Packaging structure for sensors with different high and low concentrations
By designing a sensor packaging structure with different concentrations of high and low concentrations including packaging shell, disassembly components, connecting mechanism and limiting mechanism, the problem of repair complexity of sensor integrated packaging structure in the prior art is solved, and a more flexible and efficient maintenance process is achieved.
Patent Information
- Application Number
- CN202421500410.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-28
- Publication Date
- 2025-05-27
- Estimated Expiration
- 2034-06-28
AI Technical Summary
The prior art When integrating semiconductor sensors and infrared sensors into one package structure, the entire package structure needs to be disassembled during maintenance, resulting in maintenance complexity and safety issues.
A sensor packaging structure with different high and low concentrations is designed, using a combination of packaging housing, disassembly components, connection mechanisms and limiting mechanisms, allowing the semiconductor sensor and infrared sensor to be disassembled simultaneously or separately, simplifying the maintenance process.
A more flexible maintenance method is achieved, reducing maintenance time and steps, reducing maintenance complexity and cost, and improving the efficiency of sensor maintenance.
Smart Images
Figure CN222913605U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of sensor packaging equipment, in particular to a packaging structure for sensors with different high and low concentrations. Background Art
[0002] A sensor is a device or apparatus used to detect and measure a certain physical quantity, chemical quantity or other specific signals. The sensor can be repaired by disassembling one end of it. Currently, a semiconductor sensor (measuring in ppm concentration) and an infrared sensor (measuring in VOL% concentration) are integrated into one sensor to measure extremely low concentration values. First of all, when integrating two different types of sensors together, it is necessary to consider their working principles, sensitivity ranges and characteristics of output signals. Semiconductor sensors are usually used to detect low-concentration gases, while infrared sensors are more suitable for detecting higher-concentration gases. Therefore, when integrating them into one sensor, it is necessary to adjust their sensitivity ranges and output signals to ensure that low and high concentrations can be measured simultaneously.
[0003] Currently, when integrating two sensors into one packaging structure, they share the same outer shell, which can ensure the protection of the two sensors and facilitate their integration into the system. However, when one of the sensors needs to be repaired, the entire packaging structure needs to be disassembled instead of just disassembling one sensor. Disassembling the entire packaging structure involves reinstalling and connecting multiple components. If the maintenance is not proper, it may cause the sensor to malfunction or the system to operate unstably, thus affecting the reliability and safety of the equipment, and further increasing the complexity of maintenance. Summary of the Utility Model
[0004] The purpose of the utility model is to provide a packaging structure for sensors with different high and low concentrations in view of the problems existing in the background art.
[0005] The technical solution of the utility model: A packaging structure for sensors with different high and low concentrations includes a packaging outer shell, a semiconductor sensor and an infrared sensor movably installed on the packaging outer shell, and further includes: a disassembly component installed on one side of the packaging outer shell to simultaneously disassemble the semiconductor sensor and the infrared sensor; a connection mechanism installed on the packaging outer shell to individually disassemble the semiconductor sensor or the infrared sensor.
[0006] Optionally, the disassembly component includes a support seat fixedly connected to the packaging outer shell at the middle of the semiconductor sensor and the infrared sensor. A second bottom cover is provided at one end of the infrared sensor close to the support seat, and a first bottom cover is provided at one end of the semiconductor sensor close to the support seat. A pair of L-shaped blocks for clamping the disassembly component and the connection mechanism are provided on the packaging outer shell.
[0007] Optionally, the disassembly assembly further includes a pair of rotating rods rotatably connected to the support base and corresponding to the L-shaped clamping blocks. One end of each rotating rod away from the support base is fixedly connected with a rotating clamping block for clamping the L-shaped clamping block. A rotating seat is rotatably connected to the support base. A support plate is fixedly connected to the rotating seat. A pair of support rotating rods are fixedly connected to both ends of the support plate. A first rotating hole for inserting the rotating rod is formed at one end of each rotating rod close to the support base. A turning knob is fixedly connected to the support plate. A limiting mechanism for restricting the random rotation of the rotating seat is provided at one end of the rotating seat close to the support base.
[0008] Optionally, the limiting mechanism includes a rotating rod opened on the support base. A clamping groove is formed inside the rotating rod. A pair of limiting grooves are formed inside the clamping groove. One end of the rotating seat close to the support base is fixedly connected with a pull-out plug rod for inserting into the rotating rod and the clamping groove. A pair of limiting protrusions for clamping into the limiting grooves are fixedly connected to one end of the pull-out plug rod inserted into the clamping groove.
[0009] Optionally, a pulling spring is fixedly connected inside the clamping groove. One end of the pulling spring away from the clamping groove is fixedly connected with one end of the pull-out plug rod.
