Wafer adsorption device

Abstract

The utility model discloses a wafer adsorption device, which comprises a support frame and a connecting arm, the top end of the support frame is provided with the connecting arm, the connecting arm extends to the outside of the support frame, the bottom end of the connecting arm below the support frame is provided with a connecting disc, the connecting disc is movably connected with the support frame, the outer wall of the support frame is provided with a movable frame, and the movable frame is connected with the support frame. Hinge shafts are symmetrically installed at the end, close to the supporting frame, of the movable frame, the movable frame is movably connected with the supporting frame through the hinge shafts, a supporting table is installed on the outer wall of the movable frame, a supporting seat is installed on the outer wall of the supporting table, and a rotating shaft is movably installed in the supporting seat. According to the utility model, not only is the convenient opening adjustment type adsorption realized, the angle adjustment type adsorption is facilitated, but also the multi-group rotation type adsorption on the large-size wafer is facilitated, and the adsorption flexibility of the adsorption device is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of adsorption devices, in particular to a wafer adsorption device. Background Art

[0002] A wafer refers to a silicon chip used to make silicon semiconductor circuits. Its original material is silicon. High-purity polycrystalline silicon is dissolved and doped with silicon crystal seeds, which are then slowly pulled out to form cylindrical single crystal silicon. After grinding, polishing, and slicing, the silicon crystal rod is formed into a silicon wafer, or wafer. The wafer is the basic unit of semiconductor material processing and a key component in the manufacture of integrated circuits. Among them, the wafer adsorption device plays a key role in fixing and positioning.

[0003] For example, a wafer adsorption device disclosed in the authorization announcement number CN220155513U includes a positioning frame and a vacuum suction cup, wherein the inner wall of the side wall of the positioning frame is fixed with a positioning rod at an equal angle, and the outer wall of the positioning rod is sleeved with a sliding sleeve, and the lower surface of the sliding sleeve is fixedly provided with a vacuum suction cup, and an adjustment rod is movably connected at the center of the inner wall of the lower end of the positioning frame, a gear is fixedly installed on the outer wall of the upper end of the adjustment rod, and a collar is sleeved on the outer wall of the adjustment rod below the gear, and a support rod is movably connected to the outer wall of the side of the collar;

[0004] Although the wafer adsorption device is easy to adjust, thereby facilitating the device to adsorb wafers of different sizes and increasing the versatility of the device, it does not solve the problem that the existing adsorption device is not conducive to convenient expansion and adjustment adsorption, is not conducive to angle adjustment adsorption, and is not conducive to multiple groups of rotating adsorption of large-sized wafers, which greatly affects the flexibility of adsorption of the adsorption device. Utility Model Content

[0005] The purpose of the utility model is to provide a wafer adsorption device to solve the problem that the adsorption device proposed in the above background technology is not convenient for opening and adjusting adsorption, is not convenient for angle-adjustable adsorption, is not convenient for performing multiple groups of rotating adsorption on large-sized wafers, which affects the flexibility of adsorption of the adsorption device.

[0006] To achieve the above object, the present utility model provides the following technical solutions: A wafer adsorption device, comprising a support frame and a connecting arm. The top end of the support frame is provided with a connecting arm, and the connecting arm extends to the outside of the support frame. A connecting disk is installed at the bottom end of the connecting arm below the support frame, and the connecting disk is movably connected to the support frame. An activity frame is arranged on the outer wall of the support frame. At one end of the activity frame close to the support frame, hinge shafts are symmetrically installed, and the activity frame is movably connected to the support frame through the hinge shafts. A support platform is installed on the outer wall of the activity frame, and a support seat is installed on the outer wall of the support platform. A rotating shaft is movably installed inside the support seat, and the rotating shaft extends to the outside of the support seat. A connecting frame is installed at the bottom end of the rotating shaft. A plurality of arc-shaped arms are arranged at equal intervals on the outer wall of the connecting frame. At one end of each arc-shaped arm close to the connecting frame, a movable shaft is installed, and each arc-shaped arm is movably connected to the connecting frame through the movable shaft. First vacuum suction cups are installed at the bottom ends of the arc-shaped arms. Second vacuum suction cups are installed on the outer walls of the arc-shaped arms on one side of the first vacuum suction cups. First electric push rods are movably installed on the outer walls of the connecting frame on one side of the arc-shaped arms. The output ends of the first electric push rods are all installed with telescopic rods. At one end of each telescopic rod close to the arc-shaped arm, a connecting shaft is installed, and each telescopic rod is movably connected to the arc-shaped arm through the connecting shaft.

