Pressure device for wafer grinding

Abstract

The utility model relates to the field of wafer grinding, in particular to a pressurizing device for wafer grinding, which comprises a wafer grinding machine, a grinding disc, a support A, a gear ring, a base, a screw rod, a lower pressing plate, a gear and the like. A grinding disc is rotationally connected to the wafer grinding machine, a support A is rotationally connected to the wafer grinding machine, a gear ring is fixedly connected to the support A, a base is fixedly connected to the wafer grinding machine, a screw rod is rotationally connected to the base, threads are bored in the four corners of the lower pressing plate, the screw rod is matched with the lower pressing plate through the threads, and a gear is fixedly connected to the screw rod. The support A is used for driving the gear ring to rotate, and the gear ring drives the gear and the screw rod to rotate, so that the lower pressing plate can stably move downwards and pressurize the wafer, and the effect of uniformly pressing the wafer is achieved.

Description

Technical Field

[0001] The utility model relates to the field of wafer grinding, in particular to a pressurizing device for wafer grinding. Background Art

[0002] A wafer is a silicon semiconductor material with a very wide range of applications. It is mainly used in the production and processing of chips, electronic components, and electronic communication equipment, Internet of Things devices, medical and chemical industrial equipment, etc. When grinding wafers, manual pressure needs to be applied to the wafer from the four corners of the pressure plate respectively, and when fixing the wafer, the staff needs to continuously tighten and adjust manually. Such a debugging method cannot ensure uniform stress during wafer pressure grinding, resulting in grinding deviation and affecting the grinding quality. Content of the Utility Model

[0003] In order to overcome the drawback that uneven stress during wafer pressure grinding will cause wafer grinding deviation, the technical problem to be solved is: to provide a pressurizing device for wafer grinding that can apply uniform pressure during grinding.

[0004] The technical solution is: a pressurizing device for wafer grinding, including a wafer grinding machine, a grinding disc, a support A, a toothed ring, a base, a screw rod, a lower pressure plate, and a gear. The grinding disc is rotatably connected to the wafer grinding machine, the support A is rotatably connected to the wafer grinding machine, the toothed ring is fixedly connected to the support A, the base is fixedly connected to the wafer grinding machine, the screw rod is rotatably connected to the base, threaded holes are bored at the four corners of the lower pressure plate, the screw rod and the lower pressure plate are in threaded cooperation, and the gear is fixedly connected to the screw rod.

[0005] As a preferred technical solution of the utility model, it further includes a water injection device, a fine adjustment knob A, a support B, a fine adjustment knob B, and a nozzle. The water injection device is fixedly connected to the left side of the wafer grinding machine, the fine adjustment knob A is rotatably connected to the water injection device, the support B is fixedly connected to the fine adjustment knob A, the fine adjustment knob B is rotatably connected to the support B, and the nozzle is fixedly connected to the fine adjustment knob B.

[0006] As a preferred technical solution of the utility model, it further includes a solution box, which is fixedly connected to the left side of the wafer grinding machine.

[0007] As a preferred technical solution of the utility model, it further includes a tool rack, which is fixedly connected to the right side of the wafer grinding machine.

[0008] As a preferred technical solution of the utility model, it further includes a lighting lamp, which is fixedly connected to the wafer grinding machine.

[0009] As a preferred technical solution of the utility model, it further includes an anti-slip pad, which is fixedly connected to the bottom of the wafer grinding machine.

[0010] Compared with the prior art, the utility model has the following advantages: 1. By using the support A to drive the toothed ring to rotate, the toothed ring drives the gear and the screw rod to rotate, and enables the lower pressing plate to move downward smoothly and complete the pressing of the wafer, which plays a role in uniformly pressing the wafer and achieves the improvement of the grinding accuracy of the wafer.

[0011] 2. By adjusting the left and right directions of the support B on the water injection device through the fine-tuning knob A and adjusting the up and down directions of the nozzle on the support through the fine-tuning knob B, it plays a role in uniformly adding the grinding fluid and achieves the improvement of the grinding efficiency.

[0012] 3. Through the anti-slip pad, the wafer will not shake too much during grinding, achieving the effect of ensuring the stability of the wafer grinding machine during operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a three-dimensional structure schematic diagram of the utility model.

[0014] Figure 2 It is a three-dimensional structure schematic diagram of the support A, the toothed ring and the screw rod of the utility model.

[0015] Figure 3 It is a three-dimensional structure schematic diagram of the fine-tuning knob, the support B and the nozzle of the utility model.

[0016] The labels in the figure are: 1 - wafer grinding machine, 2 - grinding disc, 3 - support A, 4 - toothed ring, 5 - base, 6 - screw rod, 7 - lower pressing plate, 8 - gear, 9 - water injection device, 10 - fine-tuning knob A, 11 - support B, 12 - fine-tuning knob B, 13 - nozzle, 14 - solution box, 15 - illuminating lamp, 16 - tool rack, 17 - anti-slip pad. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0017] Although the present utility model may be described with respect to a specific application or industry, those skilled in the art will recognize the broader applicability of the present utility model. Those of ordinary skill in the art will recognize that terms such as: above, below, upward, downward, etc. are used to describe the drawings and do not represent a limitation on the scope of the present utility model defined by the appended claims. Any numerical labels such as: first or second are merely illustrative and are not intended to limit the scope of the present utility model in any way.

