Heat dissipation plate for multi-path parallel heat exchange device for semiconductor

Abstract

A heat dissipation plate for a multi-path parallel heat exchange device for a semiconductor is characterized in that the heat dissipation plate is composed of a multi-flow-channel micro-channel heat dissipation plate (1) and a micro-channel drainage plate (2), a plurality of cooling water flowing cavities (3) are formed in one face of the multi-flow-channel micro-channel heat dissipation plate (1), cooling water partition plates (4) are arranged in the cooling water flowing cavities (3), and the micro-channel drainage plate (2) is arranged on the other face of the multi-flow-channel micro-channel heat dissipation plate (1). The micro-channel drainage plate (2) covers the cooling water flowing cavities (3) of the multi-flow-channel micro-channel heat dissipation plate (1), and cooling water enters the micro-channel drainage plate (2) from a water inlet (5) in the upper portion of the micro-channel drainage plate (2) and is distributed into the cooling water flowing cavities (3) through water inlet flow channels (6) in the micro-channel drainage plate (2). And the water flows out from a water outlet flow channel (7) in the micro-channel drainage plate (2) and is finally discharged from a water outlet (8) in the lower part of the micro-channel drainage plate (2). According to the utility model, the heat dissipation is fast, and the temperature is more stable and more uniform.

Description

Technical Field

[0001] The utility model relates to a semiconductor technology, in particular to a corrosion liquid heating technology used in semiconductor processing, specifically a heat dissipation plate for a multi-channel parallel heat exchange device for semiconductors. Background Art

[0002] In the process of semiconductor manufacturing, it is necessary to use corrosion liquid to remove unnecessary materials, such as oxides and metal impurities on the surface of semiconductor materials, and it can also be used to remove tiny defects and damages. In addition, the corrosion liquid can also be used in processes such as cleaning and de-gumming. It is necessary to cool or heat the semiconductor corrosion liquid and adjust its temperature to maintain the stability of the corrosion process, protect the surface of the semiconductor material, and prevent the corrosion agent from volatilizing or decomposing.

[0003] Most of the existing technologies adopt a series heat exchange method, designing left and right one-way flow channels. The flow channels are relatively long, and the fluid movement trajectories are chaotic. Due to uneven temperature and pressure, the heat dissipation effect is not good, the refrigeration and heating capabilities decline, the energy consumption is high, and the service life of the device is reduced, thus affecting the chip quality.

[0004] Chinese Patent No. 2021105429899 discloses a semiconductor refrigeration temperature control device, which cools or heats the corrosion liquid tank as a whole through a semiconductor refrigeration chip, with slow speed, low efficiency, and low control accuracy.

[0005] Chinese Patent No. 2008100894051 discloses a temperature adjustment device for liquid medicine, which also heats or cools the corrosion liquid tank as a whole through a semiconductor refrigeration chip, and its working principle and effect are similar to those of Chinese Patent No. 2021105429899.

[0006] In summary, the existing semiconductor corrosion liquid temperature control devices generally have problems such as low heat exchange uniformity, low efficiency, and high energy consumption, and must be improved. At present, most of the heat dissipation plates use serpentine water channels for heat exchange, and there are problems of low heat exchange efficiency and slow cooling speed when exchanging heat with the cooling water, which urgently need to be improved. Summary of the Utility Model

[0007] The purpose of the utility model is to design a heat dissipation plate for a multi-channel parallel heat exchange device for semiconductors to solve the problems of low efficiency and slow speed caused by using serpentine water channels for cooling in the heat dissipation plate of the existing semiconductor corrosion liquid temperature adjustment device.

[0008] The technical solution of the utility model is as follows:

[0009] A heat dissipation plate for a multi-channel parallel heat exchange device for semiconductors, characterized in that it is composed of a multi-channel micro-channel heat dissipation plate 1 and a micro-channel diversion plate 2. One side of the multi-channel micro-channel heat dissipation plate 1 is provided with a plurality of cooling water flow cavities 3, and cooling water partition plates 4 are arranged in the cooling water flow cavities 3. The micro-channel diversion plate 2 covers the cooling water flow cavities 3 of the multi-channel micro-channel heat dissipation plate 1. Cooling water enters the micro-channel diversion plate 2 from the water inlet 5 at the upper part of the micro-channel diversion plate 2 and is distributed to each cooling water flow cavity 3 through the internal water inlet flow channel 6, and then flows out through the internal water outlet flow channel 7 of the micro-channel diversion plate 2 and finally is discharged from the water outlet 8 at the lower part of the micro-channel diversion plate 2.

[0010] The number of the cooling water partition plates 4 in the cooling water flow cavities 3 is at least two, and its function is to make the cooling water entering the cooling water flow cavities 3 flow in an S shape to increase the heat dissipation effect.

