Multi-layer air cooling radiator
By designing a multi-layer air-cooled radiator, using multi-layer heat dissipation channels and circulating refrigeration medium, the problem of insufficient efficiency of traditional single-layer radiator is solved, and efficient heat dissipation of high-power components is achieved.
Patent Information
- Application Number
- CN202421774205.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-24
- Publication Date
- 2025-05-23
- Estimated Expiration
- 2034-07-24
AI Technical Summary
Traditional single-layer air-cooled radiators cannot effectively meet the heat dissipation needs of high-power components, and the heat dissipation efficiency is insufficient.
A multi-layer air-cooled radiator is designed, including a heat dissipation plate, runner, inlet and outlet near the heat dissipation element, as well as a multi-layer heat dissipation channel and conveying pipe, and heat exchange is performed between the heat dissipation plate and the heat dissipation channel through a circulating liquid refrigeration medium.
Through multi-layer heat dissipation channels and circulating refrigeration medium, the heat dissipation efficiency is significantly improved and the continuous and effective heat dissipation of high-power components is achieved.
Smart Images
Figure CN222897465U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of radiators, and in particular to a multi-layer air-cooled radiator. Background Art
[0002] With the rapid development of computer, communication and military electronics, the heat dissipation problem of high-power components has become increasingly prominent. Traditional air-cooled heat sinks are usually designed as single-layer heat dissipation channels, and their heat dissipation effect can no longer meet the heat dissipation requirements of current high-power components. Therefore, how to improve the heat dissipation efficiency of the heat sink has become an urgent problem to be solved. Utility Model Content
[0003] In order to improve the heat dissipation efficiency of the radiator, the present application provides a multi-layer air-cooled radiator.
[0004] The multi-layer air-cooled radiator provided in this application adopts the following technical solution:
[0005] A multi-layer air-cooled radiator comprises a heat sink arranged near a heat sink element, a flow channel for circulating a refrigerant medium being arranged inside the heat sink, an inlet and an outlet for communicating with the flow channel being opened on the heat sink, and a delivery pipe and a multi-layer heat dissipation channel being arranged outside the heat sink; one end of the multi-layer heat dissipation channel is connected to the inlet, and the other end of the multi-layer heat dissipation channel is connected to the outlet through the delivery pipe.
[0006] By adopting the above technical solution, during use, the liquid refrigerant first absorbs the heat generated by the heating element inside the heat sink and then vaporizes into gas; then, the gaseous refrigerant enters the heat dissipation channel, is cooled and liquefied under the action of the air cooling device, and finally the liquid refrigerant returns to the heat sink through the delivery pipe again, and the cycle repeats, thereby achieving continuous heat dissipation of the heating element. In addition, by setting up multiple layers of heat dissipation channels, the heat dissipation efficiency can be further improved.
[0007] Preferably, the included angle between the heat dissipation channel and the horizontal plane is set to 20°-30°, and one end of the heat dissipation channel close to the heat dissipation plate is away from the horizontal plane.
[0008] By adopting the above technical solution, it can be ensured that the gaseous refrigerant medium has enough time to fully contact with the surrounding environment in the heat dissipation channel to perform heat exchange, thereby being more effectively converted into liquid.
[0009] Preferably, each layer of the heat dissipation channel includes a plurality of heat dissipation pipes, and a first manifold connected to the plurality of heat dissipation pipes is provided at one end of the heat dissipation channel close to the heat dissipation plate, and the first manifold is connected to the outlet through a conduit.
[0010] By adopting the above technical solution, the first manifold is used to distribute the refrigerant medium to each heat dissipation tube as evenly as possible, thereby avoiding differences in heat dissipation effects caused by uneven distribution.
[0011] Preferably, a second manifold connected to the plurality of heat dissipation tubes is provided at one end of the heat dissipation channel away from the heat dissipation plate, and the second manifold is connected to the inlet through the delivery pipe.
[0012] By adopting the above technical solution, the second manifold can be used to distribute the refrigerant medium in the plurality of heat dissipation pipes to the delivery pipe as evenly as possible.
[0013] Preferably, adjacent second manifolds are connected by a connecting pipe, and the delivery pipe is connected to the second manifold located at the bottom layer.
[0014] By adopting the above technical solution, the refrigerant in the second manifold of the upper layer can enter the second manifold of the lower layer through the connecting pipe, so that the refrigerant in the second manifold can flow back to the heat sink. By providing the connecting pipe, the overall structure is simplified.
[0015] Preferably, a valve is provided on the second manifold.
[0016] By adopting the above technical solution, a vacuum can be achieved by setting a valve, and when the refrigerant medium is insufficient, the refrigerant medium can be supplemented through the valve.
[0017] Preferably, the delivery pipes are provided in plurality, and the inlets are provided in plurality and are connected to the delivery pipes in a one-to-one correspondence.
[0018] By adopting the above technical solution and arranging a plurality of delivery pipes, the refrigerant medium flowing back into the heat sink can be distributed more evenly.
[0019] Preferably, a plurality of the outlets are provided, and the plurality of the outlets are divided into a plurality of rows corresponding to the multi-layer heat dissipation channels, and at least one outlet is provided in each row.
