Solid-state relay power device installation structure
By using thermal gel to connect the heat sink in solid state relays, the problems of low efficiency, high cost and potential damage when fixed power devices of existing solid state relays are solved, and more efficient production and processing and lower scrapping rates are achieved.
Patent Information
- Application Number
- CN202421772313.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-25
- Publication Date
- 2025-05-27
- Estimated Expiration
- 2034-07-25
AI Technical Summary
During the production and processing of existing solid-state relays, the fixed power device method has problems such as slow production speed, reduced thermal conductivity, high cost, and potential damage.
By applying a thermal gel on the bottom end of the connecting substrate of the semiconductor power device and connecting it with the heat sink, the connecting substrate is crimped on the heat sink by using pressure to achieve adhesion fixation.
Improve production and processing efficiency, avoid damage problems caused by high-temperature welding, and reduce the scrap rate and production costs of semiconductor power devices.
Smart Images
Figure CN222916466U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of solid state relays, in particular to an installation structure of a power device of a solid state relay. Background Technique
[0002] A solid state relay is a product that uses a small current to control the conduction or cut-off of semiconductor power components to switch large current and high voltage loads of users. Generally, power components such as unidirectional thyristors, bidirectional thyristors, triodes, IGBTs, and field effect transistors are used inside. Since there is a voltage drop in these power components themselves during the process of controlling the loads of users, it causes the temperature rise of the power devices to be too high, and long-term use will cause damage to the power devices. Therefore, when factories actually produce solid state relays, the power devices will be fixed on a metal material, and this metal material is used to dissipate the heat generated when the power devices switch loads, reducing the temperature rise of the power devices.
[0003] There are usually two methods for fixing power devices during the production and processing of existing solid state relays. 1. Apply thermal conductive silicone grease on the power device and then fix it on the surface of the heat sink with screws. Although this method has a simple process, its disadvantages are obvious. ⑴ The production and processing speed is relatively slow. ⑵ The thermal conductive silicone grease is prone to drying after a long time, resulting in a significant reduction in the thermal conductivity. 2. Apply solder paste on the metal substrate of the power device and directly weld it on the heat dissipation metal material. This process has good heat dissipation effect, but it has the following disadvantages. ⑴ To achieve welding on the heat dissipation material, some materials cannot be directly welded. For example, in the heat dissipation materials, a large amount of aluminum is used. To weld the metal substrate of the power device on the aluminum material, some materials with better solderability, such as copper tin, etc., must be electroplated on the aluminum material. This method not only increases the cost, but also has the hidden danger that the electroplated material is prone to peeling from the original metal material when the heat is too high. ⑵ To weld the metal substrate of the power device on the heat dissipation material, high temperature is required to melt the solder paste, and the continuous high temperature is likely to cause damage to the power device. Content of the Utility Model
[0004] The utility model aims to provide an installation structure of a power device of a solid state relay to solve the problems raised in the above background technique.
[0005] To achieve the above purpose, the utility model provides the following technical solutions:
[0006] An installation structure of a power device of a solid state relay, including an upper cover, a housing, and a circuit board provided with electronic components inside the housing, characterized in that: a semiconductor power device is provided inside the housing, an installation groove is provided at the bottom of the housing, a heat sink is provided in the installation groove, a connection substrate is provided at the bottom of the semiconductor power device, a thermal conductive gel is provided on the bottom surface of the connection substrate, and the connection substrate is connected to the heat sink through the thermal conductive gel.
[0007] Preferably, the semiconductor power device is electrically connected to the circuit board.
[0008] Preferably, a plurality of wiring terminals are provided at both the front and rear of the circuit board.
[0009] Preferably, a plurality of inlet ports are provided at both the front and rear of the housing.