[0018] Embodiment: A pressurizing device for wafer grinding, as Figure 1-2As shown in the figure, it includes a wafer grinding machine 1, a grinding disc 2, a bracket A 3, a toothed ring 4, a base 5, a screw 6, a lower pressing plate 7, a gear 8, a water injection device 9, a fine-tuning knob A 10, a bracket B 11, a fine-tuning knob B 12 and a nozzle 13. The grinding disc 2 is rotatably connected to the wafer grinding machine 1. The bracket A 3 is rotatably connected to the wafer grinding machine 1. The toothed ring 4 is fixedly connected to the bracket A 3. The base 5 is fixedly connected to the wafer grinding machine 1. The screw 6 is rotatably connected to the base 5. Threads are bored at the four corners of the lower pressing plate 7. The screw 6 is in threaded cooperation with the lower pressing plate 7. The gear 8 is fixedly connected to the screw 6. The water injection device 9 is fixedly connected to the left side of the wafer grinding machine 1. The fine-tuning knob A 10 is rotatably connected to the water injection device 9. The bracket B 11 is fixedly connected to the fine-tuning knob A 10. The fine-tuning knob B 12 is rotatably connected to the bracket B 11. The nozzle 13 is fixedly connected to the fine-tuning knob B 12.

[0019] First, start the equipment. Adjust the left-right direction of the grinding fluid injection controlled by the fine-tuning knob A 10, and then adjust the up-down direction of the grinding fluid injection controlled by the fine-tuning knob B 12. Turn on the water injection device 9. At this time, the grinding fluid is sprayed from the nozzle 13 into a water mist and evenly covers the grinding disc 2, which plays a role in evenly adding the grinding fluid and achieves the effect of improving the grinding efficiency. Install and fix the wafer on the lower pressing plate 7. The operator holds the bracket A 3 and rotates it clockwise. At this time, the bracket A 3 drives the toothed ring 4 to rotate clockwise. The toothed ring 4 drives the gear 8 to rotate clockwise. The gear 8 drives the screw 6 to rotate clockwise. The lower pressing plate 7 slowly moves downward under the cooperation of the screw 6 to complete the pressurization of the wafer. Start the grinding disc 2. At this time, the grinding disc 2 rotates and starts to precisely and smoothly grind the wafer, which plays a role in evenly pressing the wafer and achieves the effect of improving the precision of wafer grinding.

[0020] As Figure 1 and Figure 3 shown in the figure, it further includes a solution box 14. The solution box 14 is fixedly connected to the left side of the wafer grinding machine 1.

[0021] The solution box 14 plays a role in temporarily storing the grinding fluid and achieves the effect of increasing the practicality of the water injection device 9.

[0022] As Figure 2 shown in the figure, it further includes a tool rack 16. The tool rack 16 is fixedly connected to the right side of the wafer grinding machine 1.

[0023] If tools are needed, the tools can be placed on the tool rack 16. In this way, the tools can be used more conveniently and quickly, and the working environment can also be kept clean.

[0024] As Figure 1-Figure 3 shown in the figure, it further includes a lighting lamp 15. The lighting lamp 15 is fixedly connected to the wafer grinding machine 1.

[0025] If working in some places with dim or poor lighting, the lighting lamp 15 can be turned on for illumination to help improve the accuracy of wafer grinding.

[0026] As Figure 3 shown, it further includes an anti-slip pad 17, and the anti-slip pad 17 is fixedly connected to the bottom of the wafer grinding machine 1.

[0027] Through the anti-slip pad, the wafer will not shake too much during grinding, achieving the effect of ensuring the stability of the wafer grinding machine during operation.

[0028] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention shall be included within the protection scope of the present invention.

Claims

1. A pressurizing device for wafer grinding, comprising a wafer grinder (1) and a grinding disc (2), wherein the grinding disc (2) is rotatably connected to the wafer grinder (1), wherein: The invention also comprises a bracket A (3), a gear ring (4), a base (5), a screw (6), a lower pressure plate (7) and a gear (8); the bracket A (3) is rotatably connected to the wafer grinder (1); the gear ring (4) is fixedly connected to the bracket A (3); the base (5) is fixedly connected to the wafer grinder (1); the screw (6) is rotatably connected to the base (5); four corners of the lower pressure plate (7) are bored with threads; the screw (6) and the lower pressure plate (7) are matched with threads; the screw (6) is fixedly connected to the gear (8).

2. A wafer grinding pressurizing device according to claim 1, characterized in that: The invention also comprises a water injection device (9), a fine adjustment knob A (10), a bracket B (11), a fine adjustment knob B (12) and a nozzle (13). The left side of the wafer grinding machine (1) is fixedly connected with the water injection device (9), the fine adjustment knob A (10) is rotatably connected to the water injection device (9), the bracket B (11) is fixedly connected to the fine adjustment knob B (12), the bracket B (11) is rotatably connected to the fine adjustment knob B (12), and the nozzle (13) is fixedly connected to the fine adjustment knob B (12).

3. A wafer grinding pressurizing device according to claim 2, characterized in that: It also includes a solution box (14), and the left side of the wafer grinding machine (1) is fixedly connected with the solution box (14).

4. A wafer grinding pressurizing device according to claim 3, characterized in that: It also includes a tool rack (16), and the right side of the wafer grinding machine (1) is fixedly connected to the tool rack (16).

5. A wafer grinding pressurizing device according to claim 4, characterized in that: It also includes an illumination lamp (15), and the wafer grinding machine (1) is fixedly connected to the illumination lamp (15).

6. A wafer grinding pressurizing device according to claim 5, characterized in that: It also includes an anti-skid pad (17), and the bottom of the wafer grinding machine (1) is fixedly connected to the anti-skid pad (17).

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