Device for testing heat-conducting property of heat-conducting pouring sealant

Abstract

The utility model relates to the technical field of testing devices, and discloses a testing device for the heat-conducting property of a heat-conducting pouring sealant, which comprises a shaping cylinder, a support frame is arranged on the side edge of the shaping cylinder, a servo motor is arranged at the top of the servo motor, and the output end of the servo motor rotatably penetrates into the support frame and is fixedly provided with a lifting screw rod; the bottom of the lifting screw rod is rotationally connected to the interior of the supporting frame through a bearing, the lifting screw rod is sleeved with a movable sleeve block in a threaded mode, and a connecting plate is fixed to the end, extending to the outer side of the shaping cylinder, of the movable sleeve block. The phenomenon of glue overflow and the like is avoided, the problem that the overall thickness uniformity is inconvenient to control when the glue is filled and formed during testing by the existing testing device for the heat-conducting property of the heat-conducting pouring sealant is solved, and the practicability of the testing device is greatly improved.

Description

Technical Field

[0001] The present utility model application relates to the technical field of testing devices, and specifically to a testing device for the thermal conductivity of thermal potting glue. Background Art

[0002] Thermal potting glue is a two-component condensation type thermal potting glue. It can long-term and reliably protect sensitive circuits and components within a wide range of temperature and humidity changes. It is a mixture composed of main components, fillers and additives. The main components are generally silicone resin, polyurethane resin, epoxy resin, etc. It has excellent thermal conductivity and bonding properties. After the thermal potting glue is processed, it is necessary to detect its thermal conductivity to ensure that the internal circuits and components of the potting port can dissipate heat normally.

[0003] At present, when using the existing testing device, most use the extrusion method to ensure that the thickness of the formed thermal potting glue is uniform. However, since there is still a gap between the extrusion plate and the forming box during extrusion, when extruding and leveling, some glue is still likely to overflow, resulting in glue sticking to the edge of the extrusion plate, and the flatness after extrusion is also limited, and subsequent cleaning is very inconvenient. Summary of the Invention

[0004] In order to solve the problem that it is inconvenient to control the overall thickness uniformity during the forming of the thermal potting glue in the existing testing device for the thermal conductivity of thermal potting glue, the present utility model provides a testing device for the thermal conductivity of thermal potting glue to solve the above problems.

[0005] To achieve the above object, the present utility model provides the following technical solutions:

[0006] A testing device for the thermal conductivity of thermal potting glue includes a shaping cylinder. A support frame is arranged on the side of the shaping cylinder, and a servo motor is arranged on the top of the servo motor. The output end of the servo motor rotates through to the inside of the support frame and is fixed with a lifting screw rod. The bottom of the lifting screw rod is rotationally connected to the inside of the support frame through a bearing. A moving sleeve block is threadedly sleeved on the lifting screw rod. One end of the moving sleeve block extending to the outside of the shaping cylinder is fixed with a connecting plate. A frame is fixed to the bottom of the connecting plate, and a motor is arranged inside the frame. The output end of the motor rotates through to the lower part of the frame and is fixed with a rotating rod. A scraper is fixed to the bottom of the rotating rod.

[0007] Further, a heating base is fixed to the bottom of the shaping cylinder, and a heating tube is arranged inside the heating base. The heating tube is arranged in a spiral shape and is located in the lower part of the shaping cylinder.

[0008] Further, a "convex"-shaped sliding groove placed horizontally and matching with the moving sleeve block is opened inside the support frame, and a thread matching with the lifting screw rod is opened inside the moving sleeve block.

[0009] Further, a sealing cover is threadedly sleeved on the top of the shaping cylinder, and an adjusting screw rod is threadedly sleeved at the center position of the sealing cover. One end of the adjusting screw rod extending below the sealing cover is fixed with a moving plate, and a plurality of temperature sensors are embedded and fixed at the bottom of the moving plate.

[0010] Further, the plurality of temperature sensors are arranged in a circular pattern at the bottom of the moving plate. The adjusting screw rod is arranged in a "T" shape, and a threaded hole matching the adjusting screw rod is opened at the center position of the sealing cover.

[0011] Further, the length of the scraping plate is equal to the inner diameter of the shaping cylinder. The outer circle of the scraping plate is slidably attached to the inner wall of the shaping cylinder, and the height of the rotating rod is greater than the height of the shaping cylinder.

