Wafer bearing table and thinning machine

Abstract

The utility model discloses a wafer bearing table and a thinning machine, and relates to the technical field of semiconductor processing, the wafer bearing table comprises a base, a bearing assembly, an air bearing and a driving assembly, the bearing assembly is arranged above the base, and the bearing assembly is used for fixing a wafer to be processed; the air bearing is arranged on the base, a main shaft is arranged in the air bearing in a penetrating mode, and the upper end of the main shaft is connected with the bearing assembly. The driving assembly is used for driving the main shaft to rotate. According to the technical scheme provided by the utility model, the technical effect of improving the rotation stability and precision of the wafer bearing table can be achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor processing, and particularly relates to a wafer chuck and a lapping machine. Background Art

[0002] The wafer chuck is a key component in a lapping machine for grinding wafers. During the grinding process, the wafer is fixed on the wafer chuck and rotates to achieve the grinding process. The smoothness and precision of the rotation of the wafer chuck will directly affect the quality of wafer processing. Therefore, improving the smoothness and precision of the rotation of the wafer chuck is of great significance for high-precision wafer processing. Summary of the Utility Model

[0003] The main object of the utility model is to provide a wafer chuck and a lapping machine, aiming to improve the smoothness and precision of the rotation of the wafer chuck.

[0004] To achieve the above object, the wafer chuck proposed by the utility model includes a base, a loading assembly, an air bearing and a driving assembly. The loading assembly is arranged above the base and is used to fix the wafer to be processed. The air bearing is arranged on the base, and a main shaft is passed through the air bearing. The upper end of the main shaft is connected to the loading assembly. The driving assembly is used to drive the main shaft to rotate.

[0005] In one embodiment, the air bearing is connected to the base through a bearing seat.

[0006] In one embodiment, the loading assembly includes a chuck, the chuck is connected to the upper end of the main shaft, and the chuck is used to fix the wafer to be processed.

[0007] In one embodiment, the chuck is a ceramic chuck.

[0008] In one embodiment, the loading assembly further includes a table plate, the table plate is fixedly arranged at the bottom of the chuck, and the upper end of the main shaft is connected to the table plate.

[0009] In one embodiment, a vacuum passage is arranged in the main shaft to communicate the vacuum flow path of the chuck with a vacuum pumping device.

[0010] In one embodiment, a vacuum rotary joint is arranged at the lower end of the main shaft, and the vacuum passage of the main shaft is communicated with the vacuum pumping device through the vacuum rotary joint.

[0011] In one embodiment, the driving assembly includes a motor and a transmission mechanism, and the output shaft of the motor is in transmission connection with the lower end of the main shaft through the transmission mechanism.

[0012] In one embodiment, the transmission mechanism includes a first pulley, a second pulley and a timing belt. The first pulley is fixedly sleeved on the output shaft of the motor, the second pulley is fixedly sleeved on the lower end of the main shaft, and the timing belt is disposed on the first pulley and the second pulley.

[0013] The present invention also provides a thinning machine, including the above-mentioned wafer chuck.

[0014] In the technical solution provided by the present invention, an air bearing is disposed on the base. After the air bearing is ventilated, it supports the main shaft. An air film is formed between the air bearing and the main shaft. The driving component drives the main shaft to rotate, and the main shaft drives the carrying component to rotate. Using an air bearing can improve the rotational stability of the main shaft and reduce the frictional force of the main shaft rotation, thereby improving the smoothness and precision of the rotation of the wafer chuck, which is beneficial to improving the processing accuracy of the wafer, and can also extend the service life of the wafer chuck. In addition, it can also reduce the noise of the rotation of the wafer chuck, which is beneficial to improving the processing environment. It can be understood that the air bearing needs to be connected to a gas source to supply gas to the air bearing to enable the normal operation of the wafer chuck. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on the structures shown in these drawings.

[0016] Figure 1 It is a perspective view of an embodiment of the wafer chuck provided by the present invention;

[0017] Figure 2 is Figure 1 a schematic structural view at an angle;

[0018] Figure 3 is Figure 2 a sectional view of...

[0019] Description of the reference numerals in the drawings:

[0020] 100, wafer chuck; 1, base; 2, carrying component; 21, chuck; 22, table; 3, air bearing; 31, bearing seat; 4, main shaft; 41, vacuum passage; 42, vacuum rotary joint; 5, driving component; 51, motor; 52, first pulley; 53, second pulley; 54, timing belt; 6, adapter block.

