Heat dissipation device and heat dissipation system
By designing the temperature uniform plate and fins in the electronic heat dissipation device and setting a pulsating heat pipe on the fins, the problem of poor outdoor heat dissipation effect in the prior art is solved, and a more efficient heat dissipation effect and a simplified assembly process are achieved.
Patent Information
- Application Number
- CN202421520497.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-28
- Publication Date
- 2025-05-23
- Estimated Expiration
- 2034-06-28
AI Technical Summary
In outdoor natural convection heat dissipation scenarios, existing electronic heat dissipation devices have poor heat dissipation effects and cannot meet the heat dissipation needs of high-heat electronic products.
A heat dissipation device is designed, including a temperature equalizing plate and a fin. The fin includes a body and a pulsating heat pipe arranged on the body. The pulsating heat pipe is completely arranged on the body and does not come into contact with the temperature equalizing plate. This structure improves heat dissipation efficiency and effect.
The device quickly transfers heat to the fins through the temperature equalization plate, and uses the diffusion effect of the pulsating heat pipe to further improve the heat dissipation efficiency, simplifying the assembly process and reducing the impact on the temperature equalization performance of the temperature equalization plate, thereby significantly improving the heat dissipation effect.
Smart Images
Figure CN222897451U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of electronic heat dissipation, and in particular to a heat dissipation device and a heat dissipation system. Background Art
[0002] With the vigorous development of the electronic cooling industry and the iterative updates of electronic products, the power of chips is getting higher and higher, and the heat generation is getting higher and higher. However, for some outdoor cooling scenarios with high heat generation and the need to use natural convection for heat dissipation, the current cooling devices cannot meet the cooling needs due to their poor cooling effect. Utility Model Content
[0003] In view of this, the present application is dedicated to providing a heat dissipation device that can improve the heat dissipation effect. In addition, the present application also provides a heat dissipation system including the above heat dissipation device.
[0004] In order to achieve the above objectives, this application provides the following technical solutions:
[0005] A heat dissipation device, comprising:
[0006] A temperature plate, used for thermal connection with the heating element;
[0007] The fin is thermally connected to the temperature homogenizing plate, and comprises a body and a pulsating heat pipe arranged on the body;
[0008] Among them, in the direction perpendicular to the installation surface of the main body, the pulsating heat pipe is arranged on the main body, there is no local part distributed outside the main body, and the side of the pulsating heat pipe close to the temperature homogenizing plate is not in contact with the temperature homogenizing plate.
[0009] Preferably, a plurality of fins are provided on the temperature averaging plate, and the plurality of fins are distributed in parallel and are provided on a side of the temperature averaging plate away from the heat generating element.
[0010] Preferably, the fin has a curved heat dissipation surface.
[0011] Preferably, the pulsating heat pipe comprises a straight section and a curved section, and the straight section is located on a side of the curved section away from the temperature homogenizing plate.
[0012] Preferably, the curved segments are distributed in a serpentine shape and are evenly distributed in a direction parallel to the temperature homogenizing plate.
[0013] Preferably, the temperature homogenizing plate comprises:
[0014] A first plate body is located on a side of the temperature homogenizing plate away from the fins and is used for thermally connecting with the heat generating element;
[0015] A second plate body is located on a side of the temperature homogenizing plate close to the fins and is thermally connected to the fins;
[0016] Wherein, a groove is provided on the first plate body and / or the second plate body so that the first plate body and the second plate body cooperate to form a uniform temperature chamber, and the surface of the first plate body used to form the uniform temperature chamber is the first surface, and the first surface is provided with a capillary structure layer.
[0017] Preferably, a capillary structure layer is provided on the surface of the second plate body used for forming the temperature-averaging chamber.
[0018] Preferably, the surface of the first plate body used for connecting with the heating element is the second surface;
[0019] The portion of the first plate body connected to the heat generating element is recessed in a direction away from the fins to form a groove on the first surface and a connecting protrusion on the second surface.
[0020] Preferably, the pulsating heat pipe is a variable diameter structure, and the diameter of the pulsating heat pipe on a side close to the temperature homogenizing plate is larger than the diameter of the pulsating heat pipe on a side away from the temperature homogenizing plate.
[0021] A heat dissipation system, comprising:
[0022] A heat dissipation device, which is the heat dissipation device mentioned above;
[0023] The heat generating element is thermally connected to the temperature averaging plate of the heat dissipation device.
