Storage module testing device

Abstract

The utility model provides a memory module testing device, which belongs to the technical field of memory module performance testing, and comprises a testing platform and a temperature adjusting assembly, and the testing platform is used for connecting a memory module; the temperature adjusting assembly is connected with the test platform; the temperature adjusting assembly comprises a heating assembly, a heat conduction fan and a mounting frame, a mounting cavity is defined by the mounting frame, the heating assembly and the heat conduction fan are both arranged in the mounting cavity, and the heating assembly is used for heating air in the mounting cavity; the heat conduction fan is used for disturbing the temperature of air in the mounting cavity. According to the utility model, air circulation in the mounting chamber is accelerated through the heat conduction fan, and the difference between the environment temperature in the mounting chamber and the surface temperature of the storage module is reduced, so that the detected environment temperature in the mounting chamber is closer to the surface temperature of the storage module; when the environment temperature in the mounting chamber is used for the high-temperature test of the storage module, the test result of the high-temperature test is more accurate.

Description

Technical Field

[0001] The utility model belongs to the technical field of storage module performance testing, and specifically relates to a storage module testing device. Background Technique

[0002] A storage module is a device used to store and retrieve data. Common storage modules include random access memory and read-only memory. Random access memory is a volatile memory that can store and read data, and is usually used to store temporary data such as program code, intermediate results, and temporary variables. Read-only memory is a non-volatile memory that can only be read and not written, and is usually used to store data that does not change frequently, such as firmware, program code, and constant data.

[0003] Before a storage module is put on the market, performance tests need to be carried out, such as tests on performance aspects such as storage capacity, storage time, and storage cycle reliability. For a storage module used in a dedicated temperature control device, a high-temperature test is generally required to ensure the reliability of the storage module when used in a high-temperature environment. However, in the prior art when performing a high-temperature test on a storage module, generally the ambient temperature in the installation chamber of the storage module is collected and regarded as the surface temperature of the storage module. In actual tests, due to the temperature gradient in the installation chamber of the storage module, when detecting at different points in the installation chamber, the detected temperatures will be different, that is, there is a difference between the ambient temperature and the surface temperature of the storage module, resulting in inaccurate high-temperature test results of the storage module. Summary of the Utility Model

[0004] Based on what is described in the above background technique, when a storage module is subjected to a high-temperature test, there is a difference between the ambient temperature and the surface temperature of the storage module, resulting in the technical problem of inaccurate high-temperature test results of the storage module. In view of this technical problem, the utility model proposes a storage module testing device.

[0005] The utility model sets a heat conduction fan in the installation chamber, and accelerates the air circulation in the installation chamber through the heat conduction fan to disturb the temperature of the air in the installation chamber, reduce the difference between the ambient temperature in the installation chamber and the surface temperature of the storage module, and make the ambient temperature in the installation chamber closer to the surface temperature of the storage module. When the ambient temperature in this installation chamber is used for the high-temperature test of the storage module, the test results of the high-temperature test can be made more accurate.

[0006] In order to solve the above technical problems, the technical solution adopted by the utility model is as follows:

[0007] A storage module testing device of the utility model includes:

[0008] A test platform for connecting a storage module;

[0009] and a temperature regulation component, connected to the test platform;

[0010] The temperature regulation component includes a mounting frame, the mounting frame encloses to form a mounting chamber, and at least part of the storage module extends into the mounting chamber;

[0011] The temperature regulation component further includes a heating component and a heat conduction fan;

[0012] The heating component is placed in the mounting chamber, and the heating component includes a heating layer, and the heating layer is used to heat the temperature of the air in the mounting chamber;

[0013] The heat conduction fan is placed in the mounting chamber and is used to disturb the temperature of the air in the mounting chamber.

[0014] Further defined, the temperature regulation component further includes a heat dissipation component;

[0015] The heat dissipation component includes at least two heat dissipation fans, and at least two heat dissipation fans are respectively arranged on opposite sides of the mounting frame and communicate with the mounting chamber to form a heat dissipation channel;

[0016] The heating component and the heat dissipation component are not coplanar.

[0017] Further defined, the heat conduction fan is arranged on the side of the heating layer close to the mounting chamber.

[0018] Further defined, the heating component further includes a heat conduction layer, and the heat conduction layer is arranged between the heat conduction fan and the heating layer.