[0020] By adopting the above technical solution and providing multiple outlets, the gaseous refrigerant medium in the flow channel can enter the multi-layer heat dissipation channel more quickly and fully, thereby further improving the heat dissipation effect.
[0021] Preferably, it also includes an air cooling device arranged close to the heat dissipation channel.
[0022] By adopting the above technical solution and providing an air cooling device, the cooling speed of the gaseous refrigerant medium in the heat dissipation pipeline can be accelerated, thereby ensuring that the gaseous refrigerant medium can be converted into a liquid refrigerant medium as much as possible.
[0023] In summary, the present application includes at least one of the following beneficial technical effects: during the heating process of the heating element, the liquid refrigerant in the heat sink absorbs heat and vaporizes, and then the gaseous refrigerant enters the heat dissipation channel through the conduit and the first manifold. The air cooling device cools the gaseous refrigerant in the heat dissipation channel and converts it into liquid. Afterwards, the liquid refrigerant returns to the heat sink through the second manifold and the delivery pipe, and the cycle repeats to achieve the heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS
[0024] Figure 1 It is a schematic diagram of the overall structure of an embodiment of the present application;
[0025] Figure 2 It is a schematic diagram of the explosion structure of an embodiment of the present application.
[0026] Figure numerals: 1, heat sink; 11, inlet; 12, outlet; 2, heat dissipation channel; 21, heat dissipation pipe; 3, delivery pipe; 4, first manifold; 5, second manifold; 6, conduit; 7, connecting pipe; 8, valve. DETAILED DESCRIPTION
[0027] The following is combined with Figure 1-2 This application is described in further detail.
[0028] The embodiment of the present application discloses a multi-layer air-cooled heat sink.
[0029] Reference Figure 1 and Figure 2 A multi-layer air-cooled radiator includes a heat sink 1 arranged near a heating element, and a plurality of flow channels are arranged inside the heat sink 1, a refrigerant medium flows inside the flow channels, and an inlet 11 and an outlet 12 connected to the flow channels are opened on the heat sink 1. A multi-layer heat dissipation channel 2 and a delivery pipe 3 are arranged on the same side of the heat sink 1, one end of the multi-layer heat dissipation channel 2 is connected to the outlet 12 of the flow channel, and the other end of the multi-layer heat dissipation channel 2 is connected to the inlet 11 of the flow channel through the delivery pipe 3, and air cooling devices are arranged on opposite sides of the multi-layer heat dissipation channel 2. The heat dissipation efficiency can be improved by arranging the multi-layer heat dissipation channel 2. During use, the liquid refrigerant first absorbs the heat generated by the heating element inside the heat sink 1 and then vaporizes into a gaseous state; then, the gaseous refrigerant enters the heat dissipation channel 2, is cooled and liquefied under the action of the air cooling device, and finally the liquid refrigerant returns to the heat sink 1 through the delivery pipe 3 again, and this cycle is repeated to achieve continuous heat dissipation of the heating element.
[0030] The heat dissipation plate 1 is integrally in the shape of a rectangular plate, and the flow channels in the heat dissipation plate 1 are laid inside the heat dissipation plate 1. The outlet 12 is arranged close to the side of the heat dissipation plate 1 in the length direction, and there are multiple rows of outlets 12 arranged along the short dimension direction of the heat dissipation plate 1, and each row of outlets 12 corresponds to each layer of the heat dissipation channels 2. The inlet 11 is arranged on the side of the heat dissipation plate 1 in the length direction away from the outlet 12, and there is one row of inlets 11. In this embodiment, there are three inlets 11, and there are a total of six outlets 12 with three in each row, and the multiple inlets 11 and the multiple outlets 12 in each row are equidistantly arranged along the length direction of the heat dissipation plate 1.
[0031] In this embodiment, there are two layers of heat dissipation channels 2. In addition, more than two layers of heat dissipation channels 2 can be set according to actual requirements. Each layer of the heat dissipation channels 2 is provided with a plurality of sheet-shaped heat dissipation tubes 21 arranged in parallel, and the length direction surfaces of the plurality of heat dissipation tubes 21 are all parallel and perpendicular to the plate surface of the heat dissipation plate 1. In this embodiment, the heat dissipation channels 2 are made of aluminum alloy material to facilitate improving the heat dissipation effect. At both ends of each layer of the heat dissipation channels 2 in the length direction, a cylindrical tubular first manifold 4 and a second manifold 5 are respectively arranged, and the length directions of the first manifold 4 and the second manifold 5 are both parallel to the length direction of the heat dissipation plate 1. Both ends of the plurality of heat dissipation tubes 21 are communicated with the first manifold 4 and the second manifold 5, and the first manifold 4 is arranged close to the heat dissipation plate 1.