[0010] Optionally, the connecting mechanism includes a mounting hole opened on the rotating seat. A return spring is arranged inside the mounting hole. Both ends of the return spring are fixedly connected with the corresponding rotating rods. A pair of rotating grooves are opened on the support base. A rotating rod for supporting the rotation of the first bottom cover and the second bottom cover is rotatably connected inside each rotating groove.
[0011] Optionally, a second rotating hole communicated with the first rotating hole is formed at one end of each rotating rod close to the support base. One end of each support rotating rod movably penetrating through the first rotating hole is fixedly connected with a buckle for rotating inside the second rotating hole.
[0012] Compared with the prior art, the utility model has the following beneficial technical effects:
[0013] By means of the cooperation of structures such as the encapsulation shell, the disassembly assembly, the connecting mechanism and the limiting mechanism, the maintenance personnel can selectively maintain a single sensor or all sensors according to needs, which not only provides greater maintenance flexibility, but also can perform targeted maintenance according to the actual situation. Further, quickly disassembling the sensor to be maintained can also reduce the maintenance time and operation steps, thereby reducing the complexity and cost of maintenance, thus reducing the consumption of manpower and time and improving the efficiency of maintaining the sensor. Description of the Drawings
[0014] Figure 1 A first-state structural schematic diagram of a high-low concentration different sensor encapsulation structure of the utility model is given;
[0015] Figure 2 Provide a schematic diagram of the second state structure of a packaging structure for different sensors with high and low concentrations of the present utility model;
[0016] Figure 3 For Figure 2 An enlarged schematic diagram of the position A in
[0017] Figure 4 For Figure 2 A schematic diagram of the structure of the fixing mechanism in
[0018] Figure 5 For Figure 4 An enlarged schematic diagram of the position B in
[0019] Figure 6 For Figure 4 A split sectional structure schematic diagram of
[0020] Figure 7 For Figure 6 An enlarged schematic diagram of the position C in
[0021] Reference numerals: 1, packaging housing; 2, semiconductor sensor; 21, first bottom cover; 3, infrared sensor; 31, second bottom cover; 123, L-shaped clamping block; 4, support seat; 41, rotation groove; 42, rotation rod; 43, rotating rod; 44, card slot; 45, limiting groove; 46, first rotation hole; 47, second rotation hole; 48, rotating clamping block; 5, rotating seat; 51, support plate; 52, support rotating rod; 53, buckle; 54, mounting hole; 55, return spring; 56, pull-out insertion rod; 57, limiting protrusion; 58, pulling spring; 59, knob. Detailed implementation manners
[0022] Next, the technical solutions of the present utility model will be clearly and completely described in conjunction with the accompanying drawings. Obviously, the described embodiments are some, but not all, of the embodiments of the present utility model.
[0023] Generally, the components of the embodiments of the present utility model described and shown in the accompanying drawings here can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present utility model provided in the accompanying drawings is not intended to limit the scope of the claimed present utility model, but merely represents the selected embodiments of the present utility model.
[0024] Based on the embodiments in the present utility model, all other embodiments obtained by those of ordinary skill in the art without making creative efforts belong to the scope of protection of the present utility model.
[0025] In the description of the present utility model, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present utility model. In addition, the terms "first", "second", "third" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance.
[0026] It should be noted that the term "comprising", "including" or any other variant thereof is intended to cover a non-exclusive inclusion, such that a process, method, article or device comprising a series of elements not only includes those elements but also includes other elements not expressly listed, or further includes elements inherent to such process, method, article or device. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.
[0027] In the description of the present utility model, it should be noted that unless otherwise clearly specified and defined, the terms "installed", "connected" and "coupled" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection or an integral connection; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.
[0028] Embodiment
[0029] As Figures 1 - 7 shown, a high-low concentration different sensor packaging structure proposed by the present utility model includes a packaging housing 1, a semiconductor sensor 2 and an infrared sensor 3 movably installed on the packaging housing 1, and further includes: a disassembly assembly installed on the packaging housing 1 for simultaneously disassembling the semiconductor sensor 2 and the infrared sensor 3; a connection mechanism installed on the packaging housing 1 for individually disassembling one of the semiconductor sensor 2 and the infrared sensor 3. The semiconductor sensor 2 is a sensor that uses the characteristics of semiconductor materials to measure gas concentration. They are usually used to measure the concentration of specific gases in the environment, such as oxygen, carbon monoxide, carbon dioxide, etc. "ppm" refers to "parts per million" and is used to represent the components in a gas or solution with a very small concentration.
