System scene linkage device
By designing an improved heat dissipation structure in the system scene linkage device, including metal fins, top heat sinks and convection heat dissipation system, the problem of device overheating is solved, and the stability and service life is improved.
Patent Information
- Application Number
- CN202421569302.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-04
- Publication Date
- 2025-05-27
- Estimated Expiration
- 2034-07-04
AI Technical Summary
The heat dissipation structure of the existing system scenario linkage device is not ideal, resulting in overheating easily after long-term use.
An improved heat dissipation structure is designed, including mounting metal fins and top heat sinks on the processor and RAM modules, and forming a thermal conduction path through metal strips and metal mesh, combining a heat dissipation fan and exhaust ports to form a convective heat dissipation system.
It effectively improves the heat dissipation effect of the device, reduces the occurrence of overheating, and ensures the stability and service life of the device.
Smart Images
Figure CN222916330U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of building intelligent systems, and particularly relates to a system scene linkage device. Background Art
[0002] A building intelligent system is a control system for comprehensively monitoring the operation of mechanical and electrical equipment in a building, alarm / fault management, and equipment maintenance / repair management. With real-time databases and historical databases as the core, this system uses technologies such as computers, networks, communications, and automatic control to incorporate parameters such as the status, alarms, and data of the main equipment in the building's fire protection, security, building automation, communication, etc. into a unified management platform. It can realize functions such as the compilation of linkage plans and the linkage control of subsystems, comprehensively and effectively monitor and manage all intelligent devices in the building, enrich the comprehensive usage functions of the building, improve the management efficiency, and then ensure that all relevant equipment in the building complex is in an efficient, energy-saving, and optimal operating state, providing a safe, comfortable, convenient, and efficient working environment for the staff in the building. In a building intelligent system, scene linkage is an important functional module, which transmits the on-site real scene to each receiving terminal in the form of images, providing the most intuitive information feedback for management personnel. Therefore, the system scene linkage device is also one of the necessary equipment for management personnel. Currently, to meet requirements such as portability and handheld use, the system scene linkage device is generally designed to be relatively thin and light, resulting in unsatisfactory internal heat dissipation effects. Especially after long-term use, with the accumulation of dust, overheating inside the device occurs frequently. Summary of the Invention
[0003] The utility model aims to address the technical deficiencies of the prior art by providing a system scene linkage device to solve the technical problem that the heat dissipation structure of a common system scene linkage device needs to be improved.
[0004] To achieve the above technical objectives, the utility model adopts the following technical solutions:
[0005] A system scenario linkage device, comprising a casing, a fixing groove, a processor, metal fins, a RAM module, a top heat sink, a metal strip, a metal mesh, a cooling fan, a first air outlet, a metal tube, a second air outlet, and a mounting bracket; the fixing groove is located at the top edge position of the casing, and an end cover is clamped at the fixing groove. The processor is installed inside the casing, and metal fins are attached to the processor. The RAM module is installed in the casing, and a top heat sink is attached to the RAM module. The metal strip is fixed inside the casing by screws, and the top heat sink is squeezed between the metal strip and the wall panel of the casing. The metal mesh is fixedly installed inside the casing, and a cooling fan is also installed inside the casing. The first air outlet is located on the wall panel of the casing, and the metal mesh is held between the cooling fan and the first air outlet. The metal tube is attached between the top heat sink and the metal mesh. The casing has a second air outlet. The mounting bracket includes a connecting plate in the middle thereof and a first strip-shaped sheet and a second strip-shaped sheet connected to both ends of the connecting plate. The first strip-shaped sheet and the second strip-shaped sheet are parallel to each other, and the first strip-shaped sheet is perpendicular to the connecting plate. There are holes in the second strip-shaped sheet, and screws pass through the holes to fix the second strip-shaped sheet to the casing.
[0006] Preferably, heat-conducting silicone grease is coated on the processor and the RAM module.
[0007] Preferably, a bracket is rotatably connected to the rear side of the casing, and an anti-slip rubber strip is fixedly connected to the bottom end of the bracket.
[0008] Preferably, anti-collision sleeves made of flexible materials are fixedly connected to the four corners of the casing.
[0009] Preferably, a temperature sensor is installed inside the casing, and the temperature sensor is electrically connected to the cooling fan.
[0010] Preferably, at least two cooling fans are installed. The air guiding direction of one cooling fan is parallel to the top wall of the casing, and the air guiding direction of the other cooling fan is parallel to the side wall of the casing.
[0011] In the structure of the present utility model, the casing is the external protection structure of the device; the fixing groove is used to fix the end cover, and the end cover enables the casing to be opened; the processor and the RAM module are both existing components of the device and are also parts with relatively large heat generation; the metal fins are attached to the processor to conduct heat for the processor; the top heat sink conducts heat for the RAM module; the metal strip fixes the top heat sink; the metal tube guides the heat of the top heat sink to the metal mesh; the metal mesh has a large surface area for increasing the heat dissipation area; the cooling fan plays an active heat dissipation role; the first air outlet and the second air outlet can form convection in the casing to ensure the air flow; the present utility model can be used handheld or installed and fixed. When installed and fixed, the first strip-shaped sheet on the mounting bracket is fixed to the casing, and the connecting plate plays a supporting role; the second strip-shaped sheet is used to fix to the plane to be installed.
