Feeding mechanism and electronic component packaging equipment

Abstract

The utility model discloses a feeding mechanism and electronic component packaging equipment. The feeding mechanism comprises a material containing frame, a frame grabbing assembly, a pressing assembly and a film clamping assembly. The film clamping assembly comprises two clamping pieces, each clamping piece comprises a clamping part and a clamping finger part, the distance between the clamping parts of the two clamping pieces is larger than the width of the material containing frame and smaller than the width of the release film, and the clamping finger parts have an opening state when being far away from the lower surfaces of the clamping parts and a clamping state when being close to the lower surfaces of the clamping parts; in the opening state, the distance between the clamping finger parts of the two clamping pieces is larger than the width of the release film; in the clamping state, the distance between the clamping finger parts of the two clamping pieces is smaller than the width of the release film. According to the feeding mechanism and the electronic component packaging equipment provided by the utility model, unnecessary contact with the release film is avoided through the design of the clamping finger part of the film clamping assembly, and curling and wrinkling of the release film caused by mechanical interference are reduced.

Description

Technical Field

[0001] The utility model belongs to the technical field of electronic component packaging, and particularly relates to a feeding mechanism and an electronic component packaging device. Background Art

[0002] In modern electronic devices, the packaging technology of chips is particularly important. The packaging technology can not only protect the chips from the influence of the external environment, but also enhance the mechanical strength of the chips, improve their heat dissipation performance, and ensure the reliability and stability of the chips during use. In the existing chip packaging technology, the compression molding method is widely used because it can achieve high-precision packaging effects.

[0003] The basic principle of the compression molding method is that in a packaging device, resin particles are supplied to a molding die and heated to make the resin particles melt into molten resin. Then, the molding die is closed, and the chips on the substrate are immersed in the molten resin. Pressure is applied to the molten resin through the molding die to make the molten resin harden to form hardened resin, thereby performing resin packaging on the chips on the substrate.

[0004] Although the compression molding method has significant advantages in chip packaging, there are still some technical problems and challenges in practical applications. Among them, the problem of the supply uniformity of the resin material is particularly prominent. Specifically, during the process of supplying resin particles to the molding die, if the distribution of the resin particles is uneven, it will cause the uneven distribution of the molten resin in the molding die during the packaging process, thereby causing packaging defects. These defects may manifest as voids, bubbles or incomplete filling in the package, seriously affecting the packaging yield and the performance of the packaged chips.

[0005] Therefore, in view of the above technical problems, it is necessary to provide a new solution. Summary of the Utility Model

[0006] The purpose of the utility model is to provide a feeding mechanism, an electronic component packaging device and a packaging method, which can...

[0007] To achieve the above purpose, the technical solutions provided by the utility model are as follows:

[0008] In the first aspect, the utility model provides a feeding mechanism, which includes:

[0009] A material storage frame having a through hole penetrating in the up and down direction. An adsorption member for adsorbing a release film to the lower surface of the material storage frame is provided on the material storage frame. When the release film is adsorbed to the lower surface of the material storage frame, it covers the lower side of the through hole, and the periphery of the release film extends beyond both sides of the material storage frame;

[0010] A frame grasping component for grasping the material receiving frame. When the frame grasping component grasps the material receiving frame, it can form an interference with the material receiving frame in the up and down direction.

[0011] A pressing component for pressing the material receiving frame when the frame grasping component grasps the material receiving frame, so that the frame grasping component and the pressing component cooperate to clamp and fix the material receiving frame in the up and down direction.

[0012] A film clamping component includes two clamping members respectively arranged on both sides of the frame grasping component. The clamping member includes a clamping part and a clamping finger part that can move relatively to cooperate with clamping the upper and lower surfaces of the peripheral edge of the release film. The distance between the clamping parts of the two clamping members is greater than the width of the material receiving frame and less than the width of the release film. The clamping finger part includes an open state when moving away from the lower surface of the clamping part and a clamping state when approaching the lower surface of the clamping part.

[0013] In the open state, the distance between the clamping finger parts of the two clamping members is greater than the width of the release film; in the clamping state, the distance between the clamping finger parts of the two clamping members is less than the width of the release film.

[0014] In one or more embodiments, a film tension member is arranged in the through hole of the material receiving frame. The film tension member is arranged on the inner side surface of the material receiving frame in a liftable manner, and the film tension member can descend to exceed the lower surface of the material receiving frame.

[0015] In one or more embodiments, the frame grasping component includes two jaws that can approach and separate relatively. The two jaws approach each other to grasp the material receiving frame and separate from each other to release the material receiving frame.

[0016] In one or more embodiments, clamping grooves are arranged on the two jaws. The opening directions of the clamping grooves on the two jaws are opposite. A clamping part corresponding to the clamping groove is arranged on the material receiving frame. The two jaws approaching each other can make the clamping part be clamped in the clamping groove.

[0017] In one or more embodiments, an avoidance groove for avoiding the jaws is arranged on the outer side of the clamping part.

[0018] In one or more embodiments, the pressing component includes a liftable pressing plate and a driving member for driving the lifting of the pressing plate; when the frame grasping component grasps the material receiving frame, the pressing plate can abut against the upper surface of the material receiving frame under the drive of the driving member.

[0019] In one or more embodiments, a negative pressure connector for connecting to a negative pressure source is provided on the pressing plate. The adsorption member includes a negative pressure interface and adsorption holes communicating with the negative pressure interface, and the adsorption holes penetrate through the lower surface of the material receiving frame. When the pressing plate abuts against the upper surface of the material receiving frame, the negative pressure connector is docked with the negative pressure interface.

