Corrosive liquid box body structure for multi-path parallel heat exchange device for semiconductor

Abstract

The utility model relates to a corrosive liquid box body structure for a multi-path parallel heat exchange device for a semiconductor. The corrosive liquid box body structure is characterized by comprising an internal flow channel main body (1) and heat conducting plates (2) which are symmetrically arranged on two sides of the internal flow channel main body, a plurality of flow channel areas (3) are symmetrically arranged on two side surfaces of the internal flow channel main body, a plurality of corrosive liquid flowing cavities are formed between each flow channel area (3) and the heat conducting plate (2) which is tightly attached to the flow channel area (3), a corrosive liquid partition plate (4) is arranged in each flow channel area (3), and the corrosive liquid partition plates (4) are alternately arranged on opposite flow channel walls of the flow channel areas (3), so that corrosive liquid flows in an S shape; a liquid inlet (5) and a liquid outlet (6) are formed in each corrosive liquid flowing cavity, each liquid inlet (5) is communicated with a liquid inlet pipe (7) through the corresponding inner cavity, and each liquid outlet (6) is communicated with a liquid outlet pipe (8) through the corresponding inner cavity. According to the utility model, a plurality of parallel flow channels are adopted for simultaneous control, the temperature is more stable and more uniform, the real-time temperature control precision reaches 0.1 DEG C, and the energy consumption is reduced by 30%.

Description

Technical Field

[0001] The utility model relates to a semiconductor technology, in particular to a corrosion liquid heating technology used in semiconductor processing, and specifically to a corrosion liquid box structure for a multi-path parallel heat exchange device for semiconductors. Background Art

[0002] In the process of semiconductor manufacturing, it is necessary to use corrosion liquid to remove unnecessary materials, such as oxides and metal impurities on the surface of semiconductor materials, and it can also be used to remove minute defects and damages. In addition, the corrosion liquid can also be used in processes such as cleaning and de-gumming. It is necessary to cool or heat the semiconductor corrosion liquid to adjust its temperature to maintain the stability of the corrosion process, protect the surface of the semiconductor material, and prevent the corrosion agent from volatilizing or decomposing.

[0003] Most of the existing technologies adopt a series heat exchange method, designing left and right one-way flow channels. The flow channels are relatively long, and the fluid movement trajectories are chaotic. Due to uneven temperature and pressure, the heat dissipation effect is not good, the refrigeration and heating capabilities decline, the energy consumption is high, and the service life of the device is reduced, thus affecting the chip quality.

[0004] Chinese Patent No. 2021105429899 discloses a semiconductor refrigeration temperature control device, which cools or heats the corrosion liquid tank as a whole through a semiconductor refrigeration chip, with slow speed, low efficiency, and low control accuracy.

[0005] Chinese Patent No. 2008100894051 discloses a temperature adjustment device for liquid medicine, which also heats or cools the corrosion liquid tank as a whole through a semiconductor refrigeration chip, and its working principle and effect are similar to those of Chinese Patent No. 2021105429899.

[0006] As far as the applicant knows, the corrosion liquid tanks in the existing semiconductor corrosion liquid temperature control devices all adopt an overall cooling or heating structure, and generally have problems of low heat exchange uniformity, low efficiency, and high energy consumption, which must be improved. Summary of the Utility Model

[0007] The purpose of the utility model is to design a corrosion liquid box structure for a multi-path parallel heat exchange device for semiconductors in view of the problem that the corrosion liquid exchange box in the existing semiconductor corrosion liquid temperature adjustment device is an integral structure, with overall heating or cooling, resulting in low efficiency and poor uniformity.

[0008] The technical solution of the utility model is as follows:

[0009] A corrosion liquid tank structure for a multi - parallel heat exchange device for semiconductors, characterized in that: it includes an internal flow channel main body 1 and heat conduction plates 2 symmetrically installed on both sides of the internal flow channel main body 1; a plurality of flow channel areas 3 are symmetrically arranged on both side surfaces of the internal flow channel main body 1, and a plurality of corrosion liquid flow cavities are formed between each flow channel area 3 and the closely installed heat conduction plate 2. A corrosion liquid partition 4 is provided in each flow channel area 3, and the corrosion liquid partitions 4 are alternately installed on the opposite flow channel walls of the flow channel area 3 so that the corrosion liquid flows in an S - shape; an inlet 5 and an outlet 6 are provided in each corrosion liquid flow cavity, and each inlet 5 is connected to an inlet pipe 7 through an internal cavity, and each outlet 6 is also connected to an outlet pipe 8 through an internal cavity.

[0010] Both sides of the corrosion liquid partition 4 are provided with partition blocks 9 that play a role in slowing down the flow rate and stirring and mixing.

[0011] The partition block 9 has a polygonal structure, and the triangular structure is the best, and the tip of the triangle points to the side with a low flow rate.

[0012] The number of partition blocks 9 on both sides of the corrosion liquid partition 4 is at least two, and three is the best. The three partition blocks are arranged in a triangle, with two arranged side by side at the position with a high flow rate and the other arranged at the position with a low flow rate.

[0013] The beneficial effects of the present utility model:

[0014] The present utility model adopts multi - parallel flow channels, corresponding one by one and controlling simultaneously, with a more stable and uniform temperature, which can reduce the temperature deviation of the refrigeration sheet, improve the fluid heat exchange efficiency, the real - time temperature control accuracy reaches 0.1 °C, and the energy consumption is reduced by 30%. Description of the Drawings

[0015] Figure 1 It is a three - dimensional structure schematic diagram of the corrosion liquid tank of the present utility model.

