Fin and heat dissipation device
By setting up bypass pipelines in parallel in the pulsating heat pipes of the fins, the problem of insufficient heat dissipation effect of existing heat dissipation devices in outdoor scenes is solved, and a more efficient heat dissipation effect is achieved.
Patent Information
- Application Number
- CN202421521718.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-28
- Publication Date
- 2025-05-23
- Estimated Expiration
- 2034-06-28
AI Technical Summary
The existing heat dissipation devices are difficult to meet the heat dissipation needs of electronic products with large heat generation in outdoor scenarios, especially under space and material limitations, and the heat dissipation effect is insufficient.
A fin and heat dissipation device are designed, and a pulsating heat pipe is used. The pulsating heat pipe includes the main pipe line and the bypass pipe line. The bypass pipe line and the main pipe line form a parallel area, which is located in the evaporation section or the evaporation section and the insulating section, so as to increase the mass of the phase change medium and the heat absorption area of the evaporation section.
By setting up bypass pipelines in parallel on the main pipeline away from the condensation section, the pipeline distribution in the evaporation section is more dense, and the heat absorption area and the quality of phase change medium are improved, so as to quickly achieve heat dissipation in scenarios with large heat generation and improve the overall heat dissipation effect.
Smart Images
Figure CN222897452U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of electronic heat dissipation, and in particular to a fin and a heat dissipation device. Background Art
[0002] With the vigorous development of the electronic cooling industry and the iterative updates of electronic products, the power of chips is getting higher and higher, and the heat is getting higher and higher, which leads to some communication equipment that uses natural convection for heat dissipation requiring better cooling devices to meet the requirements of outdoor heat dissipation.
[0003] Most existing heat dissipation devices use fins or pulsating heat pipes to dissipate heat. However, due to the limitations of space size and the materials themselves, the heat dissipation effect still cannot meet the needs of some outdoor heat dissipation scenarios with high heat generation. Utility Model Content
[0004] In view of this, the present application is dedicated to providing a fin and a heat dissipation device with better heat dissipation effect.
[0005] In order to achieve the above objectives, this application provides the following technical solutions:
[0006] A fin comprises a body for heat-conducting connection with a heating element and a pulsating heat pipe arranged on the body, wherein the pulsating heat pipe has an evaporation section, an insulation section and a condensation section;
[0007] The pulsating heat pipe includes a main pipeline and a bypass pipeline, both ends of the bypass pipeline are connected to the main pipeline, so that the bypass pipeline is partially connected in parallel with the main pipeline to form a parallel area, and the parallel area is far away from the condensing section.
[0008] Preferably, the parallel region is located in the evaporation section.
[0009] Preferably, a plurality of the bypass pipes are provided and arranged in a direction perpendicular to the evaporation section to the condensation section.
[0010] Preferably, the main pipeline has a straight pipeline and a curved pipeline, the straight pipeline is connected to the side of the curved pipeline away from the evaporation section; the curved pipeline is distributed in a serpentine shape and has a plurality of straight pipe sections arranged in parallel and a curved pipe section connecting two adjacent straight pipe sections;
[0011] Wherein, two ends of the bypass pipeline are respectively connected to the straight pipe portion and the curved pipe portion; or, two ends of the bypass pipeline are respectively connected to two adjacent straight pipe portions.
[0012] Preferably, the bypass line extends in a direction parallel to a direction from the evaporation section to the condensation section.
[0013] Preferably, the extension direction of the straight tube portion is parallel to the direction from the evaporation section to the condensation section.
[0014] Preferably, the pulsating heat pipe is laid and heat-conductively connected to the outer surface of the body, or the pulsating heat pipe is arranged inside the body.
[0015] A heat dissipation device comprises a temperature averaging plate and fins, wherein the temperature averaging plate is used for thermally connecting to a heating element, and the fins are thermally connected to the temperature averaging plate, wherein the fins are the fins as described in any one of the above items.
