the second fin area extending downward. The main body and the heat dissipation fins are both made of aluminum or graphene.

[0010] Preferably, the accommodating cavity is a flat, whole rectangular cavity, which is flat on the lower side of the semiconductor heat source; or, the accommodating cavity is a pipe-like structure extending in an S-shaped bend, and the pipe is evenly arranged on the lower side of the semiconductor heat source.

[0011] Preferably, a receiving cavity is provided in the semiconductor laser chip placement area, a phase-change refrigerant is sealed in the receiving cavity, and the gain cavity optical fiber placement area is the cooling end of the receiving cavity.

[0012] Preferably, the phase change refrigerant containing chamber includes a plurality of sub-chambers, each of which is interconnected. When a plurality of semiconductor laser chips are divided into N semiconductor laser chip groups, a sub-chamber is arranged directly below each semiconductor laser chip group in the semiconductor chip placement area. The phase change refrigerant in the sub-chamber directly below the semiconductor laser chip group absorbs the heat generated by the semiconductor laser chip group above it and vaporizes. A sub-chamber is arranged in the gain cavity fiber placement area. The sub-chamber of the phase change refrigerant containing chamber in the gain cavity fiber placement area receives the gaseous refrigerant flowing from the sub-chamber in the semiconductor chip placement area and liquefies the gaseous refrigerants. The liquid phase change refrigerant in the sub-chamber of the phase change refrigerant containing chamber in the gain cavity fiber placement area flows back to the sub-chamber of the phase change refrigerant containing chamber in the semiconductor placement area.

[0013] Preferably, the heat dissipation fins are formed of a plurality of parallel sheet structures extending along a first direction, a plurality of air flow channels extending along the first direction are formed between the plurality of sheet structures, and the air flow driven by the fan flows along the plurality of air flow channels extending in the first direction.

[0014] The beneficial effect of the utility model is that a new type of air-cooled fiber laser tube shell abandons the usual technical solution of setting a cold plate on the lower side of the tube shell bottom plate, and can have a good packaging effect while having a better heat dissipation effect. The bottom plate of the laser tube shell includes a plate-shaped body, the first surface of the body is used to receive the heat generated by the heat source and conduct it downward, and the second surface of the body forms a heat dissipation fin, which can take away the heat on the heat dissipation fin on the lower surface of the body by air cooling. The body and the heat dissipation fin are integrally formed.

[0015] At the same time, a phase-change refrigerant containing cavity is sealed on the bottom plate of the tube shell, and phase-change refrigerant is sealed in the containing cavity. The heat from the hotter area in the body can be quickly transferred to the lower temperature area through the phase-change refrigerant in the phase-change refrigerant containing cavity, so as to solve the problem that the temperature of the heat dissipation fins in different areas is different, some fin areas have higher temperature, and some fin areas have lower temperature, resulting in reduced heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a horizontal side schematic diagram of the utility model.

[0017] Figure 2 It is an explosion schematic diagram of the utility model.

[0018] Figure 3 It is a front schematic diagram of the utility model.

[0019] Figure 4 It is a schematic diagram of the back side of the utility model.

[0020] Figure 5 It is a longitudinal side schematic diagram of the utility model.

[0021] Figure 6 It is a schematic diagram of the phase change refrigerant containing chamber of the utility model. DETAILED DESCRIPTION

[0022] The technical solution of the utility model is further explained below with reference to the accompanying drawings and through specific implementation methods.

[0023] Existing lasers usually use semiconductor lasers as pump sources or part of the light source, and the semiconductor laser chip has a small area and generates a lot of heat. Therefore, in the laser, it is most important to dissipate heat for the semiconductor chip. In the usual technical solution, multiple semiconductor laser chips are used in the pump source or light source as a group of semiconductor laser chip modules, and the multiple semiconductor laser chips have a common tube shell for packaging / sealing. The tube shell can be called a laser tube shell. Multiple semiconductor laser chips are installed on the base of the tube shell. The heat generated by the semiconductor laser chip is conducted to the base of the tube shell. The base of the existing tube shell is installed on a cold plate. The base of the tube shell transfers the heat to the cold plate, and then conducts heat and dissipates heat through the cold plate. We realize that although this method is convenient for sealing, its heat dissipation is due to the effect of the tube shell. Due to the thermal conductivity gradient of heat conduction, heat accumulation will be formed at the contact position of the tube shell and the cold plate, resulting in excessively high temperature at the installation position of the semiconductor laser chip, and excessively high temperature can easily damage the semiconductor laser chip. In order to solve this problem, we decided to adopt a new packaging method, abandoning the original technical solution of using an ordinary tube shell and installing the laser tube shell on a cold plate, and instead designed an air-cooled tube shell and directly installed multiple semiconductor chips on the air-cooled tube shell.