[0021] The realization of the purpose, functional characteristics and advantages of the present utility model will be further described in conjunction with embodiments with reference to the accompanying drawings. Specific embodiments

[0022] The following will clearly and completely describe the technical solutions in the embodiments of the present utility model with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts shall fall within the protection scope of the present utility model.

[0023] It should be noted that if there are directional indications (such as up, down, left, right, front, back...) involved in the embodiments of the present utility model, the directional indications are only used to explain the relative position relationship and movement conditions between components in a specific posture. If the specific posture changes, the directional indications will also change accordingly.

[0024] In addition, if there are descriptions such as "first", "second", etc. involved in the embodiments of the present utility model, the descriptions of "first", "second", etc. are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one such feature. In addition, if "and / or" or "and / or" appears throughout the text, its meaning includes three parallel solutions. Taking "A and / or B" as an example, it includes solution A, solution B, or a solution that satisfies both A and B at the same time. In addition, the technical solutions between various embodiments can be combined with each other, but it must be based on the ability of those of ordinary skill in the art to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the protection scope required by the present utility model.

[0025] The wafer chuck is a key component in the thinning machine for grinding the wafer. During the grinding process, the wafer is fixed on the wafer chuck and rotates to achieve the grinding process. The smoothness and precision of the rotation of the wafer chuck will directly affect the quality of wafer processing. Therefore, improving the smoothness and precision of the rotation of the wafer chuck is of great significance for the high-precision processing of wafers.

[0026] Based on this, the present utility model proposes a wafer chuck and a thinning machine, which can improve the smoothness and precision of the rotation of the wafer chuck. Figure 1 Is a three-dimensional view of an embodiment of the wafer chuck provided by the present utility model; Figure 2 Is Figure 1 A structural schematic diagram at an angle; Figure 3 Is Figure 2 The sectional view of.

[0027] Please refer to Figures 1 to 3 In an embodiment of the present utility model, the wafer stage 100 includes a base 1, a carrier assembly 2, an air bearing 3, and a drive assembly 5. The carrier assembly 2 is disposed above the base 1, and the carrier assembly 2 is used to fix the wafer to be processed; the air bearing 3 is disposed on the base 1, a main shaft 4 is disposed through the air bearing 3, and the upper end of the main shaft 4 is connected to the carrier assembly 2; the drive assembly 5 is used to drive the main shaft 4 to rotate.

[0028] In the technical solution provided by the present utility model, the air bearing 3 is disposed on the base 1. After the air bearing 3 is ventilated, it supports the main shaft 4, and an air film is formed between the air bearing 3 and the main shaft 4. The drive assembly 5 drives the main shaft 4 to rotate, and the main shaft 4 drives the carrier assembly 2 to rotate; by using the air bearing 3, the stability of the rotation of the main shaft 4 can be improved, and the friction of the rotation of the main shaft 4 can be reduced. Furthermore, the smoothness and precision of the rotation of the wafer stage 100 can be improved, which is beneficial to improving the processing accuracy of the wafer, and the service life of the wafer stage 100 can also be extended; in addition, the noise of the rotation of the wafer stage 100 can also be reduced, which is beneficial to improving the processing environment. It can be understood that the air bearing 3 needs to be connected to a gas source to supply gas to the air bearing 3 to enable the normal operation of the wafer stage 100.

[0029] In an embodiment of the present utility model, the air bearing 3 is connected to the base 1 through a bearing seat 31. The air bearing 3 is fixedly installed on the base 1 through the bearing seat 31, which facilitates the installation of the air bearing 3. It can be understood that the base 1 may include a cross slide, which is convenient for installation on a machine tool.

[0030] In an embodiment of the present utility model, the carrier assembly 2 includes a chuck 21, the chuck 21 is connected to the upper end of the main shaft 4, and the chuck 21 is used to fix the wafer to be processed. The wafer to be processed is fixed by the chuck 21, and the stability is better, which is beneficial to improving the processing accuracy of the wafer. It can be understood that the chuck 21 can be used to fix wafers of different sizes, such as 4-inch, 5-inch, 6-inch, and 8-inch wafers.

[0031] In an embodiment of the present utility model, the chuck 21 is a ceramic chuck 21. Using the ceramic chuck 21 is beneficial to improving the processing accuracy of the wafer.

[0032] In an embodiment of the present utility model, the carrier assembly 2 further includes a table 22, the table 22 is fixedly disposed at the bottom of the chuck 21, and the upper end of the main shaft 4 is connected to the table 22. The chuck 21 is reinforced by the table 22, and it is also convenient for the installation of the chuck 21.

