Novel high-density array filter

Abstract

The utility model discloses a novel high-density array filter, which belongs to the technical field of filters, and comprises a plurality of capacitors and central leads thereof which are connected by welding, a shielding shell is welded outside the capacitors, and finally the capacitors are encapsulated by resin. And electromagnetic interference and humid weather influence are easily caused.

Description

Technical Field

[0001] The utility model belongs to the technical field of filters, and particularly relates to a novel high-density array filter. Background Art

[0002] With the development of electronic equipment, the requirements for the external dimensions and electrical performance of electronic products are getting higher and higher. In order to achieve the purpose of small size and high performance, in many electronic devices and chassis, a method of connecting multiple small-size filters in parallel is adopted to reduce the installation space. For traditional array filters, tubular capacitors are mostly used to assemble the array filter, with complex processes, low electrical and mechanical performance. The ceramic materials selected for making capacitors have poor temperature characteristics, narrow working temperature range, and the assembled array filter products also have defects such as large volume, easy to be affected by moisture, decline in electrical performance, and low mechanical strength due to lack of encapsulation protection.

[0003] This type of high-density and super-resistant array filter adopts the method of connecting several or dozens of ceramic capacitors in parallel, printing them together by a special process, and then cutting them into multiple capacitors through precise cutting to achieve high density, high performance, and small volume. The delicate capacitors are welded with wires. To protect the electrical and mechanical performance, a shielding shell is welded and grounded and fixed. After welding, cleaning, drying, and measuring to be qualified, it is encapsulated and fixed with epoxy resin to strengthen the mechanical strength, electrical performance, and moisture-proof protection of the product. When the product is in use, it reduces the volume and saves space. Summary of the Utility Model

[0004] Aiming at the problems of too large volume and easy to be affected by moisture in the prior art, the utility model provides a novel high-density array filter, and its purpose is to: increase the anti-electromagnetic interference and anti-moisture ability of the filter, reduce the volume of the filter, and make the application scenarios more extensive.

[0005] The technical solution adopted by the utility model to achieve the above purpose is: to provide a novel high-density array filter, which adopts multiple capacitors connected in parallel to form an array filter and is printed together with special ink.

[0006] Further, the capacitor is a plate capacitor, and the distance between each capacitor is 1.27 mm.

[0007] Further, a shielding shell is welded outside the capacitor.

[0008] Further, the shielding shell is fixed by resin encapsulation.

[0009] Further, the internal ceramic dielectric and electrode paste of the capacitor are stacked layer by layer to form a ceramic capacitor chip.

[0010] Further, the center lead of the inner electrode and the inner hole of the ceramic capacitor chip are welded to form the signal pole of the array filter, and the outer electrode of the ceramic capacitor chip and the shielding housing are welded to form the grounding pole of the array filter.

[0011] Compared with the prior art, the technical solution of the present utility model has the following advantages / beneficial effects:

[0012] 1. The plate capacitor is used to replace the tubular capacitor, and the integrated capacitor is used to replace the discrete capacitor assembly structure. The distance between individual capacitors is shortened from 2.54 mm in the prior art to 1.27 mm, reducing the volume of the product and increasing the scope of use.

[0013] 2. A shielding housing is welded outside the capacitor and fixed by resin encapsulation, solving the problems of moisture protection and electromagnetic shielding of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the following will briefly introduce the drawings required for use in the embodiments. It should be understood that the following drawings only show some embodiments of the present utility model and should not be regarded as limiting the scope. For those of ordinary skill in the art, other related drawings can be obtained based on these drawings without creative efforts.

[0015] Figure 1 is a schematic external view of a novel high-density array filter of the present utility model.

[0016] Figure 2 is a schematic circuit principle diagram of the present utility model.

[0017] Figure 3 is a schematic structural diagram of the ceramic capacitor chip used in the present utility model.

[0018] Figure 4 is a structural diagram of the present utility model.

[0019] The marks in the figure are respectively: 1, center lead of the inner electrode; 2, shielding housing; 3, inner hole of the capacitor chip; 4, resin; 5, ceramic dielectric; 6, electrode paste. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0020] To make the objectives, technical solutions and advantages of the present utility model clearer, the technical solutions in the embodiments of the present utility model will be described clearly and completely below. Apparently, the described embodiments are only a part rather than all of the embodiments of the present utility model. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts fall within the scope of protection of the present utility model. Therefore, the detailed description of the embodiments of the present utility model provided below is not intended to limit the scope of the claimed present utility model, but merely represents the selected embodiments of the present utility model.