[0019] Further defined, the temperature regulation component further includes at least two longitudinal baffles, at least two of the longitudinal baffles are both connected to the mounting frame, and the longitudinal baffles extend from the top to the bottom of the mounting chamber and extend out of the bottom of the mounting chamber;

[0020] A heat dissipation chamber is formed between the longitudinal baffle and the mounting frame, and at least one heat dissipation fan is arranged in the heat dissipation chamber,

[0021] The longitudinal baffle is provided with heat dissipation holes, and the heat dissipation chamber communicates with the mounting chamber through the heat dissipation holes to form a heat dissipation channel.

[0022] Further defined, the heat conduction fan is provided with a temperature acquisition unit, and the temperature acquisition unit is used to acquire the ambient temperature of the mounting chamber.

[0023] Further defined, the temperature regulation component further includes a temperature control board connected to the outside of the installation frame. A temperature acquisition unit interface, a heating component interface 73, and a heat dissipation component interface are provided on the temperature control board. The temperature acquisition unit interface is electrically connected to the temperature acquisition unit; the heating component interface 73 is electrically connected to the heating component; and the heat dissipation component interface is electrically connected to the heat dissipation component.

[0024] Further defined, the temperature regulation component further includes a heat insulation board, which is connected to the outside of the installation frame, and the installation position of the heat insulation board corresponds to the installation position of the heating layer.

[0025] Further defined, the storage module testing device further includes: a temperature control component fixing plate for connecting the temperature regulation component.

[0026] Further defined, the storage module testing device further includes: a testing platform fixing plate, which is arranged side by side with both the testing platform and the temperature control component fixing plate and is used for connecting the testing platform;

[0027] A storage module through hole is provided on the temperature control component fixing plate; one end of the storage module is connected to the testing platform, and the other end extends through the storage module through hole to the installation chamber.

[0028] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0029] 1. For the storage module testing device of the present utility model, the temperature regulation component includes a heat conduction fan, which is placed in the installation chamber. Through the heat conduction fan, the air circulation in the installation chamber can be accelerated, so as to disturb the temperature of the air in the installation chamber, reduce the difference between the ambient temperature in the installation chamber and the surface temperature of the storage module, and make the ambient temperature in the installation chamber closer to the surface temperature of the storage module. When the ambient temperature in the installation chamber is used for the high-temperature test of the storage module, the test result of the high-temperature test can be made more accurate.

[0030] 2. In the present utility model, the temperature regulation component includes a heating component and a heat dissipation component. The heating component is used to increase the temperature of the air in the installation chamber when the temperature in the installation chamber is too low; the heat dissipation component is used to reduce the temperature of the air in the installation chamber when the temperature in the installation chamber is too high; cooperating with the heat dissipation fan, the temperature in the installation chamber can be made more uniform during the process of increasing or decreasing the temperature.

[0031] 3. In the present utility model, the temperature regulation component further includes a longitudinal baffle, which is connected to the installation frame and extends from the top to the bottom of the installation chamber and protrudes from the bottom of the installation chamber; setting the longitudinal baffle can improve the sealing effect of the installation chamber.

[0032] 4. In the present utility model, the temperature adjustment component further includes a heat insulation board. The installation position of the heat insulation board corresponds to that of the heating layer. The heat insulation board is used to isolate the heating component from the external space of the installation frame to prevent scalding the test personnel. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 is a schematic diagram of the temperature adjustment component;

[0034] Figure 2 is a schematic diagram of the fixing plate of the temperature control component;

[0035] Figure 3 is a schematic diagram of the storage module testing device Figure 1 , with the temperature adjustment component closed;

[0036] Figure 4 is a schematic diagram of the storage module testing device Figure 2 , with the temperature adjustment component open;

[0037] Figure 5 is a front view of the storage module testing device, with the temperature adjustment component open;

[0038] Figure 6 is a schematic diagram of the fixing plate of the testing platform;

[0039] Figure 7 is a structural schematic diagram of the temperature control board;

[0040] Among them, 1 - temperature adjustment component, 101 - heat conduction fan, 102 - heat dissipation fan, 103 - heat conduction layer, 104 - heating layer, 105 - heat insulation board, 106 - longitudinal baffle, 107 - installation frame, 108 - heat dissipation cavity, 109 - installation chamber, 110 - ambient temperature acquisition point;

