Electronic component processing base material gluing device

Abstract

The utility model relates to a base material gluing device for electronic component processing. The base material gluing device comprises an operation table, the top of the operation table is fixedly connected with a discharging table. The top of the operation table is fixedly connected with a linear motor; the output end of the linear motor is fixedly connected with an electric push rod; the end part of the electric push rod is fixedly connected with a fixed frame; the inner side wall of the fixing frame is rotationally connected with a brush roller. A supporting frame is fixedly connected to the bottom of the operation table. An air guide cover is fixedly connected to the bottom of the operation table; the bottom of the gas guide cover is fixedly connected with a connecting assembly; the bottom of the connecting assembly communicates with an air pump. A plurality of air holes are formed in the top of the discharging table; by means of the structure, the air pump and the air guide cover are arranged and matched with the discharging table and the air holes, when the flexible circuit board base material is glued, the flexible circuit board base material can be adsorbed and fixed to the discharging table through suction force of air exhaust, so that the stability of the position of the flexible circuit board base material during gluing is improved, and the situation that the material of the flexible circuit board base material is thin, and the production cost is reduced is reduced. Therefore, the problem of easy fixation is solved.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic component processing, in particular to a substrate gluing device for processing electronic components. Background Art

[0002] Flexible circuit board is an electronic component made of flexible substrate, usually polyester film, with high reliability and flexibility. The characteristics of this circuit board include light weight, thin thickness and good bendability.

[0003] During the processing of the film substrate of the existing flexible circuit board, a gluing process is usually required, and then the substrate is glued together. Usually, UV glue is applied to the film substrate, and then the substrates are glued together and the glue is cured. After long-term use observation, it is found that when the existing flexible circuit board is glued, a splint is usually used to clamp and fix the flexible circuit board. However, the thickness of the substrate of the flexible circuit board is usually thin, and there is a problem that the thin substrate is not easy to be clamped and fixed in position. Utility Model Content

[0004] To this end, the technical problem to be solved by the utility model is to overcome the problem in the prior art that when the flexible circuit board is coated with glue, the thickness of the substrate of the flexible circuit board is usually thin, and when it is fixed, it is usually clamped and fixed with a splint, which results in the thinner substrate being difficult to be clamped and fixed in position.

[0005] In order to solve the above technical problems, the utility model provides a device for coating glue on substrates for processing electronic components, comprising an operating table; a material discharge table is fixedly connected to the top of the operating table; a linear motor is fixedly connected to the top of the operating table; an electric push rod is fixedly connected to the output end of the linear motor; a fixed frame is fixedly connected to the end of the electric push rod; a brush roller is rotatably connected to the inner wall of the fixed frame; a support frame is fixedly connected to the bottom of the operating table; an air guide cover is fixedly connected to the bottom of the operating table; a connecting component is fixedly connected to the bottom of the air guide cover; an air pump is connected to the top of the connecting component; a plurality of air holes are opened on the top of the material discharge table; through the above structure, an air pump and an air guide cover are set, and in conjunction with the material discharge table and the air holes, when coating glue on the flexible circuit board substrate, the flexible circuit board substrate can be adsorbed and fixed on the material discharge table by the suction force of the exhaust, so as to improve the stability of the position of the flexible circuit board substrate during gluing, so as to reduce the situation where the flexible circuit board substrate is thin and is easily fixed.

[0006] In one embodiment of the utility model, the connecting assembly includes a filter box; the filter box is fixedly connected to the inner wall of the support frame; a pair of slide rails are fixedly connected to the inner wall of the filter box; a filter screen is installed in the slide rail; the filter screen slides in cooperation with the slide rail; through the above structure, the filter box and the filter screen are arranged to filter the airflow, thereby reducing the situation where impurities attached to the surface of the flexible circuit board substrate enter the air pump and cause blockage and damage, thereby increasing the service life of the air pump.

[0007] In one embodiment of the utility model, a plurality of card slots are provided on the top of the discharge table; a pair of card sleeves are installed in the middle of the brush roller; through the above structure, the card slots and the card sleeves are provided, and the width of the glue brushed on the brush roller can be changed to adapt to the width of flexible circuit board substrates of different sizes, thereby reducing the waste of glue and the situation where excess glue enters the air holes and causes blockage.

[0008] In one embodiment of the utility model, a UV lamp board is fixedly connected to the side wall of the fixing frame; a plurality of UV lamp beads are installed at the bottom of the UV lamp board; through the above structure, the UV lamp board and the UV lamp beads are arranged, and the UV glue on the surface of the flexible circuit board substrate can be irradiated with UV light after the glue coating is completed, so as to increase the solidification speed of the UV glue, reduce the flow caused by slow solidification of the glue, and cause uneven glue.