[0020] In one or more embodiments, the finger portion is rotatably provided on the clamping portion, and rotating the finger portion can make the finger portion away from or close to the lower surface of the clamping portion, so that the finger portion can be switched between an open state and a clamping state.

[0021] In a second aspect, the present invention provides an electronic component packaging device, which includes: a molding die, a mold closing mechanism, a feeding mechanism, and the aforementioned feeding mechanism; the molding die includes an upper die and a lower die arranged oppositely, and the lower die has a cavity; the mold closing mechanism is used for closing the upper die and the lower die; the feeding mechanism is used for supplying a packaging material to the material receiving frame when a release film is covered on the lower surface of the material receiving frame of the feeding mechanism, so that the packaging material is carried on the release film; the feeding mechanism is used for transporting the release film and the packaging material carried on the release film to the cavity.

[0022] Compared with the prior art, the feeding mechanism and the electronic component packaging device provided by the present invention firmly adsorb the release film on the material receiving frame through the adsorption member, and cooperate with the precise clamping of the film clamping assembly, effectively avoiding the problem of uneven distribution of the packaging material; the coordinated work of the frame grasping assembly and the pressing assembly realizes the stable clamping of the material receiving frame in the up and down directions, reducing the unstable factors during the handling process; the finger portion design of the film clamping assembly avoids unnecessary contact with the release film, reducing the curling and wrinkling of the release film caused by mechanical interference. Description of the Drawings

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments recorded in the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0024] Figure 1 It is a schematic structural diagram of the feeding mechanism in a use state according to an embodiment of the present invention;

[0025] Figure 2 It is Figure 1 A schematic structural diagram of the feeding mechanism in another use state as shown;

[0026] Figure 3Structural schematic diagram of the loading mechanism in an embodiment of the present utility model;

[0027] Figure 4 Structural schematic diagram of the material receiving frame in an embodiment of the present utility model;

[0028] Figure 5 is Figure 4 Cross-sectional view of the shown material receiving frame;

[0029] Figure 6 is Figure 4 Cross-sectional view of the shown material receiving frame in a usage state;

[0030] Figure 7 Structural schematic diagram of the clamping member in a usage state in an embodiment of the present utility model;

[0031] Figure 8 is Figure 7 Structural schematic diagram of the shown clamping member in another usage state;

[0032] Figure 9 is Figure 7 Structural schematic diagram of the shown clamping member in a state of clamping the release film.

[0033] Main reference numeral description:

[0034] 1 - Material receiving frame, 11 - Through hole, 12 - Adsorption member, 121 - Negative pressure interface, 122 - Adsorption hole, 13 - Film tension member, 131 - Limiting portion, 14 - Protruding portion, 15 - Clamping portion, 16 - Avoidance opening, 2 - Frame grasping assembly, 21 - Claw, 211 - Card slot, 3 - Pressing assembly, 31 - Pressing plate, 32 - Driving member, 33 - Negative pressure joint, 4 - Film clamping assembly, 41 - Clamping member, 42 - Fixed seat, 421 - Clamping portion, 43 - Driver, 431 - Telescopic rod, 432 - Link base, 433 - Pin shaft, 44 - Link structure, 45 - First link, 46 - Second link, 461 - Intermediate portion, 462 - Finger portion, 463 - Limiting groove, 464 - Elastic clip, 47 - Third link, 5 - Mounting seat, 6 - Release film, 7 - Encapsulation material. Detailed implementation manners

[0035] In order to enable those skilled in the art to better understand the technical solutions in the present utility model, the following will clearly and completely describe the technical solutions in the embodiments of the present utility model with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all of the embodiments. Based on the embodiments in the present utility model, all other embodiments obtained by those of ordinary skill in the art without making creative efforts shall fall within the protection scope of the present utility model.

[0036] Unless otherwise expressly stated, throughout the specification and claims, the term "comprising" or its variations such as "including" or "having" etc. shall be understood to include the stated elements or components, without excluding other elements or other components.

[0037] In the field of modern electronic component packaging, especially in the chip packaging process, the compression molding method is widely adopted due to its advantages of high precision and high efficiency. However, the existing compression molding method faces some technical challenges in practical applications, especially the uniformity problem of resin particle supply. The main manifestation of this problem is that during the process of supplying resin particles to the molding die, if the resin particles are unevenly distributed, it will lead to uneven distribution of the molten resin in the molding die during the encapsulation process, thereby causing encapsulation defects such as voids, bubbles or incomplete filling in the package. These defects seriously affect the encapsulation yield and the performance of the packaged chip.

[0038] To overcome the aforementioned technical problems, the present utility model proposes a new technical concept for the feeding mechanism. The core of this concept is to keep the release film flat and taut during the feeding process, so as to stably carry the packaging material and ensure the uniformity and consistency of the distribution of the packaging material throughout the feeding process.

[0039] Specifically, the present utility model designs a material receiving frame with a through-hole, and an adsorption member is arranged on its lower surface for firmly adsorbing the release film to the lower surface of the material receiving frame, ensuring that the release film covers the lower side of the through-hole. A frame grasping component and a pressing component are designed, and through the cooperation in the up and down directions, it is ensured that the material receiving frame remains stable during the feeding process. A film clamping component is designed, including two clamping members, which are respectively arranged on both sides of the frame grasping component. These clamping members can clamp and tension the release film without interfering with the periphery of the release film, avoiding curling or wrinkling of the release film and ensuring uniform distribution of the packaging material.