[0041] 2 - fixing plate of the temperature control component, 201 - through hole for the storage module;

[0042] 3 - testing platform;

[0043] 4 - fixing plate of the testing platform;

[0044] 5 - limiting plate of the temperature control component;

[0045] 6 - storage module, 601 - surface temperature acquisition point;

[0046] 7 - temperature control board, 71 - interface of the temperature acquisition unit, 72 - interface of the heat dissipation component, 73 - interface of the heating component, 74 - power module slot, 75 - key switch module, 76 - temperature display module, 77 - communication module interface, 78 - main control. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0047] To make the technical solution of the present utility model clearer, the technical solution of the present utility model will be clearly and completely described below in conjunction with the embodiments and the drawings. Obviously, the described embodiments are part of the embodiments of the present utility model, rather than all of the embodiments. Therefore, the following detailed description of the embodiments of the present utility model provided in the drawings is not intended to limit the scope of the claimed protection, but merely represents the selected embodiments of the present utility model. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts fall within the scope of protection of the present utility model.

[0048] See Figure 1 , a storage module testing device of the present utility model includes a testing platform 3 and a temperature adjustment component 1. The testing platform 3 is used to connect to the storage module 6; the temperature adjustment component 1 is connected to the testing platform 3; preferably, the testing platform 3 is placed below the temperature adjustment component 1. The testing platform 3 can be a server motherboard, a desktop computer motherboard, or a testing machine table, etc., and can be various devices capable of testing the storage module 6. Among them, the temperature adjustment component 1 includes an installation frame 107, and the installation frame 107 encloses to form an installation chamber 109. At least part of the storage module 6 extends into the installation chamber 109; specifically, one side of the storage module 6 is fixedly clamped on the testing platform 3, and the side of the storage module 6 away from the testing platform 3 extends into the installation chamber 109 for high-temperature testing in the installation chamber 109.

[0049] In the present utility model, the temperature adjustment component 1 further includes a heating component and a heat conduction fan 101; among them, both the heating component and the heat conduction fan 101 are placed in the installation chamber 109. Preferably, the heat conduction fan 101 is installed on the side of the heating component close to the installation chamber 109.

[0050] The heating component includes a heating layer 104, and the heating layer 104 is used to heat the temperature of the air in the installation chamber 109; the heating layer 104 is installed on the top of the installation chamber 109; among them, the heating layer 104 can be any device such as an electric heating plate, an electric heating tube, or a liquid heater that can realize heating the air in the installation chamber 109, and the present utility model does not make specific limitations.

[0051] Preferably, the heating layer 104 in the present utility model is an electric heating plate.

[0052] The heat conduction fan 101 is arranged on the side of the heating layer 104 close to the installation chamber 109. The heat conduction fan 101 is used to disturb the temperature of the air in the installation chamber 109, reduce the difference between the ambient temperature in the installation chamber 109 and the surface temperature of the storage module 6, so that the ambient temperature in the installation chamber 109 is closer to the surface temperature of the storage module 6. When the ambient temperature in the installation chamber 109 is used for the high-temperature test of the storage module 6, the test results are more accurate.

[0053] In the present utility model, the temperature range for high-temperature testing is 75°C - 85°C.

[0054] In the present utility model, the temperature adjustment component 1 further includes a heat dissipation component. The heat dissipation component includes at least two heat dissipation fans 102. The at least two heat dissipation fans 102 are respectively arranged on opposite sides of the installation frame 107 and communicate with the installation chamber 109 to form a heat dissipation channel. Among them, the heating component and the heat dissipation component are not coplanar. Specifically, there are two groups of heat dissipation components. Each group of heat dissipation components can be provided with multiple heat dissipation components. For example: each group of heat dissipation components can have 1, 2, 3 or more heat dissipation components. The two groups of heat dissipation components are respectively arranged on opposite sides of the installation frame 107 and on the side close to the installation chamber 109.

[0055] See Figure 5 , as an implementation manner of the present utility model, each group of heat dissipation components has 2 heat dissipation components.

[0056] In the present utility model, the heat dissipation component can be any device that can realize the heat dissipation of the air in the installation chamber 109, such as the heat dissipation fan 102 or the cooler, etc., and the present utility model does not make specific limitations.