[0009] In one embodiment of the utility model, a lampshade is fixedly connected to the bottom of the ultraviolet lamp board; a plurality of prisms are fixedly connected to the inner wall of the lampshade; through the above structure, the prisms are arranged to reflect the ultraviolet light emitted by the ultraviolet lamp beads to increase the irradiation range of the ultraviolet light, to increase the contact surface between the ultraviolet light and the flexible circuit board substrate, thereby irradiating the glue on the flexible circuit board substrate more evenly.

[0010] In one embodiment of the utility model, a pair of fixed rods are fixedly connected to the top of the operating table; scrapers are fixedly connected to the ends of the fixed rods; through the above structure, fixed rods are arranged to connect the scrapers, and after the gluing work is completed, the residual glue on the surface of the brush roller can be cleaned to reduce the situation where the residual glue is inconvenient to clean, and at the same time, it can reduce the glue residue on the brush roller, which affects the next use.

[0011] In one embodiment of the utility model, a collection box is fixedly connected to the top of the operating table; the collection box is arranged at the bottom of the scraper; through the above structure, the collection box can be arranged to collect the residual glue scraped off the brush roller to reduce the situation where the residual glue falls on the surface of the operating table when it is cleaned up, causing dirt and difficulty in cleaning.

[0012] In one embodiment of the utility model, a sponge pad is placed inside the collection box; the sponge pad is square; through the above structure, the sponge pad can absorb the residual glue entering the collection box, so as to facilitate the removal of the collected residual glue from the collection box for processing, thereby improving the convenience of collection.

[0013] The above technical solution of the utility model has the following advantages compared with the prior art:

[0014] The utility model discloses a device for coating glue on substrates for processing electronic components. By arranging an air pump and an air guide hood, in cooperation with a discharge table and air holes, the flexible circuit board substrate can be adsorbed and fixed on the discharge table by the suction force of air extraction when coating glue on the flexible circuit board substrate, so as to improve the stability of the position of the flexible circuit board substrate during coating glue, and to reduce the situation where the flexible circuit board substrate is easily fixed due to its thin material.

[0015] The utility model discloses an electronic component processing substrate gluing device, which can filter the airflow by setting a filter box and a filter screen, thereby reducing the impurities adhering to the surface of the flexible circuit board substrate and preventing them from entering the air pump and causing blockage and damage, thereby increasing the service life of the air pump. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to make the content of the utility model more clearly understood, the utility model is further described in detail below based on specific embodiments of the utility model in combination with the accompanying drawings.

[0017] Figure 1 It is a three-dimensional diagram of the utility model;

[0018] Figure 2 This is a schematic diagram of the matching structure of the brush roller and the ultraviolet lamp panel of the utility model;

[0019] Figure 3 This is a schematic diagram of the matching structure of the filter box and the air pump of the utility model;

[0020] Figure 4 It is a schematic diagram of the filter structure of the utility model;

[0021] Figure 5 This is a schematic diagram of the matching structure of the collection box and the scraper of the utility model;

[0022] Explanation of the reference numerals in the drawings in the specification: 1. Operating table; 11. Unloading table; 12. Linear motor; 13. Electric push rod; 14. Fixed frame; 15. Brush roller; 16. Support frame; 17. Air guide cover; 18. Air pump; 19. Air hole; 2. Filter box; 21. Slide rail; 22. Filter; 3. Card slot; 31. Card sleeve; 4. UV lamp board; 41. UV lamp beads; 5. Lamp cover; 51. Prism; 6. Fixed rod; 61. Scraper; 7. Collection box; 8. Sponge pad. DETAILED DESCRIPTION

[0023] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments so that those skilled in the art can better understand the present invention and implement it, but the embodiments are not intended to limit the present invention.

