Modularized anti-scaling chip and anti-scaling device thereof

Abstract

The utility model discloses a modularization antiscale chip and antiscale device thereof, including at least one chip mainboard, the chip mainboard is provided with a first through hole used for connecting with another same chip mainboard to form an antiscale chip, the chip mainboard is provided with a plurality of opening parts with outward openings. According to the utility model, a modularized anti-scaling chip is designed, a plurality of anti-scaling chips can be connected in parallel to be suitable for anti-scaling devices of various specifications, and the cost of the anti-scaling devices of various specifications is reduced.

Description

Technical Field

[0001] The utility model relates to the field of anti-scaling equipment, in particular to a modular anti-scaling chip and an anti-scaling device thereof. Background Art

[0002] The anti-scaling device is equipped with a multi-alloy physical anti-scaling chip. The multi-alloy chip is a kind of chip that can release free electrons, change the physical structure of water molecules, and at the same time keep the chemical composition of the raw water unchanged, achieving the effects of anti-scaling and descaling. It integrates the functions of anti-scaling, descaling, paraffin prevention, paraffin removal, and corrosion prevention, and is an indispensable water treatment equipment in modern industry and daily life.

[0003] Such as Figure 1-2 As shown, the current anti-scaling chips on the market are circular chips. The outer diameter of the circular chip must be close to the inner diameter of the container. Therefore, the circular chip can only be adapted to a kind of anti-scaling device with a specific specification. When a larger flow rate is required in the usage scenario, a new anti-scaling chip has to be customized by opening a new mold. However, the cost of the anti-scaling chip mold is extremely high, resulting in too high cost of the anti-scaling device and inability to be applicable to anti-scaling devices of different specifications. Content of the Utility Model

[0004] The purpose of the utility model is to solve the above technical problems, and provide a modular anti-scaling chip and an anti-scaling device thereof. The utility model designs a modular anti-scaling chip, which can be adapted to anti-scaling devices of various specifications by connecting multiple anti-scaling chips in parallel, reducing the cost of anti-scaling devices of various specifications.

[0005] The technical solution adopted by the utility model to solve the above technical problems is: a modular anti-scaling chip, including at least one chip main board, on which a first through hole is opened for connecting with another same chip main board to form an anti-scaling chip, and a plurality of opening parts opening outward are arranged on the chip main board. Through the design of the first through hole, multiple chip main boards can be connected to form an anti-scaling chip, which can be used with anti-scaling devices of different specifications, reducing the mold opening cost of the anti-scaling chip, and thus reducing the cost of the anti-scaling device; through the design of the opening parts, when water flows, the opening parts can not only prevent scaling, but also allow water to pass through the chip main board from the opening parts after the water impacts the chip main board.

[0006] Preferably, fixing plates are arranged on adjacent chip main boards, fixing holes are arranged on the fixing plates, and bolts pass through the fixing holes and the first through hole to connect two adjacent chip main boards to form an anti-scaling chip. Through the design of the fixing plates, adjacent chip main boards are connected to form anti-scaling chips of different specifications. The fixing plates include a first fixing plate and a second fixing plate, and the chip main board is arranged between the first fixing plate and the second fixing plate.

[0007] Preferably, the chip mainboard is a square mainboard, the first through holes are arranged at the four right-angled edges of the square mainboard, and the fixing plate is provided with four fixing holes connected to the first through holes to connect four square mainboards to form an anti-scaling chip. Through the design of the square mainboard, four specifications of anti-scaling chips can be formed, namely, one chip mainboard, two chip mainboards connected up and down or left and right, and four chip mainboards connected.

[0008] Preferably, the opening portion includes an outwardly tilting piece arranged on the chip main board and a third through hole arranged on the chip main board, and the tilting piece is tilted above the third through hole. The third through hole allows water to flow through the chip main board. The tilting piece can block impurities in the water on the one hand, and increase the contact area between the water flow and the chip main board on the other hand, so that the electrochemical reaction between the chip main board and the water is more complete. The chip main board is made of copper-zinc alloy, and the tilting piece tilts toward the water inlet pipe.

[0009] An anti-scaling device comprises a shell, wherein the anti-scaling chip is arranged in the shell.

[0010] Preferably, a second through hole is provided on the chip main board, and a connecting rod is provided in the housing, and the connecting rod passes through the second through hole to connect a plurality of anti-scaling chips. Through the design of the second through hole, the anti-scaling chips are connected and fixed after the connecting rod passes through the second through hole, so as to prevent the anti-scaling chips from moving or colliding with the front and rear.