[0024] It can be seen from the above technical solution that the heat dissipation device provided by the present application uses a temperature equalizer as a substrate. During the heat dissipation process, the temperature equalizer can quickly and evenly transfer the heat generated by the heating element to the fins, thereby improving the heat dissipation efficiency and heat dissipation effect of the heat dissipation device. Since the fins include a body and a pulsating heat pipe, and the pulsating heat pipe is arranged on the body, the heat transferred to the fins can be quickly diffused under the action of the pulsating heat pipe, further improving the heat dissipation efficiency of the heat dissipation device. In addition, since the pulsating heat pipe is completely arranged on the body and has no contact with the temperature equalizer, during the assembly process, after completing the connection between the fins and the temperature equalizer, there is no need to connect the pulsating heat pipe to the temperature equalizer, thereby simplifying the process. At the same time, it can also reduce the influence of the pulsating heat pipe on the temperature equalization performance of the temperature equalizer, give full play to the temperature equalization performance of the temperature equalizer, and improve the heat dissipation effect of the heat dissipation device. BRIEF DESCRIPTION OF THE DRAWINGS
[0025] Figure 1 Shown is an exploded view of a heat dissipation device provided in an embodiment of the present application;
[0026] Figure 2 Shown Figure 1A cross-sectional view of the heat sink shown;
[0027] Figure 3 Shown is a schematic diagram of a heat dissipation device provided in an embodiment of the present application;
[0028] Figure 4 Shown is a cross-sectional view of a heat dissipation system provided in an embodiment of the present application.
[0029] exist Figure 1-Figure 4 middle:
[0030] 1-temperature averaging plate, 2-fins, 3-liquid injection pipe, 4-heating element;
[0031] 11-first plate body, 12-capillary structure layer, 13-second plate body;
[0032] 21-body, 22-pulsating heat pipe;
[0033] 111 - support column, 112 - connection protrusion, 113 - first surface, 114 - second surface, 131 - assembly groove; 221 - straight line segment, 222 - curved line segment. DETAILED DESCRIPTION
[0034] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.
[0035] First of all, it should be noted that the heat dissipation device in the present application is suitable for scenarios where natural convection is used for heat dissipation, for example, it is suitable for scenarios where heat is dissipated in outdoor communication base stations, or it is also suitable for scenarios where heat is dissipated in outdoor electronic equipment cabinets.
[0036] like Figure 1-Figure 4 As shown, the embodiment of the present application discloses a heat dissipation device, including a temperature averaging plate 1 and fins 2, wherein the temperature averaging plate 1 can be in contact with and attached to the heating element 4 to achieve a thermal connection, and the fins 2 are thermally connected to the temperature averaging plate 1. Under the good thermal conductivity and temperature averaging performance of the temperature averaging plate 1, during the heat dissipation process, the heat generated by the heating element 4 can be quickly evenly heated and conducted by the temperature averaging plate 1, and evenly transferred to the fins 2, thereby improving the heat dissipation efficiency and heat dissipation effect of the heat dissipation device. In addition, as Figure 1 and 2As shown, the fin 2 includes a main body 21 and a pulsating heat pipe 22 arranged on the main body 21, wherein the main body 21 is used for thermal connection with the temperature equalizing plate 1 on the one hand, so as to realize the assembly of the fin 2 and the temperature equalizing plate 1 and transfer the heat of the temperature equalizing plate 1 to the pulsating heat pipe 22, and on the other hand, the main body 21 has a larger area, that is, a larger heat dissipation area, so that the heat transferred to the pulsating heat pipe 22 can be more efficiently dissipated through the larger heat dissipation area, and the pulsating heat pipe 22 itself not only has good heat dissipation efficiency, but also has little effect of gravity on its heat dissipation efficiency, and can be better applied to a variety of heat dissipation environments. In this way, the heat transferred to the fin 2 can be quickly diffused on the main body 21 of the fin 2 under the action of the pulsating heat pipe 22, thereby further improving the heat dissipation efficiency of the heat dissipation device.
