Ceramic matrix assembly, atomizing core, atomizer and atomizing device

Abstract

The utility model provides a ceramic base body assembly, an atomizing core, an atomizer and an atomizing device.The ceramic base body assembly is used for the atomizing core and relates to the technical field of atomization, the ceramic base body assembly comprises a ceramic base body and a bonding pad, the ceramic base body comprises a heating face, the heating face is provided with a concave part, and the bonding pad is arranged on the ceramic base body; the heating surface is used for being in contact with a heating wire of the atomizing core. The bonding pad is arranged on the heating surface, at least part of the bonding pad is embedded into the concave part, and the bonding pad and the ceramic base body are integrally formed and used for welding a heating wire. According to the ceramic matrix assembly provided by the invention, the technical problems of large design limitation and short service life of the heating wire in the prior art can be solved.

Description

Technical Field

[0001] This application belongs to the technical field of atomization, and more specifically, relates to a ceramic matrix component, an atomization core, an atomizer, and an atomization device. Background Art

[0002] As a key component of products such as electronic cigarettes, the performance of the ceramic atomization core directly affects the user experience of the product. For a ceramic atomization core sintered at a low temperature, a heating wire and a ceramic matrix are usually sintered together to form a shape. Due to the low sintering temperature, there are more impurities inside the ceramic, and the atomization taste of the ceramic is not pure enough.

[0003] In related technologies, a ceramic atomization core sintered at a high temperature can improve the atomization purity. However, a high-temperature ceramic atomization core generally prepares a heating wire through screen printing technology, and the design limitations of the heating wire are large, and the service life is low. Utility Model Content

[0004] The purpose of the embodiments of this application is to provide a ceramic matrix component, an atomization core, an atomizer, and an atomization device to solve the technical problems of large design limitations and low service life of the heating wire existing in related technologies.

[0005] To achieve the above purpose, the technical solution adopted in this application is:

[0006] In a first aspect, this application provides a ceramic matrix component for an atomization core. The ceramic matrix component includes a ceramic matrix and a pad. The ceramic matrix includes a heating surface, and the heating surface is provided with a recess. The heating surface is used to contact the heating wire of the atomization core. The pad is arranged on the heating surface, and at least part of the pad is embedded in the recess. The pad is integrally formed with the ceramic matrix and is used for welding the heating wire.

[0007] Through the above technical solution, at least part of the pad is embedded in the recess, and the pad is integrally formed with the ceramic matrix and is used for welding the heating wire. The heating wire does not need to be connected to the ceramic matrix by sintering and printing at a high temperature, and can be directly welded to the pad. In this way, the heating wire can be directly welded to the pad, which can reduce the restrictions on the heating wire, thereby being beneficial to reducing the design limitations of the heating wire, and the oxidation degree during the welding process of the heating wire is low, which can increase the service life.

[0008] Therefore, the ceramic matrix component provided by this application can solve the technical problems of large design limitations and low service life of the heating wire existing in related technologies.

[0009] In some embodiments, the pad and the ceramic matrix are integrally sintered and formed; or, the pad and the ceramic matrix are integrally injection molded.

[0010] In this way, the connection stability between the pad and the ceramic matrix is good, which is beneficial to improving the structural strength of the ceramic matrix component.

[0011] In some embodiments, the pad includes opposite first and second connection surfaces. The first connection surface is connected to the recess, and the second connection surface is for welding the heating wire. Wherein, the second connection surface is flush with the heating surface, or the second connection surface is lower than the heating surface, or the second connection surface is higher than the heating surface.

[0012] In this way, the processing requirements for the pad and the ceramic substrate are reduced, and the processing difficulty and cost can be reduced. In addition, when the pad is welded to the heating wire, the requirements for the heating wire are reduced, which is beneficial to further reducing the design limitations of the heating wire.

[0013] In some embodiments, the second connection surface is a flat surface, or the second connection surface is an arc surface. In this way, the second connection surface of the pad can be a flat surface or an arc surface, and the pad has good universality and can be specifically selected according to the shape of the heating wire, reducing the requirements for the heating wire and being beneficial to further reducing the design limitations of the heating wire.

[0014] In a second aspect, the present application provides an atomization core, which includes a heating wire and any one of the above ceramic substrate components. The heating wire is connected to the pad and contacts the heating surface.