[0057] Preferably, the heat dissipation component in the present utility model is the heat dissipation fan 102.

[0058] In the present utility model, the heating component further includes a heat conduction layer 103. The heat conduction layer 103 is arranged between the heat conduction fan 101 and the heating layer 104. The heat conduction layer 103 is used to conduct the heat of the heating layer 104, so that the heat conduction is more uniform and local overheating in the installation chamber 109 is avoided.

[0059] In the present utility model, the temperature adjustment component 1 further includes at least two longitudinal baffles 106. The at least two longitudinal baffles 106 are both connected to the installation frame 107, and the longitudinal baffles 106 extend from the top to the bottom of the installation chamber 109 and extend out of the bottom of the installation chamber 109; preferably, the installation position of the longitudinal baffles 106 corresponds to the installation position of the heat dissipation component. The longitudinal baffles 106 are used to separate the heat dissipation component from the installation chamber 109, so that the sealing effect of the installation chamber 109 is better, the heat loss is reduced, and the overall power consumption is reduced.

[0060] A heat dissipation chamber 108 is formed between the longitudinal baffle 106 and the installation frame 107. At least one heat dissipation fan 102 is arranged in the heat dissipation chamber 108; specifically, a group of heat dissipation components is arranged in each heat dissipation chamber 108, and the heat dissipation component includes at least one heat dissipation fan 102.

[0061] The longitudinal baffle 106 is provided with heat dissipation holes, and the heat dissipation cavity 108 communicates with the installation chamber 109 through the heat dissipation holes, thereby forming a heat dissipation channel. Specifically, the setting positions of the heat dissipation holes correspond to the setting positions of the heat dissipation cavity 108 and the installation chamber 109, so that the heat dissipation cavity 108 is communicated with the installation chamber 109 through the heat dissipation holes, and the number of the heat dissipation holes can be multiple; it is set that the heat dissipation cavity 108 formed between the first longitudinal baffle and the installation frame 107 is the first heat dissipation cavity, and the heat dissipation cavity 108 formed between the second longitudinal baffle and the installation frame 107 is the second heat dissipation cavity. Among them, the first heat dissipation cavity, the installation chamber 109 and the second heat dissipation cavity jointly form a heat dissipation channel.

[0062] A temperature acquisition unit is arranged on the heat conduction fan 101, and the temperature acquisition unit is used for acquiring the ambient temperature of the installation chamber 109. Specifically, the temperature acquisition unit can be any device capable of realizing temperature acquisition, such as a temperature sensor, a temperature sensing wire, etc. Preferably, an ambient temperature acquisition point 110 is arranged on the heat conduction fan 101, and the temperature acquisition unit is installed at the position of the ambient temperature acquisition point 110.

[0063] As an embodiment of the present utility model, preferably, the temperature acquisition unit is a temperature sensing wire.

[0064] See Figure 7 , in the present utility model, the temperature adjustment assembly 1 further includes a temperature control board 7 connected to the outside of the installation frame 107. The temperature control board 7 is provided with a temperature acquisition unit interface 71, a heating component interface 73 and a heat dissipation component interface 72. The temperature acquisition unit interface 71 is electrically connected to the temperature acquisition unit; the heating component interface 73 is electrically connected to the heating component; the heat dissipation component interface 72 is electrically connected to the heat dissipation component.

[0065] Among them, the temperature control board 7 is further provided with a power module slot 74, a key switch module 75, a temperature display module 76, a communication module interface 77, a heat conduction fan interface and a main control 78, etc. The power module slot 74 is used for connecting a power supply to supply power to the temperature acquisition unit, the heating component, the heat dissipation component, the heat conduction fan 101, the key switch module 75, the temperature display module 76 and the communication module interface 77, etc.; the key switch module 75 is used for controlling processes such as temperature increase, temperature decrease, and switching on and off; the temperature display module 76 is connected to the temperature acquisition unit and is used for displaying the temperature acquired by the temperature acquisition unit; the communication module interface 77 is used for the temperature control board 7 to communicate and connect with other external modules, and the communication module interface 77 can be a communication protocol interface supported by both the serial port, the network port and other test main boards and the main control 78; the heat conduction fan interface is connected to the heat conduction fan 101; the main control 78 can be a chip such as a single-chip microcomputer and a field programmable gate array, and the main control 78 is respectively connected to the heating component and the heat dissipation component. Specifically, the main control 78 belongs to a conventional temperature control module in the prior art.