[0037] Further, such as Figure 1 and Figure 2 As shown, in the direction perpendicular to the body 21, the projection of each part of the pulsating heat pipe 22 is located on the body 21, and the side of the pulsating heat pipe 22 close to the temperature equalizing plate 1 is not in contact with the temperature equalizing plate 1, that is, the pulsating heat pipe 22 in the embodiment of the present application is completely arranged on the body 21 of the fin 2, and there is no part of the pulsating heat pipe 22 distributed outside the body 21, and in the assembled state, there is a gap between the side of the pulsating heat pipe 22 close to the temperature equalizing plate 1 and the temperature equalizing plate 1, that is to say, the pulsating heat pipe 22 is not in contact with and / or connected to the temperature equalizing plate 1, so that, on the one hand, during the assembly process, after completing After the fins 2 are connected to the temperature equalizing plate 1, there is no need to connect the pulsating heat pipe 22 to the temperature equalizing plate 1, which can simplify the process (it can simplify the molding process of the temperature equalizing plate 1 itself, the molding process of the fins 2 itself, and the connection process of the temperature equalizing plate 1 and the fins 2). The heat conduction from the temperature equalizing plate 1 to the pulsating heat pipe 22 is only achieved through the heat conduction of the main body 21. On the other hand, because there is no contact between the pulsating heat pipe 22 and the temperature equalizing plate 1, the influence of the pulsating heat pipe 22 on the temperature equalizing performance of the temperature equalizing plate 1 can be reduced, the temperature equalizing performance of the temperature equalizing plate 1 can be fully utilized, and the heat dissipation effect of the heat dissipation device can be improved.
[0038] In some embodiments, the temperature-averaging plate 1 and the fins 2 can be connected by welding (e.g., brazing) to achieve a heat-conducting connection between the two. In this connection mode, the temperature-averaging plate 1 and the fins 2 have a high connection strength, and can ensure good contact between the temperature-averaging plate 1 and the fins 2, thereby ensuring the thermal conductivity between the two. In addition, since there is no pulsating heat pipe 22 distributed at the connection between the temperature-averaging plate 1 and the fins 2, it can not only simplify the structure, but also make the welding operation easier and more convenient to implement.
[0039] In other embodiments, the temperature homogenizing plate 1 and the fins 2 are connected in an interlocking manner to achieve a heat-conducting connection between the two. Figure 1As shown, a plurality of assembly grooves 131 capable of interference fit with the fins 2 are provided on the temperature equalizing plate 1. During assembly, the bottom side of the fins 2 can be inserted into the assembly grooves 131 on the temperature equalizing plate 1. Under this connection mode, since there is no pulsating heat pipe 22 distributed at the connection portion between the temperature equalizing plate 1 and the fins 2, it is easier to connect the fins 2 and the temperature equalizing plate 1. Moreover, since there is no metallurgical connection between the fins 2 and the temperature equalizing plate 1, when the fins 2 are damaged, it is easier to replace them, and it will not cause damage to the pulsating heat pipe 22 or affect the absorption of heat by the pulsating heat pipe 22.
[0040] like Figure 1 As shown, in some preferred embodiments, a plurality of fins 2 are arranged on the temperature equalizing plate 1, and the plurality of fins 2 are evenly distributed on the side of the temperature equalizing plate 1 away from the heat generating element 4. Thus, on the one hand, the arrangement of the plurality of fins 2 can further increase the heat dissipation area of the heat dissipation device, thereby improving the heat dissipation efficiency of the heat dissipation device; on the other hand, the uniform distribution of the plurality of fins 2 can improve the uniformity of heat dissipation, thereby ensuring the heat dissipation effect.
[0041] It should be noted that the specific number of fins 2 can be adaptively designed according to the heat dissipation needs, and this application does not specifically limit it. For example, in some embodiments, 10 fins 2 are provided on the temperature equalizer 1; in other embodiments, 14 fins 2 are provided on the temperature equalizer 1. Of course, in some extreme cases, the number of fins 2 may be only 1.
[0042] Furthermore, on the basis of the plurality of fins 2, in some embodiments, a plurality of fins 2 are arranged in parallel, and this arrangement can reduce the disturbance of the airflow by the fins 2, thereby reducing the resistance of the air flow and ensuring the heat dissipation effect. Of course, as needed, the arrangement of the plurality of fins 2 on the temperature homogenizing plate 1 can also be changed, so that adjacent fins 2 are arranged in other distribution modes, for example, adjacent fins 2 can be arranged in an "eight" shape.