[0015] The atomization core provided by the present application has similar technical effects to the above ceramic substrate components, which will not be elaborated here.

[0016] In some embodiments, the heating wire includes a plurality of spaced connection parts, and the ceramic substrate component includes a plurality of spaced pads. One connection part is welded to one pad.

[0017] In this way, the ceramic substrate component can be welded to the heating wire through a plurality of pads, and the connection stability is good. Moreover, the positions of the plurality of pads can be adjusted according to the shape of the heating wire, which can reduce the design limitations of the heating wire.

[0018] In some embodiments, the pad includes opposite first and second connection surfaces. The first connection surface is connected to the recess, and the second connection surface is welded to the connection part. Wherein, the second connection surface is flush with the heating surface, and the connection part is flush with the heating surface; or the second connection surface is lower than the heating surface, and a part of the connection part extends into the recess; or the second connection surface is higher than the heating surface, and the connection part is spaced apart from the heating surface.

[0019] In this way, the processing requirements for the pad and the ceramic substrate are reduced, and the processing difficulty and cost can be reduced. In addition, the positional relationship between the second connection surface of the pad and the heating surface can correspond to the position of the connection part of the heating wire, so that the pad can meet different heating wires. When the pad is welded to the heating wire, the requirements for the heating wire are reduced, which is beneficial to further reducing the design limitations of the heating wire.

[0020] In some embodiments, the connecting portion includes a third connecting surface. The connecting portion is welded to the second connecting surface through the third connecting surface. The area of the second connecting surface is less than or equal to the area of the third connecting surface, and the second connecting surface is located within the third connecting surface.

[0021] In this way, the heating wire can cover the pad, enabling the heating wire to be fully welded to the pad, resulting in good connection stability and being not easily detached.

[0022] In a third aspect, the present application provides an atomizer, and the atomizer includes any one of the above atomizer cores. The atomizer provided by the present application has similar technical effects to the above atomizer core, which will not be elaborated herein.

[0023] In a fourth aspect, the present application provides an atomization device, and the atomization device includes the above atomizer. The atomization device provided by the present application has similar technical effects to the above atomizer core, which will not be elaborated herein. Description of the Drawings

[0024] To more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0025] Figure 1 One of the structural schematic diagrams of the atomizer core provided by the embodiment of the present application;

[0026] Figure 2 One of the cross-sectional structural diagrams of the atomizer core provided by the embodiment of the present application;

[0027] Figure 3 Another structural schematic diagram of the atomizer core provided by the embodiment of the present application;

[0028] Figure 4 Another cross-sectional structural diagram of the atomizer core provided by the embodiment of the present application;

[0029] Figure 5 Another structural schematic diagram of the atomizer core provided by the embodiment of the present application;

[0030] Figure 6 Another cross-sectional structural diagram of the atomizer core provided by the embodiment of the present application;

[0031] Figure 7 One of the structural schematic diagrams of the ceramic matrix assembly provided by the embodiment of the present application;

[0032] Figure 8 Another structural schematic diagram of the ceramic matrix assembly provided by the embodiment of the present application;

[0033] Figure 9 This is the third structural schematic diagram of the ceramic matrix component provided by the embodiment of the present application;

[0034] Figure 10 This is one of the partial sectional structural schematic diagrams of the atomizing core provided by the embodiment of the present application;

[0035] Figure 11 This is the second partial sectional structural schematic diagram of the atomizing core provided by the embodiment of the present application;

[0036] Figure 12 This is the third partial sectional structural schematic diagram of the atomizing core provided by the embodiment of the present application;

[0037] Figure 13 This is the fourth partial sectional structural schematic diagram of the atomizing core provided by the embodiment of the present application;

[0038] Figure 14 This is the fifth partial sectional structural schematic diagram of the atomizing core provided by the embodiment of the present application;

[0039] Figure 15 This is the sixth partial sectional structural schematic diagram of the atomizing core provided by the embodiment of the present application;

[0040] Figure 16 This is the partial structural schematic diagram after the heating wire is welded to the pad provided by the embodiment of the present application.

[0041] Among them, each reference numeral in the figure:

[0042] 100 - atomizing core; 10 - ceramic matrix component; 11 - ceramic matrix; 111 - cavity; 112 - heating surface; 113 - recessed part; 12 - pad; 121 - first connection surface; 122 - second connection surface; 20 - heating wire; 21 - first electrode; 22 - heating wire main body; 23 - second electrode; 24 - connecting part; 241 - third connection surface. Detailed implementation manners

[0043] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application clearer, the present application will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0044] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0045] It should be understood that the orientation or positional relationship indicated by terms such as "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present application.

