Abrasive grinding tool with diamond abrasive particles and grinding equipment

Abstract

The utility model relates to the technical field of grinding tools, in particular to an abrasive grinding tool with diamond abrasive particles and grinding equipment, the abrasive grinding tool with the diamond abrasive particles comprises a base layer and a frosted layer, and the frosted layer is arranged on one side of the base layer; the frosted layer comprises a plurality of abrasive particles formed on the surface of the base layer, a chip removal through groove is formed between any two adjacent abrasive particles, and the area of the cross section of at least part of the chip removal through grooves is gradually reduced in the direction from the frosted layer to the base layer. According to the technical scheme, the friction effect and the cutting effect of abrasive particles are stabilized through the chip removal through grooves.

Description

Technical Field

[0001] The utility model relates to the technical field of grinding tools, and particularly relates to an abrasive tool with diamond abrasive grains and a grinding device. Background Art

[0002] Abrasive tools such as sandpaper and emery paper play a crucial role in modern industry and handicrafts. They are mainly used to remove burrs, rust, paint, oxide layers, etc. on the surface of materials to achieve smoothness, gloss, and dimensional accuracy of the workpiece surface. In addition, these tools are widely used in industries such as wood processing, metal processing, plastic molding, automotive repair, and furniture making to improve the appearance quality and service performance of products.

[0003] Sandpaper and emery paper have similar structures and mainly consist of the following parts: a base layer, an adhesive layer, and an abrasive grain layer. The base layer is the foundation of the abrasive tool. The base layer of sandpaper is usually made of fabric or leather, while the base layer of emery paper is made of paper. The adhesive layer is used to fix the abrasive grains on the base layer to ensure that the abrasive grains do not fall off during the grinding process. The abrasive grain layer is the core part of the abrasive tool and is composed of abrasive grains of different particle sizes. These abrasive grains can be natural ores or synthetic materials, which determine the grinding ability and application range of the tool.

[0004] During the grinding process, due to the friction and cutting action between the abrasive tool and the workpiece surface, a large amount of debris will be generated. These debris will fill between the abrasive grains, reducing the cutting performance of the tool and resulting in a decline in the grinding effect. Summary of the Utility Model

[0005] The main purpose of the utility model is to provide an abrasive tool with diamond abrasive grains, aiming to stabilize the friction effect and cutting effect of the abrasive grains through chip discharge grooves.

[0006] To achieve the above purpose, the abrasive tool with diamond abrasive grains includes:

[0007] A base layer; and

[0008] An abrasive layer provided on one side of the base layer; the abrasive layer includes a plurality of abrasive grains formed on the surface of the base layer, and a chip discharge groove is formed between any two adjacent abrasive grains, and the cross-sectional area of at least part of the chip discharge groove gradually decreases along the direction from the abrasive layer to the base layer.

[0009] In an embodiment of the utility model, the direction of the orthographic projection of the abrasive layer on the base layer is defined as the first direction, and the cross-sectional area of the abrasive grains gradually increases along the first direction.

[0010] In an embodiment of the utility model, a friction tip is formed at one end of each abrasive grain away from the base layer.

[0011] In an embodiment of the present utility model, it is characterized in that the shape of the abrasive grains is a quadrangular pyramid shape.

[0012] In an embodiment of the present utility model, it is defined that four adjacent abrasive grains form a heat dissipation group, and the four abrasive grains within each heat dissipation group are arranged in a matrix and enclose to form a heat dissipation space; the heat dissipation space communicates with the chip discharge through groove formed by the four abrasive grains within the heat dissipation group.

[0013] In an embodiment of the present utility model, the bottom of each abrasive grain is connected to the bottom of one to four abrasive grains with any quantity.

[0014] In an embodiment of the present utility model, it is defined that the base layer is provided with a first mounting surface, and the abrasive layer is arranged on the first mounting surface; the included angle between the central axis of the abrasive grain and the first mounting surface is the α angle, where 0 degrees < α < 180 degrees.

[0015] In an embodiment of the present utility model, the lengths of the central axes of any number of abrasive grains are set to be equal.