[0011] Preferably, nuts and / or nuts are provided at both ends of the connecting rod, and the nuts and / or nuts are arranged outside the second through hole. The design of the nuts and / or nuts prevents the anti-scaling chip from moving out of the connecting rod.

[0012] Preferably, a water inlet hole and a water outlet hole are provided on the shell, and a water inlet pipe and a water outlet pipe are provided on both sides of the shell. The water inlet pipe is connected to the water inlet hole, and the water outlet pipe is connected to the water outlet hole.

[0013] Preferably, a water inlet mounting ring is arranged outside the water inlet pipe, and a water outlet mounting ring is arranged outside the water outlet pipe. Through the design of the water inlet mounting ring and the water outlet mounting ring, the anti-scaling device can be directly adapted to the water pipe.

[0014] Preferably, a mounting plate is provided below the housing, the mounting plate includes a first mounting plate and a second mounting plate, the first mounting plate is provided below the housing, the second mounting plate is provided below the first mounting plate, the first mounting plate is provided with a groove for clamping the housing, and the first mounting plate and the second mounting plate are connected by bolts. The housing is fixed by the first mounting plate, and the anti-scaling device is fixed by the second mounting plate.

[0015] The utility model has the beneficial effect that: the utility model can be applicable to anti-scaling devices of various specifications by connecting a plurality of anti-scaling chips in parallel, thereby reducing the cost of anti-scaling devices of various specifications. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1It is a schematic structural diagram of an existing anti-scaling chip.

[0017] Figure 2 It is a schematic structural diagram of an opened housing of an existing anti-scaling device.

[0018] Figure 3 It is a schematic structural diagram of an anti-scaling device.

[0019] Figure 4 It is Figure 3 A cross-sectional view along the A-A direction.

[0020] Figure 5 It is a schematic structural diagram of an anti-scaling chip.

[0021] Figure 6 It is a schematic structural diagram of a chip main board.

[0022] Figure 7 It is a schematic structural diagram of a mounting plate.

[0023] Figure 8 It is a schematic structural diagram of a fixing plate.

[0024] Figure 9 It is a schematic structural diagram of a first fixing plate / second fixing plate.

[0025] Figure 10 It is a schematic structural diagram of a housing.

[0026] In the figure: 1. Anti-scaling chip, 2. Chip main board, 21. First through hole, 22. Opening part, 221. Fin, 222. Third through hole, 23. Second through hole, 3. Fixing plate, 31. Fixing hole, 32. First fixing plate, 33. Second fixing plate, 4. Housing, 41. Water inlet hole, 42. Water outlet hole, 5. Connecting rod, 6. Nut, 7. Cap nut, 8. Water inlet pipe, 9. Water outlet pipe, 10. Mounting plate, 101. First mounting plate, 1011. Groove, 102. Second mounting plate, 11. Water inlet mounting ring, 12. Water outlet mounting ring. Detailed implementation manners

[0027] The following further describes the present utility model in conjunction with the accompanying drawings and implementation manners.

[0028] As Figure 3-10 shown, a modular anti-scaling chip of the present utility model includes at least one chip main board 2. A first through hole 21 for connecting with another identical chip main board 2 to form an anti-scaling chip 1 is provided on the chip main board 2, and a plurality of opening parts 22 with openings facing outward are provided on the chip main board 2.

[0029] A fixing plate 3 is provided on the adjacent chip main board 2. A fixing hole 31 is provided on the fixing plate 3. A bolt passes through the fixing hole 31 and the first through hole 21 to connect two adjacent chip main boards 2 to form an anti-scaling chip 1. The fixing plate 3 includes a first fixing plate 32 and a second fixing plate 33. The chip main board 2 is arranged between the first fixing plate 32 and the second fixing plate 33.

[0030] The chip main board 2 is a square main board. The first through holes 21 are provided at the four right-angle edges of the square main board. The fixing plate 3 connects four square main boards to form an anti-scaling chip 1.

[0031] The opening 22 includes a fin 221 provided on the chip main board 2 and extending outward, and a third through hole 222 provided on the chip main board 2. The fin 221 is inclined above the third through hole 222.

[0032] An anti-scaling device includes a housing 4, and the anti-scaling chip 1 is provided inside the housing 4.

[0033] A second through hole 23 is provided on the chip main board 2. A connecting rod 5 is provided inside the housing 4. The connecting rod 5 passes through the second through hole 23 to connect a plurality of anti-scaling chips 1.

[0034] Nuts 6 and / or nuts 7 are provided at both ends of the connecting rod 5, and the nuts 6 and / or nuts 7 are arranged outside the second through hole 23.