[0010] Advantageous Effects
[0011] One or more of the above technical solutions in the installation structure of the solid-state relay power device provided by the embodiment of the present invention have at least one of the following technical effects:
[0012] Through the above technical solutions of the present invention, the semiconductor power device and the heat sink are connected by a thermal gel, and the connection substrate of the semiconductor power device is pressed onto the heat sink with pressure. After the thermal gel is cured, the semiconductor power device and the heat sink can be adhesively fixed, so that screw fixation is not required, improving the production and processing efficiency; and the problem of damage to the semiconductor power device caused by using high-temperature soldering is avoided, ensuring both the installation efficiency of the semiconductor power device and the heat sink, and reducing the scrap rate of the semiconductor power device and the loss of production costs. BRIEF DESCRIPTION OF THE DRAWINGS
[0013] Figure 1 is a schematic diagram of the overall structure of the present invention;
[0014] Figure 2 is a schematic diagram of the side cross-sectional structure of the present invention;
[0015] Figure 3 is a schematic diagram of the installation structure of the heat sink and the semiconductor power device of the present invention;
[0016] The corresponding relationship between the reference numerals and the component names in the drawings is as follows:
[0017] 1. Upper cover; 2. Housing; 3. Circuit board; 4. Semiconductor power device; 5. Installation groove; 6. Heat sink; 7. Connection substrate; 8. Thermal gel; 9. Wiring terminal; 10. Inlet port. DETAILED DESCRIPTION OF THE EMBODIMENTS
[0018] The technical solutions of the present invention will be clearly and completely described below in conjunction with the embodiments. Obviously, the described embodiments are some, but not all, of the embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.
[0019] In the description of the present utility model, it should be understood that the orientation or positional relationship indicated by terms such as "upper", "lower", "left", "right", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present utility model.
[0020] In the description of the present utility model, it should also be noted that unless otherwise clearly specified and defined, the terms "set", "installed", "connected", "coupled" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.
[0021] As Figures 1-3 shown, it is a schematic structural diagram of an installation structure of a solid-state relay power device according to a preferred embodiment of the present utility model;
[0022] In this embodiment, it includes an upper cover 1, a housing 2, and a circuit board 3 provided with electronic components inside the housing 1. A semiconductor power device 4 is provided inside the housing 2. The semiconductor power device 4 is generally a power element such as a unidirectional thyristor, a bidirectional thyristor, a triode, an IGBT, a field effect transistor, etc. An installation groove 5 is provided at the bottom of the housing 2, and a heat sink 6 is snap-fitted in the installation groove 5. The heat sink 6 is made of a metal material. A connection substrate 7 is encapsulated at the bottom of the semiconductor power device 4. The connection substrate 7 is made of a metal material. A heat-conducting gel 8 is uniformly coated on the bottom surface of the connection substrate 7. The connection substrate 7 is connected to the heat sink 6 through the heat-conducting gel 8.
[0023] In this embodiment, the semiconductor power device 4 is electrically connected to the circuit board 3. A plurality of negative lead pins are provided on the semiconductor power device 4 and are connected to the circuit board 3 through the plurality of negative lead pins.
[0024] In this embodiment, a plurality of wiring terminals 9 are provided at both the front and rear of the circuit board 3. The plurality of wiring terminals 9 are used for connecting with wires.
[0025] In this embodiment, a plurality of wire inlet and outlet ports 10 are provided at both the front and rear of the housing 2. The plurality of wire inlet and outlet ports 10 are used for wires to enter and exit.
[0026] For an installation structure of a solid-state relay power device of the present utility model, its installation method, connection method or setting method are all common mechanical methods, and any method that can achieve its beneficial effects can be implemented.
[0027] The technologies not described in detail in this utility model are all well-known technologies. Those skilled in the art can conveniently implement this utility model on the basis of understanding this specification, and the content shown in the drawings is a part of this specification.
[0028] The above content further elaborates on this utility model in combination with specific implementation manners. It cannot be determined that the specific implementation of this utility model is only limited to these descriptions. For those of ordinary skill in the technical field to which this utility model belongs, without departing from the concept of this utility model, several simple deductions or substitutions can still be made, and all should be regarded as falling within the protection scope determined by the claims submitted for this utility model.
Claims
1. A solid-state relay power device mounting structure, comprising an upper cover (1), a housing (2), and a circuit board (3) having electronic components disposed inside the housing (2), characterized in that: A semiconductor power device (4) is arranged inside the shell (2), a mounting groove (5) is arranged at the bottom of the shell (2), a heat sink (6) is arranged in the mounting groove (5), a connection substrate (7) is arranged at the bottom of the semiconductor power device (4), a heat conducting gel (8) is arranged on the bottom surface of the connection substrate (7), and the connection substrate (7) is connected to the heat sink (6) via the heat conducting gel (8).
2. A solid-state relay power device mounting structure according to claim 1, characterized in that: The semiconductor power device (4) is electrically connected to the circuit board (3).
3. A solid-state relay power device mounting structure according to claim 1, characterized in that: The front and rear parts of the circuit board (3) are both provided with a plurality of connection terminals (9).
4. A solid-state relay power device mounting structure according to claim 1, characterized in that: The front and rear parts of the housing (2) are both provided with a plurality of wire inlets (10).