Semiconductor product taking and placing device

By designing a semiconductor product pick-and-drop device including control arms, lifting modules, sliding frames, rotary modules, flange connecting frames, handling frames, sliders, fixed pneumatic components and mobile pneumatic components, the problems of low efficiency and small application range of existing devices are solved, and efficient pick-and-drop of products of different sizes are achieved.

CN222914753UActive Publication Date: 2025-05-27YOUWEI IMAGE TECH (SUZHOU) CO LTD
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Patent Information

Application Number
CN202421506438.2
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-06-28
Publication Date
2025-05-27
Estimated Expiration
2034-06-28

AI Technical Summary

Technical Problem

The existing semiconductor product pick-and-drop devices can only pick-and-drop one product at a time, which is inefficient in working efficiency and is difficult to adapt to products of different sizes, and has a small scope of application.

Method used

A material pick-up and discharge device including a control arm, a lifting module, a sliding frame, a rotary module, a flange connecting frame, a conveyor, a slider, a fixed pneumatic component and a moving pneumatic component is designed. The drive mechanism and a variable distance mechanism are used to move the slide up and down, and the spacing of the pneumatic suction head is adjusted to adapt to semiconductor products of different sizes.

Benefits of technology

It realizes efficient access and placement of large-scale semiconductor products, has a wide range of applications, can adapt to products of different sizes, and improves work efficiency.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a semiconductor product taking and placing device, which belongs to the technical field of semiconductors and comprises a control arm, a lifting module fixedly connected onto the control arm, a sliding frame slidably connected onto the lifting module, a rotating module fixedly connected onto the sliding frame, and a flange connecting frame detachably connected to the output end of the rotating module. A carrying frame is fixedly connected to the bottom end of the flange connecting frame, a sliding plate is slidably connected to the carrying frame, a fixed pneumatic assembly is fixedly connected to the carrying frame and located on one side of the sliding plate, and a plurality of movable pneumatic assemblies are arranged on one side of the sliding plate and distributed on the two symmetrical sides of the fixed pneumatic assembly. According to the device, the working efficiency is improved through the multiple pneumatic suction heads, meanwhile, the distance between the multiple pneumatic suction heads is adjusted through cooperation of the driving mechanism, the distance changing mechanism and the sliding plate, semiconductor products of different sizes are taken and placed, and the application range is wide.
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Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, and more specifically, to a semiconductor product picking and placing device. Background Art

[0002] At present, during the production of semiconductor products, in order to ensure the normal use of semiconductor products, the processed semiconductor products need to be moved to a detection device for detection. During this detection and movement process, generally, a robotic arm is used to control the picking and placing of semiconductor products. However, most of the existing picking and placing devices can only pick and place one semiconductor product at a time, resulting in low work efficiency. For some picking and placing devices that can pick and place multiple semiconductor products simultaneously, the distance between the grasping positions cannot be adjusted, making it difficult to pick and place semiconductor products of different sizes, and the applicable range is small. Summary of the Utility Model

[0003] 1. Technical Problems to be Solved

[0004] Aiming at the problems existing in the prior art, the purpose of the present utility model is to provide a semiconductor product picking and placing device, aiming to solve the problems that most of the existing picking and placing devices can only pick and place one semiconductor product at a time, resulting in low work efficiency, and for some picking and placing devices that can pick and place multiple semiconductor products simultaneously, the distance between the grasping positions cannot be adjusted, making it difficult to pick and place semiconductor products of different sizes, and the applicable range is small.

[0005] 2. Technical Solutions

[0006] To solve the above problems, the present utility model adopts the following technical solutions:

[0007] A semiconductor product picking and placing device includes a control arm, on which a lifting module is fixedly connected. A sliding frame is slidably connected to the lifting module. A rotating module is fixedly connected to the sliding frame. The output end of the rotating module is detachably connected to a flange connection frame. The bottom end of the flange connection frame is fixedly connected to a handling frame. A sliding plate is slidably connected to the handling frame. A fixed pneumatic component is fixedly connected to the handling frame and is located on one side of the sliding plate. A plurality of movable pneumatic components are arranged on one side of the sliding plate, and the plurality of movable pneumatic components are distributed on both symmetric sides of the fixed pneumatic component. The bottom ends of the fixed pneumatic component and the plurality of movable pneumatic components are both fixedly connected with pneumatic suction heads. A driving mechanism and a distance-changing mechanism are arranged between the handling frame and the sliding plate. The driving mechanism controls the sliding of the sliding plate on the handling frame, and cooperates with the distance-changing mechanism to control the movement of the plurality of movable pneumatic components.

