Semiconductor transistor integrated heat dissipation structure

Abstract

The utility model discloses a semiconductor transistor integrated heat dissipation structure, which comprises a connecting seat, a fixing plate is arranged outside the connecting seat, a supporting plate is arranged at the top end of the fixing plate, the center line of the supporting plate and the center line of the fixing plate are on the same vertical plane, and a mounting frame is movably connected in the supporting plate. According to the semiconductor transistor integrated heat dissipation structure, the fixing plate is arranged, during installation, the fixing plate is fixed to the circuit board through welding, then the supporting plate is arranged at one end of the fixing plate, then the installation bolt penetrates through the supporting plate and is screwed into the threaded sleeve, the installation bolt is screwed down, and the heat dissipation structure is fixed through the supporting plate; the threaded sleeve can support the supporting plate, meanwhile, the limiting sleeve at the bottom end of the supporting plate is attached to the outer portion of the threaded sleeve and can limit the supporting plate, the situation that the stability of the heat dissipation structure during operation is affected by shaking of the supporting plate is prevented, and the problem that installation is not convenient is solved.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation structures, in particular to a semiconductor transistor integrated heat dissipation structure. Background Art

[0002] Semiconductor transistors are semiconductor devices used to amplify or switch electrical signals and power. They are an important component of most current electronic products. Generally, semiconductor transistors are installed in integrated circuits of electronic products to support the operation of electronic products. Because semiconductor transistors are compact integrated structures, the heat generated during operation is difficult to be naturally discharged and needs to be cooled by external heat dissipation structures.

[0003] However, the heat dissipation structure used for semiconductor transistors still has some defects in use. The heat dissipation structure body cannot be conveniently installed during use, resulting in a long time required for assembly.

[0004] Now a new semiconductor transistor integrated heat dissipation structure is proposed to solve the above problems. Utility Model Content

[0005] The utility model aims to provide a semiconductor transistor integrated heat dissipation structure to solve the problem of inconvenient installation mentioned in the above background technology.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a semiconductor transistor integrated heat dissipation structure, comprising a connection seat, a fixing plate is arranged outside the connection seat, a support plate is arranged on the top of the fixing plate, the center line of the support plate and the center line of the fixing plate are on the same vertical plane, a mounting frame is movably connected inside the support plate, a horizontal plate is fixedly connected inside the mounting frame, a micro motor is fixedly connected to the bottom end of the horizontal plate, a heat dissipation fan blade is fixedly connected to the output end of the micro motor through the horizontal plate, and a mounting structure for quick installation is arranged on the top of the fixing plate;

[0007] The mounting structure includes a threaded sleeve, and the two ends on both sides of the top of the fixing plate are respectively fixedly connected with a group of threaded sleeves, the two ends on both sides of the top of the supporting plate are respectively movably connected with a group of mounting bolts, and the two ends on both sides of the bottom of the supporting plate are respectively fixedly connected with a group of limiting sleeves.

[0008] Preferably, the limiting sleeve is movably connected to the threaded sleeve, and the mounting bolt passes through the support plate and extends to the interior of the threaded sleeve.

[0009] Preferably, the mounting bolt is threadedly connected to a threaded sleeve, and the threaded sleeve is movably connected to a support plate.

[0010] Preferably, the top end of the support plate is fixedly connected to a fixed frame, a group of lifting slots are respectively opened at both ends of the two sides of the fixing frame, a group of positioning screws are respectively fixedly connected at both ends of the two sides of the installation frame, the positioning screws pass through the lifting slots and are movably connected with positioning nuts, and the bottom end of the installation frame is fixedly connected to a heat conducting plate.

[0011] Preferably, the positioning screw is slidably connected to the lifting slot, and the positioning nut is movably connected to the fixing frame.

[0012] Preferably, a positioning frame is movably connected to the top of the installation frame, a dust net is fixedly connected to the top of the positioning frame, a group of positioning slots are respectively opened on both sides and ends of the installation frame, a group of side grooves are respectively opened on both sides and ends of the positioning frame, a positioning spring piece is fixedly connected to the top of the side groove, and a positioning plug plate is fixedly connected to the bottom end of one side of the positioning spring piece.

[0013] Preferably, the positioning plug plate is movably connected to the positioning slot, and the center line of the side slot and the center line of the positioning slot are on the same vertical plane.

[0014] Preferably, the center line of the positioning frame and the center line of the installation frame are on the same vertical plane, and the positioning slot is connected to the interior of the installation frame.