[0016] Preferably, a plurality of fins are provided on the temperature homogenizing plate, and the plurality of fins are distributed in parallel and are provided on a side of the temperature homogenizing plate away from the heat generating element.
[0017] Preferably, the temperature homogenizing plate comprises:
[0018] A bottom plate, located on a side of the temperature homogenizing plate away from the fins, and thermally connected to the heat generating element;
[0019] A cover plate, located on a side of the temperature homogenizing plate close to the fins and thermally connected to the fins;
[0020] Among them, grooves are provided on the bottom plate and / or the cover plate so that the bottom plate and the cover plate cooperate to form a uniform temperature chamber, and the surface of the bottom plate used to form the uniform temperature chamber is the first surface, and the first surface is provided with a capillary structure layer.
[0021] It can be seen from the above technical solution that in the fins provided by the present application, the pulsating heat pipe includes a main line and a bypass line. The main line constitutes the main part of the pulsating heat pipe, which is a closed-loop pipeline connected end to end. The two ends of the bypass line are respectively connected to two different positions of the main line, so that the bypass line and the main line are partially connected in parallel to form a parallel area. The parallel area is located at a position away from the condensation section on the pulsating heat pipe, that is, the parallel area is in the evaporation section, or the parallel area is in the evaporation section and the insulation section. In this way, by setting the bypass line in parallel on the main line away from the condensation section, the pipeline distribution of the evaporation section can be made denser, thereby increasing the amount of phase change medium in the evaporation section and the heat absorption area. When the heat generation of the heating element is large, the evaporation section of the pulsating heat pipe can quickly absorb heat to quickly achieve heat dissipation and quickly transfer heat to the entire surface of the body, which is conducive to improving the heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS
[0022] Figure 1 Shown is an exploded view of a heat dissipation device provided in an embodiment of the present application;
[0023] Figure 2 Shown is a cross-sectional view of a heat dissipation device provided in an embodiment of the present application;
[0024] Figure 3 The front view of the fin provided in the embodiment of the present application is shown. Figure 1 ;
[0025] Figure 4 The front view of the fin provided in the embodiment of the present application is shown. Figure 2 ;
[0026] Figure 5 The front view of the fin provided in the embodiment of the present application is shown. Figure 3 .
[0027] exist Figure 1-Figure 5 middle:
[0028] 1-temperature averaging plate, 2-fins, 3-liquid injection pipe, 4-heating element;
[0029] 11-bottom plate, 12-capillary structure layer, 13-cover plate;
[0030] 111 - support column, 112 - connection protrusion, 113 - first surface, 114 - second surface, 131 - assembly groove;
[0031] 21-body, 22-pulsating heat pipe;
[0032] 221-straight pipeline, 222-curved pipeline; 223-bypass pipeline;
[0033] 2221-straight pipe part, 2222-bent pipe part. DETAILED DESCRIPTION
[0034] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.
[0035] First of all, it should be noted that the heat dissipation device in the present application is suitable for scenarios where natural convection is used for heat dissipation, for example, it is suitable for scenarios where heat is dissipated in outdoor communication base stations, or it is also suitable for scenarios where heat is dissipated in outdoor electronic equipment cabinets.
[0036] like Figure 1-5As shown, an embodiment of the present application discloses a fin, including a main body 21 and a pulsating heat pipe 22, the main body 21 is used for thermal connection with the heating element 4, the pulsating heat pipe 22 is arranged on the main body 21, during the heat dissipation process, the heat on the heating element 4 is transferred to the main body 21, and then the heat is dissipated through the pulsating heat pipe 22 and the heat is transferred to the entire heat dissipation surface of the main body 21, so that the heat dissipation space is fully utilized, which is beneficial to improving the heat dissipation efficiency.