[0024] The utility model relates to an air-cooled fiber laser tube shell, which includes a bottom plate of the laser tube shell, at least one top plate on the upper part of the laser tube shell, and preferably also includes side plates around the laser tube shell. The bottom plate of the laser tube shell includes a plate-shaped body 1, which is made of a heat-conducting material, and the first surface (upper surface) of the body is used to receive the heat generated by the heat source and conduct it downward. The utility model directly forms heat dissipation fins on the lower side of the body 1, abandoning the heat dissipation method of contacting the bottom plate of the tube shell with the cold plate, and directly forms heat dissipation fins on the bottom plate of the laser tube shell, and uses a fan or the like to accelerate the air to flow through the heat dissipation fins to take away the heat (this can solve the problem of heat accumulation at the interface of the tube shell bottom plate). Preferably, the body 1 and the heat sink fins are integrally formed, and the body 1 and the heat sink fins are made of thermally conductive materials, especially the body 1 and the heat sink fins are made of highly thermally conductive materials, such as highly thermally conductive aluminum (including ordinary aluminum and special doped aluminum alloys, etc.), graphene materials, and fans and other components should be provided on the lower side or side of the heat sink fins to drive the airflow and increase the wind speed; in order to increase the air cooling heat dissipation efficiency, see Figure 4 The heat dissipation fins are generally formed of a plurality of parallel sheet structures extending along a first direction, and a plurality of air flow channels extending along the first direction are formed between the plurality of sheet structures, see Figure 5 The fan-driven airflow can flow along multiple airflow channels extending in the first direction without being blocked, so the airflow speed is very high and the heat dissipation surface area is large, which can greatly increase the speed at which the airflow carries away heat.

[0025] However, the above scheme still has some problems. For example, because the plate-shaped main body 1 requires a certain mechanical strength to achieve installation and support, the thickness of the main body 1 cannot be made too thin. Too high a thickness may reduce the efficiency of heat transfer and also form a slight thermal gradient, thereby reducing the efficiency of the fin wind taking away heat on the lower side of the main body 1. In addition, since the semiconductor chip is installed in some point-like areas on the base body, it is not evenly and completely distributed on the entire base body. The direct downward transfer efficiency of heat is higher, but the heat transfer to the farther side is not so fast. The temperature of the bottom of each semiconductor chip is very high, while the temperature of the area farther away from it is not so high. Therefore, the temperature of different areas of the main body is different, which leads to different temperatures of the heat dissipation fins in different areas. Some fin areas have higher temperatures, while some fin areas have lower temperatures. Therefore, the fin area in the high temperature range is reduced, thereby reducing the heat dissipation efficiency.

[0026] Based on this, engineers came up with the following technical solution: the bottom plate of the laser tube shell includes a plate-shaped body 1, which is made of heat-conducting material. Heat dissipation fins are directly formed on the lower side of the body 1. A phase-change refrigerant receiving chamber is sealed in the body 1, and a phase-change refrigerant is sealed in the receiving chamber. As for the form of the receiving chamber, it is preferred that the transverse cross-section of the receiving chamber covers more than half of the area of ​​the upper surface (or lower surface) of the body. As for the specific shape, it can be a flat, whole, basically rectangular cavity, which is flat on the lower side of the semiconductor heat source; it can also be an S-shaped bent and extended pipe-like structure, and the pipe is evenly arranged on the lower side of the semiconductor heat source. By arranging the phase-change refrigerant in the phase-change refrigerant receiving chamber, part of the liquid refrigerant is converted into gas when heated, and rapidly expands to other areas. When encountering a lower temperature area, it becomes liquid again, and can also return to the higher temperature area through the reflux structure, so that the heat of the hotter area in the body 1 can be quickly transferred to the lower temperature area to solve the above problems.

