Pump test cooling device

Abstract

The utility model discloses a pump test cooling device, which comprises a liquid cooling plate and a pressing assembly, the liquid cooling plate is internally provided with a cooling channel for cooling liquid circulation, the liquid cooling plate comprises a mounting surface, the mounting surface is provided with at least one liquid cooling groove for accommodating liquid, and the liquid cooling groove is used for accommodating at least one part of a pump; the pressing assembly is arranged on the mounting surface, the pressing assembly comprises at least one pressing mechanism, the pressing mechanism corresponds to the liquid cooling groove in position, and the pressing mechanism is used for abutting against the side, away from the liquid cooling plate, of the pump so as to limit the pump in the liquid cooling groove. According to the embodiment of the invention, at least one liquid cooling groove for accommodating liquid is formed in the mounting surface of the liquid cooling plate, and the liquid arranged in the liquid cooling groove can fill the gap between the pump and the bottom surface of the liquid cooling groove and wrap part of the surface of the pump, so that the pump can transfer heat to the liquid cooling plate more quickly through the liquid, and the heat transfer efficiency is improved. The problem that the performance of the pump is affected and even the pump is burnt due to the fact that the heat generated by the pump in the testing process is too high is avoided.

Description

Technical Field

[0001] The present application relates to the field of laser technology, and in particular to a pump test cooling device. Background Art

[0002] Fiber lasers have become the mainstream direction of laser technology development due to their high photoelectric conversion, simple structure, and good beam quality. Among them, the pump source, as the core component of the fiber laser, needs to be tested for power during its production process. The pump will generate a lot of heat during the test. If the pump under test cannot be cooled in time, the pump temperature will easily be too high, affecting performance or even burning. Utility Model Content

[0003] The embodiment of the present application provides a pump test cooling device, which aims to solve the problem that the heat generated by the pump during the test is too high, which affects the performance of the pump and even causes the pump to burn out.

[0004] The present application provides a pump test cooling device, comprising:

[0005] A liquid cooling plate, wherein a cooling channel for cooling liquid to flow therein is provided, wherein the liquid cooling plate comprises a mounting surface, wherein the mounting surface is provided with at least one liquid cooling groove for accommodating liquid, wherein the liquid cooling groove is used to accommodate at least a portion of a pump;

[0006] A pressing assembly is arranged on the mounting surface, and the pressing assembly includes at least one pressing mechanism, the pressing mechanism corresponds to the position of the liquid cooling tank, and the pressing mechanism is used to abut against a side of the pump away from the liquid cooling plate to limit the pump in the liquid cooling tank.

[0007] In some embodiments, the cooling channel includes a plurality of sub-channels connected in series, the sub-channels extend along a first direction, the plurality of sub-channels are distributed in sequence along a second direction, and the first direction forms an angle with the second direction.

[0008] In some embodiments, a heat-conducting fin is protruding from the inner surface of the sub-channel, and the heat-conducting fin extends along the first direction.

[0009] In some embodiments, a plurality of the heat-conducting fins are protruding from the inner surface of the sub-channel, and the plurality of the heat-conducting fins are sequentially spaced and distributed along the second direction.

[0010] In some embodiments, the heat conducting fins are protruding from the surface of the sub-channel close to the mounting surface.

[0011] In some embodiments, a plurality of the liquid cooling grooves are formed in the mounting surface, and the pressing assembly includes a plurality of pressing mechanisms. The number of the plurality of pressing mechanisms is equal to the number of the plurality of liquid cooling grooves, and they are arranged in one-to-one correspondence.

[0012] In some embodiments, the plurality of liquid cooling grooves are sequentially spaced apart along a first direction; the pressing assembly includes a support beam extending along the first direction, and the plurality of pressing mechanisms are sequentially mounted on the support beam along the first direction.

[0013] In some embodiments, the pressing assembly further includes a plurality of support blocks disposed on the mounting surface. The plurality of support blocks and the plurality of liquid cooling grooves are alternately distributed along the first direction; each support block is respectively connected to the support beam through a support column.

[0014] In some embodiments, the pressing mechanism includes a telescopic rod slidably connected to the support beam and a handle rotatably connected to the support beam. The length direction of the telescopic rod is perpendicular to the mounting surface. The telescopic rod can slide relative to the support beam along the length direction of the telescopic rod. The handle is rotatably connected to the telescopic rod, and the handle can rotate relative to the support beam and the telescopic rod to drive the telescopic rod to slide.