[0016] Figure 2 It is an installation and use state schematic diagram of the corrosion liquid tank of the present utility model in a multi - parallel heat exchange device for semiconductors.

[0017] In the figure: 11 is a refrigeration plate, 12 is a cooling water component, and 13 is an energy storage plate. Detailed Embodiment

[0018] The following further describes the present utility model in conjunction with the drawings and embodiments.

[0019] The structures, proportions, sizes, etc. shown in the attached drawings of this specification are only used to cooperate with the content disclosed in the specification for those familiar with this technology to understand and read, and are not used to limit the conditions for the implementation of the present utility model. Therefore, they do not have substantial technical significance. Any modification of the structure, change in the proportional relationship, or adjustment of the size, without affecting the effects that the present utility model can produce and the purposes that can be achieved, should still fall within the scope that can be covered by the technical content disclosed in the present utility model. At the same time, terms such as "upper", "lower", "left", "right", "middle", etc. cited in this specification are only for the convenience of clear narration and are not used to limit the scope of implementation. The change or adjustment of their relative relationship, without substantial change in the technical content, should also be regarded as the scope that the present utility model can implement.

[0020] As Figure 1-2 shown.

[0021] A corrosion liquid box structure for a multi-channel parallel heat exchange device for semiconductors, which includes Figure 1 the internal flow channel main body 1 shown and heat conduction plates 2 symmetrically installed on both sides of the internal flow channel main body 1 ( Figure 2 ); a plurality of flow channel areas 3 are symmetrically arranged on both side surfaces of the internal flow channel main body 1, and a plurality of corrosion liquid flow cavities are formed between each flow channel area 3 and the closely installed heat conduction plate 2. A corrosion-resistant and leak-proof sealing ring is installed on the heat conduction plate 2. A corrosion liquid partition plate 4 is provided in each flow channel area 3, and the corrosion liquid partition plates 4 are alternately installed on the opposite flow channel walls of the flow channel area 3 so that the corrosion liquid flows in an S shape; an inlet 5 and an outlet 6 are provided in each corrosion liquid flow cavity, and each inlet 5 is connected to an inlet pipe 7 through an internal cavity, and each outlet 6 is also connected to an outlet pipe 8 through an internal cavity. Partition blocks 9 for slowing down the flow rate and stirring and mixing are provided on both sides of the corrosion liquid partition plate 4. The partition blocks 9 are of a polygonal structure, with an isosceles triangle being the best, and the apex of the triangle (isosceles) points to the side with a low flow rate. The number of partition blocks 9 on both sides of the corrosion liquid partition plate 4 is more than two, with three being the best. The three partition blocks are arranged in a triangle, with two arranged side by side at the position with a high flow rate and the other arranged at the position with a low flow rate. The present utility model adopts a multi-channel parallel flow channel, Figure 1 in which the corrosion liquid is in six-channel parallel refrigeration or heating, corresponding one by one from left to right, and controlled simultaneously, with a more stable and uniform temperature, increasing the temperature deviation of the refrigeration sheet, adding an energy storage plate for energy storage, improving the fluid heat exchange efficiency, the real-time temperature control accuracy can reach 0.1 °C, and reducing the energy consumption by 30%.

[0022] The installation and use state of the corrosion liquid box of the present utility model in the whole device is as Figure 2 shown.

[0023] The above embodiments are only the preferred embodiments of the present utility model. It should be noted that for those of ordinary skill in the art, without departing from the principle of the present utility model, several improvements and equivalent replacements can be made. These technical solutions obtained by improving and equivalently replacing the claims of the present utility model all fall within the protection scope of the present utility model.

[0024] The parts not involved in the present utility model are the same as the prior art or can be implemented by using the prior art.

Claims

1. A corrosive liquid tank structure for a multi-channel parallel heat exchange device for semiconductors, characterized by: It comprises an internal flow channel body (1) and heat conducting plates (2) symmetrically mounted on both sides of the internal flow channel body (1); a plurality of flow channel areas (3) are symmetrically mounted on both sides of the internal flow channel body (1); a plurality of corrosive liquid flow cavities are formed between each flow channel area (3) and the heat conducting plates (2) mounted closely thereto; each flow channel area (3) is provided with a corrosive liquid baffle (4); the corrosive liquid baffles (4) are alternately mounted on opposite flow channel walls of the flow channel area (3) so that the corrosive liquid flows in an S shape; each corrosive liquid flow cavity is provided with a liquid inlet (5) and a liquid outlet (6); each liquid inlet (5) is connected to a liquid inlet pipe (7) through an internal cavity, and each liquid outlet (6) is also connected to a liquid outlet pipe (8) through the internal cavity.

2. The etching liquid tank structure for the semiconductor multi-way parallel heat exchange device according to claim 1 is characterized in that Both sides of the corrosive liquid partition (4) are provided with partition blocks (9) for slowing down the flow rate and stirring and mixing.

3. The etching liquid tank structure for the semiconductor multi-way parallel heat exchange device according to claim 2 is characterized in that The spacer (9) has a polygonal structure.

4. The etching liquid tank structure for a semiconductor multi-way parallel heat exchange device according to claim 3 is characterized in that The spacer (9) has a triangular structure.

5. The etching liquid tank structure for semiconductor multi-way parallel heat exchange device according to claim 2 is characterized in that The number of the spacers (9) on both sides of the corrosive liquid partition (4) is at least two.

6. The etching liquid tank structure for the semiconductor multi-way parallel heat exchange device according to claim 5 is characterized in that The number of the spacers (9) on both sides of the corrosive liquid partition (4) is three and they are arranged in a triangular shape, two of which are arranged side by side at a position with a high flow rate, and the other is arranged at a position with a low flow rate.

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