[0040] Please refer to Figures 1 to 9 As shown, the feeding mechanism in an embodiment of the present utility model includes a material receiving frame 1, a frame grasping component 2, a pressing component 3 and a film clamping component 4. The frame grasping component 2, the pressing component 3 and the film clamping component 4 are installed on the same mounting seat 5, and the frame grasping component 2, the pressing component 3 and the film clamping component 4 can be driven to move synchronously by driving the mounting seat 5.

[0041] Please refer to Figures 4 to 6 As shown, the material receiving frame 1 has a through-hole 11 penetrating in the up and down direction, and an adsorption member 12 for adsorbing the release film 6 to the lower surface of the material receiving frame 1 is arranged on the material receiving frame 1. When the release film 6 is adsorbed to the lower surface of the material receiving frame 1, it covers the lower side of the through-hole 11, and the periphery of the release film 6 extends beyond both sides of the material receiving frame 1.

[0042] The material containing frame 1 can be made of high-strength lightweight materials such as aluminum alloy or engineering plastics to ensure its durability under high temperature and high pressure conditions. The adsorption component 12 can adopt the negative pressure adsorption method to ensure that the release film 6 will not fall off or shift during the feeding process. The release film 6 covers the lower side of the through hole 11, and its periphery extends beyond both sides of the material containing frame 1, providing an operating space for subsequent clamping and handling. When the release film 6 covers the lower side of the through hole 11, it can jointly form a containing space with the through hole 11 for containing the encapsulation material 7 (such as powdery or granular resin material).

[0043] Please refer to Figures 1 to 3 As shown in the figure, the frame grasping component 2 is used to grasp the material containing frame 1. When the frame grasping component 2 grasps the material containing frame 1, it can form an interference with the material containing frame 1 in the vertical direction. The frame grasping component 2 can be realized by a robotic arm or a similar device to vertically grasp the material containing frame 1. During the grasping process, the frame grasping component 2 forms an interference with the material containing frame 1 in the vertical direction, ensuring the stability and accuracy of the grasping.

[0044] The frame grasping component 2 can adopt a mechanical clamping structure, including two jaws 21 that can approach and separate relative to each other, and can firmly grasp the material containing frame 1 through a driving device (such as a cylinder or an electric actuator). Anti-slip pads can be provided on the jaws 21 to improve the grasping stability.

[0045] Please refer to Figures 1 to 3 As shown in the figure, the pressing component 3 is used to press the material containing frame 1 when the frame grasping component 2 grasps the material containing frame 1, so that the frame grasping component 2 and the pressing component 3 cooperate to clamp and fix the material containing frame 1 in the vertical direction. The pressing component 3 works in cooperation with the frame grasping component 2, and can apply an appropriate pressure to the material containing frame 1 through the liftable pressing plate 31 to prevent the material containing frame 1 from shaking, shifting or tilting during handling, ensuring the stability of the material containing frame 1 during handling.

[0046] Please refer to Figures 1 to 3 As shown in the figure, the film clamping component 4 includes two clamping members 41 respectively arranged on both sides of the frame grasping component 2. The clamping member 41 includes a clamping part 421 and a finger part 462 that can move relative to each other to cooperate with clamping the upper and lower surfaces of the periphery of the release film 6. The distance d between the clamping parts 421 of the two clamping members 41 1 is greater than the width d of the material containing frame 1 2 and less than the width d of the release film 6 3 , and the finger part 462 includes an open state when it is far from the lower surface of the clamping part 421 and a clamping state when it is close to the lower surface of the clamping part 421. In the open state, the distance d between the finger parts 462 of the two clamping members 41 4 is greater than the width d of the release film 6 3; In the clamped state, the distance d between the finger portions 462 of the two clamping members 41 4 is less than the width d of the release film 6 3 .

[0047] Please refer to Figure 1 and Figure 2 As shown, in the open state, the distance between the finger portions 462 is greater than the width of the release film 6, avoiding interference with the release film 6; in the clamped state, the distance between the finger portions 462 is less than the width of the release film 6, ensuring stable clamping of the release film 6. The distance of the clamping portion 421 is designed to be greater than the width of the material receiving frame 1 and less than the width of the release film 6, so that in the clamped state, the release film 6 can be firmly clamped between the clamping portion 421 and the finger portions 462, and in the open state, the finger portions 462 will not interfere with the release film 6.

[0048] The clamping portion 421 can be made of rubber or silica gel material, providing sufficient friction and flexible protection to ensure that the release film 6 is not damaged during clamping. The finger portions 462 can be switched between the open and clamped states through a rotating mechanism.

[0049] During the feeding process, first place the material receiving frame 1 on the release film 6, so that the release film 6 covers the lower surface of the material receiving frame 1 and the lower side of the through hole 11, ensuring that the encapsulation material 7 will not leak during processing. In addition, the peripheral edge of the release film 6 extends beyond both sides of the material receiving frame 1, providing sufficient operating space for subsequent clamping and tensioning.

[0050] Supply the encapsulation material 7 into the through hole 11 of the material receiving frame 1 through the feeding mechanism, so that the encapsulation material 7 is carried on the release film 6. The design of the feeding mechanism can include a precise feeding device to ensure that the encapsulation material 7 (such as resin particles) can be evenly distributed on the release film 6.

[0051] After the feeding is completed, drive the mounting base 5 to move the frame grasping assembly 2, the pressing assembly 3 and the film clamping assembly 4 above the material receiving frame 1. After alignment (so that the projection of the material receiving frame 1 in the vertical direction can fall between the two clamping portions 421), start to descend. The key to this step is to ensure that the three assemblies can accurately align with the material receiving frame 1 to avoid deviations in subsequent operations.