[0015] Compared with the prior art, the utility model has the following beneficial effects: the semiconductor transistor integrated heat dissipation structure can not only be quickly installed, but also can adjust the installation height of the structure, and can effectively prevent dust;

[0016] (1) By providing a fixing plate, a threaded sleeve, a support plate, a mounting bolt and a limiting sleeve, during installation, the fixing plate is fixed on the circuit board by welding, and then the support plate is placed at one end of the fixing plate, and then the mounting bolt is passed through the support plate and rotated into the inside of the threaded sleeve, and the mounting bolt is tightened to fix the heat dissipation structure through the support plate, the threaded sleeve can support the support plate, and at the same time, the limiting sleeve at the bottom end of the support plate fits on the outside of the threaded sleeve to limit the support plate, preventing the support plate from shaking and affecting the stability of the heat dissipation structure during operation, thereby realizing that the heat dissipation structure can be quickly installed;

[0017] (2) By providing a fixing frame, an installation frame, a positioning nut, a positioning screw, a heat conducting sheet and a lifting slot, during installation, the transistor is installed on the top of the connection seat, and then the positioning nut is rotated to disengage one side of the fixing frame, and then the installation frame can be pushed to drive the heat conducting sheet to descend, so that the heat conducting sheet is attached to the top of the transistor, and then the positioning nut is rotated to make it close to one side of the fixing frame, so that the installation frame is positioned by the positioning screw, and then the micro motor can be started to drive the heat dissipation fan blades to rotate for heat dissipation, so that the height of the heat conducting sheet can be adjusted so that it can fit closely with the transistor;

[0018] (3) By providing an installation frame, a positioning frame, a dust-proof net, side grooves, positioning elastic pieces, a positioning insertion plate and a positioning slot, when dissipating heat, the dust-proof net inside the positioning frame can effectively prevent dust and prevent dust from entering the interior. After long-term use, the positioning insertion plate inside the positioning slot can be pressed, and after the positioning insertion plate is disengaged from the interior of the positioning slot, the positioning frame can be taken out from the interior of the installation frame to facilitate the cleaning of the dust-proof net. After the cleaning is completed, the positioning frame is inserted into the interior of the installation frame. At the same time, the positioning elastic piece can eject the positioning insertion plate and make it insert into the interior of the positioning slot to position the positioning frame, achieving effective dust prevention. Description of the Drawings

[0019] Figure 1 It is a front view sectional structure diagram of the present utility model;

[0020] Figure 2 It is a top view sectional structure diagram of the fixed frame of the present utility model;

[0021] Figure 3 It is a bottom view sectional structure diagram of the positioning frame of the present utility model;

[0022] Figure 4 It is a side view structure diagram of the fixed frame of the present utility model.

[0023] In the figure: 1, connecting seat; 2, fixing plate; 3, threaded sleeve; 4, support plate; 5, fixed frame; 6, installation frame; 7, positioning frame; 8, cross plate; 9, heat dissipation fan blade; 10, dust-proof net; 11, side groove; 12, positioning elastic piece; 13, positioning nut; 14, positioning screw; 15, installation bolt; 16, limit sleeve; 17, heat conducting sheet; 18, micro motor; 19, positioning insertion plate; 20, positioning slot; 21, lifting groove. Detailed Embodiment

[0024] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0025] Embodiment 1: Please refer to Figures 1-4, A semiconductor transistor integrated heat dissipation structure, including a connection base 1. An fixing plate 2 is arranged outside the connection base 1. A support plate 4 is arranged at the top of the fixing plate 2. The center line of the support plate 4 and the center line of the fixing plate 2 are on the same vertical plane. An installation frame 6 is movably connected inside the support plate 4. A cross plate 8 is fixedly connected inside the installation frame 6. A micro motor 18 is fixedly connected to the bottom end of the cross plate 8. The output end of the micro motor 18 penetrates through the cross plate 8 and is fixedly connected with a heat dissipation fan blade 9. An installation structure for quick installation is arranged at the top of the fixing plate 2;

[0026] The installation structure includes a threaded sleeve 3. A group of threaded sleeves 3 are respectively fixedly connected to both ends of the two sides of the top of the fixing plate 2. A group of installation bolts 15 are respectively movably connected to both ends of the two sides of the top of the support plate 4. A group of limit sleeves 16 are respectively fixedly connected to both ends of the two sides of the bottom of the support plate 4;

[0027] The limit sleeve 16 is movably connected with the threaded sleeve 3. The installation bolt 15 penetrates through the support plate 4 and extends into the threaded sleeve 3;