[0008] As a preferred embodiment of the present utility model, the driving mechanism includes a driving motor module, a threaded rod, and a lifting nut. The driving motor module is fixedly connected to the handling rack, the threaded rod is rotatably connected to the handling rack, and there is a transmission connection between the threaded rod and the output end of the driving motor module. The lifting nut is threadedly connected to the circumferential surface of the threaded rod, and the lifting nut is fixedly connected to the sliding plate.

[0009] As a preferred embodiment of the present utility model, the variable pitch mechanism includes a slide rail module, a plurality of variable pitch rods, a plurality of rollers, and a plurality of chutes. The slide rail module is fixedly connected to the handling rack, a plurality of the variable pitch rods are all slidably connected to the slide rail module, and a plurality of moving pneumatic components are respectively fixedly connected to one ends of the plurality of variable pitch rods. A plurality of the rollers are respectively rotatably connected to the plurality of variable pitch rods. A plurality of the chutes are all opened on the sliding plate, and a plurality of the rollers are respectively slidably connected in the plurality of chutes.

[0010] As a preferred embodiment of the present utility model, two auxiliary slide rails are fixedly connected to the handling rack. Slide seats are slidably connected to both of the two auxiliary slide rails, and the sliding plate is fixedly connected to the two slide seats.

[0011] 3. Beneficial effects

[0012] Compared with the prior art, the advantages of the present utility model are as follows:

[0013] 1) In this solution, a plurality of pneumatic suction heads at the bottom of the fixed pneumatic component and the plurality of moving pneumatic components are used to grasp semiconductor products, realizing the picking and placing of a large number of products, thereby improving work efficiency.

[0014] 2) In this solution, the driving mechanism and the variable pitch mechanism cooperate to move the sliding plate up and down, so that the plurality of moving pneumatic components are equidistantly adjusted with the fixed pneumatic component as the center, thereby controlling the equidistant distribution of the plurality of pneumatic suction heads. Sufficient spacing is maintained between the adjusted plurality of pneumatic suction heads to be applicable to the grasping of semiconductor products of different sizes.

[0015] 3) In this solution, while the device improves work efficiency through a plurality of pneumatic suction heads, the driving mechanism, the variable pitch mechanism, and the sliding plate cooperate to adjust the spacing of the plurality of pneumatic suction heads, realizing the picking and placing of semiconductor products of different sizes, and having a wide range of applications. Description of the drawings

[0016] Figure 1 is the front view of the present utility model;

[0017] Figure 2 is the first three-dimensional view of part of the structure of the present utility model;

[0018] Figure 3 is the second three-dimensional view of part of the structure of the present utility model;

[0019] Figure 4 is the first front view of some structures in the present utility model;

[0020] Figure 5 is the second front view of some structures in the present utility model.

[0021] Description of reference numerals in the figure:

[0022] 1. Control arm; 2. Lifting module; 3. Sliding frame; 4. Rotating module; 5. Flange connecting frame; 6. Handling frame; 7. Slide plate; 8. Fixed pneumatic component; 81. Moving pneumatic component; 9. Pneumatic suction head; 101. Driving motor module; 102. Threaded rod; 103. Lifting nut; 111. Slide rail module; 112. Variable pitch rod; 113. Roller; 114. Chute; 12. Auxiliary slide rail; 13. Slide seat. Detailed implementation manners

[0023] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all of the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0024] In the description of the present utility model, it should be noted that the orientation or positional relationship indicated by the terms "upper", "lower", "inner", "outer", "top / bottom end", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present utility model. In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance.

[0025] In the description of the present utility model, it should be noted that unless otherwise clearly specified and limited, the terms "installed", "provided with", "sheathed / connected", "connected", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific situations.