[0015] In some embodiments, an installation portion is provided at one end of the telescopic rod facing the mounting surface, and a buffer pad is provided on one side of the installation portion facing the mounting surface. The buffer pad is used to abut against the side of the pump away from the liquid cooling plate.

[0016] The pump test cooling device provided by the embodiments of the present application has at least one liquid cooling groove for accommodating liquid formed in the mounting surface of the liquid cooling plate, so that the pressing mechanism corresponds to the position of the liquid cooling groove, and the pressing mechanism is used to abut against the side of the pump away from the liquid cooling plate to limit the pump in the liquid cooling groove. When testing the pump, the pressure that the pressing mechanism can exert on the pump can make the pump fit with the bottom surface of the liquid cooling groove, and the liquid provided in the liquid cooling groove can fill the gap between the pump and the bottom surface of the liquid cooling groove and wrap a part of the surface of the pump, so that the pump can transfer heat to the liquid cooling plate faster through the liquid, further improving the cooling efficiency of the liquid cooling plate for the pump, effectively avoiding the problem that the heat generated by the pump during the test is too high, which affects the performance of the pump or even causes the pump to burn out. Description of the Drawings

[0017] The following will make the technical solutions and other beneficial effects of the present application obvious by describing the specific embodiments of the present application in detail in conjunction with the drawings.

[0018] Figure 1 It is a schematic structural diagram of an embodiment of the pump test cooling device provided by the embodiments of the present application;

[0019] Figure 2 The structural schematic diagram of an embodiment of the liquid cooling plate provided by the embodiment of the present application;

[0020] Figure 3 is Figure 2 The cross-sectional view along the A-A direction in

[0021] Figure 4 is Figure 2 The cross-sectional view along the B-B direction in

[0022] Figure 5 is Figure 4 The enlarged view at A in

[0023] Pump test cooling device 100; liquid cooling plate 110; cooling channel 1100; sub-channel 1101; heat conduction fin 1102; mounting surface 111; liquid cooling tank 1111; bottom surface 1112; side surface 1113; boss 1114; table top 1115; pressing assembly 120; support beam 121; hinge part 122; support block 123; support column 124; pressing mechanism 125; telescopic rod 1251; handle 1252; connecting rod 1253; mounting part 1254; buffer pad 1255; first joint 130; second joint 140; first direction X; second direction Y. Specific embodiments

[0024] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative efforts belong to the scope of protection of the present application.

[0025] The following disclosure provides many different embodiments or examples for implementing different structures of the present application. To simplify the disclosure of the present application, the components and settings of specific examples are described below. Of course, they are only examples and are not intended to limit the present application. In addition, the present application may repeat reference numerals and / or reference letters in different examples. This repetition is for the purpose of simplification and clarity, and does not itself indicate the relationship between the various embodiments and / or settings discussed. In addition, the present application provides examples of various specific processes and materials, but those skilled in the art can be aware of the application of other processes and / or the use of other materials.

[0026] The embodiment of the present application provides a pump test cooling device. The following will be described in detail respectively.

[0027] Figure 1A schematic structural diagram of an embodiment of a pump test cooling device provided in an embodiment of the present application. Figure 2 A schematic structural diagram of an embodiment of a liquid cooling plate provided in an embodiment of the present application. Figure 3 for Figure 2 The cross-sectional view along the AA direction. Figures 1 to 3 As shown, the pump test cooling device 100 includes a liquid cooling plate 110 and a pressing assembly 120. The liquid cooling plate 110 is provided with a cooling channel 1100 for the circulation of coolant. The liquid cooling plate 110 includes a mounting surface 111, and the mounting surface 111 is used to support the pump to be tested (not shown in the figure). The pressing assembly 120 is arranged on the mounting surface 111, and the pressing assembly 120 includes at least one pressing mechanism 125, and the pressing mechanism 125 is used to abut against the side of the pump away from the liquid cooling plate 110, so as to limit the pump to the mounting surface 111 of the liquid cooling plate 110, so that the pump and the mounting surface 111 of the liquid cooling plate 110 fit more closely, thereby improving the cooling effect of the liquid cooling plate 110 on the pump. Among them, the coolant can be water or other liquids that can cool the liquid cooling plate 110, which is not limited here.