[0028] The installation bolt 15 is threadedly connected with the threaded sleeve 3. The threaded sleeve 3 is movably connected with the support plate 4;

[0029] Specifically, as Figure 1 shown, during installation, the fixing plate 2 is fixed to the circuit board by welding. Then, the support plate 4 is placed at one end of the fixing plate 2. Then, the installation bolt 15 is passed through the support plate 4 and turned into the threaded sleeve 3, and the installation bolt 15 is tightened to fix the heat dissipation structure through the support plate 4. The threaded sleeve 3 can support the support plate 4. At the same time, the limit sleeve 16 at the bottom end of the support plate 4 fits on the outside of the threaded sleeve 3 to limit the support plate 4, preventing the support plate 4 from shaking and affecting the stability during the operation of the heat dissipation structure, realizing the quick installation of the heat dissipation structure.

[0030] Embodiment 2: A fixing frame 5 is fixedly connected to the top of the support plate 4. A group of lifting grooves 21 are respectively opened at both ends of the two sides of the fixing frame 5. A group of positioning screws 14 are respectively fixedly connected to both ends of the two sides of the installation frame 6. The positioning screws 14 penetrate through the lifting grooves 21 and are movably connected with positioning nuts 13. A heat conduction sheet 17 is fixedly connected to the bottom end of the installation frame 6;

[0031] The positioning screw 14 is slidably connected with the lifting groove 21. The positioning nut 13 is movably connected with the fixing frame 5;

[0032] Specifically, as Figure 1 、 Figure 2 and Figure 4As shown, during installation, the transistor is installed on the top of the connecting seat 1, and then the positioning nut 13 is rotated to disengage it from one side of the fixing frame 5, and then the installation frame 6 can be pushed to drive the heat conductive sheet 17 to descend, so that the heat conductive sheet 17 fits on the top of the transistor, and then the positioning nut 13 is rotated to make it close to one side of the fixing frame 5, so that the installation frame 6 is positioned by the positioning screw 14, and then the micro motor 18 can be started to drive the heat dissipation fan blades 9 to rotate for heat dissipation, so that the height of the heat conductive sheet 17 can be adjusted so that it can fit closely with the transistor.

[0033] Embodiment 3: The top of the installation frame 6 is movably connected to the positioning frame 7, the top of the positioning frame 7 is fixedly connected to the dust screen 10, the two sides and ends of the installation frame 6 are respectively provided with a group of positioning slots 20, the two sides and ends of the positioning frame 7 are respectively provided with a group of side grooves 11, the top of the side groove 11 is fixedly connected to the positioning spring piece 12, and the bottom end of one side of the positioning spring piece 12 is fixedly connected to the positioning plug plate 19;

[0034] The positioning plug plate 19 is movably connected to the positioning slot 20, and the center line of the side slot 11 and the center line of the positioning slot 20 are on the same vertical plane;

[0035] The center line of the positioning frame 7 and the center line of the installation frame 6 are on the same vertical plane, and the positioning slot 20 is connected to the interior of the installation frame 6;

[0036] Specifically, Figure 1 , Figure 3 and Figure 4 As shown, the dustproof net 10 inside the positioning frame 7 can effectively prevent dust from entering the interior during heat dissipation. After long-term use, the positioning plate 19 inside the positioning slot 20 can be pressed to disengage the positioning plate 19 from the interior of the positioning slot 20. The positioning frame 7 can then be taken out from the interior of the mounting frame 6 to facilitate cleaning of the dustproof net 10. After cleaning, the positioning frame 7 can be inserted into the interior of the mounting frame 6. At the same time, the positioning spring piece 12 can push out the positioning plate 19 and insert it into the interior of the positioning slot 20 to position the positioning frame 7, thereby achieving effective dust prevention.