[0037] Among them, the pulsating heat pipe 22 has an evaporation section, an insulation section and a condensation section. When in use, the evaporation section is closer to the heating element 4 relative to the condensation section, and the insulation section is located between the evaporation section and the condensation section. In the evaporation section, the phase change medium absorbs heat to generate bubbles, which expand and increase pressure rapidly, pushing the phase change medium to flow to the low-temperature condensation section. In the condensation section, the bubbles cool, shrink and burst, and the pressure drops. Due to the pressure difference between the evaporation section and the condensation section and the pressure imbalance between adjacent pipelines, the phase change medium oscillates and flows between the evaporation section and the condensation section, thereby realizing heat transfer.
[0038] The pulsating heat pipe 22 includes a main pipeline and a bypass pipeline 223. The main pipeline constitutes the main flow channel part of the pulsating heat pipe 22, which is a closed-loop pipeline connected end to end. The two ends of the bypass pipeline 223 are respectively connected to two different positions of the main pipeline, such as the first position and the second position of the main pipeline, so that the bypass pipeline 223 and a part of the main pipeline (the part is defined as the first pipeline between the first position and the second position on the main pipeline) are connected in parallel to form a parallel area. The parallel area is located at a position away from the condensing section on the pulsating heat pipe 22, that is, the parallel area is in the evaporating section, or the parallel area is in the evaporating section and the adiabatic section. Since the parallel area is the area where the bypass pipeline 223 and the first pipeline are located, the bypass pipeline 223 and the first pipeline are both set away from the condensing section.
[0039] In this way, by setting a bypass pipe 223 in parallel on the main pipe away from the condensing section, the pipe distribution of the evaporating section can be made denser, thereby increasing the amount of phase change medium and the heat absorption area of the evaporating section. When the heat generated by the heating element 4 is large, the evaporating section of the pulsating heat pipe can quickly absorb heat so that the heat is transferred to the entire surface of the main body 21, which is beneficial to improving the heat dissipation effect.
[0040] In the specific scheme, the parallel area is set in the evaporation section so that the bypass pipeline 223 and the first pipeline are close to the heating element 4. The evaporation section pipeline of the pulsating heat pipe 22 is denser than other positions, making it easier to exchange heat with the heating element 4 and can exchange heat to a greater extent, further improving the heat dissipation effect.
[0041] In some preferred schemes, the diameter of the bypass pipeline 223 is smaller than the diameter of the main pipeline. Since the bypass pipeline 223 and the first pipeline are connected in parallel, the bypass pipeline 223 and the first pipeline form a loop, and the first pipeline constitutes a part of the loop of the entire main pipeline. If the diameter of the bypass pipeline 223 is too large, it will affect the loop formed by the main pipeline. Here, by making the diameter of the bypass pipeline 223 smaller than the diameter of the main pipeline, the heat absorption effect of the evaporation section can be improved, and a better oscillation effect can be ensured in the main pipeline.
[0042] There are multiple bypass pipes 223, and they are arranged along a direction perpendicular to the evaporation section to the condensation section (defined in this article as the first direction, i.e., the direction close to and away from the heating element 4). For example, multiple bypass pipes 223 can be evenly distributed in the evaporation section, thereby enhancing the heat absorption effect of the entire evaporation section.
[0043] It should be noted that the number of bypass pipes 223 can be designed according to the required pipe density, and can also be designed for different heating areas of the heating element 4. For example, in the area of the heating element 4 with higher heat generation, the pipe density of the evaporation section is higher, and the number of bypass pipes 223 is larger; in the area of the heating element 4 with lower heat generation, the pipe density of the evaporation section is lower, and the number of bypass pipes 223 is smaller.
[0044] In some embodiments, the pulsating heat pipe 22 includes a straight line 221 and a curved line 222, and the straight line 221 is located on the side of the curved line 222 away from the evaporation section (heating element 4). That is, the straight line 221 of the pulsating heat pipe 22 in this embodiment is located in the condensation section of the pulsating heat pipe 22, and the curved line 222 of the pulsating heat pipe 22 is located in the evaporation section and the insulation section of the pulsating heat pipe 22. In this way, after the phase change medium inside the pulsating heat pipe 22 absorbs heat and generates bubbles, it is easier to move toward the condensation section of the pulsating heat pipe 22, thereby improving the heat dissipation efficiency.