[0007] Preferably, a second electric push rod is installed on the outer wall of the support platform on one side of the support seat. The output end of the second electric push rod is installed with an adjusting rod, and a connecting block is installed at the end of the adjusting rod away from the second electric push rod.

[0008] Preferably, a chute frame is installed on the outer wall of the support platform on one side of the second electric push rod. A first rack is arranged on the outer wall of the support platform on one side of the chute frame, and the first rack is slidably connected to the chute frame and is connected to the connecting block.

[0009] Preferably, a first gear is installed at the top end of the rotating shaft, and the first gear meshes with the first rack.

[0010] Preferably, a bushing is sleeved on the surface of the connecting arm above the support frame. A first right-angle motor is installed on the outer wall of the bushing. The output end of the first right-angle motor is installed with a second gear. An arc-shaped rack is installed at the top end of the support frame on one side of the second gear, and the second gear meshes with the arc-shaped rack.

[0011] Preferably, a connecting box is movably installed inside the support frame. A second right-angle motor is installed on the outer wall of the connecting box, and the second right-angle motor extends into the connecting box.

[0012] Preferably, an active rack is arranged inside the connection box on one side of the second right-angle motor, and the active rack extends to the outside of the connection box. A support shaft is installed on the outer wall of the movable frame on one side of the active rack, and the active rack is connected to the support shaft. The output end of the second right-angle motor is installed with a third gear, and the third gear meshes with the active rack.

[0013] Preferably, a remote controller is installed on the outer wall of the support platform, and the output end of the remote controller is electrically connected to the input ends of the first electric push rod, the second electric push rod, the first right-angle motor, and the second right-angle motor.

[0014] Compared with the prior art, the beneficial effects of the present utility model are as follows: This adsorption device not only realizes convenient stretching and adjustable adsorption, facilitates angle-adjustable adsorption, but also facilitates multi-group rotational adsorption of large-sized wafers, improving the flexibility of the adsorption of the adsorption device;

[0015] (1) Drive the telescopic rod to move through the first electric push rod. The telescopic rod drives the arc-shaped arm to rotate through the connecting shaft. The arc-shaped arm rotates around the movable shaft. The arc-shaped arm drives the first vacuum chuck to adjust the angle, so as to facilitate the first vacuum chuck to adsorb the wafer. Drive the adjusting rod to move through the second electric push rod. The adjusting rod drives the connecting block to move. The connecting block drives the first rack to move. The first gear drives the rotating shaft to rotate. The rotating shaft drives the entire connecting frame to rotate, so as to facilitate the connecting frame to drive multiple groups of first vacuum chucks to rotate through the arc-shaped arm, so as to facilitate the first vacuum chuck to perform rotational adsorption on the wafer, realizing convenient stretching and adjustable adsorption of the adsorption device, facilitating rotational adsorption of multiple groups of wafers, and improving the flexibility of the adsorption of the adsorption device;

[0016] (2) Drive the third gear to rotate through the second right-angle motor. The third gear drives the active rack to move. The active rack moves inside the support platform. The active rack drives the entire movable frame to rotate through the support shaft. The movable frame drives the support platform to rotate. The arc-shaped arm drives the second vacuum chuck to perform angle-adjustable flipping, so as to facilitate the second vacuum chuck to rotate above the wafer, so as to facilitate the second vacuum chuck to adsorb the large-sized wafer. Drive the second gear to rotate through the first right-angle motor. The arc-shaped rack rotates on the surface of the second gear. The arc-shaped rack drives the entire support frame to rotate. The support frame drives the movable frame to rotate. The movable frame drives the support platform to rotate. The support platform drives the rotating shaft to rotate. The rotating shaft drives the connecting frame to rotate. The connecting frame drives the second vacuum chuck to rotate through the arc-shaped arm, so as to facilitate multiple groups of second vacuum chucks to perform rotational adsorption on the wafer, realizing convenient angle-adjustable adsorption of the adsorption device, facilitating rotational adsorption of large-sized wafers, and improving the convenience of the adsorption of the adsorption device. Description of the Drawings