[0027] For the structure inside the shell, the specific scheme is as follows: a new type of fiber laser shell, including a bottom plate on the lower side and multiple packaging top plates on the upper side, a laser generating component is fixedly installed on the bottom plate of the laser shell; the laser generating component includes a plurality of semiconductor laser chips, a gain cavity fiber part and other related components, the bottom plate on the lower side is divided into a semiconductor laser chip placement area and a gain cavity fiber placement area, a plurality of semiconductor laser chips are supported on the semiconductor chip placement area, and an active optical fiber is supported and arranged on the gain cavity fiber placement area; at least one semiconductor chip packaging top plate is arranged on the semiconductor chip placement area, preferably, an active optical fiber and a packaging top plate of each passive device are preferably arranged on the gain cavity fiber placement area; at least one semiconductor chip packaging top plate and the bottom plate cooperate to form a package / seal for a plurality of semiconductor laser chips; preferably, when a plurality of semiconductor laser chips can be divided into N semiconductor laser chip groups, each semiconductor laser chip group jointly outputs a beam of pump laser, and multiple beams of pump laser are combined through spatial photosynthesis or entering a combiner for beam combining After entering the gain cavity fiber, preferably, there are N semiconductor chip packaging top plates, each semiconductor chip packaging top plate is used to cover a corresponding semiconductor laser chip group, that is, a semiconductor chip group is packaged between the bottom plate of the laser tube shell and a corresponding semiconductor chip top plate, that is, N semiconductor chip packaging top plates and the laser tube shell bottom plate cooperate to package N semiconductor laser chip groups; preferably, the gain cavity fiber packaging top plate and the laser tube shell bottom plate cooperate to form a package / seal for the gain cavity fiber, and the gain cavity fiber packaging top plate covers the gain cavity fiber part, that is, the gain cavity fiber part is packaged between the laser tube shell bottom plate and the gain cavity fiber packaging top plate; such a configuration can omit the side plate of the usual laser tube shell, which not only saves materials and makes the device thinner, but also makes the packaging method and process simpler. In addition, due to the multi-zone independent packaging method, it is convenient to replace some parts without opening the overall packaging when they are damaged, and the impact on the stability of the overall device when some devices are damaged is minimized. N is an integer greater than 1. Preferably, the semiconductor chip packaging top plate can be a cover plate with a groove or a flat cover plate. The wavelength of the chips in each chipset is the same, and the wavelength of the chips between each chipset is different, which can reduce the nonlinear effect while increasing the output power of the laser. Figure 6A preferred embodiment of a phase-change refrigerant containing chamber is shown. The phase-change refrigerant containing chamber can be divided into a plurality of sub-chambers, each of which is interconnected through a pipeline. When a plurality of semiconductor laser chips are divided into N semiconductor laser chip groups, a sub-chamber is arranged directly below each semiconductor laser chip group in the semiconductor chip placement area. The phase-change refrigerant in the sub-chamber can absorb the heat generated by the semiconductor laser chip group above it and vaporize, and then diffuse into other areas. A sub-chamber is arranged in the gain cavity fiber placement area. The sub-cavity can receive the gaseous refrigerant flowing from the sub-cavity in the semiconductor chip placement area and liquefy the gaseous refrigerant. Thus, the sub-cavity of the phase change refrigerant holding cavity in the gain cavity optical fiber placement area becomes the condensation end of the phase change refrigerant holding cavity and plays a heat dissipation role for the phase change refrigerant. The liquid phase change refrigerant in the gain cavity optical fiber placement area can flow back to the sub-cavity of the phase change refrigerant holding cavity in the semiconductor placement area. This design can effectively utilize the semiconductor chip placement area and the gain cavity optical fiber placement area in the mounting plate without the need to set up an additional condensation end. Thus, the structure is simple and plays a role in balanced heat dissipation. Of course, this is only a preferred embodiment of the phase change refrigerant holding cavity. In actual situations, the shape of the phase change refrigerant holding cavity and the specific structures of the evaporation end and the condensation end can be reasonably set according to needs.

[0028] The laser generating component is an optical component that can generate the final output laser or the intermediate process laser. The laser generating component may include a semiconductor laser chip, a collimating / coupling component, a gain cavity fiber part, etc., and in some embodiments, it also includes a passive optical fiber and various devices. Preferably, the bottom plate of the laser tube shell includes a plate-shaped body, the body is made of a heat-conducting material, and the first surface (upper surface) of the body is used to receive the heat generated by the heat source and conduct it downward. In order to improve the heat dissipation efficiency, a phase-change refrigerant receiving cavity is sealed and buried in the bottom plate of the tube shell, and the refrigerant can be sealed in the receiving cavity. Heat dissipation fins are formed on the second surface (lower surface) of the body, and the heat on the heat dissipation fins on the lower surface of the body can be continuously taken away by air cooling (a device that accelerates the airflow, such as a fan, can be provided in conjunction). Thus, the phase-change refrigerant receiving cavity of the bottom plate of the tube shell can be effectively utilized to accelerate the heat conduction capacity and realize accelerated air cooling to improve the heat dissipation efficiency, and the effect of direct air cooling can be greatly improved at the same time. In order to reduce the thermal resistance of air cooling and improve the heat dissipation capacity of air cooling, preferably, the body and the heat dissipation fins are integrally formed, and the body and the heat dissipation fins are made of thermally conductive materials, especially the body and the heat dissipation fins are made of high thermal conductivity materials, such as high thermal conductivity aluminum and graphene materials. In addition, the bottom plate also needs a refrigerant injection port and other structures to facilitate the injection of refrigerant into the phase change refrigerant accommodating cavity.