[0052] The frame grasping assembly 2, the pressing assembly 3 and the film clamping assembly 4 start to descend synchronously until they reach the position where they can cooperate with the material receiving frame 1 to achieve grasping. During this process, the finger portions 462 of the film clamping assembly 4 are in the open state, so that the distance between the finger portions 462 is greater than the width of the release film 6. The purpose of this design is to avoid the finger portions 462 touching and interfering with the peripheral edge of the release film 6 during the descent, preventing the release film 6 from curling or wrinkling due to interference.

[0053] The frame grasping component 2 starts after descending in place and grasps the material containing frame 1. The frame grasping component 2 can grasp the material containing frame 1 through its grasping structure, ensuring that the material containing frame 1 does not move during the entire feeding process.

[0054] While the frame grasping component 2 grasps the material containing frame 1, the pressing component 3 starts to apply pressure. The pressing component 3 can apply a downward pressure to the material containing frame 1 through its pressing structure, cooperating with the frame grasping component 2 to clamp and fix the material containing frame 1 in the up and down direction. The function of the pressing component 3 is not only to fix the material containing frame 1, but also to ensure that the release film 6 is firmly adsorbed on the lower surface of the material containing frame 1, avoiding loosening or displacement.

[0055] During the process of the pressing component 3 applying pressure, the adsorption member 12 can be connected to the negative pressure source to generate a negative pressure to adsorb the release film 6 on the lower surface of the material containing frame 1. The negative pressure of the adsorption member 12 ensures that the release film 6 closely adheres to the material containing frame 1, covering the lower side of the through hole 11, providing a flat carrier for the uniform distribution of the encapsulation material 7.

[0056] With the actions of the frame grasping component 2 and the pressing component 3, the finger parts 462 of the film clamping component 4 switch to the clamping state. The clamping action of the finger parts 462 clamps the periphery of the release film 6 between the clamping part 421 and the finger parts 462, ensuring that the release film 6 remains in a tensioned state during the entire processing. The distance between the clamping parts 421 is designed to be greater than the width of the material containing frame 1 but less than the width of the release film 6, ensuring that the release film 6 is accurately clamped.

[0057] After completing the above series of operations, the entire feeding mechanism starts to move. The feeding mechanism transports the release film 6 and the encapsulation material 7 carried on the release film 6 to the cavity of the lower mold. The moving process maintains stability and accuracy to ensure that the release film 6 and the encapsulation material 7 on it do not displace or tilt, affecting the subsequent encapsulation operation.

[0058] When the feeding mechanism transports the release film 6 and the encapsulation material 7 to the cavity of the lower mold, the adsorption member 12 releases the adsorption of the release film 6. At this time, the release film 6 and the encapsulation material 7 on it are supplied into the cavity together, ready for the encapsulation and forming operation. The process of releasing the adsorption needs to ensure that the release film 6 can smoothly separate from the material containing frame 1 and accurately fall into the cavity of the lower mold, avoiding the scattering or uneven distribution of the materials.

[0059] After the release film 6 and the encapsulation material 7 accurately fall into the cavity of the lower mold, further processing and forming operations can be carried out. This step usually includes closing the mold, heating the encapsulation material 7 to make it melt, and forming it under a certain pressure to finally form the encapsulated electronic component.

[0060] In an exemplary embodiment, please refer toFigures 4 to 6 As shown, a film tension member 13 is provided in the through hole 11 of the material receiving frame 1. The film tension member 13 is vertically movably provided on the inner side surface of the material receiving frame 1 and can descend beyond the lower surface of the material receiving frame 1.

[0061] The film tension member 13 is vertically movably provided on the inner side surface of the material receiving frame 1, and its main function is to adjust the tension state of the release film 6 through the lifting action. When the film tension member 13 descends beyond the lower surface of the material receiving frame 1, a downward pressure is exerted on the release film 6. This pressure causes the release film 6 to closely adhere to the lower surface of the film tension member 13, thereby keeping the release film 6 in a tensioned state. The surface of the film tension member 13 is designed to be smooth to avoid friction or damage when pressing the release film 6. The surface of the film tension member 13 can be coated with a low-friction material such as polytetrafluoroethylene (PTFE) to reduce the friction between the release film 6 and the member and improve the film tensioning effect.

[0062] After the film tension member 13 presses down the release film 6, it not only makes the release film 6 closely adhere to its lower surface but also effectively blocks the lateral movement of the encapsulation material 7 on the release film 6, thereby preventing the encapsulation material 7 from entering between the lower surface of the material receiving frame 1 and the upper surface of the release film 6, ensuring that the encapsulation material 7 can be evenly distributed on the release film 6 and avoiding encapsulation defects caused by uneven material distribution.

[0063] Specifically, please refer to Figure 5 and Figure 6 As shown, a protruding portion 14 for restricting the descent of the film tension member 13 protrudes from the inner side surface of the material receiving frame 1. The protruding portion 14 is disposed near the lower surface of the material receiving frame 1. A limiting portion 131 corresponding to the protruding portion 14 protrudes from the outer side surface of the film tension member 13. The limiting portion 131 cooperates with the protruding portion 14 to restrict the descent of the film tension member 13.

[0064] The main function of the protruding portion 14 is to ensure that the film tension member 13 remains at a predetermined position during the descent process, avoiding damage or functional failure of the release film 6 caused by excessive descent of the film tension member 13. The protruding portion 14 can be fixed to the inner side surface of the material receiving frame 1 by integral molding or later installation. Its shape and size match the design of the film tension member 13 to ensure that it can effectively restrict the descent of the film tension member 13.