[0017] Figure 1 3D stereoscopic structure diagram of the present utility model;

[0018] Figure 2 3D stereoscopic structure diagram of the first rack of the present utility model;

[0019] Figure 3 Front view structure diagram of the present utility model;

[0020] Figure 4 of the present utility model Figure 1 Enlarged structure diagram of part A;

[0021] Figure 5 of the present utility model Figure 3 Enlarged structure diagram of part B;

[0022] Figure 6 Partially enlarged structure diagram of the movable frame of the present utility model.

[0023] In the figure: 1, support frame; 2, connecting arm; 3, connecting disk; 4, movable frame; 5, support table; 6, rotating shaft; 7, connecting frame; 8, arc arm; 9, first vacuum suction cup; 10, second vacuum suction cup; 11, movable shaft; 12, first electric push rod; 13, telescopic rod; 14, connecting shaft; 15, support seat; 16, second electric push rod; 17, adjusting rod; 18, first rack; 19, chute frame; 20, first gear; 21, bushing; 22, first right-angle motor; 23, second gear; 24, arc rack; 25, connecting box; 26, movable rack; 27, support shaft; 28, second right-angle motor; 29, third gear; 30, hinge shaft; 31, connecting block; 32, remote controller. Detailed implementation manners

[0024] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts shall fall within the protection scope of the present utility model.

[0025] Please refer to Figures 1-6, an embodiment provided by the present utility model: a wafer adsorption device, including a support frame 1 and a connecting arm 2. The top of the support frame 1 is provided with a connecting arm 2, and the connecting arm 2 extends to the outside of the support frame 1. A connecting disk 3 is installed at the bottom end of the connecting arm 2 below the support frame 1, and the connecting disk 3 is movably connected to the support frame 1. An activity frame 4 is arranged on the outer wall of the support frame 1. At one end of the activity frame 4 close to the support frame 1, hinge shafts 30 are symmetrically installed, and the activity frame 4 is movably connected to the support frame 1 through the hinge shafts 30. A support platform 5 is installed on the outer wall of the activity frame 4, and a support seat 15 is installed on the outer wall of the support platform 5. A rotating shaft 6 is movably installed inside the support seat 15, and the rotating shaft 6 extends to the outside of the support seat 15. A connecting frame 7 is installed at the bottom end of the rotating shaft 6. A plurality of groups of arc-shaped arms 8 are arranged at equal intervals on the outer wall of the connecting frame 7. At one end of the arc-shaped arm 8 close to the connecting frame 7, movable shafts 11 are installed, and the arc-shaped arms 8 are all movably connected to the connecting frame 7 through the movable shafts 11. First vacuum suction cups 9 are installed at the bottom ends of the arc-shaped arms 8. Second vacuum suction cups 10 are installed on the outer walls of the arc-shaped arms 8 on one side of the first vacuum suction cups 9. First electric push rods 12 are movably installed on the outer walls of the connecting frame 7 on one side of the arc-shaped arms 8, and the first electric push rods 12 play a role in power output;

[0026] The output ends of the first electric push rods 12 are all installed with telescopic rods 13. At one end of the telescopic rods 13 close to the arc-shaped arms 8, connecting shafts 14 are installed, and the telescopic rods 13 are all movably connected to the arc-shaped arms 8 through the connecting shafts 14. A second electric push rod 16 is installed on the outer wall of the support platform 5 on one side of the support seat 15, and the second electric push rod 16 plays a role in power output. The output end of the second electric push rod 16 is installed with an adjusting rod 17. A connecting block 31 is installed at one end of the adjusting rod 17 away from the second electric push rod 16. A chute frame 19 is installed on the outer wall of the support platform 5 on one side of the second electric push rod 16. A first rack 18 is arranged on the outer wall of the support platform 5 on one side of the chute frame 19, and the first rack 18 is slidably connected to the chute frame 19 and is connected to the connecting block 31. A first gear 20 is installed at the top end of the rotating shaft 6, and the first gear 20 meshes with the first rack 18;

