Ion source device for sputtering coating in powder nano material preparation process
By setting the first gas chamber and the second gas chamber in the ion source device, the problems of low argon utilization rate and unstable emission electrode temperature are solved, efficient utilization of argon and effective cooling of the emission electrode are achieved, and the overall working efficiency is improved.
Patent Information
- Application Number
- CN202421684162.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-16
- Publication Date
- 2025-05-27
- Estimated Expiration
- 2034-07-16
AI Technical Summary
The existing ion source devices have low utilization rate of argon and cannot effectively maintain the temperature of the emitter electrode, resulting in a decrease in working efficiency.
An ion source device including a first gas chamber and a second gas chamber is designed, and by inputting argon gas into the first gas chamber to increase the gas pressure, argon gas can stably enter the device, and nitrogen gas is brought into the cooling chamber through a gas conduit to maintain the temperature of the emitter electrode.
The utilization rate of argon is improved, the stable input of argon is ensured, and the temperature of the emitter electrode is maintained through effective cooling measures, thereby improving working efficiency.
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Figure CN222908044U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of nano metal powder preparation, and particularly relates to an ion source device for sputtering coating in a powder nano material preparation process. Background Art
[0002] Metal nano powder refers to ultra-fine particles with one or more dimensions in the range of 1 - 100 nm in three-dimensional space. There are two methods for its preparation, one is the chemical method, and the other is the physical method. The physical method includes the magnetron sputtering method, and the corresponding device is a sputtering negative ion source. Its working mode is to bombard the working substance with a positive ion beam to obtain the negative ions of this substance.
[0003] However, in the prior art, the utilization rate of argon by the ion source device is not high, and it is easy to leave excess argon inside the device. Moreover, the coolant cannot maintain the temperature of the emission electrode, resulting in unstable temperature of the emission electrode, thereby reducing the working efficiency. Summary of the Utility Model
[0004] The purpose of the utility model is to provide an ion source device for sputtering coating in a powder nano material preparation process to solve the problems that the existing ion source device has low utilization rate of argon and cannot maintain the temperature of the emission electrode.
[0005] To achieve the above purpose, the utility model provides the following technical solution: An ion source device for sputtering coating in a powder nano material preparation process, including a housing. A positive electrode plate is installed at the bottom inside the housing. A first gas chamber is arranged on one side of the inner wall of the housing. An air inlet is installed on one side inner wall of the first gas chamber. A second gas chamber is installed on the side of the inner wall of the housing opposite to the first gas chamber. A nitrogen inlet is installed on one side inner wall of the second gas chamber. A first air extraction port is arranged below the nitrogen inlet. A cooling box is installed above the inner wall of the housing. An emission electrode is installed at the bottom of the inner wall of the cooling box. A coating target is arranged at the bottom of the emission electrode. A liquid inlet is installed at the top of the inner wall of the cooling box. A liquid extraction port is installed on the side of the inner wall of the cooling box opposite to the liquid inlet. A spring is installed at the bottom of the inner wall of the first gas chamber. One end of the spring is installed with a stopper.
[0006] Preferably, a gas guide pipe is installed on one side inner wall of the second gas chamber. The gas guide pipe penetrates through the inner walls of the cooling box and the second gas chamber at the same time. A baffle is installed above the inner wall of the cooling box. A second air extraction port is installed at the top of the inner wall of the housing.
[0007] Preferably, a clamping groove is formed on the side of the bottom of the first gas chamber opposite to the stopper. The clamping groove is matched with the stopper.
[0008] Preferably, air vents are provided inside the baffle, and the air vents are located directly above the emission electrode.
[0009] Preferably, the air duct is closely attached to the surface of the emission electrode, and cooling ports are provided inside the air duct.
[0010] Preferably, the length of the liquid extraction port is greater than that of the liquid inlet port, and both the liquid extraction port and the liquid inlet port penetrate through the outer shell and the inner wall of the cooling box at the same time.
[0011] Compared with the prior art, the utility model has the following beneficial effects:
[0012] (1) The utility model is provided with a first air chamber and a spring. When an appropriate amount of argon gas is introduced into the first air chamber, the air pressure inside the first air chamber increases, causing the block at one end of the spring to move towards the spring direction, thereby ensuring that the argon gas in the first air chamber can stably enter the outer shell and increasing the utilization rate of argon gas by controlling the amount of intake gas.