[0012] The utility model discloses a system scenario linkage device. This device improves the heat dissipation structure inside the casing, and constructs a heat conduction structure and a heat dissipation path for the processor and the RAM module. Applying the utility model, the system scenario linkage device is not prone to overheating, which helps to ensure the stability and service life of the device. Description of the Drawings
[0013] Figure 1 is the first internal view of the utility model;
[0014] Figure 2 is the second internal view of the utility model;
[0015] Figure 3 is the external view of the utility model;
[0016] Figure 4 is the partial view of the mounting rack;
[0017] Figure 5 is the partial view of the top heat sink;
[0018] Wherein:
[0019] 1. Casing 2. Fixed groove 3. Processor 4. Metal fins
[0020] 5. RAM module 6. Top heat sink 7. Metal strip 8. Metal mesh
[0021] 9. Cooling fan 10. First air outlet 11. Metal pipe 12. Second air outlet
[0022] 13. Mounting rack 14. First strip-shaped sheet 15. Connecting plate 16. Second strip-shaped sheet. Detailed Embodiments
[0023] The following will describe the detailed embodiments of the utility model in detail. In order to avoid too many unnecessary details, the well-known structures or functions will not be described in detail in the following embodiments. The approximate language used in the following embodiments can be used for quantitative expression, indicating that a certain change in quantity is allowed without changing the basic function. Unless otherwise defined, the technical and scientific terms used in the following embodiments have the same meaning as commonly understood by those skilled in the art to which the utility model belongs.
[0024] Embodiment 1
[0025] A system scenario linkage device, see Figures 1 to 5, including a chassis 1, a fixing groove 2, a processor 3, metal fins 4, a RAM module 5, a top heat sink 6, a metal strip 7, a metal mesh 8, a cooling fan 9, a first air outlet 10, a metal tube 11, a second air outlet 12, and a mounting bracket 13; the fixing groove 2 is located at the top edge position of the chassis 1, and an end cover is clamped at the fixing groove 2. The processor 3 is installed inside the chassis 1, and metal fins 4 are attached to the processor 3. The RAM module 5 is installed in the chassis 1, and a top heat sink 6 is attached to the RAM module 5. The metal strip 7 is fixed inside the chassis 1 by screws, and the top heat sink 6 is pressed between the metal strip 7 and the wall plate of the chassis 1. The metal mesh 8 is fixedly installed inside the chassis 1, and the cooling fan 9 is also installed inside the chassis 1. The first air outlet 10 is located on the wall plate of the chassis 1, and the metal mesh 8 is held between the cooling fan 9 and the first air outlet 10. The metal tube 11 is attached between the top heat sink 6 and the metal mesh 8. The chassis 1 has a second air outlet 12. The mounting bracket 13 includes a connecting plate 15 in the middle thereof and a first strip-shaped sheet 14 and a second strip-shaped sheet 16 connected to both ends of the connecting plate 15. The first strip-shaped sheet 14 and the second strip-shaped sheet 16 are parallel to each other, and the first strip-shaped sheet 14 is perpendicular to the connecting plate 15. There are holes in the second strip-shaped sheet 16, and screws pass through the holes to fix the second strip-shaped sheet 16 to the chassis 1.
[0026] Wherein: The chassis 1 is the external protection structure of the device; the fixing groove 2 is used to fix the end cover, and the end cover enables the chassis 1 to be opened; the processor 3 and the RAM module 5 are existing components of the device and are also parts with relatively large heat generation; the metal fins 4 are attached to the processor 3 to conduct heat for the processor 3; the top heat sink 6 conducts heat for the RAM module 5; the metal strip 7 fixes the top heat sink 6; the metal tube 11 guides the heat of the top heat sink 6 to the metal mesh 8; the metal mesh 8 has a large surface area for increasing the heat dissipation area; the cooling fan 9 plays an active heat dissipation role; the first air outlet 10 and the second air outlet 12 can form a convection in the chassis 1 to ensure the air flow; the present utility model can be used handheld or installed and fixed. When installed and fixed, the first strip-shaped sheet 14 on the mounting bracket 13 is fixed to the chassis 1, and the connecting plate 15 plays a supporting role; the second strip-shaped sheet 16 is used to fix to the plane to be installed.