[0011] The beneficial effects of the present utility model:

[0012] The present utility model adopts multi-channel parallel flow channels, corresponding one by one and controlling simultaneously, with more stable and uniform temperature, increasing the temperature deviation of the refrigerating sheet, increasing the energy storage of the heat transfer block, improving the fluid heat exchange efficiency, achieving a real-time temperature control accuracy of 0.1 °C, and reducing energy consumption by 30%. Description of the drawings

[0013] Figure 1 It is a schematic diagram of the main structure of the multi-channel micro-channel heat dissipation plate of the present utility model.

[0014] Figure 2 It is a schematic diagram of the structure of the micro-channel diversion plate of the present utility model.

[0015] Figure 3 It is a schematic diagram of the installation of the heat dissipation plate in the multi-channel parallel heat exchange device for semiconductors of the present utility model.

[0016] In the figure, 11 is an energy storage plate, 12 is a heat conduction plate, and 13 is the main body of the internal flow channel of the parallel heat exchange device. Specific implementation manners

[0017] The following further describes the present utility model in conjunction with the drawings and embodiments.

[0018] The structures, proportions, sizes, etc. shown in the drawings of this specification are only used to cooperate with the content disclosed in the specification for those familiar with this technology to understand and read, and are not used to limit the conditions for the implementation of this utility model. Therefore, they do not have substantial technical significance. Any modification of the structure, change in the proportional relationship, or adjustment of the size, without affecting the effects that this utility model can produce and the purposes that can be achieved, should still fall within the scope that can be covered by the technical content disclosed in this utility model. At the same time, terms such as "upper", "lower", "left", "right", "middle", etc. cited in this specification are only for the convenience of clear narration and are not used to limit the scope of implementation. The change or adjustment of their relative relationships, without substantial change in the technical content, should also be regarded as the scope that this utility model can implement.

[0019] Such as Figure 1-2 shown.

[0020] A heat dissipation plate for a multi-channel parallel heat exchange device for semiconductors, which is composed of Figure 1 the multi-channel microchannel heat dissipation plate 1 shown in Figure 2 and the microchannel diversion plate 2 shown in . One side of the multi-channel microchannel heat dissipation plate 1 is provided with a plurality of cooling water flow cavities 3, and cooling water partition plates 4 are arranged in the cooling water flow cavities 3. The microchannel diversion plate 2 covers the cooling water flow cavities 3 of the multi-channel microchannel heat dissipation plate 1. Cooling water enters the microchannel diversion plate 2 from the water inlet 5 at the upper part of the microchannel diversion plate 2 and is distributed to each cooling water flow cavity 3 through the internal water inlet channel 6, and then flows out through the internal water outlet channel 7 of the microchannel diversion plate 2 and finally discharges from the water outlet 8 at the lower part of the microchannel diversion plate 2. The number of cooling water partition plates 4 in the cooling water flow cavity 3 is at least two, and its function is to make the cooling water entering the cooling water flow cavity 3 flow in an S shape to increase the heat dissipation effect.

[0021] This utility model adopts multi-channel heat dissipation, which can quickly dissipate the heat generated by the refrigeration chip and achieve rapid temperature adjustment. Figure 1 12-way water temperature adjustment is adopted in , and the adjustment effect is very obvious. The overall heat dissipation effect is significantly better than the prior art.

[0022] The installation and use of the heat dissipation plate of this utility model in a multi-channel parallel heat exchange device for semiconductors are as Figure 3 shown. When in use, a microchannel cover plate 9 is installed on the outside of this utility model, and the inside is attached to the refrigeration chip 10. Each component is connected into a whole with long screws.

[0023] The above embodiments are only the preferred embodiments of this utility model. It should be noted that: for those of ordinary skill in the art in this technical field, without departing from the principle of this utility model, several improvements and equivalent replacements can be made. These technical solutions obtained by improving and making equivalent replacements to the claims of this utility model all fall within the protection scope of this utility model.

[0024] For the parts not involved in this utility model, they are the same as or can be implemented by using the prior art.

Claims

1. A heat sink for a semiconductor multi-way parallel heat exchange device, characterized in that The invention comprises a multi-channel microchannel heat sink (1) and a microchannel guide plate (2); a plurality of cooling water flow chambers (3) are provided on one side of the multi-channel microchannel heat sink (1); a cooling water baffle (4) is provided in the cooling water flow chamber (3); the microchannel guide plate (2) covers the cooling water flow chamber (3) of the multi-channel microchannel heat sink (1); cooling water enters the microchannel guide plate (2) from a water inlet (5) at the upper part of the microchannel guide plate (2) and is distributed to each cooling water flow chamber (3) through a water inlet channel (6) inside the microchannel guide plate (2); then flows out through a water outlet channel (7) inside the microchannel guide plate (2) and is finally discharged from a water outlet (8) at the lower part of the microchannel guide plate (2).

2. The heat sink for a semiconductor multi-way parallel heat exchange device according to claim 1, characterized in that the cooling The number of cooling water baffles (4) in the water flow cavity (3) is at least two, and their function is to make the cooling water entering the cooling water flow cavity (3) flow in an S shape to increase the heat dissipation effect.

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