[0045] The curved pipeline 222 is distributed in a serpentine shape, that is, the curved pipeline 222 has a plurality of straight pipe parts 2221 and a plurality of curved pipe parts 2222, and the plurality of straight pipe parts 2221 are arranged in parallel on the main body 21, for example, the plurality of straight pipe parts 2221 are evenly distributed in a direction parallel to the main body 21, and the ends of two adjacent straight pipe parts 2221 are connected by a curved pipe part 2222, so that the plurality of straight pipe parts 2221 and the plurality of curved pipe parts 2222 are connected to form a serpentine curved pipeline 222. In this way, the pulsating heat pipe 22 can be evenly distributed on the main body 21, and the heat is evenly diffused to various parts of the heat dissipation surface of the main body 21 through the pulsating heat pipe 22, which is more conducive to fully utilizing the heat dissipation surface of the main body 21 of the fin 2, thereby improving the heat dissipation efficiency.
[0046] It should be understood that the above embodiment is only an example of the pulsating heat pipe 22 including a straight pipe 221 and a curved pipe 222, and the shape of the pulsating heat pipe 22 is exemplified, but the present application is not limited thereto. For example, the straight pipe 221 in the above embodiment can be modified into a curved tubular structure, that is, the entire pulsating heat pipe 22, whether it is the evaporation section or the condensation section, is a curved tubular structure. Moreover, the serpentine curved pipe 222 can be provided with a (for example Figure 3 and Figure 5 ), or two (such as Figure 4 ), the arrangement direction of the plurality of straight pipe portions 2221 in the curved pipeline 222 may be parallel to the first direction (eg Figure 3 ), or perpendicular to the first direction (e.g. Figure 4 ), and may also form an angle with the first direction (e.g. Figure 5 ).
[0047] Among them, the two ends of the bypass pipe 223 are respectively connected to the straight pipe portion 2221 and the curved pipe portion 2222 of the curved pipe 222, or the two ends of the bypass pipe 223 are respectively connected to two adjacent straight pipe portions 2221. In this way, the span of the bypass pipe 223 is small, and the effect produced will only act on a local area of the pulsating heat pipe 22, and will not affect the operation of the entire pulsating heat pipe 22.
[0048] In some preferred schemes, the extension direction of the bypass pipe 223 is parallel to the direction from the evaporation section to the condensation section (i.e., the first direction). During the heat dissipation process, the phase change medium in the bypass pipe 223 absorbs heat and expands to form bubbles, which will then move along the extension direction of the bypass pipe 223. By making the extension direction of the bypass pipe 223 parallel to the first direction, the bubbles can be quickly moved to the condensation section.
[0049] The extension direction of the straight pipe portion 2221 is parallel to the direction from the evaporation section to the condensation section (i.e., the first direction), so that the extension direction of the bypass pipe 223 is parallel to the extension direction of the straight pipe portion 2221. In this way, the bypass pipe 223 and the straight pipe portion 2221 both have a good flow rate, which is conducive to improving the heat conduction effect of the pulsating heat pipe 22.
[0050] like Figure 3 As shown, the plurality of straight pipe portions 2221 in the curved pipe 222 all extend along the first direction, and the arrangement direction of the plurality of straight pipe portions 2221 is perpendicular to the first direction. The bypass pipe 223 is arranged on the connected straight pipe portions 2221 and the curved pipe portions 2222, and the extending direction of the bypass pipe 223 is parallel to the first direction. The number of the bypass pipes 223 is less than the number of the straight pipe portions 2221, and a bypass pipe 223 is arranged for every four straight pipe portions 2221.