[0028] When testing the pump, the pump can be placed on the mounting surface 111 of the liquid cooling plate 110, and the pressing mechanism 125 is abutted against the side of the pump facing away from the liquid cooling plate 110, so as to apply pressure to the pump so that the pump and the mounting surface 111 of the mounting plate are more closely fitted. Afterwards, the cooling liquid is circulated to the cooling channel 1100 of the liquid cooling plate 110 through the cooling liquid supply device. Then, the pump is connected to the power supply and the power test fixture, and the pump is turned on to test the power of the pump. Since the pump fits the mounting surface 111 of the mounting plate very well, the heat generated by the pump during operation can be quickly transferred to the liquid cooling plate 110, and heat exchanged with the coolant flowing in the cooling channel 1100, thereby achieving rapid heat dissipation of the pump. After the power test of the pump is completed, the pressing mechanism 125 can be separated from the side of the pump facing away from the liquid cooling plate 110, so as to remove the pump and replace the next pump for testing.

[0029] In some embodiments, Figure 1 and Figure 2 As shown, at least one liquid cooling groove 1111 for accommodating liquid can be provided on the mounting surface 111 of the liquid cooling plate 110, and the liquid cooling groove 1111 is used to accommodate at least a portion of the pump. The pressing mechanism 125 corresponds to the position of the liquid cooling groove 1111, and the pressing mechanism 125 is used to abut against a side of the pump away from the liquid cooling plate 110 to limit the pump in the liquid cooling groove 1111.

[0030] It can be understood that when the pressing mechanism 125 abuts against the side of the pump away from the liquid cooling plate 110, causing the pump to fit against the mounting surface 111 of the mounting plate, there will still be a certain gap between the pump and the mounting surface 111 of the liquid cooling plate 110, and this gap will affect the efficiency of the pump transferring heat to the liquid cooling plate 110.

[0031] In the embodiment of the present application, at least one liquid cooling groove 1111 for accommodating liquid is provided on the mounting surface 111 of the liquid cooling plate 110, the pressing mechanism 125 corresponds to the position of the liquid cooling groove 1111, and the pressing mechanism 125 is used to abut against the side of the pump away from the liquid cooling plate 110 to limit the pump in the liquid cooling groove 1111. When testing the pump, the pressure that the pressing mechanism 125 can exert on the pump can make the pump fit against the bottom surface 1112 of the liquid cooling groove 1111, and the liquid provided in the liquid cooling groove 1111 can fill the gap between the pump and the bottom surface 1112 of the liquid cooling groove 1111 and wrap part of the surface of the pump, so that the pump can transfer heat to the liquid cooling plate 110 faster through the liquid, further improving the cooling efficiency of the liquid cooling plate 110 for the pump, effectively avoiding the problem that the heat generated by the pump during the test is too high, which affects the performance of the pump or even causes the pump to burn out.

[0032] In some embodiments, as Figure 1 , Figure 2 and Figure 4 shown, a plurality of liquid cooling grooves 1111 are provided on the mounting surface 111 of the liquid cooling plate 110, the pressing assembly 120 includes a plurality of pressing mechanisms 125, the number of the plurality of pressing mechanisms 125 is equal to the number of the plurality of liquid cooling grooves 1111, and they are arranged in one-to-one correspondence. Thus, the pump test cooling device 100 can meet the simultaneous testing of multiple pumps, which is beneficial to improving the test efficiency of the pumps.

[0033] Among them, the plurality of liquid cooling grooves 1111 can be arranged at intervals in sequence along the first direction X. The plurality of liquid cooling grooves 1111 can also be distributed in a matrix or other ways on the mounting surface 111 of the liquid cooling plate 110. Of course, the number of the liquid cooling grooves 1111 provided on the mounting surface 111 of the liquid cooling plate 110 can also be one, and this liquid cooling groove 1111 can accommodate multiple pumps, and the plurality of pressing mechanisms 125 all correspond to this liquid cooling groove 1111.

[0034] In the embodiment of the present application, the number and size of the liquid cooling grooves 1111 can be determined according to the requirements of the pump test efficiency and the size of the pump, and there is no limitation here.