[0043] Furthermore, in some embodiments, Figure 3 As shown, the fin 2 has a curved heat dissipation surface; in this way, the heat dissipation area of the fin 2 can be increased, and the flow effect of the airflow can also be optimized, thereby improving the heat dissipation capacity of the heat dissipation device. As for the formation method of the curved heat dissipation surface, in some embodiments, the fin 2 is repeatedly bent to form a wavy curved surface. In other embodiments, the fin 2 is set to a structure with inconsistent thickness to form a curved heat dissipation surface. When multiple fins 2 are set, the structures of the multiple fins 2 are the same, and the direction of the curved parts remains the same.
[0044] As mentioned above, the pulsating heat pipe 22 is arranged on the body 21 of the fin 2. It should be noted here that, under the premise of ensuring a good heat conduction effect, the pulsating heat pipe 22 can be arranged on the surface of the body 21 or integrated into the inside of the body 21. For example:
[0045] In some embodiments, the pulsating heat pipe 22 is a bent aluminum tube, which is connected end to end and is welded to the surface of the body 21. In this arrangement, since the pulsating heat pipe 22 is exposed on the surface of the fin 2, it is easier to detect, and part of the outer surface of the pulsating heat pipe 22 can be used as a heat dissipation surface, thereby increasing the heat dissipation area and improving the heat dissipation efficiency.
[0046] In other embodiments, the pulsating heat pipe 22 is a fine channel disposed inside the body 21 and formed by a blowing process. In this arrangement, since there is no need to introduce a welding process, the process steps can be simplified, and at the same time, the damage to the body 21 and the pulsating heat pipe 22 caused by high temperature during the welding process can be avoided, thereby improving the yield rate. At the same time, since the pulsating heat pipe 22 is hidden inside the body 21, the body 21 serves as a protective structure for the pulsating heat pipe 22, which can prevent the pulsating heat pipe 22 from being damaged.
[0047] In addition, if Figure 2 As shown, a liquid injection pipe 3 is also provided on the body 21 of the fin 2, and the liquid injection pipe 3 is connected to the pulsating heat pipe 22, so as to add a working medium for heat conduction inside the pulsating heat pipe 22 to ensure the normal operation of the pulsating heat pipe 22. It should be noted that when the heat dissipation device is in the working state, the liquid injection pipe 3 is in a closed state to ensure the closedness of the pulsating heat pipe 22 and the circulation of the working medium inside the pulsating heat pipe 22.
[0048] Furthermore, as described above, the heating element 4, the temperature equalizing plate 1 and the fin 2 are connected in sequence by thermal conduction. During operation of the heat dissipation device, the heat generated by the heating element 4 is transferred to the temperature equalizing plate 1 and the fin 2 in sequence, and the conduction direction on the fin 2 is: from the end of the fin 2 close to the temperature equalizing plate 1 to the end of the fin 2 away from the temperature equalizing plate 1. Correspondingly, based on the above, the heat transfer direction of the pulsating heat pipe 22 on the fin 2 is from the end close to the temperature equalizing plate 1 to the end away from the temperature equalizing plate 1, that is, the end of the pulsating heat pipe 22 on the fin 2 close to the temperature equalizing plate 1 is the evaporation end (that is, the end where the working fluid inside the pulsating heat pipe 22 absorbs heat to generate bubbles and expands rapidly), and the end away from the temperature equalizing plate 1 is the condensation end (that is, the end where the bubbles inside the pulsating heat pipe 22 shrink and rupture).
[0049] Based on the above, in some embodiments, Figure 2As shown, the pulsating heat pipe 22 arranged on the fin 2 includes a straight section 221 and a curved section 222, and the straight section 221 is located on the side of the curved section 222 away from the temperature equalizing plate 1. That is, the straight section 221 of the pulsating heat pipe 22 in this embodiment is located at the condensation end of the pulsating heat pipe 22, and the curved section 222 of the pulsating heat pipe 22 is located at the evaporation end of the pulsating heat pipe 22. In this arrangement, compared with the technical solution of arranging the straight section 221 close to one side of the substrate (or the heating element 4) in the prior art, the evaporation end of the pulsating heat pipe 22 in this embodiment has a longer length and a higher heat absorption efficiency, and the working fluid inside is more likely to move toward the condensation end of the pulsating heat pipe 22 after absorbing heat and generating bubbles, thereby improving the heat dissipation efficiency.
[0050] Further, such as Figure 2 As shown, the curve segments 222 are distributed in a serpentine shape and are evenly distributed in a direction parallel to the temperature equalizer 1. With such a configuration, the pulsating heat pipes 22 are evenly laid on the heat dissipation surface of the body 21, and the heat is evenly diffused to various parts of the heat dissipation surface of the body 21 through the pulsating heat pipes 22, which is more conducive to fully utilizing the heat dissipation surface of the body 21 of the fin 2, and can also keep the condensation end of the pulsating heat pipe 22 away from the heat source, so as to better dissipate heat and thus improve the heat dissipation efficiency.