[0013] (2) The utility model is provided with a second air chamber, an air duct and a baffle. By introducing an appropriate amount of nitrogen gas into the second air chamber, the nitrogen gas enters the cooling box through the air duct, then enters the coolant in the cooling box through the cooling ports in the air duct, and then the nitrogen gas floats upward, passes through the air vents in the baffle, and is effectively extracted by the second air extraction port. In this way, the temperature in the cooling box can be maintained, thereby maintaining the working efficiency of the emission electrode. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Figure 1 is a schematic structural diagram of the utility model;
[0015] Figure 2 is Figure 1 an enlarged view of part A in
[0016] Figure 3 is Figure 1 an enlarged view of part B in
[0017] In the figure: 1. Outer shell; 2. First air chamber; 3. Second air chamber; 4. Positive plate; 5. First air extraction port; 6. Intake port; 7. Liquid extraction port; 8. Second air extraction port; 9. Liquid inlet port; 10. Nitrogen inlet port; 11. Coating target; 12. Cooling box; 13. Air duct; 14. Cooling port; 15. Emission electrode; 16. Spring; 17. Block; 18. Card slot; 19. Baffle; 20. Air vent. DETAILED DESCRIPTION OF THE EMBODIMENTS
[0018] The following will clearly and completely describe the technical solutions in the embodiments of the present utility model in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.
[0019] Please refer to Figures 1-3 As shown, the present utility model provides the following technical solution: An ion source device for sputtering coating in a powder nano-material preparation process, including a housing 1. A positive electrode plate 4 is installed at the inner bottom of the housing 1. The positive electrode plate 4 can adsorb the negative ions generated by the collision of argon positive ions inside the housing 1, thereby realizing the sputtering coating of the product. A first gas chamber 2 is arranged on one side of the inner wall of the housing 1. The first gas chamber 2 can effectively increase the argon gas pressure, thereby ensuring the stable input of argon gas. An air inlet 6 is installed on one side inner wall of the first gas chamber 2. A second gas chamber 3 is installed on the side of the inner wall of the housing 1 opposite to the first gas chamber 2. A nitrogen inlet 10 is installed on one side inner wall of the second gas chamber 3. A first air extraction port 5 is arranged below the nitrogen inlet 10. A cooling box 12 is installed above the inner wall of the housing 1. An emission electrode 15 is installed at the inner bottom of the cooling box 12. A coating target 11 is arranged at the bottom of the emission electrode 15. A liquid inlet 9 is installed at the inner top of the cooling box 12. A liquid extraction port 7 is installed on the side of the inner wall of the cooling box 12 opposite to the liquid inlet 9. A spring 16 is installed at the inner bottom of the first gas chamber 2. One end of the spring 16 is installed with a stop block 17. The top of the stop block 17 is a slope, which can facilitate the air pressure to press the stop block 17 into one side of the spring.
[0020] Furthermore, a gas guide pipe 13 is installed on one side inner wall of the second gas chamber 3. The gas guide pipe 13 penetrates through the inner walls of both the cooling box 12 and the second gas chamber 3 at the same time. The gas guide pipe 13 can bring nitrogen into the cooling box 12 and can introduce nitrogen into the cooling box 12. A baffle 19 is installed above the inner wall of the cooling box 12. A second air extraction port 8 is installed at the top of the inner wall of the housing 1. The excess nitrogen enters the upper part of the cooling box 12 through the inside of the baffle 19 and is extracted by the second air extraction port 8, thereby realizing the utilization of nitrogen.
[0021] Even further, a card slot 18 is opened on the side of the bottom of the first gas chamber 2 opposite to the stop block 17. The card slot 18 cooperates with the stop block 17, and the card slot 18 can prevent the argon gas inside the first gas chamber 2 from flowing out.
[0022] Specifically, air holes 20 are opened inside the baffle 19. The air holes 20 are located directly above the emission electrode 15. The excess nitrogen enters the upper part of the baffle 19 through the air holes 20 and is collected by the second air extraction port 8.
[0023] It should be noted that the air duct 13 is closely attached to the surface of the emission electrode 15. A cooling port 14 is provided inside the air duct 13, and the cooling port 14 can ensure the contact between nitrogen and the emission electrode 15 and maintain the temperature inside the cooling box 12.
[0024] Furthermore, the length of the liquid extraction port 7 is greater than that of the liquid inlet port 9, and both the liquid extraction port 7 and the liquid inlet port 9 penetrate through the inner wall of the outer shell 1 and the cooling box 12 at the same time. The coolant enters the cooling box 12 through the liquid inlet port 9 and is extracted from the liquid extraction port 7, thereby realizing the circulation of the coolant.