[0066] Preferably, a temperature control board fixing structure is vertically fixed on the outside of the installation frame 107 of the present utility model. The temperature control board fixing structure is used for fixedly connecting the temperature control board 7, that is, the temperature control board 7 is fixedly connected to the installation frame 107 through the temperature control board fixing structure, which is convenient for testers to observe the test status.

[0067] In the present utility model, the temperature adjustment component 1 further includes a heat insulation board 105. The heat insulation board 105 is connected to the outside of the installation frame 107, and the installation position of the heat insulation board 105 corresponds to the installation position of the heating layer 104. The heat insulation board 105 is used to isolate the heating layer 104 from the external environment, avoiding scalding the test personnel due to the relatively high temperature of the corresponding part of the heating layer 104. Preferably, the heat insulation board 105 is connected to the outside of the installation frame 107 through copper columns, so that a hollow structure is formed between the heat insulation board 105 and the installation frame 107.

[0068] In the present utility model, the storage module testing device further includes: a temperature control component fixing plate 2, which is used for connecting the temperature adjustment component 1. Preferably, the temperature control component fixing plate 2 is hinged to the temperature adjustment component 1. When performing the high-temperature test on the storage module 6, the temperature adjustment component 1 is put down and buckled above the temperature control component fixing plate 2 to provide a test space for the storage module 6 through the installation chamber 109. After the high-temperature test of the storage module 6 is completed, the temperature adjustment component 1 is lifted, which is convenient for the replacement operation of the storage module 6. Among them, the temperature control component fixing plate 2 is hinged to the temperature adjustment component 1 through a hinge, which is convenient for testers to open and close the temperature adjustment component 1.

[0069] A temperature control component limiting plate 5 is fixedly installed on the temperature control component fixing plate 2 of the present utility model. The temperature control component limiting plate 5 is used for limiting the temperature adjustment component 1 when the temperature adjustment component 1 is opened.

[0070] See Figure 2 , Figure 3 , Figure 4 and Figure 6 , in the present utility model, the storage module testing device further includes: a test platform fixing plate 4, which is arranged side by side with the test platform 3 and the temperature control component fixing plate 2 from bottom to top in sequence. The test platform fixing plate 4 is used for connecting and fixing the test platform 3, and at the same time provides effective support for the test platform 3, reducing the deformation of the test platform 3 during the insertion and extraction process of the storage module 6 and improving the service life of the test platform 3.

[0071] In the present utility model, a storage module through hole 201 is provided on the temperature control component fixing plate 2; one end of the storage module 6 is connected to the test platform 3, and the other end extends through the storage module through hole 201 into the installation chamber 109.

[0072] See Figure 4, on one side of the storage module 6 of the present utility model close to the temperature regulation component 1, a surface temperature acquisition point 601 is provided. When the surface temperature of the storage module 6 acquired through the surface temperature acquisition point 601 is used for high-temperature testing, the test results will be more accurate.

[0073] The working principle of the storage module testing device of the present utility model is as follows:

[0074] When performing high-temperature testing on the storage module 6, the temperature regulation component 1 is lowered and buckled above the temperature control component fixing plate 2, and a test space is provided for the storage module 6 through the installation chamber 109 of the temperature regulation component 1;

[0075] During the testing process, the heat conduction fan 101 is always in a working state to accelerate the air circulation in the installation chamber 109, disturb the temperature of the air in the installation chamber 109, and reduce the difference between the ambient temperature in the installation chamber 109 and the surface temperature of the storage module 6, so that the ambient temperature in the installation chamber 109 is closer to the surface temperature of the storage module 6; when the temperature collected by the temperature acquisition unit is too high and fed back to the temperature display module 76, the heat dissipation component is turned on through the key switch module 75 to dissipate heat from the installation chamber 109 until the temperature in the installation chamber 109 is within a reasonable range, and the heat dissipation component is turned off through the key switch module 75; when the temperature collected by the temperature acquisition unit is too low and fed back to the temperature display module 76, the heating component is turned on through the key switch module 75 to heat the installation chamber 109 until the temperature in the installation chamber 109 is within a reasonable range, and the heating component is turned off through the key switch module 75; during the heat dissipation and heating processes, the heat dissipation fan 102 is always in a working state, which can make the temperature in the installation chamber 109 more uniform during the heating or heat dissipation process.