[0051] like Figure 4As shown, there are two curved pipelines 222, the extension direction of the straight pipe portion 2221 in the first curved pipeline 222 is perpendicular to the first direction, the arrangement direction of the plurality of straight pipe portions 2221 is parallel to the first direction, and in the curved pipeline 222, the bypass pipeline 223 connects two adjacent straight pipe portions 2221, and the extension direction is parallel to the first direction. The extension direction of the straight pipe portion 2221 in the second curved pipeline 222 is parallel to the first direction, the arrangement direction of the plurality of straight pipe portions 2221 is perpendicular to the first direction, and in the curved pipeline 222, the bypass pipeline 223 is arranged on the connected straight pipe portion 2221 and the curved pipe portion 2222, and the extension direction of the bypass pipeline 223 is parallel to the first direction.
[0052] like Figure 5 As shown, the extension direction of the straight pipe portion 2221 in the curved pipe 222 forms an angle with the first direction, and the arrangement direction of the plurality of straight pipe portions 2221 is perpendicular to the first direction. The bypass pipe 223 is arranged on two adjacent straight pipe portions 2221, and the extension direction of the bypass pipe 223 is parallel to the first direction. The number of the bypass pipes 223 is less than the number of the straight pipe portions 2221, and a bypass pipe 223 is arranged for every two straight pipe portions 2221.
[0053] As mentioned above, the pulsating heat pipe 22 is disposed on the body 21 of the fin 2. It should be noted here that the pulsating heat pipe 22 can be disposed on the surface of the body 21 or integrated into the inside of the body 21. For example:
[0054] In some embodiments, the pulsating heat pipe 22 is a bent aluminum tube, which is connected end to end and laid on the outer surface of the body 21. Specifically, the aluminum tube is connected to the surface of the body 21 by welding. In this arrangement, since the pulsating heat pipe 22 is exposed on the surface of the fin 2, it is easier to detect, and part of the outer surface of the pulsating heat pipe 22 can be used as a heat dissipation surface, thereby increasing the heat dissipation area and improving the heat dissipation efficiency.
[0055] In other embodiments, the pulsating heat pipe 22 is a fine channel arranged inside the body 21 and formed by the inflation process. In this arrangement, since there is no need to introduce a welding process, the process steps can be simplified, and at the same time, the damage to the body 21 and the pulsating heat pipe 22 caused by high temperature during the welding process can be avoided, thereby improving the yield rate. At the same time, since the pulsating heat pipe 22 is hidden inside the body 21, the body 21 serves as a protective shell for the pulsating heat pipe 22, making it less likely to be damaged.
[0056] In addition, if Figure 2As shown, a liquid injection pipe 3 is also provided on the body 21 of the fin 2, and the liquid injection pipe 3 is connected to the pulsating heat pipe 22, so as to add a phase change medium for heat conduction inside the pulsating heat pipe 22 to ensure the normal operation of the pulsating heat pipe 22. It should be noted that, in the working state, the liquid injection pipe 3 is in a closed state to ensure the sealing of the pulsating heat pipe 22 and the circulation of the phase change medium inside the pulsating heat pipe 22.
[0057] The embodiment of the present application also provides a heat dissipation device, including a temperature equalizing plate 1 and fins 2. The temperature equalizing plate 1 is used for thermal connection with the heating element 4, and the fins 2 are thermally connected with the temperature equalizing plate 1. With the good thermal conductivity and temperature equalization performance of the temperature equalizing plate 1, during the heat dissipation process, the heat generated by the heating element 4 can be quickly and evenly transferred to the fins 2, thereby improving the heat dissipation efficiency and heat dissipation effect of the heat dissipation device.
[0058] Among them, the fin 2 is the fin 2 in the above embodiment. In this way, by setting the bypass pipeline 223 in parallel on the main pipeline far away from the condensing section, the pipeline distribution of the evaporation section can be made denser, thereby increasing the amount of phase change medium and the heat absorption area of the evaporation section. When the heat generation of the heating element 4 is large, the evaporation section of the pulsating heat pipe can quickly absorb heat, so that the heat is transferred to the entire surface of the body 21, which is conducive to improving the heat dissipation effect.