[0033] In an embodiment of the present utility model, a vacuum passage 41 is provided inside the main shaft 4 for communicating the vacuum flow passage of the chuck 21 with a vacuum pumping device. The structure is compact, and it is also convenient to evacuate the chuck 21 to fix the wafer to be processed.

[0034] In an embodiment of the present utility model, a vacuum rotary joint 42 is provided at the lower end of the main shaft 4, and the vacuum passage 41 of the main shaft 4 is communicated with the vacuum pumping device through the vacuum rotary joint 42. By providing the vacuum rotary joint 42 at the lower end of the main shaft 4, the influence of the rotation of the main shaft 4 on vacuum pumping can be avoided, which is beneficial to ensuring the effect of the chuck 21 in fixing the wafer to be processed and improving the processing accuracy of the wafer.

[0035] In an embodiment of the present utility model, the driving assembly 5 includes a motor 51 and a transmission mechanism. The output shaft of the motor 51 is drivingly connected to the lower end of the main shaft 4 through the transmission mechanism. By driving the main shaft 4 to rotate through the motor 51 and the transmission mechanism, the motor 51 can be installed on the side of the main shaft 4, which is convenient for installing components (such as vacuum rotary joints) at the lower end of the main shaft 4.

[0036] In an embodiment of the present utility model, the transmission mechanism includes a first pulley 52, a second pulley 53 and a synchronous belt 54. The first pulley 52 is fixedly sleeved on the output shaft of the motor 51, the second pulley 53 is fixedly sleeved on the lower end of the main shaft 4, and the synchronous belt 54 is disposed on the first pulley 52 and the second pulley 53. The transmission between the motor 51 and the main shaft 4 is realized through the synchronous belt 54, which is beneficial to improving the smoothness and precision of the rotation of the wafer stage 100, and is also beneficial to reducing the noise of the rotation of the wafer stage 100. Further, the second pulley 53 can be rotatably connected to the air bearing 3 through an adapter block 6, which is beneficial to improving the smoothness of the rotation of the wafer stage 100.

[0037] The present utility model also provides a thinning machine, which includes a wafer stage 100. The specific structure of the wafer stage 100 refers to the above embodiments. Since this thinning machine adopts all the technical solutions of the above embodiments, it has at least all the beneficial effects brought by the technical solutions of the above embodiments, which will not be elaborated herein one by one.

[0038] The above description is only an exemplary embodiment of the present utility model, and does not limit the patent scope of the present utility model. Any equivalent structural transformation made under the technical concept of the present utility model by using the content of the specification and drawings of the present utility model, or direct / indirect application in other related technical fields, is included in the patent protection scope of the present utility model.

Claims

1. A wafer holding table, characterized in that: include: Pedestal; A bearing assembly, the bearing assembly is arranged above the base, and the bearing assembly is used to fix the wafer to be processed; An air bearing, wherein the air bearing is disposed on the base, a main shaft is passed through the air bearing, and an upper end portion of the main shaft is connected to the bearing assembly; as well as The driving assembly is used to drive the main shaft to rotate.

2. The wafer stage according to claim 1, characterized in that: The air bearing is connected to the base through a bearing seat.

3. The wafer stage according to claim 1, characterized in that: The bearing assembly comprises a suction cup, which is connected to the upper end of the spindle and is used to fix the wafer to be processed.

4. The wafer stage according to claim 3, characterized in that: The suction cup is a ceramic suction cup.

5. The wafer stage according to claim 3, characterized in that: The bearing assembly further comprises a table, which is fixed to the bottom of the suction cup, and the upper end of the main shaft is connected to the table.

6. The wafer stage according to claim 3, characterized in that: A vacuum passage is arranged in the main shaft to connect the vacuum channel of the suction cup with the vacuum pumping device.

7. The wafer stage according to claim 6, characterized in that: A vacuum rotary joint is provided at the lower end of the main shaft, and the vacuum passage of the main shaft is connected with the vacuum extraction device through the vacuum rotary joint.

8. The wafer stage according to claim 1, characterized in that: The driving assembly includes a motor and a transmission mechanism, and the output shaft of the motor is transmission-connected to the lower end of the main shaft through the transmission mechanism.

9. The wafer stage according to claim 8, characterized in that: The transmission mechanism includes a first pulley, a second pulley and a synchronous belt. The first pulley is fixedly sleeved on the output shaft of the motor, the second pulley is fixedly sleeved on the lower end of the main shaft, and the synchronous belt is stretched on the first pulley and the second pulley.

10. A thinning machine, characterized in that: It comprises a wafer stage as claimed in any one of claims 1 to 9.

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