[0035] The housing 4 is provided with a water inlet hole 41 and a water outlet hole 42. Water inlet pipes 8 and water outlet pipes 9 are provided on both sides of the housing 4. The water inlet pipe 8 is communicated with the water inlet hole 41, and the water outlet pipe 9 is communicated with the water outlet hole 42.

[0036] A water inlet mounting ring 11 is provided outside the water inlet pipe 8, and a water outlet mounting ring 12 is provided outside the water outlet pipe 9.

[0037] A mounting plate 10 is provided below the housing 4. The mounting plate 10 includes a first mounting plate 101 and a second mounting plate 102. The first mounting plate 101 is arranged below the housing 4, and the second mounting plate 102 is arranged below the first mounting plate 101. A groove 1011 for clamping the housing 4 is provided on the first mounting plate 101. The first mounting plate 101 and the second mounting plate 102 are bolted together.

[0038] It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0039] It should be noted that when an element is referred to as being "fixed on" or "provided on" another element, it can be directly located on the other element or indirectly located on the other element. When an element is referred to as "connected" to another element, it can be directly connected or indirectly connected to the other element.

[0040] It should be understood that the orientation or positional relationship indicated by terms such as "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention, rather than indicating that the device or component must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present invention.

[0041] In addition, the terms "first" and "second" are only used for descriptive purposes and should not be construed as indicating relative importance or indicating the quantity of technical features. In the description of the present invention, "a plurality of" means two or more unless otherwise specifically defined.

Claims

1. A modular anti-scaling chip, characterized in that: The invention comprises at least one chip main board (2), the chip main board (2) being provided with a first through hole (21) for connecting with another identical chip main board (2) to form an anti-scaling chip (1), and the chip main board (2) being provided with a plurality of openings (22) opening outward; adjacent chip main boards (2) being provided with a fixing plate (3), the fixing plate (3) being provided with a fixing hole (31), and bolts passing through the fixing hole (31) and the first through hole (21) connect two adjacent chip main boards (2) to form an anti-scaling chip (1).

2. The modular anti-scaling chip according to claim 1, characterized in that: The fixing plate (3) comprises a first fixing plate (32) and a second fixing plate (33), and the chip main board (2) is arranged between the first fixing plate (32) and the second fixing plate (33).

3. The modular anti-scaling chip according to claim 2, characterized in that: The chip main board (2) is a square main board, the first through holes (21) are arranged at four right-angled edges of the square main board, and the fixing plate (3) connects the four square main boards to form an anti-scaling chip (1).

4. The modular anti-scaling chip according to claim 1, characterized in that: The opening portion (22) comprises an outwardly directed lift piece (221) provided on the chip main board (2) and a third through hole (222) provided on the chip main board (2), wherein the lift piece (221) is obliquely provided above the third through hole (222).

5. An anti-scaling device, characterized in that: The invention comprises a shell (4), wherein the shell (4) is provided with an anti-scaling chip (1) as claimed in any one of claims 1 to 4.

6. The anti-scaling device according to claim 5, characterized in that: A second through hole (23) is provided on the chip main board (2), a connecting rod (5) is provided in the housing (4), and the connecting rod (5) passes through the second through hole (23) to connect a plurality of anti-scaling chips (1).

7. The anti-scaling device according to claim 6, characterized in that: Nuts (6) and / or nuts (7) are provided at both ends of the connecting rod (5), and the nuts (6) and / or nuts (7) are arranged outside the second through hole (23).

8. The anti-scaling device according to claim 5, 6 or 7, characterized in that: A water inlet hole (41) and a water outlet hole (42) are provided on the shell (4), and a water inlet pipe (8) and a water outlet pipe (9) are provided on both sides of the shell (4); the water inlet pipe (8) is connected to the water inlet hole (41), and the water outlet pipe (9) is connected to the water outlet hole (42).

9. The anti-scaling device according to claim 8, characterized in that: A water inlet mounting ring (11) is provided on the outer side of the water inlet pipe (8), and a water outlet mounting ring (12) is provided on the outer side of the water outlet pipe (9).

10. The anti-scaling device according to claim 5, 6, 7 or 9, characterized in that: A mounting plate (10) is provided below the housing (4), the mounting plate (10) comprising a first mounting plate (101) and a second mounting plate (102), the first mounting plate (101) being provided below the housing (4), the second mounting plate (102) being provided below the first mounting plate (101), the first mounting plate (101) being provided with a groove (1011) for clamping the housing (4), and the first mounting plate (101) and the second mounting plate (102) being connected by bolts.

Images