[0059] There are multiple fins 2 on the temperature equalizing plate 1 (for example, there may be two or three, or more than ten). The multiple fins 2 are evenly distributed on the side of the temperature equalizing plate 1 away from the heat-generating element 4. In this way, on the one hand, the multiple fins 2 can increase the heat dissipation area of the heat dissipation device, thereby improving the heat dissipation efficiency of the heat dissipation device; on the other hand, the multiple fins 2 are evenly distributed, which can improve the uniformity of heat dissipation and thus ensure the heat dissipation effect.
[0060] In the direction perpendicular to the main body 21, the projection of each part of the pulsating heat pipe 22 is located on the main body 21, and the side of the pulsating heat pipe 22 close to the temperature equalizing plate 1 is not in contact with the temperature equalizing plate 1, that is, the pulsating heat pipe 22 in the embodiment of the present application is completely arranged on the main body 21 of the fin 2, and in the assembled state, there is a gap between the side of the pulsating heat pipe 22 close to the temperature equalizing plate 1 and the temperature equalizing plate 1. In this way, during the assembly process, after the connection between the fin 2 and the temperature equalizing plate 1 is completed, there is no need to connect the pulsating heat pipe 22 to the temperature equalizing plate 1, thereby simplifying the process and avoiding the problem of low yield caused by the connection between the pulsating heat pipe 22 and the temperature equalizing plate 1. In addition, since there is no contact between the pulsating heat pipe 22 and the temperature equalizing plate 1, the influence of the pulsating heat pipe 22 on the temperature equalizing performance of the temperature equalizing plate 1 can be reduced, the temperature equalizing performance of the temperature equalizing plate 1 can be fully utilized, and the heat dissipation effect of the heat dissipation device can be improved.
[0061] In some embodiments, the temperature plate 1 and the fins 2 are connected by welding (e.g., brazing) to achieve a heat conductive connection between the two. In this connection mode, the temperature plate 1 and the fins 2 have a high connection strength, and can ensure good contact between the temperature plate 1 and the fins 2, thereby ensuring the heat conductive performance between the two.
[0062] In other embodiments, the temperature averaging plate 1 and the fins 2 are connected by interlocking to achieve a heat-conducting connection between the two. Specifically, a plurality of assembly grooves 131 capable of interference fit with the fins 2 are provided on the temperature averaging plate 1, and during assembly, the fins 2 are simply inserted into the assembly grooves 131 on the temperature averaging plate 1; this connection method makes it easier to connect the fins 2 and the temperature averaging plate 1, and since there is no metallurgical connection between the fins 2 and the temperature averaging plate 1, it is easier to replace the fins 2 when they are damaged.
[0063] Furthermore, as described above, the heating element 4, the temperature equalizing plate 1 and the fin 2 are connected in sequence by thermal conduction. During operation of the heat dissipation device, the heat generated by the heating element 4 is transferred to the temperature equalizing plate 1 and the fin 2 in sequence, and the conduction direction on the fin 2 is: from the end of the fin 2 close to the temperature equalizing plate 1 to the end of the fin 2 away from the temperature equalizing plate 1. Correspondingly, based on the above, the heat transfer direction of the pulsating heat pipe 22 on the fin 2 is from the end close to the temperature equalizing plate 1 to the end away from the temperature equalizing plate 1, that is, the end of the pulsating heat pipe 22 on the fin 2 close to the temperature equalizing plate 1 is the evaporation section (that is, the end where the phase change medium inside the pulsating heat pipe 22 absorbs heat to generate bubbles and expands rapidly), and the end away from the temperature equalizing plate 1 is the condensation section (that is, the end where the bubbles inside the pulsating heat pipe 22 shrink and rupture).