[0065] A limiting portion 131 corresponding to the protruding portion 14 of the material receiving frame 1 is provided on the outer side surface of the film tension member 13. The limiting portion 131 cooperates with the protruding portion 14 to ensure that the film tension member 13 stops descending after reaching the predetermined position. The main function of the limiting portion 131 is to provide a physical limit to prevent the film tension member 13 from descending excessively.

[0066] In an exemplary embodiment, please refer toFigures 1 to 3 As shown, the frame gripping assembly 2 includes two jaws 21 that can move relatively closer and farther apart. The two jaws 21 move closer to each other to grip the material storage frame 1 and move farther apart to release the material storage frame 1.

[0067] The frame gripping assembly 2 is a component in the entire feeding mechanism for realizing the gripping and releasing of the material storage frame 1. The two jaws 21 are designed to be able to move relatively closer and farther apart to achieve the gripping and releasing actions. The jaws 21 can be made of high-strength materials such as stainless steel or aluminum alloy to ensure their durability and reliability during frequent operations. The inner surface of the jaws 21 can be coated with anti-slip materials such as rubber pads to enhance the stability of gripping. The closer and farther movement of the jaws 21 can be controlled by a driving device. The driving device can include a cylinder, a servo motor, an electric push rod, etc. These driving devices can provide precise control and rapid response to ensure the smooth and accurate movement of the jaws 21.

[0068] Specifically, please refer to Figure 2 As shown, the two jaws 21 are provided with clamping grooves 211. The opening directions of the clamping grooves 211 on the two jaws 21 are opposite. The material storage frame 1 is provided with a clamping portion 15 corresponding to the clamping groove 211. When the two jaws 21 move closer to each other, the clamping portion 15 can be clamped in the clamping groove 211.

[0069] The opening directions of the clamping grooves 211 are opposite to ensure that the clamping portion 15 of the material storage frame 1 can be simultaneously clamped when the jaws 21 move closer to each other. The shape and size of the clamping portion 15 need to match the clamping grooves 211 on the jaws 21 to ensure that the clamping portion 15 can smoothly fit into the clamping grooves 211 when the jaws 21 move closer to each other, realizing the gripping.

[0070] When the frame gripping assembly 2 descends to a position where it can cooperate with the material storage frame 1 to achieve gripping, the clamping grooves 211 on the jaws 21 will correspond to the clamping portion 15 on the material storage frame 1. When the two jaws 21 move closer to each other, the clamping portion 15 can be inserted into the clamping grooves 211 to realize the gripping of the material storage frame 1.

[0071] Specifically, please refer to Figures 2 to 4 As shown, in order to prevent the jaws 21 from colliding with the material storage frame 1 during the gripping and releasing processes, an avoidance opening 16 for avoiding the jaws 21 is provided on the outside of the clamping portion 15. The avoidance opening 16 can provide enough space for the jaws 21 to move, ensuring that the jaws 21 do not collide with the material storage frame 1 during the gripping and releasing processes.

[0072] In an exemplary embodiment, please refer to Figures 1 to 3As shown, the pressing assembly 3 includes a liftable pressing plate 31 and a driving member 32 for driving the lifting of the pressing plate 31; when the frame gripping assembly 2 grips the material receiving frame 1, the pressing plate 31 can be moved by the driving member 32 to abut against the upper surface of the material receiving frame 1.

[0073] The pressing assembly 3 is used in the feeding mechanism to further fix the material receiving frame 1 after the material receiving frame 1 is gripped by the frame gripping assembly 2. The pressing assembly 3 includes a liftable pressing plate 31 and a driving member 32. The pressing plate 31 can be lifted and lowered under the action of the driving member 32 and abut against the upper surface of the material receiving frame 1, so as to realize stable pressing of the material receiving frame 1.

[0074] A flexible gasket, such as rubber or silica gel, can be added to the surface of the pressing plate 31 to avoid damaging the surface of the material receiving frame 1. The pressing plate 31 needs to be designed to be flat and have sufficient area to ensure uniform pressure application during pressing and guarantee the stability of the material receiving frame 1.

[0075] After the frame gripping assembly 2 grips the material receiving frame 1, the pressing plate 31 of the pressing assembly 3 starts to move, and slowly descends under the action of the driving member 32 until it abuts against the upper surface of the material receiving frame 1. The main function of the pressing plate 31 is to keep the material receiving frame 1 stable by applying a downward pressure, avoiding movement or tilting during subsequent operations.

[0076] Specifically, please refer to Figure 3 and Figure 5 As shown, a negative pressure connector 33 for connecting to a negative pressure source is provided on the pressing plate 31. The adsorption member 12 includes a negative pressure interface 121 and adsorption holes 122 communicating with the negative pressure interface 121. The adsorption holes 122 penetrate the lower surface of the material receiving frame 1. When the pressing plate 31 abuts against the upper surface of the material receiving frame 1, the negative pressure connector 33 is docked with the negative pressure interface 121 to form a complete negative pressure channel, thereby providing an adsorption force through the negative pressure source.

[0077] In an exemplary embodiment, please refer to Figures 1 to 3 As shown, the finger part 462 is rotatably provided on the clamping part 421. Rotating the finger part 462 can make the finger part 462 move away from or close to the lower surface of the clamping part 421, so that the finger part 462 can be switched between an open state and a clamping state.

[0078] The finger part 462 is a component rotatably provided on the clamping part 421. Its main function is to switch between an open state and a clamping state by rotation. The finger part 462 can firmly clamp the release film 6 in the clamping state, and can release the release film 6 in the open state, thus completing the operations of grasping and releasing. The finger part 462 is designed to be a rotatable structure and can be connected to the clamping part 421 through a hinge or a bearing to achieve flexible rotation movement.

