Integrated circuit material grabbing structure

Abstract

The utility model discloses an integrated circuit material grabbing structure, which relates to the technical field of integrated circuits and comprises a connecting rod, a first telescopic cylinder is mounted at the upper end of the connecting rod, anti-falling mechanisms are arranged at the front end and the rear end of the lower end of the first telescopic cylinder, and the anti-falling mechanisms are used for receiving fallen integrated circuit materials; the anti-falling mechanism comprises cylindrical rods connected to the front end and the rear end of the lower portion of the first telescopic air cylinder, the ends, away from the first telescopic air cylinder, of the cylindrical rods are connected with fixing blocks, the left end and the right end of each fixing block are slidably connected with sliding rods, and springs are wound around the outer surfaces of the sliding rods. According to the integrated circuit material grabbing structure, ventilation is achieved through the air pipe connected with the connector, the second telescopic air cylinder is promoted to extend, the pocket boxes in the installation plate are pushed out, the two sets of pocket boxes are oppositely pushed out to be spliced, the lower end of a silicon wafer is wrapped with the pocket boxes, and the phenomena that a negative pressure pump breaks down suddenly, suction force on the silicon wafer disappears, and the silicon wafer falls off and is damaged are prevented; the prevention effect is realized.

Description

Technical Field

[0001] The utility model relates to the technical field of integrated circuits, in particular to an integrated circuit material grabbing structure. Background Art

[0002] An integrated circuit is a miniature electronic device or component. It uses a certain process to interconnect the transistors, resistors, capacitors, inductors and other components and wiring required in a circuit. It is made on a small piece or several small pieces of semiconductor wafers or dielectric substrates, and then packaged in a tube shell to become a miniature structure with the required circuit function. During the production process, the integrated circuit materials need to be moved using corresponding grasping tools, thus forming a production chain for batch processing of electronic devices.

[0003] The patent document with application number CN202322117078.9 discloses an integrated circuit material grabbing structure, which relates to the field of grabbing structure technology, including: a fixed plate, a grabbing assembly, the grabbing assembly includes a fixed frame, two support plates are fixed on the inner side of the fixed frame, a limit column is movably embedded between the two support plates, and a driven gear is fixed to the bottom end of the limit column. In this utility model, when it is necessary to grab the integrated circuit material, first start the drive motor to drive the suction cup to rotate to the top of the integrated circuit material, start the negative pressure pump to extract the air inside the suction cup, so that the integrated circuit material and the suction cup fit tightly, start the drive motor again, drive the suction cup to transport the integrated circuit material to a suitable position, start the negative pressure pump, so that the negative pressure pump transports gas to the inside of the suction cup, separates the suction cup from the integrated circuit material, and completes the transportation of the integrated circuit material.

[0004] Compared with the above documents, although a negative pressure pump is used to extract the air inside the suction cup so that the integrated circuit material silicon wafer fits tightly against the suction cup, when the negative pressure pump fails after working for a long time, the suction force suddenly disappears and the silicon wafer is detached, which can easily cause collision and damage to the silicon wafer. To address the above problems, we have introduced an integrated circuit material grabbing structure. Utility Model Content

[0005] The utility model discloses an integrated circuit material grabbing structure. When a negative pressure pump fails after long-term operation, the suction force suddenly disappears, and the silicon wafer is separated therefrom, which easily causes the silicon wafer to collide and be damaged.

[0006] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0007] A structure for grasping integrated circuit materials comprises a connecting rod, wherein a first telescopic cylinder is mounted on the upper end of the connecting rod, and anti-fall mechanisms are arranged at the front and rear ends of the lower end of the first telescopic cylinder, and the anti-fall mechanisms are used to catch the integrated circuit materials that fall off; the anti-fall mechanism comprises a cylindrical rod connected to the front and rear ends of the lower part of the first telescopic cylinder, the end of the cylindrical rod away from the first telescopic cylinder is connected to a fixed block, the left and right ends of the fixed block are slidably connected to a sliding rod, the outer surface of the sliding rod is wrapped with a spring, the lower end of the sliding rod is connected to a mounting plate, a joint is arranged on the side of the mounting plate away from the first telescopic cylinder, the end of the joint close to the first telescopic cylinder is connected to a second telescopic cylinder, and a pocket box is slidably connected inside the mounting plate.