[0016] In an embodiment of the present utility model, the material of the abrasive grain is an agglomerated diamond abrasive material.

[0017] The present utility model further provides a grinding device, and the grinding device includes the abrasive tool with diamond abrasive grains.

[0018] In the technical solution of the present utility model, the abrasive tool with diamond abrasive grains can be used for manual grinding or machine grinding. During the grinding process of the workpiece, due to the friction and cutting action between the abrasive grains and the workpiece, chip powder will be generated. At the same time, the chip powder on the surface will accumulate at the end opening of the chip discharge through groove far from the base layer for the first time. Also, because the cross-sectional dimension of the chip discharge through groove gradually becomes smaller along the direction from the abrasive layer to the base layer, that is, the chip discharge through groove has sufficient space for the chip powder to move. However, at the same time, the abrasive tool with diamond abrasive grains is in a moving state during the grinding of the workpiece. Therefore, the chip powder is quickly discharged to prevent blockage, thereby stabilizing the friction effect and cutting effect of the abrasive grains. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on the structures shown in these drawings.

[0020] Figure 1Schematic perspective view of an embodiment of an abrasive tool with diamond abrasive grains provided by the present utility model;

[0021] Figure 2 is Figure 1 Schematic view of the structure from another perspective;

[0022] Figure 3 Schematic view of the structure of an embodiment of the heat dissipation group of an abrasive tool with diamond abrasive grains provided by the present utility model.

[0023] Explanation of the reference numerals in the drawings:

[0024] 10, base layer; 10a, first mounting surface; 21, abrasive grains; 20a, chip discharge groove; 22, friction tip; 23, cutting edge; 20b, heat dissipation space; 211, chip discharge surface.

[0025] The realization of the object, functional features and advantages of the present utility model will be further described with reference to the embodiments and the accompanying drawings. Specific embodiments

[0026] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all of the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts shall fall within the protection scope of the present utility model.

[0027] It should be noted that all directional indications (such as up, down, left, right, front, back...) in the embodiments of the present utility model are only used to explain the relative positional relationship and movement conditions between components in a specific posture (as shown in the drawings). If the specific posture changes, the directional indications will also change accordingly.

[0028] In addition, the descriptions involving "first", "second", etc. in the present utility model are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one of such features. In addition, the meaning of "and / or" appearing throughout the text includes three parallel solutions. Taking "A and / or B" as an example, it includes solution A, solution B, or a solution where A and B are satisfied simultaneously. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of those of ordinary skill in the art to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the protection scope required by the present utility model.

[0029] Please refer to Figures 1 to 3 , the grinding tool with diamond abrasive grains 21 includes:

[0030] a base layer 10; and

[0031] a matte layer provided on one side of the base layer 10; the matte layer includes a plurality of abrasive grains 21 formed on the surface of the base layer 10, and a chip discharge groove 20a is formed between any two adjacent abrasive grains 21, and the cross-sectional area of at least part of the chip discharge groove 20a gradually decreases along the direction from the matte layer to the base layer 10.

[0032] In the technical solution of the present invention, the grinding tool with diamond abrasive grains 21 can be used for manual grinding or machine grinding. During the grinding of the workpiece, due to the friction and cutting action between the abrasive grains 21 and the workpiece, debris powder will be generated. At the same time, the debris powder on the surface will accumulate at the end opening of the chip discharge groove 20a far from the base layer 10 for the first time. Also, because the cross-sectional size of the chip discharge groove 20a gradually decreases along the direction from the matte layer to the base layer 10, that is, the chip discharge groove 20a has sufficient space for the debris powder to move, but at the same time, the grinding tool with diamond abrasive grains 21 is in a moving state during the grinding of the workpiece. Therefore, the debris powder is quickly discharged to prevent blockage, thereby stabilizing the friction effect and cutting effect of the abrasive grains 21.

[0033] The base layer 10 includes two structural forms: sandpaper and sand leather. The manufacturing process can be known through the prior art and will not be described in detail here, which belongs to the content known to those skilled in the art. In this technical solution, the cross-sectional shape of the base layer 10 can be adaptively designed according to actual needs, such as circular or square, and will not be limited here.