[0035] In some embodiments, as Figure 1 shown, the pressing assembly 120 can include a support beam 121 extending along the first direction X, and a plurality of pressing mechanisms 125 are sequentially installed on the support beam 121 along the first direction X, so that the installation of the plurality of pressing mechanisms 125 is more convenient.

[0036] Among them, the pressing assembly 120 may further include a plurality of support blocks 123 provided on the mounting surface 111. The plurality of support blocks 123 and the plurality of liquid cooling grooves 1111 are alternately distributed along the first direction X. Each support block 123 is respectively connected to the support beam 121 through a support column 124, so that the connection between the support beam 121 and the liquid cooling plate 110 is more stable, which is beneficial to improving the abutting stability between the pressing mechanism 125 and the pump.

[0037] Specifically, the support block 123 extends in a rectangular parallelepiped structure along the second direction Y. Both ends of the support block 123 in the length direction are fixedly connected to the liquid cooling plate 110 by screws. The length direction of the support column 124 is perpendicular to the mounting surface 111 of the liquid cooling plate 110. The support beam 121 is substantially parallel to the mounting surface 111 of the liquid cooling plate 110. The middle part of the support block 123 is connected to one end of the support column 124, and the support beam 121 is supported on the other end of the support column 124. Among them, the support column 124 and the support block 123, and the support column 124 and the support beam 121 can be fixedly connected by screws. The second direction Y forms an angle with the first direction X. The angle formed by the second direction Y and the first direction X can be a right angle or an acute angle. In addition, the second direction Y and the first direction X can be respectively parallel to the mounting surface 111 of the liquid cooling plate 110.

[0038] In some embodiments, as Figure 1 shown, the pressing mechanism 125 may include a telescopic rod 1251 slidably connected to the support beam 121, and a handle 1252 rotatably connected to the support beam 121. The length direction of the telescopic rod 1251 is perpendicular to the mounting surface 111. The telescopic rod 1251 can slide relative to the support beam 121 along the length direction of the telescopic rod 1251. The handle 1252 is rotatably connected to the telescopic rod 1251. The handle 1252 can rotate relative to the support beam 121 and the telescopic rod 1251 to drive the telescopic rod 1251 to slide, so that the end of the telescopic rod 1251 close to the liquid cooling plate 110 approaches or moves away from the liquid cooling plate 110.

[0039] When the telescopic rod 1251 slides towards the liquid cooling plate 110 under the drive of the handle 1252, the end of the telescopic rod 1251 close to the liquid cooling plate 110 moves towards the liquid cooling plate 110 and directly or indirectly abuts against the pump, so as to limit the pump in the liquid cooling groove 1111. When the telescopic rod 1251 slides away from the liquid cooling plate 110 under the drive of the handle 1252, the pressure exerted by the telescopic rod 1251 on the pump is cancelled, and the pump can be removed from the liquid cooling plate 110.

[0040] Specifically, the pressing mechanism 125 can be an elbow clamp. Among them, the pressing mechanism 125 further includes a connecting rod 1253. One end of the connecting rod 1253 is hinged to the support beam 121, and the other end of the connecting rod 1253 is hinged to the handle 1252. The handle 1252 is hinged to the end of the telescopic rod 1251 away from the liquid cooling plate 110. The hinge axis of the handle 1252 and the telescopic rod 1251 is not coaxial with the hinge axis of the handle 1252 and the connecting rod 1253. Thus, when the handle 1252 rotates relative to the support beam 121, the telescopic rod 1251 can be driven to slide. Among them, a hinged portion 122 can be convexly provided on the side of the support beam 121 facing away from the liquid cooling plate 110. One end of the connecting rod 1253 is hinged to the hinged portion 122, so that the connecting rod 1253 is indirectly hinged to the support beam 121. A through hole (not shown in the figure) for the telescopic rod 1251 to pass through is further provided in the support beam 121. The telescopic rod 1251 passes through the hinged portion 122 and the through hole.

[0041] In some embodiments, as Figure 1 shown, an installation portion 1254 can be provided at one end of the telescopic rod 1251 facing the installation surface 111. A buffer pad 1255 is provided on the side of the installation portion 1254 facing the installation surface 111. The buffer pad 1255 is used to abut against the side of the pump away from the liquid cooling plate 110. Thus, the pressing mechanism 125 can abut against the pump through the buffer pad 1255, and it can avoid the situation that the force between the pressing mechanism 125 and the pump is too large, resulting in damage to the pump.