[0076] The above are only the preferred embodiments of the present utility model and are not used to limit the present utility model. For those skilled in the art, the present utility model can have various changes and modifications. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model shall be included in the protection scope of the present utility model.

Claims

1. A storage module testing device, characterized in that: include: A test platform (3), used for connecting to a storage module (6); and a temperature regulating component (1), connected to the testing platform (3); The temperature adjustment assembly (1) comprises a mounting frame (107), the mounting frame (107) encloses a mounting chamber (109), and the storage module (6) at least partially extends into the mounting chamber (109); The temperature adjustment component (1) also includes a heating component and a heat-conducting fan (101); The heating component is placed in the installation chamber (109), and the heating component comprises a heating layer (104), and the heating layer (104) is used to heat the temperature of the air in the installation chamber (109); The heat-conducting fan (101) is placed in the installation chamber (109) and is used to disturb the temperature of the air in the installation chamber (109).

2. The storage module testing device according to claim 1, characterized in that: The temperature regulating component (1) also includes a heat dissipation component; The heat dissipation assembly comprises at least two heat dissipation fans (102), and the at least two heat dissipation fans (102) are respectively arranged on opposite sides of the installation frame (107) and communicated with the installation chamber (109) to form a heat dissipation channel; The heating component is not coplanar with the heat dissipation component.

3. The storage module testing device according to claim 1, characterized in that: The heat-conducting fan (101) is arranged on a side of the heating layer (104) close to the installation chamber (109).

4. The storage module testing device according to claim 3, characterized in that: The heating component further comprises a heat-conducting layer (103), wherein the heat-conducting layer (103) is arranged between the heat-conducting fan (101) and the heating layer (104).

5. The storage module testing device according to claim 2, characterized in that: The temperature adjustment assembly (1) further comprises at least two longitudinal baffles (106), at least two of the longitudinal baffles (106) are connected to the mounting frame (107), and the longitudinal baffles (106) extend from the top to the bottom of the mounting chamber (109) and extend out of the bottom of the mounting chamber (109); A heat dissipation cavity (108) is formed between the longitudinal baffle (106) and the mounting frame (107), and at least one heat dissipation fan (102) is arranged in the heat dissipation cavity (108); The longitudinal baffle (106) is provided with heat dissipation holes, and the heat dissipation cavity (108) is connected with the installation cavity (109) through the heat dissipation holes, thereby forming a heat dissipation channel.

6. The storage module testing device according to claim 5, characterized in that: The heat-conducting fan (101) is provided with a temperature collection unit, and the temperature collection unit is used to collect the ambient temperature of the installation chamber (109).

7. The storage module testing device according to claim 6, characterized in that: The temperature adjustment component (1) further comprises a temperature control board (7) connected to the outside of the mounting frame (107); the temperature control board (7) is provided with a temperature acquisition unit interface (71), a heating component interface (73) and a heat dissipation component interface (72); the temperature acquisition unit interface (71) is electrically connected to the temperature acquisition unit; the heating component interface (73) is electrically connected to the heating component; and the heat dissipation component interface (72) is electrically connected to the heat dissipation component.

8. The storage module testing device according to claim 1, characterized in that: The temperature regulating assembly (1) further comprises a thermal insulation plate (105), wherein the thermal insulation plate (105) is connected to the outside of the mounting frame (107), and the mounting position of the thermal insulation plate (105) corresponds to the mounting position of the heating layer (104).

9. The storage module testing device according to claim 1, characterized in that: The storage module testing device further comprises: a temperature control component fixing plate (2) used for connecting the temperature adjustment component (1).

10. The storage module testing device according to claim 9, characterized in that: The storage module testing device further comprises: a test platform fixing plate (4), which is arranged side by side with the test platform (3) and the temperature control component fixing plate (2) and is used to connect the test platform (3); The temperature control component fixing plate (2) is provided with a storage module via (201); one end of the storage module (6) is connected to the test platform (3), and the other end passes through the storage module via (201) and extends into the installation chamber (109).

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