[0034] The matte layer, the matte layer includes a plurality of abrasive grains 21 formed on the surface of the base layer 10, and the abrasive grains 21 are fixed on one side of the base layer 10 through an adhesive process. In one embodiment, all the abrasive grains 21 included in the matte layer can be set in the same specification. The so-called specification setting refers to the setting methods such as the appearance shape, size and volume of the abrasive grains 21, and the angle between the abrasive grains 21 and the base layer 10. For example, all the abrasive grains 21 with a quadrangular pyramid appearance are adopted, and the bottom of the quadrangular pyramid-shaped abrasive grains 21 contacts the base layer 10, and the abrasive grains 21 are consistent in height dimension and volume dimension, and each abrasive grain 21 is perpendicular to the surface of the base layer 10 so that the angle formed between the abrasive grain 21 and the base layer 10 is 90 degrees. In this way, each chip discharge groove 20a formed by any two adjacent abrasive grains 21 has the same shape and volume size, so as to balance the chip storage and chip discharge capabilities of the grinding tool with diamond abrasive grains 21; In another embodiment, according to the requirements of the workpiece to be ground, some of the abrasive grains 21 included in the matte layer are set in different specifications from other abrasive grains 21. The so-called specification setting refers to the setting methods such as the appearance shape, size and volume of the abrasive grains 21, and the angle between the abrasive grains 21 and the base layer 10. For example, some of the abrasive grains 21 can be circular or square in shape due to the shape and structure of the workpiece, and another part of the abrasive grains 21 are quadrangular pyramid-shaped. Further, it can be known that assuming that the surface to be ground of the workpiece is not a parallel horizontal surface, such as a curved surface or a folded surface, at the same time, the height of some of the abrasive grains 21 is in the first height range, and the height of another part of the abrasive grains 21 is in the second height range. The first height range and the second height range intersect or do not intersect. In this way, all the abrasive grains 21 included in an abrasive grinding tool with diamond abrasive grains have abrasives with the same height and abrasives that are different from other heights, so as to improve the practicability and applicability of the abrasive grinding tool proposed by this technical solution. Further, for example, in the face of some workpieces to be ground with a higher degree of complexity, in order to ensure the friction and cutting effects between the abrasive grains 21 and the workpiece, the angle α formed between the abrasive grains 21 and the base layer 10 can be selected within (0°, 180°), so as to improve the practicability and applicability.

[0035] Further, in order to stabilize the friction effect and cutting effect of the abrasive grains 21, the cross-sectional area of at least part of the chip discharge grooves 20a gradually becomes smaller along the direction from the matte layer to the base layer 10. It can be known that during the grinding process, it is always the end of the matte layer far from the base layer 10 that contacts the surface of the workpiece. From this, it can be seen that the debris powder generated during the grinding process will first appear at the flared end of the chip discharge groove 20a. At the same time, the relative movement between the abrasive grains 21 and the workpiece can disrupt the stability of the debris powder staying in the chip discharge groove 20a, and the flared end of the chip discharge groove 20a can provide sufficient movement space for the movement of the debris powder, so as to discharge the debris powder in time and avoid the problem of debris powder blockage, thereby stabilizing the friction effect and cutting effect of the abrasive grains 21.

[0036] Further, define the orthographic projection direction of the matte layer on the base layer 10 as the first direction. As Figure 2 shown, the cross-sectional area of the abrasive grains 21 gradually increases along the first direction. In this way, the abrasive grains 21 have a relatively large stacking thickness. After the surface abrasives of the abrasive grains 21 are worn, new abrasives can be exposed, ensuring the durability of the processing.

[0037] In an embodiment of the present invention, as Figure 1 shown, a friction tip 22 is formed at one end of each abrasive grain 21 away from the base layer 10. In this way, the abrasive grains 21 can more easily cut into the surface of the workpiece, achieving finer grinding, which helps to improve the surface finish and accuracy of the workpiece. Moreover, the consistency of the friction tips 22 of the abrasive grains 21 helps to maintain consistent grinding force and effect during the grinding process.