[0029] refer to Figure 3 , 4, so that the active optical fiber and the semiconductor laser chip are simultaneously packaged on the bottom plate of the laser tube shell, that is, the bottom plate of the laser tube shell includes a semiconductor laser chip placement area and an active optical fiber placement area, at least one semiconductor laser chip is installed on the surface of the semiconductor laser chip placement area and is in thermal contact with the semiconductor laser chip, the active optical fiber and various passive devices are installed on the surface of the gain cavity optical fiber placement area and are in thermal contact with it, at least one semiconductor laser chip outputs pump light through the output pigtail, and the pump light couples the pump light of the output pigtail into the gain cavity optical fiber through an optical fiber combiner or other coupler, and generates and outputs optical fiber laser through the gain cavity optical fiber (that is, the laser generation component of the optical fiber laser is composed of the semiconductor laser chip, the active optical fiber and other related optical components). That is, the optical fiber laser is arranged on the bottom plate of the laser tube shell, and the optical fiber laser is packaged by the laser tube shell, that is, the semiconductor laser chip is packaged between the bottom plate of the laser tube shell and the semiconductor chip packaging top plate; the gain cavity optical fiber part is packaged between the bottom plate of the laser tube shell and the gain cavity optical fiber packaging top plate. Since the semiconductor laser chip generates more heat than the active optical fiber, in order to dissipate heat more effectively and more evenly, preferably, the fins on the lower side of the semiconductor laser chip placement area are longer than the fins on the lower side of the gain cavity fiber placement area, that is, the lower side of the gain cavity fiber placement area has a second fin area, and the lower side of the semiconductor laser chip placement area has a first fin area, and the length of the fins of the first fin area extending downward is more than twice the length of the fins of the second fin area extending downward. A phase change refrigerant accommodating cavity is buried in the bottom plate of the laser tube shell, and the phase change refrigerant is sealed in the accommodating cavity. The area of ​​the transverse cross-section of the accommodating cavity in the semiconductor laser chip placement area is T1, and the area of ​​the transverse cross-section of the accommodating cavity in the active fiber placement area is T2, T1>2T2. The transverse cross section is parallel to the upper surface of the tube shell bottom plate. Of course, the following implementation method can also be adopted, in which a accommodating cavity is provided in the semiconductor laser chip placement area, and a phase change refrigerant is sealed in the accommodating cavity, and no accommodating cavity is provided in the gain cavity fiber placement area. Of course, although this can achieve balanced heat dissipation, it will reduce the heat dissipation capacity of the gain cavity fiber placement area compared to the previous implementation method. Regardless of the first fin region or the second fin region, the heat dissipation fins are formed of a plurality of parallel sheet structures extending along a first direction, and a plurality of air flow channels extending along the first direction are formed between the plurality of sheet structures.

[0030] That is, the utility model relates to an air-cooled fiber laser tube shell, which is used to encapsulate a fiber laser or other laser generating components. The lower surface of the bottom plate of the laser tube shell is integrally formed with heat dissipation fins that can be air-cooled (instead of the usual cold plate being arranged on the lower side of the tube shell bottom plate), which can effectively reduce thermal resistance and achieve efficient heat dissipation. Preferably, a phase change refrigerant containing cavity is also arranged in the bottom plate of the laser tube shell, and the phase change refrigerant is sealed in the containing cavity, so that the heat conduction efficiency between various places can be improved, and the heat on the heat dissipation fins on the lower surface of the main body 1 can be continuously and efficiently removed by air cooling.

[0031] The technical principle of the present invention is described above in combination with specific embodiments. These descriptions are only for explaining the principle of the present invention and cannot be interpreted as limiting the protection scope of the present invention in any way. Based on the explanations here, technicians in this field can think of other specific implementation methods of the present invention without creative work, and these methods will fall within the protection scope of the present invention.