[0027] During use, connect to an external power supply. First, lift the entire support frame 1 onto the ceiling through the connecting arm 2. Then, operate the remote controller 32 to turn on the first electric push rod 12. Under the support of the connecting frame 7, the telescopic rod 13 is driven by the first electric push rod 12 to move. The telescopic rod 13 drives the arc-shaped arm 8 to rotate through the connecting shaft 14. The arc-shaped arm 8 rotates around the movable shaft 11. The arc-shaped arm 8 drives the first vacuum suction cup 9 to adjust the angle, so as to facilitate the adsorption of the wafer by the first vacuum suction cup 9. Operate the remote controller 32 to turn on the second electric push rod 16. Under the support of the support platform 5, the adjusting rod 17 is driven by the second electric push rod 16 to move. The adjusting rod 17 drives the connecting block 31 to move. Under the sliding support of the chute frame 19 and the first rack 18, the connecting block 31 drives the first rack 18 to move. Under the meshing action of the first rack 18 and the first gear 20, the first gear 20 drives the rotating shaft 6 to rotate. Under the support of the support base 15, the rotating shaft 6 drives the entire connecting frame 7 to rotate, so as to facilitate the connecting frame 7 to drive multiple groups of first vacuum suction cups 9 to rotate through the arc-shaped arm 8, and to facilitate the first vacuum suction cup 9 to perform rotational adsorption on the wafer, realizing the convenient expansion and adjustment type adsorption of the adsorption device, facilitating the rotational adsorption of multiple groups of wafers, and improving the flexibility of the adsorption of the adsorption device;

[0028] A bushing 21 is sleeved on the surface of the connecting arm 2 above the support frame 1. A first right-angle motor 22 is installed on the outer wall of the bushing 21. The first right-angle motor 22 serves as a power output. The output end of the first right-angle motor 22 is installed with a second gear 23. An arc-shaped rack 24 is installed at the top end of the support frame 1 on one side of the second gear 23, and the second gear 23 meshes with the arc-shaped rack 24. A connecting box 25 is movably installed inside the support frame 1. A second right-angle motor 28 is installed on the outer wall of the connecting box 25. The second right-angle motor 28 serves as a power output, and the second right-angle motor 28 extends into the connecting box 25. An active rack 26 is arranged inside the connecting box 25 on one side of the second right-angle motor 28, and the active rack 26 extends outside the connecting box 25. A support shaft 27 is installed on the outer wall of the movable frame 4 on one side of the active rack 26, and the active rack 26 is connected to the support shaft 27. The output end of the second right-angle motor 28 is installed with a third gear 29, and the third gear 29 meshes with the active rack 26. A remote controller 32 is installed on the outer wall of the support platform 5. The output end of the remote controller 32 is electrically connected to the input ends of the first electric push rod 12, the second electric push rod 16, the first right-angle motor 22, and the second right-angle motor 28;