[0024] Reference Figures 1 to 5 As shown, the utility model is a device for coating substrates for processing electronic components, comprising an operating table 1; characterized in that: a discharge table 11 is fixedly connected to the top of the operating table 1; a linear motor 12 is fixedly connected to the top of the operating table 1; an electric push rod 13 is fixedly connected to the output end of the linear motor 12; a fixing frame 14 is fixedly connected to the end of the electric push rod 13; a brush roller 15 is rotatably connected to the inner side wall of the fixing frame 14; a support frame 16 is fixedly connected to the bottom of the operating table 1; an air guide cover 17 is fixedly connected to the bottom of the operating table 1; a connecting component is fixedly connected to the bottom of the air guide cover 17; an air pump 18 is connected to the bottom of the connecting component; a plurality of air holes 19 are opened on the top of the discharge table 11; during operation, when coating the flexible circuit board substrate with glue, the flexible circuit board substrate is placed on the discharge table 11, and at this time, the air pump 18 is started to drive the airflow from the air hole 19 into the inside of the discharge table 11, and then the airflow passes through the air guide cover 17 into the connecting component The air enters the part and then enters the air pump 18 for discharge. When the air flow enters the discharge table 11 from the air hole 19, the flexible circuit board substrate is placed on the discharge table 11 and can be adsorbed on the top of the discharge table 11. At this time, the position of the flexible circuit board substrate can be fixed. At this time, UV glue can be applied to the brush roller 15, and then the electric push rod 13 is started to drive the brush roller 15 to contact the surface of the flexible circuit board substrate. The linear motor 12 is started to drive the electric push rod 13 and the brush roller 15 to move. At this time, the brush roller 15 rolls on the flexible circuit board substrate and glue can be applied to its surface. Through the above structure, the air pump 18 and the air guide cover 17 are set, and the discharge table 11 and the air hole 19 are matched. When the flexible circuit board substrate is coated with glue, the flexible circuit board substrate can be adsorbed and fixed on the discharge table 11 by the suction force of the exhaust gas, so as to improve the stability of the position of the flexible circuit board substrate during glue coating, so as to reduce the situation where the flexible circuit board substrate is thin and is easily fixed.

[0025] Reference Figure 3 and Figure 4As shown, the connection assembly includes a filter box 2; the filter box 2 is fixedly connected to the inner wall of the support frame 16; a pair of slide rails 21 are fixedly connected to the inner wall of the filter box 2; a filter screen 22 is installed in the slide rail 21; the filter screen 22 slides with the slide rail 21; during operation, the flexible circuit board substrate is usually stained with dust or film debris and other impurities. When the flexible circuit board substrate is placed on the discharge table 11, when the airflow enters the discharge table 11 from the air hole 19, the impurities attached to the surface of the flexible circuit board substrate will be brought into the discharge table 11 at the same time. At this time, the airflow is mixed with impurities It will enter the filter box 2. When the airflow passes through the filter screen 22 in the filter box 2, the airflow will be filtered to filter out impurities contained in the airflow, and then the filtered airflow will enter the air pump 18 and be discharged. When the filter screen 22 needs to be cleaned, the filter screen 22 can be pulled out from the slide rail 21 and put back into the slide rail 21 after cleaning. Through the above structure, the filter box 2 and the filter screen 22 are set to filter the airflow, reduce the impurities attached to the surface of the flexible circuit board substrate, and enter the air pump 18 to cause blockage and damage, so as to increase the service life of the air pump 18.

[0026] Reference Figure 1 and Figure 2 As shown, a plurality of card slots 3 are provided on the top of the discharge table 11; a pair of card sleeves 31 are installed in the middle of the brush roller 15; during operation, when the size of the flexible circuit board substrate is different, the position of the card sleeves 31 can be moved on the brush roller 15 according to the actual required size, so that the card sleeves 31 are aligned with the card slots 3 on the discharge table 11 and match the size of the flexible circuit board substrate. When brushing glue on the brush roller 15, the glue can be brushed on the surface of the brush roller 15 between the card sleeves 31, and then the brush roller 15 is used to apply glue to the flexible circuit board substrate. Through the above structure, the card slots 3 and the card sleeves 31 are set, and the width of the glue brushed on the brush roller 15 can be changed to adapt to the width of the flexible circuit board substrate of different sizes, which can reduce the waste of glue and the blockage caused by excess glue entering the air hole 19.

[0027] Reference Figure 2 As shown, the side wall of the fixing frame 14 is fixedly connected with an ultraviolet lamp board 4; a plurality of ultraviolet lamp beads 41 are installed at the bottom of the ultraviolet lamp board 4; during operation, after the flexible circuit board substrate is coated with glue, the electric push rod 13 can be started to drive the brush roller 15 to move upward, and then the ultraviolet lamp beads 41 are energized to emit ultraviolet light, and then the linear motor 12 drives the ultraviolet lamp board 4 and the ultraviolet lamp beads 41 to move above the flexible circuit board substrate. Through the above structure, the ultraviolet lamp board 4 and the ultraviolet lamp beads 41 are arranged, and the UV glue on the surface of the flexible circuit board substrate can be irradiated with ultraviolet light after the glue coating is completed, so as to increase the solidification speed of the UV glue and reduce the flow caused by the slow solidification of the glue, which causes the glue to appear uneven.