[0042] Specifically, the installation portion 1254 is provided in a plate shape. The plate surface of the installation portion 1254 is substantially perpendicular to the length direction of the telescopic rod 1251. A buffer pad 1255 is provided on the side plate surface of the installation portion 1254 facing the liquid cooling plate 110. The material of the buffer pad 1255 can be a flexible material such as silica gel, rubber, or sponge.

[0043] In some embodiments, as Figures 3 to 5 shown, the cooling channel 1100 includes a plurality of sub-channels 1101 connected in series in sequence. The sub-channels 1101 extend along the first direction X, and the plurality of sub-channels 1101 are sequentially spaced apart along the second direction Y. The first direction X and the second direction Y form an angle. Thus, the cooling channel 1100 is distributed in an S shape in the liquid cooling plate 110, and the distribution of the cooling channel 1100 is more uniform, enabling each area of the liquid cooling plate 110 to have a better heat dissipation effect. Moreover, when the plurality of liquid cooling grooves 1111 are also sequentially spaced apart along the first direction X, the cooling effect of the cooling channel 1100 on each liquid cooling groove 1111 is basically the same.

[0044] In some embodiments, heat-conducting fins 1102 may be convexly provided on the inner surface of the sub-channel 1101, and the heat-conducting fins 1102 extend along the first direction X. The provision of the heat-conducting fins 1102 can improve the heat exchange efficiency between the liquid cooling plate 110 and the coolant in the sub-channel 1101, which is beneficial to further improving the cooling and heat dissipation effect of the liquid cooling plate 110 on the pump.

[0045] Among them, a plurality of heat-conducting fins 1102 may be convexly provided on the inner surface of the sub-channel 1101, and the plurality of heat-conducting fins 1102 are sequentially spaced apart along the second direction Y to further improve the heat exchange efficiency between the liquid cooling plate 110 and the coolant in the sub-channel 1101.

[0046] In addition, the heat-conducting fins 1102 may be convexly provided on the surface of the sub-channel 1101 close to the mounting surface 111, so that the heat-conducting fins 1102 are closer to the pump. That is, the heat-conducting fins 1102 are closer to the heat source and can transfer the heat conducted from the pump to the liquid cooling plate 110 to the coolant faster.

[0047] Specifically, a plurality of heat-conducting fins 1102 are convexly provided on the surface of each sub-channel 1101 close to the mounting surface 111, and the side surfaces of the plurality of heat-conducting fins 1102 are respectively perpendicular to the second direction Y. The plurality of heat-conducting fins 1102 are spaced apart along the second direction Y.

[0048] In some embodiments, as Figure 1 and Figure 2 shown, a boss 1114 may be convexly provided on the mounting surface 111 of the liquid cooling plate 110, and the boss 1114 is located at the entrance or the exit of the cooling channel 1100, thereby increasing the thickness of the liquid cooling plate 110 at the entrance or the exit of the cooling channel 1100 to facilitate the installation of connectors at the entrance or the exit of the cooling channel 1100.

[0049] Among them, the entrance and / or the exit of the cooling channel 1100 may be located on the side surface 1113 of the liquid cooling plate 110 along the first direction X or the second direction Y, the boss 1114 is located at one end of the liquid cooling plate 110 along the first direction X or the second direction Y and is flush with the corresponding side surface 1113, and a first connector 130 is installed at the entrance and / or the exit of the side surface 1113. The coolant supply device may be communicated with the first connectors 130 at the entrance and the exit to supply coolant to the cooling channel 1100.

[0050] In addition, an opening (not shown in the figure) communicating with the cooling channel 1100 may be formed on the tabletop 1115 of the boss 1114, and a second joint 140 may be installed at the opening. The coolant supply device may communicate with the second joint 140 to supply coolant to the cooling channel 1100. Herein, the pipe diameters of the second joint 140 and the first joint 130 may be different, so that the liquid cooling plate 110 can communicate with coolant supply devices of different specifications.

[0051] In the above embodiments, the descriptions of the various embodiments have their respective emphases. For parts not detailed in a certain embodiment, reference may be made to the relevant descriptions of other embodiments.