[0008] In a preferred solution, a mounting box is slidably connected to the left side of the connecting rod, teeth are equidistantly provided on the rear surface of the connecting rod, a first motor is mounted on the upper end of the mounting box, a gear is connected to the output end below the first motor, and the gear is transmission-connected to the connecting rod through the teeth.

[0009] By arranging a first motor to drive the tooth transmission connecting rod to slide in the installation box, the integrated circuit material can be placed at positions with different distances from the base.

[0010] In a preferred solution, a support column is fixedly connected to the lower end of the installation box, a base is rotatably connected to the lower end of the support column, and a second motor is installed inside the upper end of the base.

[0011] By arranging the second motor-driven support column to rotate on the base, the integrated circuit material can be placed at different positions centered on the base.

[0012] In a preferred solution, a negative pressure pump is installed at the lower end of the first telescopic cylinder, a suction cup is connected to the lower end of the negative pressure pump, a rubber pad is installed on the lower end surface of the suction cup, and a plurality of air holes are provided on the lower surface of the rubber pad.

[0013] By setting up a negative pressure pump to draw air, the suction cup is prompted to suck up the integrated circuit material, and the rubber pad is in contact with the integrated circuit material to provide material cushioning to prevent damage.

[0014] The utility model provides an integrated circuit material grabbing structure through improvement, which has the following improvements and advantages compared with the prior art:

[0015] One: an integrated circuit material grabbing structure, which is ventilated through the air pipe connected to the joint, prompting the second telescopic cylinder to extend, and the pocket box inside the mounting plate is pushed out. The two sets of pocket boxes are pushed out relative to each other and spliced, and the pocket is at the lower end of the silicon wafer to prevent the negative pressure pump from suddenly failing, the suction force on the silicon wafer disappears, and the silicon wafer falls off and is damaged, thereby achieving a preventive effect.

[0016] Second: An integrated circuit material grasping structure. By setting the first motor to drive the toothed transmission connecting rod to slide in the installation box and the second motor to drive the support column to rotate on the base, the integrated circuit material can be placed at any distance from the base as the center. Brief Description of the Drawings

[0017] Figure 1 FIG. 1 is a schematic diagram of the overall structure of an integrated circuit material grasping structure proposed by the present utility model;

[0018] Figure 2 FIG. 2 is a schematic diagram of the main sectional structure of the installation box of an integrated circuit material grasping structure proposed by the present utility model;

[0019] Figure 3 FIG. 3 is a bottom view of the connecting rod structure of an integrated circuit material grasping structure proposed by the present utility model;

[0020] Figure 4 FIG. 4 is a schematic diagram of the anti-falling mechanism structure of an integrated circuit material grasping structure proposed by the present utility model.

[0021] In the drawings: 1. Connecting rod; 2. First telescopic cylinder; 3. Anti-falling mechanism; 301. Cylindrical rod; 302. Fixed block; 303. Slide rod; 304. Spring; 305. Installation plate; 306. Joint; 307. Second telescopic cylinder; 308. Scoop box; 4. Installation box; 5. First motor; 6. Gear; 7. Support column; 8. Base; 9. Second motor; 10. Negative pressure pump; 11. Suction cup; 12. Rubber pad; 13. Air hole; 14. Tooth. Detailed Embodiment

[0022] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments.

[0023] In the description of the present utility model, it should be understood that the orientation or positional relationship indicated by the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present utility model.

[0024] An integrated circuit material grasping structure disclosed by the present utility model is mainly applied to the scenario of grasping integrated circuit materials in production.

[0025] Refer to Figure 1 , Figure 3 andFigure 4 , an integrated circuit material grasping structure, including a connecting rod 1. A first telescopic cylinder 2 is installed at the upper end of the connecting rod 1. Anti-falling mechanisms 3 are arranged at the front and rear ends of the lower end of the first telescopic cylinder 2. The anti-falling mechanisms 3 are used to catch the falling integrated circuit materials. The anti-falling mechanism 3 includes cylindrical rods 301 connected to the front and rear ends below the first telescopic cylinder 2. One end of the cylindrical rod 301 away from the first telescopic cylinder 2 is connected with a fixed block 302. Slide rods 303 are slidably connected to the left and right ends of the fixed block 302. Springs 304 are wound around the outer surfaces of the slide rods 303. The lower ends of the slide rods 303 are connected with a mounting plate 305. A joint 306 is arranged on one side of the mounting plate 305 away from the first telescopic cylinder 2. One end of the joint 306 close to the first telescopic cylinder 2 is connected with a second telescopic cylinder 307. A holding box 308 is slidably connected inside the mounting plate 305. A negative pressure pump 10 is installed at the lower end of the first telescopic cylinder 2. The lower end of the negative pressure pump 10 is connected with a suction cup 11. A rubber pad 12 is installed on the lower surface of the suction cup 11. Multiple groups of air holes 13 are opened on the lower surface of the rubber pad 12;