[0026] Embodiment:

[0027] Please refer to Figures 1-5, a semiconductor product picking and placing device, comprising a control arm 1, a lifting module 2 fixedly connected to the control arm 1, a sliding frame 3 slidably connected to the lifting module 2, a rotating module 4 fixedly connected to the sliding frame 3, a flange connecting frame 5 detachably connected to the output end of the rotating module 4, a handling frame 6 fixedly connected to the bottom end of the flange connecting frame 5, a sliding plate 7 slidably connected to the handling frame 6, a fixed pneumatic component 8 fixedly connected to the handling frame 6 and located on one side of the sliding plate 7, a plurality of moving pneumatic components 81 arranged on one side of the sliding plate 7, and the plurality of moving pneumatic components 81 are distributed on both symmetrical sides of the fixed pneumatic component 8. The bottom ends of the fixed pneumatic component 8 and the plurality of moving pneumatic components 81 are both fixedly connected with pneumatic suction heads 9. A driving mechanism and a variable pitch mechanism are arranged between the handling frame 6 and the sliding plate 7. The driving mechanism controls the sliding of the sliding plate 7 on the handling frame 6, and cooperates with the variable pitch mechanism to control the movement of the plurality of moving pneumatic components 81.

[0028] In this embodiment, when the semiconductor product moves for detection during the production process, the driving mechanism is used to move the sliding plate 7 up and down. The sliding plate 7 controls the position adjustment of the plurality of moving pneumatic components 81 through the variable pitch mechanism. The plurality of moving pneumatic components 81 are adjusted equidistantly centered on the fixed pneumatic component 8. After the spacing of the plurality of moving pneumatic components 81 is adjusted, the lifting module 2 controls the lifting of the rotating module 4 and the flange connecting frame 5 through the sliding frame 3, so that the plurality of pneumatic suction heads 9 are adjusted in height. The rotating module 4 drives the handling frame 6 to rotate through the flange connecting frame 5, so that the plurality of pneumatic suction heads 9 are adjusted in angle, thereby realizing the adjustment of the plurality of pneumatic suction heads 9 in different directions, enabling the plurality of pneumatic suction heads 9 to move in position. The plurality of moving pneumatic components 81 and the fixed pneumatic component 8 control the plurality of pneumatic suction heads 9 to pick and place the semiconductor product.

[0029] Specifically, the driving mechanism includes a driving motor module 101, a threaded rod 102, and a lifting nut 103. The driving motor module 101 is fixedly connected to the handling frame 6. The threaded rod 102 is rotatably connected to the handling frame 6, and is in transmission connection with the output end of the driving motor module 101. The lifting nut 103 is threadedly connected to the circumferential surface of the threaded rod 102, and the lifting nut 103 is fixedly connected to the sliding plate 7.

[0030] In this embodiment, the driving motor module 101 is started by an external power source to control the rotation of the threaded rod 102. The threaded rod 102 causes the lifting nut 103 to move up and down. The lifting nut 103 drives the sliding plate 7 to slide on the handling frame 6. During the sliding process of the sliding plate 7, the spacing between the plurality of moving pneumatic components 81 and the fixed pneumatic component 8 is adjusted through the variable pitch mechanism.

[0031] Specifically, the variable pitch mechanism includes a slide rail module 111, a plurality of variable pitch rods 112, a plurality of rollers 113 and a plurality of chutes 114. The slide rail module 111 is fixedly connected to the handling rack 6. A plurality of variable pitch rods 112 are all slidably connected to the slide rail module 111, and a plurality of moving pneumatic components 81 are respectively fixedly connected to one ends of the plurality of variable pitch rods 112. A plurality of rollers 113 are respectively rotatably connected to the plurality of variable pitch rods 112. A plurality of chutes 114 are all formed in the sliding plate 7, and a plurality of rollers 113 are respectively slidably connected in the plurality of chutes 114.

[0032] In this embodiment, when the sliding plate 7 moves up and down, the plurality of rollers 113 slide according to the angles of the plurality of chutes 114. The plurality of rollers 113 slide in the plurality of chutes 114, thereby driving the plurality of variable pitch rods 112 to slide on the slide rail module 111. The plurality of variable pitch rods 112 perform equidistant adjustment, so that the plurality of moving pneumatic components 81 perform equidistant adjustment centered on the fixed pneumatic component 8, realizing variable pitch between the plurality of pneumatic suction heads 9.

[0033] Specifically, two auxiliary slide rails 12 are fixedly connected to the handling rack 6. Slide seats 13 are slidably connected to both of the two auxiliary slide rails 12, and the sliding plate 7 is fixedly connected to the two slide seats 13.

[0034] In this embodiment, the sliding plate 7 is slidably connected to the handling rack 6 through the two auxiliary slide rails 12 and the two slide seats 13. The two auxiliary slide rails 12 and the two slide seats 13 are used to assist the sliding of the handling rack 6 and improve the stability of the handling rack 6 when sliding.