Claims

1. An air-cooled fiber laser tube shell, comprising a bottom plate of the laser tube shell, the bottom plate supports a laser generating assembly; the laser generating assembly comprises a plurality of semiconductor laser chips and a gain cavity fiber portion; the bottom plate of the laser tube shell comprises a semiconductor laser chip placement area and a gain cavity fiber placement area, the gain cavity fiber portion and the semiconductor laser chip are mounted on the bottom plate of the laser tube shell, characterized in that: The bottom plate of the laser tube shell includes a plate-shaped body, the first surface of the body is used to receive the heat generated by the heat source and conduct it downward, and the second surface of the body is formed with heat dissipation fins, which can take away the heat on the heat dissipation fins on the lower surface of the body by air cooling. The body and the heat dissipation fins are integrally formed, and the body and the heat dissipation fins are both made of heat-conducting materials; a phase-change refrigerant accommodating chamber is sealed in the body, and the phase-change refrigerant is sealed in the accommodating chamber.

2. According to claim 1, an air-cooled fiber laser tube shell, at least one semiconductor chip packaging top plate is arranged on the semiconductor chip placement area; at least one semiconductor chip packaging top plate and the bottom plate cooperate to form a package for a plurality of semiconductor laser chips.

3. According to the air-cooled fiber laser tube shell of claim 1, the transverse cross-section of the accommodating cavity covers more than half of the area of ​​the upper surface of the body.

4. According to claim 2, an air-cooled fiber laser shell, a plurality of semiconductor laser chips are divided into N semiconductor laser chip groups, each semiconductor laser chip group outputs a pump laser together, the chips in each chips group have the same wavelength, and the chips between each chips group have different wavelengths, and multiple pump lasers enter the active optical fiber after being combined by spatial photosynthesis or a beam combiner, and have N semiconductor chip packaging top plates, each of which is used to cover a corresponding semiconductor laser chip group, that is, the N semiconductor chip packaging top plates and the laser shell bottom plate cooperate to package the N semiconductor laser chip groups; N is an integer greater than 1.

5. According to claim 4, an air-cooled fiber laser tube shell, at least one semiconductor laser chip is installed on the surface of the semiconductor laser chip placement area and is in thermal contact with the semiconductor laser chip, the active optical fiber and various passive components are installed on the surface of the gain cavity fiber placement area and are in thermal contact with them, at least one semiconductor laser chip outputs pump light through the output pigtail, the pump light couples the pump light of the output pigtail into the gain cavity fiber through a coupler, and the fiber laser is generated and output through the gain cavity part; the gain cavity fiber packaging top plate covers the active optical fiber and various passive component parts.

6. According to claim 1, an air-cooled fiber laser tube shell has a second fin area on the lower side of the gain cavity fiber placement area, and a first fin area on the lower side of the semiconductor laser chip placement area, and the length of the fins of the first fin area extending downward is twice or more than the length of the fins of the second fin area extending downward; the body and the heat dissipation fins are both made of aluminum or graphene.

7. According to claim 3, an air-cooled fiber laser tube shell, the accommodating cavity is a flat, whole rectangular cavity, and the accommodating cavity is flat on the lower side of the semiconductor heat source; or, the accommodating cavity is an S-shaped bent and extended pipe-like structure, and the pipe is evenly arranged on the lower side of the semiconductor heat source.

8. According to the air-cooled fiber laser tube shell of claim 1, a receiving cavity is arranged in the semiconductor laser chip placement area, a phase change refrigerant is sealed in the receiving cavity, and the gain cavity fiber placement area is the cooling end of the receiving cavity.

9. According to an air-cooled fiber laser tube shell of claim 8, the phase change refrigerant containing chamber includes a plurality of sub-chambers, each of which is interconnected, and when a plurality of semiconductor laser chips are divided into N semiconductor laser chip groups, a sub-chamber is arranged directly below each semiconductor laser chip group in the semiconductor chip placement area, and the phase change refrigerant in the sub-chamber directly below the semiconductor laser chip group absorbs the heat generated by the semiconductor laser chip group above it and vaporizes, and a sub-chamber is arranged in the gain cavity fiber placement area, and the sub-chamber of the phase change refrigerant containing chamber in the gain cavity fiber placement area receives the gaseous refrigerant flowing from the sub-chamber in the semiconductor chip placement area and liquefies the gaseous refrigerant, and the liquid phase change refrigerant in the sub-chamber of the phase change refrigerant containing chamber in the gain cavity fiber placement area flows back to the sub-chamber of the phase change refrigerant containing chamber in the semiconductor placement area.

10. According to claim 1, a wind-cooled fiber laser tube shell, the heat dissipation fins are formed by a plurality of parallel sheet structures extending along a first direction, a plurality of airflow channels extending along the first direction are formed between the plurality of sheet structures, and the airflow driven by the fan flows along the plurality of airflow channels extending in the first direction.

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