[0028] Reference Figure 2As shown, a lampshade 5 is fixedly connected to the bottom of the ultraviolet lamp board 4; a plurality of prisms 51 are fixedly connected to the inner wall of the lampshade 5; during operation, when the ultraviolet lamp bead 41 emits ultraviolet light to irradiate the flexible circuit board substrate, the ultraviolet light will simultaneously irradiate the prism 51, and the prism 51 can reflect the ultraviolet light at this time. Through the above structure, the prism 51 is arranged to reflect the ultraviolet light emitted by the ultraviolet lamp bead 41 to increase the irradiation range of the ultraviolet light, to increase the contact surface between the ultraviolet light and the flexible circuit board substrate, thereby irradiating the glue on the flexible circuit board substrate more evenly.

[0029] Reference Figure 5 As shown, a pair of fixed rods 6 are fixedly connected to the top of the operating table 1; a scraper 61 is fixedly connected to the end of the fixed rod 6; during operation, when the gluing work is completed, the brush roller 15 is moved to the scraper 61, and then the brush roller 15 is rotated, at this time the scraper 61 can scrape the surface of the brush roller 15 to scrape off the residual glue on the surface of the brush roller 15, and when the cleaning is completed, the brush roller 15 is moved away from the scraper 61. Through the above structure, the fixed rods 6 are arranged to connect the scraper 61, and the residual glue on the surface of the brush roller 15 can be cleaned after the gluing work is completed, so as to reduce the situation where the residual glue is inconvenient to clean, and at the same time, it can reduce the glue residue on the brush roller 15, which affects the next use.

[0030] Reference Figure 5 As shown, a collecting box 7 is fixedly connected to the top of the operating table 1; the collecting box 7 is arranged at the bottom of the scraper 61; during operation, when the scraper 61 scrapes off the residual glue on the brush roller 15, the residual glue will fall into the collecting box 7 below, and the collecting box 7 will collect the cleaned glue. Through the above structure, the collecting box 7 can be set to collect the residual glue scraped off the brush roller 15, so as to reduce the situation where the residual glue falls on the surface of the operating table 1 when it is cleaned, causing dirt and difficulty in cleaning.

[0031] Reference Figure 5 As shown, a sponge pad 8 is placed inside the collecting box 7; the sponge pad 8 is square in shape; during operation, when the cleaned residual glue enters the collecting box 7, the sponge pad 8 is located inside the collecting box 7 and can adsorb the glue that has entered inside. After cleaning, the sponge pad 8 is taken out of the collecting box 7 to clean the adsorbed glue, and then put back into the collecting box 7. Through the above structure, the sponge pad 8 is arranged to adsorb the residual glue that has entered the collecting box 7, so that the collected residual glue can be taken out from the collecting box 7 for processing, thereby improving the convenience of collection.