[0026] In this embodiment: During the process of grasping the integrated circuit material, the first telescopic cylinder 2 extends to cause the suction cup 11 to press down. The rubber pad 12 at the bottom of the suction cup 11 contacts the surface of the silicon wafer. Due to the elastic characteristics of the rubber pad 12, the phenomenon of damage caused by contact on the surface of the silicon wafer is prevented. Subsequently, the negative pressure pump 10 pumps air to evacuate the gas between the silicon wafer and the rubber pad 12 from the air holes 13, thereby sucking the silicon wafer. During the process of the suction cup 11 pressing down, since the height of the mounting plate 305 is lower than that of the rubber pad 12, during the extension of the first telescopic cylinder 2, the cylindrical rod 301 drives the fixed block 302, the slide rod 303 and the mounting plate 305 to move downward synchronously. The lower end of the mounting plate 305 contacts and presses against the platform first, causing the slide rod 303 to slide upward in the fixed block 302 and the spring 304 to contract. After sucking the silicon wafer, the first telescopic cylinder 2 contracts, and the sucked silicon wafer moves upward synchronously to a suspended state. At this time, the pressing force between the mounting plate 305 and the platform is eliminated, and the slide rod 303 is restored under the action of the spring 304. At this time, the height of the silicon wafer is higher than that of the mounting plate 305. The air pipe connected through the joint 306 is ventilated to cause the second telescopic cylinder 307 to extend, and the holding box 308 inside the mounting plate 305 is pushed out. The two holding boxes 308 are pushed out relatively and spliced to hold the lower end of the silicon wafer, achieving the prevention effect and preventing the negative pressure pump 10 from suddenly malfunctioning, resulting in the disappearance of the suction force on the silicon wafer and the silicon wafer falling off and being damaged. When the silicon wafer needs to be put down, the second telescopic cylinder 307 contracts. After the holding box 308 is received inside the mounting plate 305, the first telescopic cylinder 2 extends to cause the suction cup 11 to press down. The silicon wafer contacts the platform, the negative pressure pump 10 is stopped, the suction force disappears, and the silicon wafer is separated and placed on the platform.

[0027] Refer to Figure 1 、 Figure 2 and Figure 3, in a preferred embodiment, an installation box 4 is slidably connected to the left side of the connecting rod 1. Tooth grooves 14 are equidistantly formed on the rear surface of the connecting rod 1. A first motor 5 is installed at the upper end of the installation box 4. The lower output end of the first motor 5 is connected to a gear 6. The gear 6 is in transmission connection with the connecting rod 1 through the tooth grooves 14. The lower end of the installation box 4 is fixedly connected to a support column 7. The lower end of the support column 7 is rotatably connected to a base 8. A second motor 9 is installed inside the upper end of the base 8;

[0028] In this embodiment: after the silicon wafer is sucked up, when it is necessary to place the silicon wafer from the right platform onto the left platform and at a position closer to the base 8, the first motor 5 is started to drive the gear 6, which meshes with the tooth grooves 14, prompting the connecting rod 1 to slide leftward in the installation box 4, so as to make the silicon wafer closer to the base 8. Subsequently, the second motor 9 is started to drive the support column 7 to rotate, so as to rotate the silicon wafer around the base 8 from the right side position to the left side position, thereby completing the change of the placement position of the silicon wafer.