[0027] Embodiment 2
[0028] A system scenario linkage device, see Figures 1 to 5, including a chassis 1, a fixing groove 2, a processor 3, metal fins 4, a RAM module 5, a top heat sink 6, a metal strip 7, a metal mesh 8, a cooling fan 9, a first air outlet 10, a metal pipe 11, a second air outlet 12, and a mounting bracket 13; the fixing groove 2 is located at the top edge position of the chassis 1, and an end cover is clamped at the fixing groove 2. The processor 3 is installed inside the chassis 1, and metal fins 4 are attached to the processor 3. A RAM module 5 is installed in the chassis 1, and a top heat sink 6 is attached to the RAM module 5. The metal strip 7 is fixed inside the chassis 1 by screws, and the top heat sink 6 is squeezed between the metal strip 7 and the wall plate of the chassis 1. The metal mesh 8 is fixedly installed inside the chassis 1. A cooling fan 9 is also installed inside the chassis 1. The first air outlet 10 is located on the wall plate of the chassis 1, and the metal mesh 8 is held between the cooling fan 9 and the first air outlet 10. The metal pipe 11 is attached between the top heat sink 6 and the metal mesh 8. There is a second air outlet 12 on the chassis 1. The mounting bracket 13 includes a connecting plate 15 in the middle thereof and a first strip-shaped sheet 14 and a second strip-shaped sheet 16 connected to both ends of the connecting plate 15. The first strip-shaped sheet 14 and the second strip-shaped sheet 16 are parallel to each other, and the first strip-shaped sheet 14 is perpendicular to the connecting plate 15. There are holes in the second strip-shaped sheet 16, and screws pass through the holes to fix the second strip-shaped sheet 16 to the chassis 1. Heat-conducting silicone grease is coated on the processor 3 and the RAM module 5. A bracket is rotatably connected to the rear side of the chassis 1, and an anti-slip rubber strip is fixedly connected to the bottom end of the bracket. Anti-collision sleeves made of flexible materials are fixedly connected to the four corner positions of the chassis 1. A temperature sensor is installed inside the chassis 1, and the temperature sensor is electrically connected to the cooling fan 9. At least two cooling fans 9 are installed, and the air intake direction of one of the cooling fans 9 is parallel to the top wall of the chassis 1, and the air intake direction of the other cooling fan 9 is parallel to the side wall of the chassis 1.
[0029] The embodiments of the present invention have been described in detail above, but the above content is only the preferred embodiments of the present invention and is not intended to limit the present invention. Any modifications, equivalent replacements, and improvements made within the scope of the application of the present invention shall be included within the protection scope of the present invention.
Claims
1. A system scene linkage device, characterized in that: The invention comprises a housing (1), a fixing slot (2), a processor (3), a metal fin (4), a RAM module (5), a top heat sink (6), a metal strip (7), a metal mesh (8), a heat dissipation fan (9), a first air outlet (10), a metal pipe (11), a second air outlet (12), and a mounting frame (13); the fixing slot (2) is located at the top edge of the housing (1), an end cover is fixed at the fixing slot (2), the processor (3) is installed in the housing (1), the metal fin (4) is mounted on the processor (3), the RAM module (5) is installed in the housing (1), the top heat sink (6) is mounted on the RAM module (5), the metal strip (7) is fixed in the housing (1) by screws, the top heat sink (6) is squeezed between the metal strip (7) and the wall plate of the housing (1), and the metal mesh (8) is fixed The invention is installed inside a casing (1), a heat dissipation fan (9) is also installed inside the casing (1), a first air outlet (10) is located on a wall plate of the casing (1), a metal mesh (8) is maintained between the heat dissipation fan (9) and the first air outlet (10), a metal tube (11) is mounted between a top heat sink (6) and the metal mesh (8), a second air outlet (12) is provided on the casing (1), and a mounting frame (13) comprises a connecting plate (15) located in the middle thereof and a first strip sheet (14) and a second strip sheet (16) connected to both ends of the connecting plate (15), the first strip sheet (14) and the second strip sheet (16) are parallel to each other, the first strip sheet (14) is perpendicular to the connecting plate (15), and a hole is provided on the second strip sheet (16), and a screw passes through the hole to fix the second strip sheet (16) to the casing (1).
2. A system scene linkage device according to claim 1, characterized in that: Heat dissipation silicone grease is coated on the processor (3) and the RAM module (5).
3. A system scene linkage device according to claim 1, characterized in that: A bracket is rotatably connected to the rear side of the housing (1), and a non-slip rubber strip is fixedly connected to the bottom end of the bracket.
4. A system scene linkage device according to claim 1, characterized in that: Anti-collision sleeves made of flexible material are fixedly connected to the four corners of the casing (1).
5. A system scene linkage device according to claim 1, characterized in that: A temperature sensor is installed in the casing (1), and the temperature sensor is electrically connected to the heat dissipation fan (9).
6. A system scene linkage device according to claim 1, characterized in that: At least two heat dissipation fans (9) are installed, wherein the air induction direction of one of the heat dissipation fans (9) is parallel to the top wall of the casing (1), and the air induction direction of the other heat dissipation fan (9) is parallel to the side wall of the casing (1).