[0046] In addition, the terms "first" and "second" are only used for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present application, "a plurality" means two or more unless otherwise specifically defined.

[0047] As a key component of atomization products such as electronic cigarettes, the performance of the ceramic atomization core directly affects the user experience of the product. Currently, ceramic atomization cores can be classified into two categories: low-temperature sintered (600°C to 800°C) ceramics and high-temperature sintered (above 1200°C) ceramics with reference to the sintering temperature.

[0048] The advantage of low-temperature sintering is that the sintering temperature is low, and metal heating wires made of FeCrAl and NiCr materials can be sintered together with the ceramic, and the preparation process is relatively simple. However, due to the relatively low sintering temperature, there are more impurities inside the ceramic, and the atomization taste of the ceramic is not pure enough.

[0049] The sintering temperature of high-temperature sintered ceramics is high, and generally, heating wires made of metal materials such as FeCrAl and NiCr materials cannot be sintered together. The heating wires on high-temperature ceramic atomization cores are mostly prepared by screen printing technology. The heating wires prepared by this method are mostly made of high-temperature metals such as silver powder and tungsten powder to form printing pastes, and the metal particles are stacked through screen printing and form a ceramic atomization core combined with high-temperature ceramics after high-temperature co-melting sintering.

[0050] The inventors found that high-temperature sintered ceramic atomization cores can improve atomization purity, but the heating wires of high-temperature ceramic atomization cores need to meet the preparation process, the design limitations of the heating wires are large, and they are in a high-temperature state during the preparation process, are easily oxidized, and the service life is reduced.

[0051] To solve the above technical problems, an embodiment of the present application provides an atomization device, and the atomization device can be an electronic cigarette or other atomization products. Hereinafter, the atomization device will be described by taking an electronic cigarette as an example.

[0052] The atomizing device provided by the embodiment of the present application includes an atomizer, which is used to atomize the e-liquid in the atomizer to generate smoke. The atomizer includes an atomizing core, and the atomizing core is a key component for the atomizer to atomize the e-liquid.

[0053] Please refer to Figures 1 to 6 together. Now, the atomizing core 100 provided by the embodiment of the present application will be described. The atomizing core 100 provided by the embodiment of the present application includes a ceramic matrix assembly 10 and a heating wire 20.

[0054] The ceramic matrix assembly 10 includes a ceramic matrix 11 and a pad 12. The ceramic matrix 11 includes a heating surface 112, and the heating surface 112 is provided with a recess 113. The pad 12 is arranged on the heating surface 112, and at least part of the pad 12 is embedded in the recess 113, and the pad 12 is integrally formed with the ceramic matrix 11. Among them, the pad 12 can be entirely embedded in the recess 113 or partially embedded in the recess 113.

[0055] It can be understood that the ceramic matrix 11 is a porous ceramic formed by high-temperature sintering or injection molding, which is beneficial to improving the purity of the atomized e-liquid.

[0056] Exemplarily, the pad 12 and the ceramic matrix 11 are integrally sintered and formed.

[0057] Exemplarily, the pad 12 and the ceramic matrix 11 are integrally injection-molded.

[0058] In this way, the pad 12 and the ceramic matrix 11 are integrally formed during the high-temperature sintering or injection molding process, and the connection stability between the pad 12 and the ceramic matrix 11 is good, which is beneficial to improving the structural strength of the ceramic matrix assembly 10 and the service life of the atomizing core 100.

[0059] A cavity 111 is provided on the side of the ceramic matrix 11 facing away from the heating wire 20. The cavity 111 is used to store e-liquid, and the e-liquid can enter the micropores of the ceramic matrix 11 from the cavity 111.

[0060] Among them, the heating wire 20 includes a first electrode 21, a heating wire body 22 and a second electrode 23. The first electrode 21 and the second electrode 23 are respectively connected to both ends of the heating wire 20 and are used to connect to a power source. The pad 12 is welded to the heating wire 20, and the heating wire 20 is in contact with the heating surface 112 to transfer heat to the ceramic matrix 11, so as to atomize the e-liquid in the micropores of the ceramic matrix 11.