[0035] Working principle: When the semiconductor product moves for detection during the production process, the drive motor module 101 controls the rotation of the threaded rod 102. The threaded rod 102 causes the lifting nut 103 to move up and down. The lifting nut 103 drives the sliding plate 7 to slide on the handling rack 6. The sliding plate 7 causes the plurality of rollers 113 to slide in the plurality of chutes 114, thereby driving the plurality of variable pitch rods 112 to slide on the slide rail module 111. The plurality of variable pitch rods 112 perform equidistant adjustment, so that the plurality of moving pneumatic components 81 perform equidistant adjustment centered on the fixed pneumatic component 8, realizing variable pitch between the plurality of pneumatic suction heads 9, enabling the plurality of pneumatic suction heads 9 to adapt to semiconductor products of different sizes. After the pitch adjustment of the plurality of pneumatic suction heads 9 is completed, the lifting module 2 controls the lifting of the rotation module 4 and the flange connecting frame 5 through the sliding frame 3, so that the plurality of pneumatic suction heads 9 perform height adjustment. The rotation module 4 drives the handling rack 6 to rotate through the flange connecting frame 5, so that the plurality of pneumatic suction heads 9 perform rotation angle adjustment, thereby realizing the adjustment of the plurality of pneumatic suction heads 9 in different directions and enabling the plurality of pneumatic suction heads 9 to move in position. The plurality of moving pneumatic components 81 and the fixed pneumatic component 8 control the plurality of pneumatic suction heads 9 to pick up and place the semiconductor product.

[0036] The above are only the preferred specific embodiments of the present utility model, but the protection scope of the present utility model is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present utility model, according to the technical solution and its improvement concept of the present utility model, making equivalent substitutions or changes, shall be covered by the protection scope of the present utility model.

Claims

1. A semiconductor product loading and unloading device, comprising a control arm (1), characterized in that: The control arm (1) is fixedly connected to a lifting module (2), the lifting module (2) is slidably connected to a sliding frame (3), the sliding frame (3) is fixedly connected to a rotating module (4), the output end of the rotating module (4) is detachably connected to a flange connecting frame (5), the bottom end of the flange connecting frame (5) is fixedly connected to a transport frame (6), the transport frame (6) is slidably connected to a slide plate (7), the transport frame (6) is fixedly connected to a fixed pneumatic assembly (8), and the fixed pneumatic assembly (8) is located on the slide plate (7). One side of the slide plate (7) is provided with a plurality of mobile pneumatic components (81), and the plurality of mobile pneumatic components (81) are distributed on two symmetrical sides of the fixed pneumatic component (8), the bottom ends of the fixed pneumatic component (8) and the plurality of mobile pneumatic components (81) are fixedly connected to a pneumatic suction head (9), and a driving mechanism and a variable pitch mechanism are provided between the transport frame (6) and the slide plate (7), the driving mechanism controls the slide plate (7) to slide on the transport frame (6), and cooperates with the variable pitch mechanism to control the plurality of mobile pneumatic components (81) to move.

2. A semiconductor product loading and unloading device according to claim 1, characterized in that: The driving mechanism comprises a driving motor module (101), a threaded rod (102) and a lifting nut (103); the driving motor module (101) is fixedly connected to the transport frame (6); the threaded rod (102) is rotatably connected to the transport frame (6); and the threaded rod (102) and an output end of the driving motor module (101) are transmission-connected; the lifting nut (103) is threadedly connected to the circumferential surface of the threaded rod (102), and the lifting nut (103) is fixedly connected to the slide plate (7).

3. A semiconductor product loading and unloading device according to claim 2, characterized in that: The pitch changing mechanism comprises a slide rail module (111), a plurality of pitch changing rods (112), a plurality of rollers (113) and a plurality of slide grooves (114); the slide rail module (111) is fixedly connected to the transport frame (6); the plurality of pitch changing rods (112) are slidably connected to the slide rail module (111); the plurality of mobile pneumatic components (81) are respectively fixedly connected to one end of the plurality of pitch changing rods (112); the plurality of rollers (113) are respectively rotatably connected to the plurality of pitch changing rods (112); the plurality of slide grooves (114) are all provided on the slide plate (7); and the plurality of rollers (113) are respectively slidably connected to the plurality of slide grooves (114).

4. A semiconductor product loading and unloading device according to claim 3, characterized in that: The transport frame (6) is fixedly connected to two auxiliary slide rails (12), the two auxiliary slide rails (12) are slidably connected to a slide seat (13), and the slide plate (7) is fixedly connected to the two slide seats (13).