[0038] Further, as Figures 1 - 3 shown, the shape of the abrasive grains 21 is a quadrangular pyramid shape. In this way, one abrasive grain 21 can form one friction tip 22 and four cutting edges 23, further improving the friction and cutting ability of the abrasive grains 21.

[0039] To improve the heat dissipation ability of the abrasive tool with diamond abrasive grains, define four adjacent abrasive grains 21 as a heat dissipation group. The four abrasive grains 21 in each heat dissipation group are arranged in a matrix and enclose a heat dissipation space 20b. The heat dissipation space 20b communicates with the chip discharge channels 20a formed by the four abrasive grains 21 in the heat dissipation group. Specifically, please refer to Figure 3 . Each abrasive grain 21 has at least one chip discharge surface 211. The chip discharge surface 211 refers to a groove surface of a chip discharge channel 20a. When a quadrangular pyramid-shaped abrasive grain 21 is only adjacent to one quadrangular pyramid-shaped abrasive grain 21, this quadrangular pyramid-shaped abrasive grain 21 only has one chip discharge surface 211. From this, it can be further inferred that each abrasive grain 21 has at most four chip discharge surfaces 211. One chip discharge channel 20a is composed of two chip discharge surfaces 211. Further, each heat dissipation group has four chip discharge channels 20a. At the same time, because the abrasive grains 21 are in the shape of a quadrangular pyramid and their cutting edges 23 are inclined with respect to the surface of the base layer 10, at this time, the four abrasive grains 21 arranged in a matrix will form a heat dissipation space 20b. The heat dissipation space 20b communicates with the adjacent chip discharge channels 20a around. The boundary of the heat dissipation space 20b is the four adjacent cutting edges 23 that converge on the surface of the base layer 10. In this way, when any one chip discharge channel 20a is filled with debris powder, it can flow through the heat dissipation space 20b to other chip discharge channels 20a to reduce the probability of blockage. At the same time, the heat dissipation space 20b connects the chip discharge channels 20a, which is beneficial to discharging the heat generated during the grinding process, thereby avoiding burning the workpiece.

[0040] In an embodiment of the present invention, as Figure 1As shown, the bottom of each abrasive grain 21 is connected to the bottom of one to four abrasive grains 21 in any quantity. In this way, the surface area of the base layer 10 can be fully utilized, thereby increasing the quantity of abrasive grains 21 and enhancing the friction and cutting ability.

[0041] In the present utility model, it is defined that the base layer 10 is provided with a first mounting surface 10a, the abrasive layer is arranged on the first mounting surface 10a, and the included angle between the central axis of the abrasive grain 21 and the first mounting surface 10a is the α angle, where 0° < α < 180°; in one embodiment, as Figure 2 shown, the α angle is 90°, that is, the abrasive grain 21 in the shape of a quadrangular pyramid is perpendicular to the first mounting surface 10a of the base layer 10. At this time, for processing some workpieces with a flat surface and regular shape, the abrasive layer can provide a stronger grinding force and cut into the surface of the workpiece, improving the grinding efficiency. Moreover, the vertically arranged abrasive grains 21 will not change the shape of the chip discharge groove 20a. For example, when a certain abrasive grain 21 is in an inclined state, it will inevitably affect the area and shape of at least two chip discharge grooves 20a, thereby affecting the chip discharge ability. Of course, for some irregular workpieces, the included angle between the central axis of the abrasive grain 21 and the first mounting surface 10a can be set according to actual needs, which is not limited here.

[0042] Furthermore, the lengths of the central axes of any number of abrasive grains 21 are set to be equal. As Figure 2 shown, in this way, all the abrasive grains 21 can contact the surface of the workpiece at the same time. For a workpiece to be polished with a flat surface, this means that the grinding force can be evenly distributed, thereby achieving a more uniform grinding effect. Moreover, the depth at which each abrasive grain 21 cuts into the surface of the workpiece is the same, thus ensuring the uniformity of the grinding depth, thereby reducing the number of processing times, such as grinding parts such as the middle frame of a mobile phone and the inner cavity surface of a watch.