[0079] The finger clamping part 462 realizes the switching between the open state and the clamping state through rotation. When the finger clamping part 462 rotates outward, it moves away from the lower surface of the clamping part 421, increasing the distance between the two finger clamping parts 462 and entering the open state; when the finger clamping part 462 rotates inward, it approaches the lower surface of the clamping part 421, reducing the distance between the two finger clamping parts 462 and entering the clamping state.

[0080] In an exemplary embodiment, please refer to Figures 7 to 9 As shown, the clamping member 41 includes a fixed seat 42, a driver 43, and a link structure 44. The bottom of the fixed seat 42 is provided with a clamping part 421. The driver 43 (which can be a cylinder, a hydraulic cylinder, an electric cylinder, etc.) is fixed on the fixed seat 42. The driver 43 has a telescopic rod 431, and a link base 432 is fixedly connected to the telescopic rod 431. The link structure 44 includes a first link 45, a second link 46, and a third link 47. The first end of the first link 45 is hinged to the fixed seat 42, and the second end is hinged to the middle part 461 of the second link 46; one end of the second link 46 away from the clamping part 421 is hinged to the link base 432, and the other end is provided with a finger clamping part 462 for cooperating with the clamping part 421 to clamp the release film 6. A limiting groove 463 is provided at one end of the second link 46 away from the clamping part 421. A pin shaft 433 is fixedly provided on the link base 432, and the pin shaft 433 is hinged in the limiting groove 463 and can slide along the limiting groove 463. One end of the third link 47 is hinged to the link base 432, and the other end is hinged to the middle part of the first link 45.

[0081] Among them, when the telescopic rod 431 extends, it can make the second end of the first link 45 rotate towards the direction close to the clamping part 421, so as to drive the second link 46 close to the clamping part 421; and the second link 46 can rotate around the second end of the first link 45 to drive the finger clamping part 462 close to the clamping part 421.

[0082] The limiting groove 463 is provided at one end of the second link 46 away from the clamping part 421. Its main function is to provide a certain displacement space for the second link 46, so that the second link 46 can flexibly adjust its position during the movement. Through the setting of the limiting groove 463, the second link 46 can smoothly switch between approaching the clamping part 421 and moving away from the clamping part 421. The length and shape of the limiting groove 463 need to be optimized according to specific movement requirements to ensure that the second link 46 can obtain sufficient degrees of freedom during the movement.

[0083] The function of the pin shaft 433 is to transmit the movement of the connecting rod base 432 to the second connecting rod 46, and realize the displacement of the second connecting rod 46 through the sliding in the limiting groove 463. When the driver 43 drives the connecting rod base 432 to move, the pin shaft 433 slides in the limiting groove 463, enabling the second connecting rod 46 to obtain a certain degree of displacement freedom. The design of the pin shaft 433 needs to ensure that it can slide smoothly in the limiting groove 463, and high-strength and low-friction materials can be used for manufacturing, such as high-strength steel or alloys coated with low-friction materials.

[0084] Specifically, the third connecting rod 47 is configured such that when the telescopic rod 431 is at the first extended length, the angle between the third connecting rod 47 and the telescopic rod 431 is an obtuse angle ( Figure 7 angle α in the figure); when the telescopic rod 431 is at the second extended length, the angle between the third connecting rod 47 and the telescopic rod 431 is an acute angle ( Figure 9 angle α in the figure). When the telescopic rod 431 is at the first extended length, the finger part 462 is away from the clamping part 421; when the telescopic rod 431 is at the second extended length, the finger part 462 is close to the clamping part 421.

[0085] Please refer to Figure 7 As shown, when the telescopic rod 431 is at the first extended length, the entire film clamping mechanism is in the initial state. In this state, the length of the telescopic rod 431 is short, and the finger part 462 is away from the clamping part 421. At this time, a relatively large distance is maintained between the finger part 462 and the clamping part 421, enabling the release film 6 to be freely placed or adjusted. When the telescopic rod 431 extends to the second extended length, the finger part 462 is close to the clamping part 421, realizing the clamping of the release film 6. In this state, the length of the telescopic rod 431 reaches the maximum, and each component in the connecting rod structure 44 moves coordinately to ensure that the finger part 462 is closely attached to the clamping part 421.

[0086] When the telescopic rod 431 is at the first extended length (initial state, the finger part 462 is in the Figure 7 open state shown in the figure), the angle between the third connecting rod 47 and the telescopic rod 431 is an obtuse angle. This means that the line connecting the two hinge points of the third connecting rod 47 forms an angle greater than 90 degrees with the axis of the telescopic rod 431. In this state, the height of the hinge point (the first hinge point 471) of the third connecting rod 47 and the connecting rod base 432 is higher than the height of the hinge point (the second hinge point 472) of the third connecting rod 47 and the first connecting rod 45. At this time, the finger part 462 is away from the clamping part 421, and the release film 6 can be freely placed or adjusted.

[0087] As the telescopic rod 431 extends, the angle between the third link 47 and the telescopic rod 431 begins to decrease. Since the distance between the first hinge point 471 and the second hinge point 472 is constant, the extension of the telescopic rod 431 causes the height of the first hinge point 471 to gradually decrease. When the height of the first hinge point 471 drops to the same level as the second hinge point 472 (as Figure 8 shown), the angle between the third link 47 and the telescopic rod 431 becomes a right angle. During this process, the third link 47 pushes the first link 45 to rotate towards the clamping portion 421, driving the second link 46 to also move towards the clamping portion 421. The finger portion 462 gradually approaches the clamping portion 421, preparing for the subsequent clamping action.