[0051] Alternatively, in addition to the direction parallel to the temperature homogenizing plate 1, the curve segment 222 may also be distributed along other directions, which can also enable the pulsating heat pipe 22 to dissipate heat, for example Figure 1 As shown, part (or all) of the pulsating heat pipe 22 is evenly distributed along a direction perpendicular to the temperature homogenizing plate 1 .
[0052] It should be understood that the above embodiment only takes the pulsating heat pipe 22 including a straight segment 221 and a curved segment 222 as an example to illustrate the shape of the pulsating heat pipe 22, but the present application is not limited to this. For example, the straight segment 221 in the above embodiment can be modified into a curved tubular structure, that is, the entire pulsating heat pipe 22, whether it is the evaporation end or the condensation end, is a curved tubular structure.
[0053] In addition, if Figure 1 and Figure 2As shown, the temperature equalizing plate 1 in the embodiment of the present application includes a first plate body 11 and a second plate body 13, wherein the first plate body 11 is located on a side of the temperature equalizing plate 1 away from the fin 2, and is used for thermal connection with the heating element 4, and the second plate body 13 is located on a side of the temperature equalizing plate 1 close to the fin 2, and is thermally connected with the fin 2, and a groove is provided on the first plate body 11 and / or the second plate body 13, so that the first plate body 11 and the second plate body 13 can cooperate to form a temperature equalizing cavity of the temperature equalizing plate 1, and the temperature equalizing cavity has a phase change working medium, and in addition, the surface of the first plate body 11 for forming the temperature equalizing cavity is a first surface 113, and the first surface 113 is provided with a capillary structure layer 12 for achieving uniform temperature and rapid heat absorption, and the capillary structure layer 12 covers the entire first surface 113, and in a normal state (that is, the heating element 4 does not generate heat, or generates very little heat) state), the phase change medium in the temperature-averaging chamber is in liquid state and is located in the capillary structure layer 12. When the heating element 4 generates a large amount of heat during operation, the heat dissipation device starts to work. At this time, the heat generated by the heating element 4 is transferred to the phase change medium in the temperature-averaging chamber through heat conduction. The phase change medium undergoes a phase change after absorbing heat, that is, it changes from liquid to gas, and moves toward the side of the second plate body 13 (gas floating). Since the temperature on one side of the second plate body 13 is relatively low, the gaseous phase change medium transfers heat to the second plate body 13 on the side of the second plate body 13. At the same time, the gaseous phase change medium is cooled and changes from gas to liquid. The liquid phase change medium flows back into the capillary structure layer 12 under the action of its own gravity, and flows in the tiny gaps in the capillary structure layer 12 to cover the entire capillary structure layer 12 to participate in the next phase change cycle.
[0054] Further, such as Figure 1 and Figure 2 As shown, a plurality of support columns 111 are arranged in the temperature-averaging cavity, and one end of the support column 111 is connected to the first plate body 11, and the other end is connected to the second plate body 13, so that the compressive strength of the temperature-averaging plate 1 can be effectively increased. Specifically, the support column 111 can be integrally formed with the first plate body 11 and protrude from the first surface. After the temperature-averaging plate 1 is assembled, the protruding end of the support column 111 abuts against the surface of the second plate body 13 forming the temperature-averaging cavity, so that the processing technology can be simplified, and the structural strength can be improved. At the same time, the support column 111 and the first plate body 11 can be made of the same material, so that the support column 111 also has a heat-conducting effect.
[0055] In addition, in some embodiments, the surface of the second plate 13 used to form the uniform temperature chamber can also be provided with a capillary structure layer 12, that is, the surfaces of the first plate 11 and the second plate 13 that form the uniform temperature chamber can both be provided with a capillary structure layer 12. When the gaseous phase-change medium flows into the capillary structure layer 12 on the second plate 13, the gaseous phase-change medium will quickly fill into the tiny gaps to achieve uniform diversion of the gaseous phase-change medium, thereby making the amount of the gaseous phase-change medium in each tiny gap small, so that the gaseous phase-change medium can be quickly condensed to form a liquid state, and the liquid phase-change medium then flows back to the capillary structure layer 12 on the first plate 11 under the action of its own gravity. In this way, the uniformity of the temperature on one side of the second plate 13 and the heat absorption effect can be further improved, thereby improving the heat dissipation effect of the heat dissipation device.