[0032] Working principle: When gluing the flexible circuit board substrate, place the flexible circuit board substrate on the discharge table 11. At this time, start the air pump 18 to drive the air flow from the air hole 19 into the inside of the discharge table 11, and then the air flow passes through the air guide cover 17 into the connecting component, and then enters the air pump 18 for discharge. When the air flow enters the discharge table 11 from the air hole 19, the flexible circuit board substrate is placed on the discharge table 11 and can be adsorbed on the top of the discharge table 11. At this time, the position of the flexible circuit board substrate can be fixed. At this time, UV glue can be applied to the brush roller 15, and then the electric push rod 13 is started to drive the brush roller 15 to contact the surface of the flexible circuit board substrate. The linear motor 12 is started to drive the electric push rod 13 and the brush roller 15 to move. At this time, the brush roller 15 is on the flexible circuit board substrate. The flexible circuit board substrate is rolled on the surface to apply glue on the surface. The flexible circuit board substrate is usually stained with impurities such as dust or film debris. When the flexible circuit board substrate is placed on the discharge table 11, the airflow enters the discharge table 11 from the air hole 19, and the impurities attached to the surface of the flexible circuit board substrate are brought into the discharge table 11 at the same time. At this time, the airflow mixed with impurities will enter the filter box 2. When the airflow passes through the filter screen 22 in the filter box 2, the airflow will be filtered to filter out the impurities contained in the airflow, and then the filtered airflow will enter the air pump 18 and be discharged. When the filter screen 22 needs to be cleaned, the filter screen 22 can be pulled out from the slide rail 21 and put back into the slide rail 21 after cleaning. When the size of the flexible circuit board substrate is When the sizes are different, the position of the card sleeve 31 can be moved on the brush roller 15 according to the actual required size, so that the card sleeve 31 is aligned with the card slot 3 on the discharge table 11 and matches the size of the flexible circuit board substrate. Then, when brushing glue on the brush roller 15, the glue can be brushed on the surface of the brush roller 15 between the card sleeves 31, and then the brush roller 15 can apply glue to the flexible circuit board substrate. When the flexible circuit board substrate is coated with glue, the electric push rod 13 can be started to drive the brush roller 15 to move upward, and then the ultraviolet lamp bead 41 is energized to emit ultraviolet light, and then the linear motor 12 drives the ultraviolet lamp board 4 and the ultraviolet lamp bead 41 to move above the flexible circuit board substrate. When the ultraviolet lamp bead 41 emits ultraviolet light to irradiate the flexible circuit board substrate, the ultraviolet light will simultaneously illuminate The ultraviolet light is projected onto the prism 51, and the prism 51 can reflect the ultraviolet light. When the gluing work is completed, the brush roller 15 is moved to the scraper 61, and then the brush roller 15 is rotated. At this time, the scraper 61 can scrape the surface of the brush roller 15 to scrape off the residual glue on the surface of the brush roller 15. When the cleaning is completed, the brush roller 15 is moved away from the scraper 61. When the scraper 61 scrapes off the residual glue on the brush roller 15, the residual glue will fall into the collection box 7 below. At this time, the collection box 7 will collect the cleaned glue. When the cleaned residual glue enters the collection box 7, the sponge pad 8 is located inside the collection box 7, and the glue that enters can be adsorbed inside. When the cleaning is completed, the sponge pad 8 is taken out of the collection box 7 to clean the adsorbed glue, and then put back into the collection box 7.

[0033] Obviously, the above embodiments are merely examples for the purpose of clear explanation and are not intended to limit the implementation methods. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation methods here. The obvious changes or modifications derived from these are still within the scope of protection of the invention of the utility model.

Claims

1. A device for coating substrates for processing electronic components, comprising an operating table (1); characterized in that: The top of the operating table (1) is fixedly connected to a material discharge table (11); the top of the operating table (1) is fixedly connected to a linear motor (12); the output end of the linear motor (12) is fixedly connected to an electric push rod (13); the end of the electric push rod (13) is fixedly connected to a fixing frame (14); the inner wall of the fixing frame (14) is rotatably connected to a brush roller (15); the bottom of the operating table (1) is fixedly connected to a support frame (16); the bottom of the operating table (1) is fixedly connected to an air guide cover (17); the bottom of the air guide cover (17) is fixedly connected to a connecting assembly; the bottom of the connecting assembly is connected to an air pump (18); and a plurality of air holes (19) are provided on the top of the material discharge table (11).

2. The electronic component processing substrate glue coating device according to claim 1, characterized in that: The connection assembly comprises a filter box (2); the filter box (2) is fixedly connected to the inner wall of the support frame (16); a pair of slide rails (21) are fixedly connected to the inner wall of the filter box (2); a filter screen (22) is installed in the slide rail (21); and the filter screen (22) is slidably matched with the slide rail (21).

3. The electronic component processing substrate glue coating device according to claim 2, characterized in that: A plurality of slots (3) are provided on the top of the material discharging platform (11); and a pair of sleeves (31) are installed in the middle of the brush roller (15).

4. The electronic component processing substrate glue coating device according to claim 3, characterized in that: The side wall of the fixing frame (14) is fixedly connected to an ultraviolet lamp board (4); a plurality of ultraviolet lamp beads (41) are installed at the bottom of the ultraviolet lamp board (4).

5. The electronic component processing substrate glue coating device according to claim 4, characterized in that: A lampshade (5) is fixedly connected to the bottom of the ultraviolet lamp panel (4); and a plurality of prisms (51) are fixedly connected to the inner side wall of the lampshade (5).

6. The electronic component processing substrate glue coating device according to claim 5, characterized in that: A pair of fixing rods (6) are fixedly connected to the top of the operating table (1); and a scraper (61) is fixedly connected to the end of the fixing rod (6).

7. The electronic component processing substrate glue coating device according to claim 6, characterized in that: A collection box (7) is fixedly connected to the top of the operating table (1); the collection box (7) is arranged at the bottom of the scraper (61).

8. The electronic component processing substrate glue coating device according to claim 7, characterized in that: A sponge pad (8) is placed inside the collection box (7); the sponge pad (8) is in a square shape.

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