[0021] It should be noted that like reference numerals and letters denote like items in the following figures. Therefore, once an item is defined in one figure, it may not be further defined and explained in subsequent figures.

[0022] Embodiment 1:

[0023] As Figure 1 、 Figure 2 、 Figure 4 shown, a novel high-density array filter uses a plurality of capacitors connected in parallel to form an array filter and is printed together using a special ink.

[0024] The capacitors used in the present utility model are plate capacitors. The distance between each capacitor is 1.27 mm, while the distance between capacitors in the prior art is 2.54 mm. The present utility model has obvious progress.

[0025] A shielding housing 2 is welded outside the capacitor.

[0026] The shielding housing 2 is encapsulated and fixed with a resin 4.

[0027] The center lead 1 of the inner electrode and the inner hole 3 of the capacitor chip are welded to form the signal pole of the array filter, and the outer electrode of the ceramic capacitor chip and the shielding housing 2 are welded to form the grounding pole of the array filter.

[0028] The array filter proposed by the present utility model adopts a method of connecting several or dozens of ceramic capacitors in parallel, printing them together using a special process, and then precisely cutting them into multiple capacitors to achieve the technical advantages of high density, high performance and small volume. To protect the electrical and mechanical properties of the array filter, a shielding housing 2 is welded for grounding and fixing. After welding, cleaning, drying and passing the measurement, it is encapsulated and fixed with a resin 4, which enhances the mechanical strength, electrical performance and moisture-proof performance of the array filter.

[0029] The materials and manufacturing processes for fabricating capacitor chips are different from previous methods. Ultra-fine ceramic powders with good performance are selected, mixed with organic solvents and other additives, and then, through an automatic printing machine, the processes of printing, cutting, firing, and metallization are repeated over and over again to fabricate high-density capacitor chips. Then, through assembly, soldering, and encapsulation, the fabrication of capacitor chips is finally completed, improving the density of the capacitor chips, preventing the capacitor chips from being invaded by moisture in the air, and realizing the moisture-proof function of the array filter. The shielding case 2 is made of brass material, which not only facilitates processing but also improves the electromagnetic interference resistance of the array filter.

[0030] And it can be seen from Figure 2 that each capacitor chip in the array capacitor has a grounding device, effectively avoiding the situation of circuit overload.

[0031] Embodiment 2, as Figure 3 shown, the structure of the ceramic capacitor chip used in the present utility model is as follows:

[0032] The internal ceramic dielectric 5 and the electrode paste 6 of the capacitor are stacked layer by layer to form the ceramic capacitor chip, and there are parallel hole positions for placing the center lead 1 of the internal electrode, and each hole position is arranged at intervals.

[0033] In the present utility model, unless otherwise clearly defined and limited, terms such as "installation", "connection", "connection", "fixation", etc. should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal communication of two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0034] The above are only the preferred embodiments of the present utility model. It should be noted that the above preferred embodiments should not be regarded as limiting the present utility model, and the protection scope of the present utility model should be subject to the scope defined by the claims. For those of ordinary skill in the art of this technology, without departing from the spirit and scope of the present utility model, several improvements and refinements can still be made, and these improvements and refinements should also be regarded as within the protection scope of the present utility model.

Claims

1. A novel high-density array filter, characterized in that: A plurality of capacitors are connected in parallel to form an array filter. The capacitors are plate capacitors, and the spacing between each capacitor is 1.27 mm.

2. A novel high-density array filter according to claim 1, characterized in that: A shielding shell is welded outside the capacitor.

3. A novel high-density array filter according to claim 2, characterized in that: The shielding shell is encapsulated and fixed by resin.

4. A novel high-density array filter according to claim 1, characterized in that: The ceramic dielectric and electrode slurry inside the capacitor are stacked layer by layer to form a ceramic capacitor chip.

5. A novel high-density array filter according to claim 1, characterized in that: The center lead of the inner electrode and the inner hole of the ceramic capacitor chip are welded to form the signal electrode of the array filter, and the outer electrode of the ceramic capacitor chip and the shielding shell are welded to form the grounding electrode of the array filter.

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