[0012] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0013] 1. In the present utility model, through the methods of stirring and leveling, the thickness uniformity of the colloid can be ensured during the molding process, avoiding phenomena such as overflow of the colloid. It solves the problem that the existing testing device for the thermal conductivity of thermal conductive potting glue is inconvenient to control the overall thickness uniformity during the testing of colloid filling and molding, and greatly improves the practicality of the testing device.

[0014] 2. In the present utility model, through the adjustable detection mechanism, during the testing, it can adapt to the testing of colloids with different thicknesses, and it is not necessary to remove the colloid from the shaping cylinder during the detection, avoiding deformation or damage of the colloid caused by improper operation during the removal and separation process, which affects the detection results. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0016] Figure 1 It is a front view schematic diagram of the structure of the testing device according to an embodiment of the present application;

[0017] Figure 2 It is Figure 1 A front view sectional schematic diagram of the structure of the testing device during molding in the illustrated embodiment;

[0018] Figure 3 It is Figure 1 A front view sectional schematic diagram of the structure of the testing device during detection in the illustrated embodiment.

[0019] Meanings of the reference numerals in the figures: 1, shaping cylinder; 2, support frame; 3, servo motor; 4, lifting screw; 5, moving sleeve block; 6, connecting plate; 7, frame; 8, motor; 9, rotating rod; 10, scraper; 11, heating base; 12, heating tube; 13, sealing cover; 14, adjusting screw; 15, moving plate; 16, temperature sensor. Detailed implementation manners

[0020] In order to make the application purpose, features and advantages of the present application more obvious and understandable, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the embodiments described below are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

[0021] Refer to Figure 1 、 Figure 2 and Figure 3 , a testing device for the thermal conductivity of a thermally conductive potting adhesive, including a shaping cylinder 1, a support frame 2 is arranged on the side of the shaping cylinder 1, and a servo motor 3 is arranged on the top of the servo motor 3. The output end of the servo motor 3 rotates through to the inside of the support frame 2 and is fixed with a lifting screw 4. The bottom of the lifting screw 4 is rotatably connected to the inside of the support frame 2 through a bearing. A "convex"-shaped chute placed horizontally and matched with the moving sleeve block 5 is opened inside the support frame 2. A thread matched with the lifting screw 4 is opened inside the moving sleeve block 5. The moving sleeve block 5 is threadedly sleeved on the lifting screw 4. One end of the moving sleeve block 5 extending outside the shaping cylinder 1 is fixed with a connecting plate 6. A frame 7 is fixed at the bottom of the connecting plate 6. A motor 8 is arranged inside the frame 7. The output end of the motor 8 rotates through to the lower part of the frame 7 and is provided with a rotating rod 9. A scraper 10 is fixed at the bottom of the rotating rod 9. The length of the scraper 10 is equal to the inner diameter of the shaping cylinder 1. The outer ring of the scraper 10 is slidably attached to the inner wall of the shaping cylinder 1. The height of the rotating rod 9 is greater than the height of the shaping cylinder 1.

[0022] Specifically, when detection is required, first inject the potting adhesive into the shaping cylinder 1, and at the same time turn on the servo motor 3 and the motor 8, so that the servo motor 3 operates to drive the lifting screw 4 to rotate. When the lifting screw 4 rotates, it drives the moving sleeve block 5 to move upward, and then the rotating rod 9 and the scraper 10 can be driven to move upward through the connecting plate 6. At the same time, the motor 8 operates to drive the rotating rod 9 and the scraper 10 to rotate, so as to stir the internal potting adhesive to ensure its filling is full. When the rotating rod 9 moves upward to the top surface of the potting adhesive, as the scraper 10 rotates, the top surface of the potting adhesive can be smoothed to ensure the uniformity of the thickness of the potting adhesive.

[0023] As an optimized scheme, as Figure 2 and Figure 3As shown in the figure, a heating base 11 is fixed at the bottom of the shaping cylinder 1, and a heating pipe 12 is arranged inside the heating base 11. The heating pipe 12 is arranged in a spiral shape and is located at the lower part of the shaping cylinder 1. A sealing cover 13 is sleeved on the top of the shaping cylinder 1 in a threaded manner, and an adjusting screw rod 14 is sleeved on the center position of the sealing cover 13 in a threaded manner. One end of the adjusting screw rod 14 extending below the sealing cover 13 is fixed with a moving plate 15, and a plurality of temperature sensors 16 are embedded and fixed at the bottom of the moving plate 15. The plurality of temperature sensors 16 are arranged in a ring at the bottom of the moving plate 15. The adjusting screw rod 14 is arranged in a "T" shape, and a threaded hole matching the adjusting screw rod 14 is opened at the center position of the sealing cover 13.