[0064] In addition, if Figure 1 , 2As shown, the temperature equalizing plate 1 includes a bottom plate 11 and a cover plate 13, wherein the bottom plate 11 is located on a side of the temperature equalizing plate 1 away from the fins 2 and is thermally connected to the heating element 4, the cover plate 13 is located on a side of the temperature equalizing plate 1 close to the fins 2 and is thermally connected to the fins 2, a groove is provided on the bottom plate 11 and / or the cover plate 13, so that the bottom plate 11 and the cover plate 13 can cooperate to form a temperature equalizing cavity of the temperature equalizing plate 1, and the temperature equalizing cavity has a phase change medium, in addition, the surface of the bottom plate 11 for forming the temperature equalizing cavity is a first surface 113, the first surface 113 is provided with a capillary structure layer 12, in a normal state (that is, the heating element 4 does not generate heat, or generates heat) In a state of extremely low heat), the phase-change medium in the temperature-averaging chamber is located in the capillary structure layer 12. When the heating element 4 generates a large amount of heat during operation, the heat dissipation device starts to work. At this time, the heat generated by the heating element 4 is transferred to the phase-change medium in the temperature-averaging chamber through heat conduction. The phase-change medium undergoes a phase change after absorbing heat, that is, it changes from liquid to gas, and moves toward the side of the cover plate 13. Since the temperature on one side of the cover plate 13 is relatively low, the gaseous phase-change medium transfers the heat to the cover plate 13 on one side of the cover plate 13, and changes from gas to liquid, and returns to the capillary structure layer 12 to participate in the next phase change cycle.
[0065] Further, such as Figure 1 and 2 As shown in the figure, a plurality of support columns 111 are arranged in the temperature equalizing chamber, and one end of the support column 111 is connected to the bottom plate 11 , and the other end is connected to the cover plate 13 , so that the pressure resistance of the temperature equalizing plate 1 can be effectively increased.
[0066] In addition, in some embodiments, the surface of the cover plate 13 used to form the uniform temperature chamber is also provided with a capillary structure layer 12. In this way, the uniformity of the temperature on one side of the cover plate 13 can be further improved, thereby improving the heat dissipation effect of the heat dissipation device.
[0067] Furthermore, the surface of the bottom plate 11 connected to the heating element 4 is the second surface 114; Figure 2As shown, the part where the bottom plate 11 is connected to the heating element 4 is recessed in the direction away from the fin 2 to form a groove on the first surface 113, and a connecting protrusion 112 is formed on the second surface 114. Among them, the groove located on the first surface 113 can store more phase change medium, so that in the heat dissipation process, it can absorb more heat generated by the heating element 4 faster. The connecting protrusion 112 located on the second surface 114, as a boss connected to the heating element 4, can reduce the flatness requirements of the temperature plate 1 during the processing, thereby improving the yield rate and reducing the processing cost; specifically, as mentioned above, the temperature plate 1 is connected to the heating element 4 in a thermally conductive manner. In order to ensure the thermal conductivity efficiency, it is necessary to ensure that the connecting surface of the heating element 4 and the temperature plate 1 is closely fitted. On this basis, if the connecting protrusion 112 is not provided, it is necessary to strictly control the flatness of the entire first surface 113 of the bottom plate 11. After the connecting protrusion 112 is provided, it is only necessary to ensure the flatness of the area corresponding to the connecting protrusion 112 in the first surface 113, which greatly reduces the processing difficulty. In addition, the arrangement of the connecting protrusion 112 provides an escape space between the temperature averaging plate 1 and the heating element 4 , which is more conducive to the connection between the temperature averaging plate 1 and the heating element 4 .
[0068] The basic principles of the present application are described above in conjunction with specific embodiments. However, it should be noted that the advantages, strengths, effects, etc. mentioned in the present application are only examples and not limitations, and it cannot be considered that these advantages, strengths, effects, etc. are required by each embodiment of the present application. In addition, the specific details disclosed above are only for the purpose of illustration and ease of understanding, not for limitation, and the above details are not limited to the present application must be implemented by using the above specific details.