[0029] During use, the second right-angle motor 28 is turned on by operating the remote controller 32. The second right-angle motor 28 drives the third gear 29 to rotate. Under the meshing action of the third gear 29 and the movable rack 26, the third gear 29 drives the movable rack 26 to move. The movable rack 26 moves inside the support table 5. Supported by the support shaft 27, the movable rack 26 drives the entire movable frame 4 to rotate through the support shaft 27. The movable frame 4 rotates around the hinge shaft 30. The movable frame 4 drives the support table 5 to rotate. The support table 5 drives the connecting frame 7 to rotate through the rotating shaft 6. The connecting frame 7 drives the arc-shaped arm 8 to rotate. The arc-shaped arm 8 drives the second vacuum chuck 10 to perform an angle-adjustable flip, so as to facilitate the rotation of the second vacuum chuck 10 above the wafer, and facilitate the adsorption of the large-sized wafer by the second vacuum chuck 10. The first right-angle motor 22 is turned on by operating the remote controller 32. Supported by the bushing 21, the first right-angle motor 22 drives the second gear 23 to rotate. Under the meshing action of the second gear 23 and the arc-shaped rack 24, the arc-shaped rack 24 rotates on the surface of the second gear 23. The arc-shaped rack 24 drives the entire support frame 1 to rotate. Supported by the movable support of the connecting disk 3, the support frame 1 drives the movable frame 4 to rotate. The movable frame 4 drives the support table 5 to rotate. The support table 5 drives the rotating shaft 6 to rotate. The rotating shaft 6 drives the connecting frame 7 to rotate. The connecting frame 7 drives the second vacuum chuck 10 to rotate through the arc-shaped arm 8, so as to facilitate the rotational adsorption of the wafer by multiple groups of second vacuum chucks 10, realizing the convenient angle-adjustable adsorption of the adsorption device, facilitating the rotational adsorption of the large-sized wafer, and improving the convenience of the adsorption of the adsorption device.

[0030] Working principle: When in use, with an external power supply, first, the entire support frame 1 is hoisted on the ceiling through the connecting arm 2. The telescopic rod 13 is driven to move by the first electric push rod 12. The telescopic rod 13 drives the arc-shaped arm 8 to rotate through the connecting shaft 14. The arc-shaped arm 8 rotates around the movable shaft 11. The arc-shaped arm 8 drives the first vacuum chuck 9 to adjust the angle, so as to facilitate the first vacuum chuck 9 to adsorb the wafer. The adjusting rod 17 is driven to move by the second electric push rod 16. The adjusting rod 17 drives the connecting block 31 to move. The connecting block 31 drives the first rack 18 to move. The first gear 20 drives the rotating shaft 6 to rotate. The rotating shaft 6 drives the entire connecting frame 7 to rotate, so as to facilitate the connecting frame 7 to drive multiple groups of first vacuum chucks 9 to rotate through the arc-shaped arm 8, and to facilitate the first vacuum chucks 9 to perform rotational adsorption on the wafer. The third gear 29 is driven to rotate by the second right-angle motor 28. The third gear 29 drives the movable rack 26 to move. The movable rack 26 moves inside the support table 5. The movable rack 26 drives the entire movable frame 4 to rotate through the support shaft 27. The movable frame 4 rotates around the hinge shaft 30. The movable frame 4 drives the support table 5 to rotate. The support table 5 drives the rotating shaft 6 to rotate through the support table 5. The rotating shaft 6 drives the connecting frame 7 to rotate. The connecting frame 7 drives the arc-shaped arm 8 to rotate. The arc-shaped arm 8 drives the second vacuum chuck 10 to perform angle-adjustable flipping, so as to facilitate the second vacuum chuck 10 to rotate above the wafer, and to facilitate the second vacuum chuck 10 to adsorb the large-size wafer. The second gear 23 is driven to rotate by the first right-angle motor 22. The arc-shaped rack 24 rotates on the surface of the second gear 23. The arc-shaped rack 24 drives the entire support frame 1 to rotate. Under the movable support of the connecting disk 3, the support frame 1 drives the movable frame 4 to rotate. The movable frame 4 drives the support table 5 to rotate. The support table 5 drives the rotating shaft 6 to rotate. The rotating shaft 6 drives the connecting frame 7 to rotate. The connecting frame 7 drives the second vacuum chuck 10 to rotate through the arc-shaped arm 8, so as to facilitate multiple groups of second vacuum chucks 10 to perform rotational adsorption on the wafer, and to complete the use work of the adsorption device.