[0088] Please refer to Figure 9 shown. As the telescopic rod 431 continues to extend, the angle between the third link 47 and the telescopic rod 431 further decreases and becomes an acute angle (less than 90 degrees). During this process, the height of the first hinge point 471 continues to drop and is lower than the height of the second hinge point 472. Since the distance between the hinge point of the third link 47 and the first link 45 remains constant, the third link 47 will pull the first link 45 to rotate away from the clamping portion 421. This movement drives the second link 46 to also move away from the clamping portion 421. During this process, the finger portion 462 continues to approach the clamping portion 421 to clamp the release film 6. The movement of the second link 46 away from the clamping portion 421 not only enables the finger portion 462 to clamp the release film 6 but also exerts an outward pulling force on the release film 6. This outward pulling force further tensions the release film 6, ensuring the flatness of the surface of the release film 6. This tensioning effect is beneficial for the uniform distribution of the resin material and avoids uneven distribution caused by the relaxation of the release film 6.

[0089] Furthermore, please refer to Figure 7 shown. An elastic clip 464 is provided on the side of the finger portion 462 close to the clamping portion 421. The elastic clip 464 is a component that cooperates with the clamping portion 421 to achieve film clamping. The elastic clip 464 can be made of materials with high elasticity and wear resistance, such as spring steel or engineering plastics. The material selection needs to ensure that the elastic clip 464 can maintain good elastic deformation ability and durability during frequent use. The shape design of the elastic clip 464 needs to be optimized according to the characteristics of the release film 6 and the structure of the clamping portion 421 to ensure that it can closely fit the release film 6 during clamping and avoid the sliding or falling off of the film.

[0090] Please refer to Figure 9As shown, when the telescopic rod 431 extends to a predetermined length, it can drive the finger portion 462 closer to the clamping portion 421 and make the elastic clip 464 abut against the clamping portion 421, realizing a stable clamping function. The elastic clip 464 has a certain elastic deformation function and can better fit the surface of the film when clamping the release film 6. The elastic deformation ability of the elastic clip 464 enables it to automatically adjust the bonding force during the clamping process to adapt to release films 6 of different thicknesses and materials.

[0091] In an embodiment of the present utility model, an electronic component packaging device is provided, which includes: a forming die, a mold clamping mechanism, a feeding mechanism, and the aforementioned feeding mechanism. The forming die includes an upper die and a lower die arranged oppositely, and the lower die has a cavity; the mold clamping mechanism is used for clamping the upper die and the lower die; the feeding mechanism is used for supplying packaging material to the material receiving frame when a release film covers the lower surface of the material receiving frame of the feeding mechanism, so that the packaging material is carried on the release film; the feeding mechanism is used for transporting the release film and the packaging material carried on the release film to the cavity.

[0092] The mold clamping mechanism controls the clamping and parting operations of the upper die and the lower die through a driving device. During the packaging process, the mold clamping mechanism provides sufficient clamping force to closely fit the upper die and the lower die to form a sealed mold cavity. Under the action of the mold clamping mechanism, the forming die can maintain the pressure and temperature of the mold cavity during the curing process of the packaging material to ensure the uniform curing and forming of the packaging material.

[0093] When a release film covers the lower surface of the material receiving frame of the feeding mechanism, the feeding mechanism supplies packaging material to the material receiving frame. The feeding mechanism adsorbs the release film by negative pressure to ensure the uniformity of the packaging material during transportation. The cooperation of the feeding mechanism and the feeding mechanism ensures that the packaging material can be evenly distributed on the release film and accurately transported to the cavity of the lower die through the feeding mechanism.

[0094] The feeding mechanism transports the release film and the packaging material carried on the release film to the cavity of the lower die. After the upper die and the lower die are clamped, the packaging material cures and forms in the cavity.

[0095] In an embodiment of the present utility model, an electronic component packaging method applied to the aforementioned electronic component packaging device is also provided. The method specifically includes the following steps:

[0096] S1: Configure a material receiving frame on the release film so that the release film can cover the lower surface of the material receiving frame and the lower side of the holes of the material receiving frame, and make the peripheral edge of the release film extend beyond both sides of the material receiving frame;

[0097] S2: Supply packaging material into the through holes of the material receiving frame through the feeding mechanism so that the packaging material is carried on the release film;

[0098] S3: After moving the frame grasping assembly, the pressing assembly, and the film clamping assembly above the material storage frame and aligning them, lower the frame grasping assembly, the pressing assembly, and the film clamping assembly to a position where they can cooperate with the material storage frame to achieve grasping, so that the lower surface of the clamping portion of the film clamping assembly is close to the upper surface of the periphery of the release film; wherein, during the lowering process, the finger portions of the film clamping assembly are in an open state;

[0099] S4: Start the frame grasping assembly to grasp the material storage frame, press down the pressing assembly so that the frame grasping assembly and the pressing assembly cooperate to clamp and fix the material storage frame in the up and down direction, and make the adsorption member of the material storage frame adsorb the release film on the lower surface of the material storage frame;

[0100] S5: Switch the finger portions to the clamping state, and clamp the periphery of the release film between the clamping portion and the finger portions;

[0101] S6: Move the feeding mechanism to transport the release film and the packaging material carried on the release film to the cavity of the lower mold;

[0102] S7: Release the adsorption of the adsorption member on the release film, and supply the release film and the packaging material carried on the release film into the cavity together.