[0030] The infrared sensor 3 is a sensor that utilizes the characteristics of infrared radiation to detect objects or gases. Generally, infrared sensors are used to detect gas concentrations, especially harmful gases in the air. "VOL%" refers to volume percentage, which is used to represent the volume ratio of a gas in a mixed gas. The working principle of the infrared sensor 3 is based on the absorption characteristics of the target gas for infrared radiation. Each gas has its specific infrared spectral absorption characteristics. When infrared radiation passes through a mixed gas containing the target gas, the target gas will absorb infrared light of a specific wavelength, resulting in a change in the intensity of the infrared light received by the sensor. By measuring this change, the concentration of the target gas can be inferred.
[0031] Furthermore, the disassembly component includes a support base 4 fixedly connected to the encapsulation housing 1 and located in the middle of the semiconductor sensor 2 and the infrared sensor 3. A second bottom cover 31 is provided at one end of the infrared sensor 3 close to the support base 4, and a first bottom cover 21 is provided at one end of the semiconductor sensor 2 close to the support base 4. A pair of L-shaped clamping blocks 123 for clamping the disassembly component and the connection mechanism are provided on the encapsulation housing 1.
[0032] Among them, the disassembly component further includes a pair of rotating rods 43 corresponding to the L-shaped clamping blocks 123 and rotatably connected to the support base 4. Second rotating holes 47 communicating with the first rotating hole 46 are provided at one end of each rotating rod 43 close to the support base 4. At one end of the support rotating rod 52 movably passing through the first rotating hole 46, a clamping buckle 53 for rotating in the second rotating hole 47 is fixedly connected. The function of the clamping buckle 53 is that when the support rotating rod 52 moves up and down, it will drive the rotating rod 43 to move. At the end of each rotating rod 43 far from the support base 4, a rotating clamping block 48 for clamping the L-shaped clamping block 123 is fixedly connected. A rotating seat 5 is rotatably connected to the support base 4, and a support plate 51 is fixedly connected to the rotating seat 5. A pair of support rotating rods 52 are fixedly connected to both ends of the support plate 51. First rotating holes 46 for inserting the rotating rods 43 are provided at one end of each rotating rod 43 close to the support base 4. A turning knob 59 is fixedly connected to the support plate 51, and a limiting mechanism for restricting the random rotation of the rotating seat 5 is provided at one end of the rotating seat 5 close to the support base 4.
[0033] Secondly, the limiting mechanism includes a rotating rod 43 provided on the support base 4. A clamping groove 44 is provided inside the rotating rod 43. A pulling spring 58 is fixedly connected inside the clamping groove 44. The function of the pulling spring 58 is to limit the positioning convex block 57 of the pull-out plug rod 56 that has come out of the clamping groove 44 and the limiting groove 45 to automatically re-engage. One end of the pulling spring 58 far from the clamping groove 44 is fixedly connected to one end of the pull-out plug rod 56. A pair of limiting grooves 45 are provided inside the clamping groove 44. A pull-out plug rod 56 for inserting into the rotating rod 43 and the clamping groove 44 is fixedly connected to one end of the rotating seat 5 close to the support base 4. A pair of limiting convex blocks 57 for engaging with the limiting grooves 45 are fixedly connected to one end of the pull-out plug rod 56 inserted into the clamping groove 44.
[0034] Furthermore, the connecting mechanism includes a mounting hole 54 formed in the rotating base 5. A return spring 55 is arranged inside the mounting hole 54. The function of the return spring 55 is that when the rotating rod 43 is not subjected to force, it will return to its original position through the elastic tension of the return spring 55. Both ends of the return spring 55 are fixedly connected to the corresponding rotating rod 43. A pair of rotating grooves 41 are formed in the support base 4, and a rotating rod 42 for supporting the rotation of the first bottom cover 21 and the second bottom cover 31 is rotatably connected inside each of the rotating grooves 41.
[0035] In this embodiment, when it is necessary to use the high-low concentration different sensor packaging structure, such as Figure 1 As shown, when it is necessary to repair both the semiconductor sensor 2 and the infrared sensor 3, only need to pinch the rotary knob 59 and move it in the direction away from the support base 4. The rotary knob 59 drives the support plate 51, the rotating base 5 and the pull-out plug 56 to move in sequence, and the pull-out plug 56 drives a pair of limit bumps 57 to move from the card slots 44 and the limit slots 45 into the rotating rod 43. At this time, the rotary knob 59 can be rotated 90°, and then the support plate 51 drives the support rotating rod 52 and the support rotating rod 52 to rotate in sequence. One end of the support rotating rod 52 with the buckle 53 drives the corresponding rotating rod 43 to rotate 90° around the pull-out plug 56. Each rotating rod 43 drives the rotating block 48 at one end thereof to move away from the corresponding L-shaped block 123. At this time, the first bottom cover 21 and the second bottom cover 31 can be opened from one end of the semiconductor sensor 2 and the infrared sensor 3, and then the semiconductor sensor 2 and the infrared sensor 3 can be repaired;
[0036] When it is necessary to repair one of the semiconductor sensor 2 and the infrared sensor 3, only need to rotate the rotating rod 43 on the corresponding first bottom cover 21 and the second bottom cover 31. The rotating rod 43 rotates 90° around the support rotating rod 52 through the first rotating hole 46, so that the rotating rod 43 drives the rotating block 48 at one end thereof to move away from the L-shaped block 123. Finally, rotate the corresponding first bottom cover 21 and the second bottom cover 31 upward, and the corresponding first bottom cover 21 or the second bottom cover 31 can be repaired, which is simple and easy to operate.