[0056] Furthermore, the surface of the first plate body 11 connected to the heating element 4 is the second surface 114; Figure 2 and Figure 4As shown, the part where the first plate 11 is connected to the heating element 4 is recessed in a direction away from the fin 2 to form a groove on the first surface 113, and a connecting protrusion 112 is formed on the second surface 114. The groove formed on the first surface 113 allows the liquid phase change medium to flow into the groove, so that more phase change medium can be stored in the part that contacts and fits with the heating element 4. Therefore, in the heat dissipation process, the heat generated by the heating element 4 can be absorbed faster and more. The connecting protrusion 112 located on the second surface 114 can form a boss that fits with the heat generating element 4. When processing the temperature averaging plate 1, in order to ensure that the temperature averaging plate 1 is in full contact and fit with the heat generating element 4 and improve the heat absorption effect, it is necessary to ensure that the second surface 114 of the temperature averaging plate 1 that contacts and fits with the heat generating element 4 has good flatness. In the prior art, the surface of the heat dissipation device used for contacting and fitting with the heat generating element 4 is the entire surface of the temperature averaging plate 1 away from the fins 2 (the surface with the same function as the second surface 114). Due to its large area, it is difficult to process the flatness, which adds difficulty to the manufacture of the heat dissipation device. In the present application, by forming the connecting protrusion 112 at the portion of the temperature averaging plate 1 that is connected and fits with the heat generating element 4, it is only necessary to ensure the flatness of the connecting protrusion 112. Since the surface area of the connecting protrusion 112 is much smaller than the area of the second surface 114, The flatness processing can be achieved more simply and conveniently, and the processing accuracy can be higher, which reduces the flatness requirements of the entire temperature equalizing plate 1 during the processing, thereby improving the yield rate and reducing the processing cost; in addition, the setting of the connecting protrusion 112 makes the other parts of the second surface 114 higher than the surface of the connecting protrusion 112, so that there is a gap between the two in the thickness direction of the temperature equalizing plate 1, so that an avoidance space can be formed around the connecting protrusion 112. If the outdoor equipment that needs to dissipate heat has other components higher than the heating element 4 around the heating element 4, the height difference between the heating element 4 and the other components can be compensated by the avoidance space, so that the other components can be accommodated in the avoidance space, which is more conducive to the coordination (contact, fitting) of the temperature equalizing plate 1 and the heating element 4, so that the heat dissipation device can be applied to more installation environments, and its versatility is significantly improved.
[0057] Furthermore, in some embodiments, the pulsating heat pipe 22 is a variable diameter structure. Thus, on the one hand, the flow velocity and flow state of the working fluid (i.e., the working fluid inside the pulsating heat pipe 22) in the pipe can be changed, thereby optimizing the heat transfer efficiency; on the other hand, the variable diameter structure can better control the distribution of heat in the pipe, so that the heat can be more evenly transferred to the entire system, avoiding local hot spot problems; in addition, the optimized variable diameter design can also improve the stability and reliability of the system, so that the pulsating heat pipe 22 can effectively transfer heat under different working conditions.
[0058] In an exemplary embodiment, the diameter of the pulsating heat pipe 22 on the side close to the temperature equalizing plate 1 is larger than the diameter of the pulsating heat pipe 22 on the side away from the temperature equalizing plate 1. That is, the diameter of the evaporation end of the pulsating heat pipe 22 is larger than the diameter of the condensation end of the pulsating heat pipe 22. In this way, the evaporation end of the pulsating heat pipe 22 has more phase change medium, and can absorb more heat to improve the heat dissipation efficiency of the heat dissipation device. In addition, the diameter of the condensation end is set to be smaller, which can make the phase change medium at the condensation end easier to cool on the one hand, and on the other hand, it can also increase the flow speed of the phase change medium inside the pulsating heat pipe 22, thereby improving the temperature equalization effect of the pulsating heat pipe 22, so that the temperature of each part of the body 21 of the fin 2 is more uniform, so as to improve the heat dissipation effect.