[0043] In one embodiment of the present utility model, the material of the abrasive grain 21 is an agglomerated diamond abrasive material. It can be understood that the agglomerated diamond abrasive is based on diamond powder, mixed with ceramic binder raw materials to generate a gel, and then the gel is dried, ball-milled, crushed, and screened to obtain the agglomerated diamond abrasive. Then the agglomerated diamond abrasive is mixed with filling powders such as alumina powder, spinel powder, and nano-silica powder. Subsequently, the aforementioned obtained mixed powder is added to the UV curable glue to obtain a mixed slurry, and then the abrasive grain 21 can be formed using a mold; the abrasive grain 21 composed of the agglomerated diamond abrasive has good self-sharpening property. Combining the chip discharge and heat dissipation capabilities mentioned above, it can greatly improve the grinding ability of the grinding tool, thereby improving the processing productivity.

[0044] The present utility model also provides a grinding device, which includes a grinding tool with diamond abrasive grains 21. The specific structure of the grinding tool with diamond abrasive grains 21 refers to the above-mentioned embodiments. Since the grinding device adopts all the technical solutions of the above-mentioned embodiments, it has at least all the beneficial effects brought by the technical solutions of the above-mentioned embodiments, which will not be elaborated here one by one.

[0045] The above are only the preferred embodiments of the present utility model, and do not limit the patent scope of the present utility model accordingly. Any equivalent structural transformation made by using the content of the specification and drawings of the present utility model under the inventive concept of the present utility model, or direct / indirect application in other related technical fields, is included in the patent protection scope of the present utility model.

Claims

1. An abrasive tool having diamond abrasive grains, characterized in that: The abrasive tool with diamond abrasive grains comprises: Grassroots (10); and A frosted layer is provided on one side of the base layer; the frosted layer comprises a plurality of abrasive grains (21) formed on the surface of the base layer, a chip removal groove (20a) is formed between any two adjacent abrasive grains (21), and the cross-sectional area of ​​at least part of the chip removal groove (20a) gradually decreases along the direction from the frosted layer to the base layer (10).

2. The abrasive tool with diamond abrasive grains according to claim 1, characterized in that: The orthographic projection direction of the frosted layer on the base layer (10) is defined as a first direction, and the cross-sectional area of ​​the abrasive grains (21) gradually increases along the first direction.

3. The abrasive tool with diamond abrasive grains according to claim 2, characterized in that: One end of each abrasive grain (21) away from the base layer (10) forms a friction tip (22).

4. The abrasive tool with diamond abrasive grains according to any one of claims 1 to 3, characterized in that: The abrasive grains (21) are in the shape of a quadrangular pyramid.

5. The abrasive tool with diamond abrasive grains according to claim 4, characterized in that: The four adjacently arranged abrasive grains are defined to form a heat dissipation group, the four abrasive grains in each heat dissipation group are arranged in a matrix and enclose a heat dissipation space; the heat dissipation space is connected to the chip removal grooves formed by the four abrasive grains in the heat dissipation group.

6. The abrasive tool with diamond abrasive grains according to claim 5, characterized in that: The bottom of each of the abrasive particles (21) is connected to the bottoms of any number of one to four abrasive particles (21).

7. The abrasive tool with diamond abrasive grains according to claim 6, characterized in that: It is defined that the base layer (10) is provided with a first mounting surface (10a), and the frosting layer is provided on the first mounting surface; the angle between the central axis of the abrasive grain (21) and the first mounting surface (10a) is angle α, 0 degrees < α < 180 degrees.

8. The abrasive tool with diamond abrasive grains according to claim 7, characterized in that: The lengths of the central axes of any plurality of the abrasive particles (21) are set to be identical.

9. The abrasive tool with diamond abrasive grains according to claim 1, characterized in that: The material of the abrasive grains (21) is agglomerated diamond abrasive.

10. A grinding device, characterized in that: The grinding device comprises an abrasive tool having diamond abrasive grains as claimed in any one of claims 1 to 9.

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