[0037] Working principle: When the utility model is in use and during installation, the fixing plate 2 is fixed on the circuit board by welding. Then, the support plate 4 is placed at one end of the fixing plate 2. After that, the installation bolt 15 passes through the support plate 4 and is screwed into the interior of the threaded sleeve 3, and the installation bolt 15 is tightened to fix the heat dissipation structure through the support plate 4. The threaded sleeve 3 can support the support plate 4. At the same time, the limiting sleeve 16 at the bottom end of the support plate 4 fits on the outside of the threaded sleeve 3 to limit the support plate 4 and prevent the support plate 4 from shaking and affecting the stability during the operation of the heat dissipation structure. Then, the transistor is installed on the top of the connecting seat 1. After that, when the positioning nut 13 is rotated to disengage from one side of the fixing frame 5, the installation frame 6 can be pushed to drive the heat conduction sheet 17 to descend, so that the heat conduction sheet 17 fits on the top of the transistor. Then, the positioning nut 13 is rotated back to make it closely adhere to one side of the fixing frame 5, thereby positioning the installation frame 6 through the positioning screw 14. After that, the micro motor 18 can be started to drive the heat dissipation fan blades 9 to rotate for heat dissipation. During heat dissipation, the dust-proof net 10 inside the positioning frame 7 can effectively prevent dust and prevent dust from entering the interior. After long-term use, the positioning plug 19 inside the positioning slot 20 can be pressed, so that the positioning plug 19 disengages from the interior of the positioning slot 20, and then the positioning frame 7 can be taken out from the interior of the installation frame 6 to facilitate the cleaning of the dust-proof net 10. After the cleaning is completed, the positioning frame 7 is inserted into the interior of the installation frame 6. At the same time, the positioning elastic piece 12 can push out the positioning plug 19 and make it insert into the interior of the positioning slot 20 to position the positioning frame 7.

Claims

1. A semiconductor transistor integrated heat dissipation structure, comprising a connection base (1), characterized in that: The connection seat (1) is provided with a fixing plate (2) on the outside, a support plate (4) is provided on the top of the fixing plate (2), the center line of the support plate (4) and the center line of the fixing plate (2) are on the same vertical plane, the support plate (4) is movably connected to the inside of the installation frame (6), the inside of the installation frame (6) is fixedly connected to a transverse plate (8), the bottom end of the transverse plate (8) is fixedly connected to a micro motor (18), the output end of the micro motor (18) passes through the transverse plate (8) and is fixedly connected to a heat dissipation fan blade (9), and the top of the fixing plate (2) is provided with a mounting structure for quick installation; The mounting structure comprises a threaded sleeve (3), the two ends of the top of the fixing plate (2) are respectively fixedly connected with a group of threaded sleeves (3), the two ends of the top of the supporting plate (4) are respectively movably connected with a group of mounting bolts (15), and the two ends of the bottom of the supporting plate (4) are respectively fixedly connected with a group of limiting sleeves (16).

2. The semiconductor transistor integrated heat dissipation structure according to claim 1, characterized in that: The limiting sleeve (16) is movably connected to the threaded sleeve (3), and the mounting bolt (15) passes through the support plate (4) and extends to the interior of the threaded sleeve (3).

3. The semiconductor transistor integrated heat dissipation structure according to claim 1, characterized in that: The mounting bolt (15) is threadedly connected to the threaded sleeve (3), and the threaded sleeve (3) is movably connected to the support plate (4).

4. The semiconductor transistor integrated heat dissipation structure according to claim 1, characterized in that: The top end of the support plate (4) is fixedly connected to a fixing frame (5), and a group of lifting grooves (21) are respectively provided at both ends of both sides of the fixing frame (5). A group of positioning screws (14) are respectively fixedly connected to both ends of both sides of the installation frame (6), and the positioning screws (14) pass through the lifting grooves (21) and are movably connected to positioning nuts (13). The bottom end of the installation frame (6) is fixedly connected to a heat conducting sheet (17).

5. The semiconductor transistor integrated heat dissipation structure according to claim 4, characterized in that: The positioning screw (14) is slidably connected to the lifting slot (21), and the positioning nut (13) is movably connected to the fixing frame (5).

6. The semiconductor transistor integrated heat dissipation structure according to claim 1, characterized in that: The top of the interior of the installation frame (6) is movably connected to a positioning frame (7), the top of the interior of the positioning frame (7) is fixedly connected to a dust screen (10), both sides and ends of the installation frame (6) are respectively provided with a group of positioning slots (20), both sides and ends of the positioning frame (7) are respectively provided with a group of side grooves (11), the top of the interior of the side groove (11) is fixedly connected to a positioning spring sheet (12), and the bottom of one side of the positioning spring sheet (12) is fixedly connected to a positioning plug plate (19).

7. The semiconductor transistor integrated heat dissipation structure according to claim 6, characterized in that: The positioning plug plate (19) is movably connected to the positioning slot (20), and the center line of the side slot (11) and the center line of the positioning slot (20) are on the same vertical plane.

8. The semiconductor transistor integrated heat dissipation structure according to claim 6, characterized in that: The center line of the positioning frame (7) and the center line of the installation frame (6) are on the same vertical plane, and the positioning slot (20) is connected to the interior of the installation frame (6).

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