[0052] The above has introduced in detail a pump test cooling device provided by an embodiment of the present application. Specific examples are used herein to elaborate on the principle and implementation manner of the present application. The description of the above embodiments is only used to help understand the technical solution and its core idea of the present application; those of ordinary skill in the art should understand that: they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

[0053] In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation of the present application. In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of the described features. In the description of the present application, "a plurality" means two or more, unless otherwise specifically defined.

[0054] In the description of the present application, it should be noted that unless otherwise clearly defined and limited, the terms "installed", "connected", and "coupled" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or a connection that allows mutual communication; it can be directly connected, or indirectly connected through an intermediate medium, and can be the internal connection of two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0055] In the present application, unless otherwise clearly defined and limited, the first feature being "above" or "below" the second feature may include direct contact between the first and second features, or may include the first and second features not being in direct contact but in contact through additional features therebetween. Moreover, the first feature being "above", "over", and "on top of" the second feature includes the first feature being directly above and diagonally above the second feature, or merely indicating that the first feature has a higher horizontal height than the second feature. The first feature being "below", "beneath", and "underneath" the second feature includes the first feature being directly below and diagonally below the second feature, or merely indicating that the first feature has a lower horizontal height than the second feature.

Claims

1. A pump test cooling device, characterized in that: include: A liquid cooling plate, wherein a cooling channel for cooling liquid to flow therein is provided, wherein the liquid cooling plate comprises a mounting surface, wherein the mounting surface is provided with at least one liquid cooling groove for accommodating liquid, wherein the liquid cooling groove is used to accommodate at least a portion of a pump; A pressing assembly is arranged on the mounting surface, and the pressing assembly includes at least one pressing mechanism, the pressing mechanism corresponds to the position of the liquid cooling tank, and the pressing mechanism is used to abut against a side of the pump away from the liquid cooling plate to limit the pump in the liquid cooling tank.

2. The pump test cooling device according to claim 1, characterized in that: The cooling channel comprises a plurality of sub-channels connected in series in sequence, wherein the sub-channels extend along a first direction, and the plurality of sub-channels are distributed in sequence at intervals along a second direction, and the first direction forms an angle with the second direction.

3. The pump test cooling device according to claim 2, characterized in that: The inner surface of the sub-channel is protrudingly provided with a heat-conducting fin, and the heat-conducting fin extends along the first direction.

4. The pump test cooling device according to claim 3, characterized in that: A plurality of heat-conducting fins are protrudingly provided on the inner surface of the sub-channel, and the plurality of heat-conducting fins are sequentially spaced and distributed along the second direction.

5. The pump test cooling device according to claim 3, characterized in that: The heat conducting fin is protrudingly arranged on the surface of the sub-channel close to the mounting surface.

6. The pump test cooling device according to any one of claims 1 to 5, characterized in that: The mounting surface is provided with a plurality of the liquid cooling grooves, the pressing assembly comprises a plurality of the pressing mechanisms, the number of the plurality of the pressing mechanisms is equal to the number of the plurality of the liquid cooling grooves, and the plurality of the pressing mechanisms are arranged in a one-to-one correspondence.

7. The pump test cooling device according to claim 6, characterized in that: The plurality of liquid cooling grooves are sequentially spaced apart and distributed along a first direction; the pressing assembly comprises a support beam extending along the first direction, and the plurality of pressing mechanisms are sequentially installed on the support beam along the first direction.

8. The pump test cooling device according to claim 7, characterized in that: The pressing assembly also includes a plurality of support blocks arranged on the mounting surface, and the plurality of support blocks and the plurality of liquid cooling grooves are alternately distributed along the first direction; each of the support blocks is connected to the support beam via a support column.

9. The pump test cooling device according to claim 7, characterized in that: The pressing mechanism includes a telescopic rod slidably connected to the support beam, and a handle rotatably connected to the support beam, the length direction of the telescopic rod is perpendicular to the mounting surface, the telescopic rod can slide relative to the support beam along the length direction of the telescopic rod, the handle is rotatably connected to the telescopic rod, and the handle can rotate relative to the support beam and the telescopic rod to drive the telescopic rod to slide.

10. The pump test cooling device as claimed in claim 9, characterized in that: A mounting portion is provided at one end of the telescopic rod facing the mounting surface, and a buffer pad is provided at one side of the mounting portion facing the mounting surface. The buffer pad is used to abut against a side of the pump facing away from the liquid cooling plate.

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