[0025] The working principle and usage process of the present utility model: When using the present utility model, place the product on the positive electrode plate 4, extract the air inside the outer shell 1 through the first air extraction port 5, then energize the emission electrode 15 through the process power supply, and at the same time introduce argon gas into the first gas chamber 2 through the air inlet 6. When the gas pressure in the first gas chamber 2 reaches a certain level, the stopper 17 leaves the card slot 18 and moves towards the spring 16 direction, thereby introducing the argon gas in the first gas chamber 2 into the outer shell 1. At this time, introduce the coolant into the cooling box 12 through the liquid inlet port 9, and at the same time, the coolant is extracted from the liquid extraction port 7. Then introduce nitrogen gas into the second gas chamber 3 through the nitrogen inlet 10, so that the nitrogen gas enters the cooling box 12 through the cooling port 14 on the air duct 13. After passing through the cooling box 12, the nitrogen gas passes through the ventilation holes 20 in the baffle 19 to the second air extraction port 8, and the floating nitrogen gas is effectively extracted by the second air extraction port 8;
[0026] While cooling the emission electrode 15, the Ar+ ions in the argon gas in the outer shell 1 combine with the coating target 11, and the e- ions on the coating target 11 are displaced to the surface of the product, thereby realizing sputtering coating on the surface of the product.
[0027] Although the embodiments of the present utility model have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principle and spirit of the present utility model. The scope of the present utility model is defined by the appended claims and their equivalents.
Claims
1. An ion source device for sputtering coating in a powder nanomaterial preparation process, characterized in that: The invention comprises a shell (1), wherein a positive electrode plate (4) is installed at the bottom of the inner part of the shell (1), a first air chamber (2) is arranged on one side of the inner wall of the shell (1), an air inlet (6) is installed on one side of the inner wall of the first air chamber (2), a second air chamber (3) is installed on the inner wall of the shell (1) opposite to the first air chamber (2), a nitrogen inlet (10) is installed on one side of the inner wall of the second air chamber (3), a first air extraction port (5) is arranged below the nitrogen inlet (10), a cooling box (12) is installed above the inner wall of the shell (1), an emitting electrode (15) is installed at the bottom of the inner wall of the cooling box (12), a coating target (11) is arranged at the bottom of the emitting electrode (15), and a liquid inlet (9) is installed at the top of the inner wall of the cooling box (12).
2. The ion source device for sputtering coating in a powder nanomaterial preparation process according to claim 1, characterized in that: A liquid extraction port (7) is installed on the inner wall of the cooling box (12) on the side opposite to the liquid inlet (9).
3. The ion source device for sputtering coating in a powder nanomaterial preparation process according to claim 1, characterized in that: A spring (16) is installed at the bottom of the inner wall of the first air chamber (2), and a stopper (17) is installed at one end of the spring (16).
4. The ion source device for sputtering coating in a powder nanomaterial preparation process according to claim 1, characterized in that: An air guide pipe (13) is installed on one inner wall of the second air chamber (3), and the air guide pipe (13) penetrates both the cooling box (12) and the inner wall of the second air chamber (3).
5. The ion source device for sputtering coating in a powder nanomaterial preparation process according to claim 1, characterized in that: A baffle (19) is installed above the inner wall of the cooling box (12).
6. The ion source device for sputtering coating in a powder nanomaterial preparation process according to claim 1, characterized in that: A second air extraction port (8) is installed at the top of the inner wall of the outer shell (1).
7. The ion source device for sputtering coating in the process for preparing powder nanomaterials according to claim 3, characterized in that: A clamping groove (18) is provided on a side of the bottom of the first air chamber (2) opposite to the stopper (17), and the clamping groove (18) cooperates with the stopper (17).
8. The ion source device for sputtering coating in the process for preparing powder nanomaterials according to claim 5, characterized in that: An air vent (20) is provided inside the baffle (19), and the air vent (20) is located directly above the emitting electrode (15).
9. The ion source device for sputtering coating in a powder nanomaterial preparation process according to claim 4, characterized in that: The air guide tube (13) is in close contact with the surface of the emitting electrode (15), and a cooling port (14) is provided inside the air guide tube (13).
10. The ion source device for sputtering coating in the process for preparing powder nanomaterials according to claim 2, characterized in that: The length of the liquid extraction port (7) is greater than the length of the liquid inlet (9), and the liquid extraction port (7) and the liquid inlet (9) simultaneously penetrate the inner wall of the outer shell (1) and the cooling box (12).