[0037] The preferred embodiments of the above utility model are only used to help illustrate the utility model. The preferred embodiments do not describe all the details in detail, nor do they limit the utility model to only the specific embodiments. Obviously, according to the content of this specification, many modifications and changes can be made. This specification selects and specifically describes these embodiments in order to better explain the principle and practical application of the utility model, so that those skilled in the relevant technical field can understand and utilize the utility model well. The utility model is only limited by the claims and their full scope and equivalents.
Claims
1. A high- and low-concentration sensor packaging structure, comprising a packaging shell (1) and a semiconductor sensor (2) and an infrared sensor (3) movably mounted on the packaging shell (1), characterized in that: Also includes: A disassembly component installed on one side of the packaging housing (1) to allow the semiconductor sensor (2) and the infrared sensor (3) to be disassembled simultaneously; A connecting mechanism is installed on the packaging housing (1) to enable the semiconductor sensor (2) or the infrared sensor (3) to be individually disassembled.
2. A high and low concentration sensor packaging structure according to claim 1, characterized in that: The disassembly assembly comprises a support base (4) fixedly connected to the packaging shell (1) and located in the middle of the semiconductor sensor (2) and the infrared sensor (3); the end of the infrared sensor (3) close to the support base (4) is provided with a second bottom cover (31); the end of the semiconductor sensor (2) close to the support base (4) is provided with a first bottom cover (21); and the packaging shell (1) is provided with a pair of L-shaped clamping blocks (123) for clamping the disassembly assembly and the connecting mechanism.
3. A high and low concentration sensor packaging structure according to claim 2, characterized in that: The disassembly assembly further comprises a pair of rotating rods (43) rotatably connected to the support seat (4) and corresponding to the L-shaped clamping block (123); one end of the rotating rod (43) away from the support seat (4) is fixedly connected to a rotating clamping block (48) for clamping the L-shaped clamping block (123); a rotating seat (5) is rotatably connected to the support seat (4); a support plate (51) is fixedly connected to the rotating seat (5); a pair of supporting rotating rods (52) are fixedly connected at both ends of the support plate (51); a first rotating hole (46) for inserting the rotating rod (43) is provided at one end of the rotating rod (43) close to the support seat (4); a rotating knob (59) is fixedly connected to the support plate (51); and a limiting mechanism for limiting the random rotation of the rotating seat (5) is provided at one end of the rotating seat (5) close to the support seat (4).
4. A high-low concentration sensor packaging structure according to claim 3, characterized in that: The limiting mechanism comprises a rotating rod (43) provided on the supporting seat (4), a slot (44) provided inside the rotating rod (43), a pair of limiting slots (45) provided inside the slot (44), a pull-out rod (56) for inserting into the rotating rod (43) and the slot (44) fixedly connected to one end of the rotating seat (5) close to the supporting seat (4), and a pair of limiting protrusions (57) for inserting into the limiting slots (45) fixedly connected to one end of the pull-out rod (56) inserted into the slot (44).
5. A high and low concentration sensor packaging structure according to claim 4, characterized in that: A pulling spring (58) is fixedly connected inside the clamping slot (44), and one end of the pulling spring (58) away from the clamping slot (44) is fixedly connected to one end of the pulling and inserting rod (56).
6. A high-low concentration sensor packaging structure according to claim 3, characterized in that: The connection mechanism comprises a mounting hole (54) formed on the rotating seat (5), a return spring (55) being provided inside the mounting hole (54), two ends of the return spring (55) being fixedly connected to the corresponding rotating rod (43), a pair of rotating grooves (41) being formed on the supporting seat (4), the rotating grooves (41) being rotatably connected inside with rotating rods (42) for supporting the first bottom cover (21) and the second bottom cover (31) to rotate.
7. A high-low concentration sensor packaging structure according to claim 4, characterized in that: The end of the rotating rod (43) close to the support seat (4) is provided with a second rotating hole (47) connected to the first rotating hole (46), and the end of the supporting rotating rod (52) that movably passes through the first rotating hole (46) is fixedly connected with a buckle (53) for rotating in the second rotating hole (47).