[0069] It should also be noted that in the apparatus, device and method of the present application, each component or each step can be decomposed and / or recombined. Such decomposition and / or recombination should be regarded as equivalent solutions of the present application.
[0070] The above description of the disclosed aspects is provided to enable any person skilled in the art to make or use the present application. Various modifications to these aspects will be readily apparent to those skilled in the art, and the general principles defined herein may be applied to other aspects without departing from the scope of the present application. Therefore, the present application is not intended to be limited to the aspects shown herein, but rather to the widest scope consistent with the principles and novel features disclosed herein.
[0071] It should be understood that the qualifiers "first", "second", "third", "fourth", "fifth" and "sixth" used in the description of the embodiments of the present application are only used to more clearly explain the technical solutions and cannot be used to limit the scope of protection of the present application.
[0072] The above description has been given for the purpose of illustration and description. In addition, this description is not intended to limit the embodiments of the present application to the forms disclosed herein. Although multiple example aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, changes, additions and sub-combinations thereof.
Claims
1. A fin, characterized in that: It comprises a body for heat-conducting connection with a heating element and a pulsating heat pipe arranged on the body, wherein the pulsating heat pipe has an evaporation section, an insulation section and a condensation section; The pulsating heat pipe includes a main pipeline and a bypass pipeline, both ends of the bypass pipeline are connected to the main pipeline, so that the bypass pipeline is partially connected in parallel with the main pipeline to form a parallel area, and the parallel area is far away from the condensing section.
2. The fin according to claim 1, characterized in that: The parallel region is located in the evaporation section.
3. The fin according to claim 1, characterized in that: The bypass pipelines are provided in plurality and are arranged in a direction perpendicular to the evaporation section to the condensation section.
4. The fin according to claim 1, characterized in that: The main pipeline has a straight pipeline and a curved pipeline, the straight pipeline is connected to the side of the curved pipeline away from the evaporation section; the curved pipeline is distributed in a serpentine shape and has a plurality of straight pipe parts arranged in parallel and a curved pipe part connecting two adjacent straight pipe parts; Wherein, two ends of the bypass pipeline are respectively connected to the straight pipe portion and the curved pipe portion; or, two ends of the bypass pipeline are respectively connected to two adjacent straight pipe portions.
5. The fin according to claim 4, characterized in that: The bypass pipeline extends in a direction parallel to a direction from the evaporation section to the condensation section.
6. The fin according to claim 5, characterized in that: The extension direction of the straight tube portion is parallel to the direction from the evaporation section to the condensation section.
7. The fin according to claim 1, characterized in that: The pulsating heat pipe is laid and heat-conductingly connected to the outer surface of the body, or the pulsating heat pipe is arranged inside the body.
8. A heat dissipation device, characterized in that: It comprises a temperature averaging plate and fins, wherein the temperature averaging plate is used for thermally connecting with the heating element, and the fins are thermally connected with the temperature averaging plate, wherein the fins are the fins according to any one of claims 1 to 7.
9. The heat dissipation device according to claim 8, characterized in that: A plurality of fins are arranged on the temperature averaging plate, and the plurality of fins are distributed in parallel and arranged on a side of the temperature averaging plate away from the heat generating element.
10. The heat dissipation device according to claim 8, characterized in that: The temperature homogenizing plate comprises: A bottom plate, located on a side of the temperature homogenizing plate away from the fins, and thermally connected to the heat generating element; A cover plate, located on a side of the temperature homogenizing plate close to the fins and thermally connected to the fins; Among them, grooves are provided on the bottom plate and / or the cover plate so that the bottom plate and the cover plate cooperate to form a uniform temperature chamber, and the surface of the bottom plate used to form the uniform temperature chamber is the first surface, and the first surface is provided with a capillary structure layer.