Claims

1. A wafer adsorption device, comprising a support frame (1) and a connecting arm (2), characterized in that: The top of the support frame (1) is provided with a connecting arm (2), and the connecting arm (2) extends to the outside of the support frame (1); the bottom end of the connecting arm (2) below the support frame (1) is installed with a connecting plate (3), and the connecting plate (3) is movably connected to the support frame (1); a movable frame (4) is provided on the outer wall of the support frame (1); an end of the movable frame (4) close to the support frame (1) is symmetrically installed with a hinge shaft (30), and the movable frame (4) is movably connected to the support frame (1) through the hinge shaft (30); a support platform (5) is installed on the outer wall of the movable frame (4); a support seat (15) is installed on the outer wall of the support platform (5); a rotating shaft (6) is movably installed inside the support seat (15), and the rotating shaft (6) extends to the outside of the support seat (15); a connecting frame (7) is installed at the bottom end of the rotating shaft (6) ), a plurality of groups of arc-shaped arms (8) with equal spacing are arranged on the outer wall of the connecting frame (7), a movable shaft (11) is installed on one end of the arc-shaped arms (8) close to the connecting frame (7), and the arc-shaped arms (8) are movably connected to the connecting frame (7) through the movable shaft (11), a first vacuum suction cup (9) is installed at the bottom end of the arc-shaped arms (8), a second vacuum suction cup (10) is installed on the outer wall of the arc-shaped arms (8) on one side of the first vacuum suction cup (9), a first electric push rod (12) is movably installed on the outer wall of the connecting frame (7) on one side of the arc-shaped arms (8), a telescopic rod (13) is installed on the output end of the first electric push rod (12), a connecting shaft (14) is installed on one end of the telescopic rod (13) close to the arc-shaped arms (8), and the telescopic rod (13) is movably connected to the arc-shaped arms (8) through the connecting shaft (14).

2. The wafer adsorption device according to claim 1, characterized in that: A second electric push rod (16) is installed on the outer wall of the support platform (5) on one side of the support seat (15), an adjusting rod (17) is installed at the output end of the second electric push rod (16), and a connecting block (31) is installed at one end of the adjusting rod (17) away from the second electric push rod (16).

3. The wafer adsorption device according to claim 2, characterized in that: A slide frame (19) is installed on the outer wall of the support platform (5) on one side of the second electric push rod (16), and a first rack (18) is arranged on the outer wall of the support platform (5) on one side of the slide frame (19), and the first rack (18) is slidably connected to the slide frame (19), and the first rack (18) is connected to the connecting block (31).

4. The wafer adsorption device according to claim 3, characterized in that: A first gear (20) is installed at the top end of the rotating shaft (6), and the first gear (20) and the first rack (18) are meshed with each other.

5. The wafer adsorption device according to claim 1, characterized in that: A shaft sleeve (21) is sleeved on the surface of the connecting arm (2) above the support frame (1); a first right-angle motor (22) is mounted on the outer wall of the shaft sleeve (21); a second gear (23) is mounted on the output end of the first right-angle motor (22); an arc-shaped rack (24) is mounted on the top end of the support frame (1) on one side of the second gear (23); and the second gear (23) and the arc-shaped rack (24) are meshed with each other.

6. The wafer adsorption device according to claim 1, characterized in that: A connection box (25) is movably installed inside the support frame (1), a second right-angle motor (28) is installed on the outer wall of the connection box (25), and the second right-angle motor (28) extends into the interior of the connection box (25).

7. The wafer adsorption device according to claim 6, characterized in that: A movable rack (26) is arranged inside the connection box (25) on one side of the second right-angle motor (28), and the movable rack (26) extends to the outside of the connection box (25); a support shaft (27) is installed on the outer wall of the movable frame (4) on one side of the movable rack (26), and the movable rack (26) is connected to the support shaft (27); a third gear (29) is installed at the output end of the second right-angle motor (28), and the third gear (29) and the movable rack (26) are meshed with each other.

8. The wafer adsorption device according to claim 6, characterized in that: A remote controller (32) is installed on the outer wall of the support platform (5), and an output end of the remote controller (32) is electrically connected to input ends of the first electric push rod (12), the second electric push rod (16), the first right-angle motor (22), and the second right-angle motor (28).

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