[0024] Specifically, when the filling glue inside the shaping cylinder 1 solidifies, the moving sleeve block 5 drives the scraping plate 10 to move out of the shaping cylinder 1 and away. Then, the sealing cover 13 is screwed onto the shaping cylinder 1. At this time, the heating pipe 12 is turned on, so that the heating pipe 12 operates to heat the shaping cylinder 1. At the same time, the adjusting screw rod 14 is rotated, so that the adjusting screw rod 14 drives the moving plate 15 to move down until it fits with the top surface of the filling glue, and then the temperature of the top surface of the filling glue can be detected by the temperature sensors 16 to detect the heat conduction performance of the filling glue.

[0025] For those skilled in the art, it is obvious that this application is not limited to the details of the above exemplary embodiments, and without departing from the spirit or basic characteristics of this application, this application can be implemented in other specific forms. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-limiting. The scope of this application is defined by the appended claims rather than the above description. Therefore, all changes falling within the meaning and scope of the same elements of the claims are intended to be included in this application. Any reference signs in the claims should not be regarded as limiting the claimed rights.

[0026] The above is the case. The above embodiments are only used to illustrate the technical solutions of this application, rather than to limit it; although this application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. A device for testing the thermal conductivity of a thermally conductive potting compound, characterized in that: The invention comprises a shaping cylinder (1), a support frame (2) is arranged on the side of the shaping cylinder (1), and a servo motor (3) is arranged on the top of the servo motor (3), the output end of the servo motor (3) rotates and passes through the support frame (2), and a lifting screw (4) is fixed inside the support frame (2), and the bottom of the lifting screw (4) is rotatably connected to the inside of the support frame (2) through a bearing, a moving sleeve (5) is threadedly sleeved on the lifting screw (4), and a connecting plate (6) is fixed at one end of the moving sleeve (5) extending to the outside of the shaping cylinder (1), a frame (7) is fixed at the bottom of the connecting plate (6), and a motor (8) is arranged inside the frame (7), the output end of the motor (8) rotates and passes through the bottom of the frame (7) and a rotating rod (9) is arranged at the height, and a scraper (10) is fixed at the bottom of the rotating rod (9).

2. The device for testing the thermal conductivity of the thermally conductive potting compound according to claim 1, characterized in that: A heating base (11) is fixed at the bottom of the shaping cylinder (1), and a heating tube (12) is arranged inside the heating base (11); the heating tube (12) is arranged in a vortex shape and is located at the lower part of the shaping cylinder (1).

3. The device for testing the thermal conductivity of the thermally conductive potting compound according to claim 1, characterized in that: The support frame (2) is provided with a transversely placed "convex" shaped sliding groove cooperating with the movable sleeve block (5), and the movable sleeve block (5) is provided with a thread cooperating with the lifting screw (4).

4. The device for testing the thermal conductivity of the thermally conductive potting compound according to claim 1, characterized in that: A sealing cover (13) is threadedly sleeved on the top of the shaping cylinder (1), and an adjusting screw (14) is threadedly sleeved at the center of the sealing cover (13). A moving plate (15) is fixed to one end of the adjusting screw (14) extending below the sealing cover (13), and a plurality of temperature sensors (16) are embedded and fixed at the bottom of the moving plate (15).

5. The device for testing the thermal conductivity of the thermally conductive potting compound according to claim 4, characterized in that: A plurality of temperature sensors (16) are arranged in a ring shape at the bottom of the movable plate (15); the adjusting screw (14) is arranged in a "T" shape; and a threaded hole matching the adjusting screw (14) is provided at the center of the sealing cover (13).

6. The device for testing the thermal conductivity of the thermally conductive potting compound according to claim 1, characterized in that: The length of the scraper (10) is equal to the inner diameter of the shaping cylinder (1), the outer ring of the scraper (10) is slidably fitted with the inner wall of the shaping cylinder (1), and the height of the rotating rod (9) is greater than the height of the shaping cylinder (1).

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