[0032] Two first manifolds 4 are communicated with the ducts 6 corresponding to two rows of a plurality of outlets 12, and the other ends of the ducts 6 are communicated with the outlets 12 one by one. The gaseous refrigeration medium in the flow channels can be converged into the first manifold 4 through the plurality of ducts 6, then flow from the first manifold 4 into the plurality of heat dissipation channels 2, and then flow from the plurality of heat dissipation channels 2 into the second manifold 5. A connecting pipe 7 is communicated between the two second manifolds 5. The delivery pipe 3 is arranged on the second manifold 5 close to the outlet 12, and the delivery pipe 3 is located at the end of the second manifold 5 away from the connecting pipe 7. By setting the connecting pipe 7, the refrigeration medium in the upper layer of the second manifold 5 can flow into the second manifold 5, so that the liquid cooling medium in the two second manifolds 5 can enter the delivery pipe 3.
[0033] The delivery pipe 3 is integrally in the shape of an L-shaped tube, and in this embodiment, there are three delivery pipes 3, and the three delivery pipes 3 are equidistantly arranged along the length direction of the second manifold 5. One end of each delivery pipe 3 is communicated with the second manifold 5 of the lower layer, and the other end is communicated with the adjacent inlet 11. By setting the plurality of delivery pipes 3 and the inlets 11, the refrigeration medium flowing back into the heat dissipation plate 1 can be distributed more evenly.
[0034] Preferably, the inclination angle between the heat dissipation channel 2 and the horizontal plane is set to 20°-30°, and the end of the heat dissipation channel 2 close to the heat dissipation plate 1 is away from the horizontal plane, so as to facilitate the circulation of gaseous and liquid refrigerant media while increasing the time of the refrigerant medium in the heat dissipation channel 2, so that the gaseous refrigerant medium can be more fully converted into liquid.
[0035] On this basis, a valve 8 for vacuuming is further provided on the second manifold 5, and in this embodiment, the valve 8 is provided above the second manifold 5 away from the delivery pipe 3. When the refrigerant medium is insufficient, the refrigerant medium can be supplemented through the valve 8.
[0036] The implementation principle of a multi-layer air-cooled radiator in an embodiment of the present application is as follows: during the heating process of the heating element, the liquid refrigerant medium in the heat sink 1 absorbs heat and vaporizes, and the gaseous refrigerant medium enters the heat dissipation channel 2 through the conduit 6 and the first manifold 4 in sequence; the gaseous refrigerant medium in the heat dissipation channel 2 is cooled by an air cooling device so that the gaseous refrigerant medium can be converted into a liquid refrigerant medium; then the liquid refrigerant returns to the heat sink 1 through the second manifold 5 and the delivery pipe 3 in sequence, thereby circulating to achieve the heat dissipation effect.
[0037] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.
Claims
1. A multi-layer air-cooled radiator, characterized in that: The invention comprises a heat dissipation plate (1) arranged near a heat dissipation element, wherein a flow channel for circulating a refrigerant medium is arranged inside the heat dissipation plate (1), an inlet (11) and an outlet (12) for communicating with the flow channel are provided on the heat dissipation plate (1), and a delivery pipe (3) and a multi-layer heat dissipation channel (2) are arranged outside the heat dissipation plate (1); one end of the multi-layer heat dissipation channel (2) is connected to the inlet (11), and the other end of the multi-layer heat dissipation channel (2) is connected to the outlet (12) via the delivery pipe (3).
2. A multi-layer air-cooled heat sink according to claim 1, characterized in that: The included angle between the heat dissipation channel (2) and the horizontal plane is set to 20°-30°, and the end of the heat dissipation channel (2) close to the heat dissipation plate (1) is away from the horizontal plane.
3. The multi-layer air-cooled heat sink according to claim 1, characterized in that: Each layer of the heat dissipation channel (2) comprises a plurality of heat dissipation tubes (21); one end of the heat dissipation channel (2) close to the heat dissipation plate (1) is provided with a first manifold (4) connected to the plurality of heat dissipation tubes (21); and the first manifold (4) is connected to the outlet (12) via a conduit (6).
4. A multi-layer air-cooled heat sink according to claim 3, characterized in that: A second manifold (5) connected to the plurality of heat dissipation tubes (21) is provided at one end of the heat dissipation channel (2) away from the heat dissipation plate (1), and the second manifold (5) is connected to the inlet (11) via the delivery tube (3).
5. A multi-layer air-cooled heat sink according to claim 4, characterized in that: A connecting pipe (7) is connected between adjacent second manifolds (5), and the delivery pipe (3) is connected to the second manifold (5) located at the bottom layer.
6. A multi-layer air-cooled heat sink according to claim 4, characterized in that: The second manifold (5) is provided with a valve (8).
7. The multi-layer air-cooled heat sink according to claim 1, characterized in that: A plurality of the delivery pipes (3) are provided, and a plurality of the inlets (11) are provided and are connected to the delivery pipes (3) in a one-to-one correspondence.
8. The multi-layer air-cooled heat sink according to claim 1, characterized in that: A plurality of the outlets (12) are provided, and the plurality of the outlets (12) are divided into a plurality of rows corresponding to the multi-layer heat dissipation channels (2), and at least one outlet (12) is provided in each row.
9. The multi-layer air-cooled heat sink according to claim 1, characterized in that: It also includes an air cooling device arranged close to the heat dissipation channel (2).