[0059] In addition, the embodiment of the present application further provides a heat dissipation system, including a heat dissipation device and a heating element 4, wherein the heat dissipation device is the above-mentioned heat dissipation device, and the heating element 4 is thermally connected to the temperature averaging plate 1 of the heat dissipation device. It should be noted that since the heat dissipation system in the embodiment of the present application includes the above-mentioned heat dissipation device, the beneficial effects of the heat dissipation system caused by the heat dissipation device are discussed in detail above, and the present application will not repeat them here.
[0060] The basic principles of the present application are described above in conjunction with specific embodiments. However, it should be noted that the advantages, strengths, effects, etc. mentioned in the present application are only examples and not limitations, and it cannot be considered that these advantages, strengths, effects, etc. are required by each embodiment of the present application. In addition, the specific details disclosed above are only for the purpose of illustration and ease of understanding, not for limitation, and the above details are not limited to the present application must be implemented by using the above specific details.
[0061] It should also be noted that in the apparatus, device and method of the present application, each component or each step can be decomposed and / or recombined. Such decomposition and / or recombination should be regarded as equivalent solutions of the present application.
[0062] The above description of the disclosed aspects is provided to enable any person skilled in the art to make or use the present application. Various modifications to these aspects will be readily apparent to those skilled in the art, and the general principles defined herein may be applied to other aspects without departing from the scope of the present application. Therefore, the present application is not intended to be limited to the aspects shown herein, but rather to the widest scope consistent with the principles and novel features disclosed herein.
[0063] It should be understood that the qualifiers "first", "second", "third", "fourth", "fifth" and "sixth" used in the description of the embodiments of the present application are only used to more clearly explain the technical solutions and cannot be used to limit the scope of protection of the present application.
[0064] The above description has been given for the purpose of illustration and description. In addition, this description is not intended to limit the embodiments of the present application to the forms disclosed herein. Although multiple example aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, changes, additions and sub-combinations thereof.
Claims
1. A heat dissipation device, characterized in that: include: A temperature plate, used for thermal connection with the heating element; The fin is thermally connected to the temperature homogenizing plate, and comprises a body and a pulsating heat pipe arranged on the body; Among them, in the direction perpendicular to the installation surface of the main body, the pulsating heat pipe is arranged on the main body, there is no local part distributed outside the main body, and the side of the pulsating heat pipe close to the temperature homogenizing plate is not in contact with the temperature homogenizing plate.
2. The heat dissipation device according to claim 1, characterized in that: A plurality of fins are arranged on the temperature averaging plate, and the plurality of fins are distributed in parallel and arranged on a side of the temperature averaging plate away from the heat generating element.
3. The heat dissipation device according to claim 1 or 2, characterized in that: The fin has a curved heat dissipation surface.
4. The heat dissipation device according to claim 1, characterized in that: The pulsating heat pipe comprises a straight section and a curved section, and the straight section is located on a side of the curved section away from the temperature homogenizing plate.
5. The heat dissipation device according to claim 4, characterized in that: The curve segments are distributed in a serpentine shape and are evenly distributed in a direction parallel to the temperature homogenizing plate.
6. The heat dissipation device according to claim 1, characterized in that: The temperature homogenizing plate comprises: A first plate body is located on a side of the temperature homogenizing plate away from the fins and is used for thermally connecting with the heat generating element; A second plate body is located on a side of the temperature homogenizing plate close to the fins and is thermally connected to the fins; Wherein, a groove is provided on the first plate body and / or the second plate body so that the first plate body and the second plate body cooperate to form a uniform temperature chamber, and the surface of the first plate body used to form the uniform temperature chamber is the first surface, and the first surface is provided with a capillary structure layer.
7. The heat dissipation device according to claim 6, characterized in that: The surface of the second plate body used to form the temperature-averaging chamber is provided with a capillary structure layer.
8. The heat dissipation device according to claim 6, characterized in that: The surface of the first plate body used for connecting with the heating element is the second surface; The portion of the first plate body connected to the heat generating element is recessed in a direction away from the fins to form a groove on the first surface and a connecting protrusion on the second surface.
9. The heat dissipation device according to claim 1, characterized in that: The pulsating heat pipe is a variable diameter structure, and the diameter of the pulsating heat pipe on a side close to the temperature homogenizing plate is larger than the diameter of the pulsating heat pipe on a side away from the temperature homogenizing plate.
10. A heat dissipation system, characterized in that: include: A heat dissipation device, which is the heat dissipation device according to any one of claims 1 to 9; The heat generating element is thermally connected to the temperature averaging plate of the heat dissipation device.