[0103] S8: After the release film and the packaging material are supplied into the cavity of the lower mold, heat the packaging material to make it melt;

[0104] S9: Close the upper mold and the lower mold, immerse the electronic component in the molten packaging material, apply pressure to the molten packaging material through the forming mold, and harden the molten packaging material to encapsulate the electronic component.

[0105] The feeding mechanism, the electronic component encapsulation device, and the encapsulation method provided by the present utility model firmly adsorb the release film on the material storage frame through the adsorption member, and cooperate with the precise clamping of the film clamping assembly, effectively avoiding the problem of uneven distribution of the packaging material; the coordinated work of the frame grasping assembly and the pressing assembly realizes the stable clamping of the material storage frame in the up and down direction, reducing the unstable factors during the handling process; the design of the finger portions of the film clamping assembly avoids unnecessary contact with the release film, reducing the curling and wrinkling of the release film caused by mechanical interference.

[0106] For those skilled in the art, it is obvious that the present utility model is not limited to the details of the above-described exemplary embodiments, and the present utility model can be implemented in other specific forms without departing from the spirit or basic characteristics of the present utility model. Therefore, in any regard, the embodiments should be regarded as exemplary and non-limiting. The scope of the present utility model is defined by the appended claims rather than the above description. Therefore, all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be embraced within the present utility model. Any reference signs in the claims should not be construed as limiting the claims involved.

[0107] In addition, it should be understood that although this specification is described in terms of embodiments, not every embodiment only contains an independent technical solution. This narrative manner of the specification is only for clarity. Those skilled in the art should regard the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A feeding mechanism, characterized in that: include: A material receiving frame having a through hole extending in the up-down direction, wherein the material receiving frame is provided with an adsorption member for adsorbing a release film on the lower surface of the material receiving frame, wherein the release film covers the lower side of the through hole when adsorbed on the lower surface of the material receiving frame, and the periphery of the release film extends beyond the two sides of the material receiving frame; A frame grabbing component, used for grabbing the material receiving frame, and when the frame grabbing component grabs the material receiving frame, it can form interference with the material receiving frame in the up and down directions; A pressing assembly, used for pressing the material receiving frame when the frame grabbing assembly grabs the material receiving frame, so that the frame grabbing assembly and the pressing assembly cooperate to clamp and fix the material receiving frame in the up and down directions; A film clamping assembly, comprising two clamping members respectively arranged on both sides of the frame grabbing assembly, the clamping members comprising a clamping portion and a clamping finger portion which can move relatively to cooperate with the upper and lower surfaces of the periphery of the release film, the spacing between the clamping portions of the two clamping members is greater than the width of the material receiving frame and less than the width of the release film, and the clamping finger portion comprises an open state when away from the lower surface of the clamping portion and a clamping state when close to the lower surface of the clamping portion; In the open state, the distance between the clamping fingers of the two clamping members is greater than the width of the release film; in the clamping state, the distance between the clamping fingers of the two clamping members is less than the width of the release film.

2. The feeding mechanism according to claim 1, characterized in that: A membrane tension member is provided in the through hole of the material receiving frame. The membrane tension member is movably provided on the inner side surface of the material receiving frame. The membrane tension member can be lowered to exceed the lower surface of the material receiving frame.

3. The feeding mechanism according to claim 1, characterized in that: The frame grabbing assembly comprises two clamping jaws which can be relatively close to and far away from each other. The two clamping jaws are close to each other to grab the material receiving frame and are far away from each other to release the material receiving frame.

4. The feeding mechanism according to claim 3, characterized in that: The two clamping jaws are provided with a card slot, the opening directions of the card slots on the two clamping jaws are opposite, and the material receiving frame is provided with a clamping part corresponding to the card slot. When the two clamping jaws are close to each other, the clamping part can be clamped in the card slot.

5. The feeding mechanism according to claim 4, characterized in that: The outer side of the clamping portion is provided with an avoidance groove for avoiding the clamping claws.

6. The feeding mechanism according to claim 1, characterized in that: The pressing assembly includes a lifting and lowering pressing plate and a driving member for driving the lifting and lowering of the pressing plate; When the frame grabbing assembly grabs the material receiving frame, the pressing plate can be pressed against the upper surface of the material receiving frame under the movement of the driving member.

7. The feeding mechanism according to claim 6, characterized in that: The pressing plate is provided with a negative pressure connector for connecting to a negative pressure source, the adsorption component includes a negative pressure interface and an adsorption hole connected to the negative pressure interface, and the adsorption hole passes through the lower surface of the material receiving frame; When the pressing plate is pressed against the upper surface of the material receiving frame, the negative pressure joint is butted against the negative pressure interface.

8. The feeding mechanism according to claim 1, characterized in that: The clamping finger portion is rotatably arranged on the clamping portion. Rotating the clamping finger portion can make the clamping finger portion move away from or close to the lower surface of the clamping portion, so that the clamping finger portion is switched between an open state and a clamping state.

9. An electronic component packaging device, characterized in that: include: A forming die, a clamping mechanism, a feeding mechanism, and a loading mechanism as claimed in any one of claims 1 to 8; The molding die comprises an upper die and a lower die which are arranged opposite to each other, and the lower die has a cavity; The mold clamping mechanism is used to clamp the upper mold and the lower mold; The feeding mechanism is used to supply packaging material to the material receiving frame when the lower surface of the material receiving frame of the feeding mechanism is covered with a release film, so that the packaging material is carried on the release film; The feeding mechanism is used to transport the release film and the packaging material carried on the release film to the mold cavity.

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