[0029] Working principle: When in use, during the process of grasping the integrated circuit materials, the first telescopic cylinder 2 extends, prompting the suction cup 11 to press down. The rubber pad 12 at the bottom of the suction cup 11 contacts the surface of the silicon wafer. Due to the elastic characteristics of the rubber pad 12, the phenomenon of surface contact damage of the silicon wafer is prevented. Subsequently, the negative pressure pump 10 pumps air, evacuating the gas between the silicon wafer and the rubber pad 12 from the air holes 13, thereby sucking the silicon wafer. During the downward pressing of the suction cup 11, since the height of the mounting plate 305 is lower than that of the rubber pad 12, during the extension of the first telescopic cylinder 2, the cylindrical rod 301 drives the fixed block 302, the sliding rod 303 and the mounting plate 305 to move downward synchronously, prompting the lower end of the mounting plate 305 to contact and press against the platform first, realizing the upward sliding of the sliding rod 303 in the fixed block 302 and the contraction of the spring 304. After the silicon wafer is sucked, the first telescopic cylinder 2 contracts, and the sucked silicon wafer moves upward synchronously to a suspended state. At this time, the pressing force between the mounting plate 305 and the platform is eliminated, and the sliding rod 303 is restored under the action of the spring 304. By then, the height of the silicon wafer is higher than that of the mounting plate 305. The air pipe connected through the joint 306 is ventilated, prompting the second telescopic cylinder 307 to extend, pushing out the pocket box 308 inside the mounting plate 305. The two pocket boxes 308 are pushed out relatively and spliced to hold the lower end of the silicon wafer, achieving a preventive effect and preventing the sudden failure of the negative pressure pump 10, the disappearance of the suction force on the silicon wafer, and the falling and damage of the silicon wafer. When it is necessary to put down the silicon wafer, after the second telescopic cylinder 307 contracts and the pocket box 308 is received inside the mounting plate 305, the first telescopic cylinder 2 extends, prompting the suction cup 11 to press down. The silicon wafer contacts the platform, the negative pressure pump 10 is stopped, the suction force disappears, and the silicon wafer is detached and placed on the platform.

[0030] The above are only the preferred specific embodiments of the present utility model, but the protection scope of the present utility model is not limited thereto. The substitution may be the substitution of part of the structure, device, method steps, or a complete technical solution. Any equivalent substitution or change made according to the technical solution of the present utility model and its inventive concept shall be covered within the protection scope of the present utility model.

Claims

1. An integrated circuit material grabbing structure, comprising a connecting rod (1), characterized in that: A first telescopic cylinder (2) is mounted on the upper end of the connecting rod (1); an anti-fall mechanism (3) is arranged at the front and rear ends of the lower end of the first telescopic cylinder (2); the anti-fall mechanism (3) is used to catch the dropped integrated circuit material; the anti-fall mechanism (3) comprises a cylindrical rod (301) connected to the front and rear ends of the lower end of the first telescopic cylinder (2); the end of the cylindrical rod (301) away from the first telescopic cylinder (2) is connected to a fixed block (302); the fixed block (302) is The right two ends are slidably connected with a slide bar (303), the outer surface of the slide bar (303) is wound with a spring (304), the lower end of the slide bar (303) is connected with a mounting plate (305), a joint (306) is provided on the side of the mounting plate (305) away from the first telescopic cylinder (2), the end of the joint (306) close to the first telescopic cylinder (2) is connected with a second telescopic cylinder (307), and a pocket box (308) is slidably connected inside the mounting plate (305).

2. The integrated circuit material grabbing structure according to claim 1, characterized in that: The left side of the connecting rod (1) is slidably connected to a mounting box (4), and the rear surface of the connecting rod (1) is provided with teeth (14) at equal intervals.

3. The integrated circuit material grabbing structure according to claim 2, characterized in that: A first motor (5) is installed at the upper end of the installation box (4); a gear (6) is connected to the output end below the first motor (5); and the gear (6) is transmission-connected to the connecting rod (1) via the teeth (14).

4. The integrated circuit material grabbing structure according to claim 2, characterized in that: The lower end of the installation box (4) is fixedly connected to a support column (7), the lower end of the support column (7) is rotatably connected to a base (8), and a second motor (9) is installed inside the upper end of the base (8).

5. The integrated circuit material grabbing structure according to claim 1, characterized in that: A negative pressure pump (10) is installed at the lower end of the first telescopic cylinder (2), and a suction cup (11) is connected to the lower end of the negative pressure pump (10).

6. The integrated circuit material grabbing structure according to claim 5, characterized in that: A rubber pad (12) is installed on the lower end surface of the suction cup (11), and a plurality of groups of air holes (13) are provided on the lower surface of the rubber pad (12).

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