[0061] Through the above technical solution, the heating wire 20 does not need to be connected to the ceramic substrate 11 by sintering or printing at high temperature, and can be directly welded to the pad 12. In this way, the direct welding of the heating wire 20 to the pad 12 can reduce the limitations on the heating wire 20, thereby facilitating the reduction of the design limitations of the heating wire 20, and the oxidation degree during the welding process of the heating wire 20 is low, which can increase the service life.

[0062] Thus, the ceramic substrate assembly 10 provided by this application can solve the technical problems of large design limitations and low service life of the heating wire 20 existing in the related art.

[0063] Please continue to refer to Figure 1 and Figure 2 , in some embodiments, the ceramic substrate 11 can be cylindrical, the heating wire body 22 can include a plurality of annular bodies, the plurality of annular bodies are sequentially sleeved and connected together, and the first electrode 21 and the second electrode 23 are connected to the outermost annular body.

[0064] In this embodiment, the ceramic substrate assembly 10 can be installed in an atomizer having a cylindrical cavity.

[0065] Please continue to refer to Figure 3 and Figure 4 , in some embodiments, the ceramic substrate 11 can be a cuboid structure, the heating wire body 22 can include a plurality of quadrilateral frames, the plurality of quadrilateral frames are sequentially connected to form a mesh structure, and the first electrode 21 and the second electrode 23 are respectively connected to both ends of the mesh structure.

[0066] In this embodiment, the ceramic substrate assembly 10 can be installed in an atomizer having a cuboid-shaped cavity.

[0067] Please continue to refer to Figure 5 and Figure 6 , in some embodiments, the ceramic substrate 11 can be a cube structure, the heating wire body 22 can include a plurality of square frames, the plurality of square frames are sequentially sleeved and connected together, and the first electrode 21 and the second electrode 23 are connected to the outermost annular body.

[0068] In this embodiment, the ceramic substrate assembly 10 can be installed in an atomizer having a cube-shaped cavity.

[0069] In other embodiments, the ceramic substrate 11 can also be structures such as a prism or a triangular block, and the shape of the heating wire 20 can also be adjusted accordingly.

[0070] It can be understood that the ceramic substrate assembly 10 provided by the embodiments of this application can be specifically designed according to the structure of the atomizer, and the shapes of the ceramic substrate 11 and the heating wire 20 can be adjusted according to the internal structure of the atomizer, with strong designability.

[0071] Please refer to Figure 7 、 Figure 8 and Figure 9 as well. In some embodiments, the ceramic matrix component 10 includes a plurality of pads 12 spaced apart. The positions and numbers of the pads 12 can be adjusted according to the shape of the heating wire 20 so that the heating wire 20 can be stably welded to the pads 12.

[0072] Please continue to refer to Figure 2 、 Figure 4 、and Figure 6 as well. The heating wire 20 includes a plurality of connecting portions 24 spaced apart. One connecting portion 24 is welded to one pad 12.

[0073] In this way, the ceramic matrix component 10 can be welded to the heating wire 20 through a plurality of pads 12, and the connection stability is good. Moreover, the positions of the plurality of pads 12 can be adjusted according to the shape of the heating wire 20, which can reduce the design limitations of the heating wire 20.

[0074] Please refer to Figure 10 . In some embodiments, the pad 12 includes opposite first and second connection surfaces 121 and 122. The first connection surface 121 is connected to the recess 113, and the second connection surface 122 is welded to the connecting portion 24. In this way, the pad 12 is welded to the heating wire 20.

[0075] It can be understood that the recess 113 can be a blind hole, a pit or other recessed structures. The cross-sectional shape (the cross-section parallel to the heating surface 112) of the recess 113 corresponds to the cross-sectional shape (the cross-section parallel to the heating surface 112) of the pad 12. The cross-sectional shape of the pad 12 can be square, circular, triangular, etc.

[0076] Exemplarily, the recess 113 is a cylindrical hole. Correspondingly, the pad 12 is a cylindrical structure.

[0077] Exemplarily, the recess 113 is a square hole. Correspondingly, the pad 12 is a square structure, that is, the cross-section of the pad 12 is square.

[0078] In addition, the value range of the depth h of the recess 113 can be: 0.5 mm ≤ h ≤ 3 mm. The value range of the maximum dimension d of the cross-section of the pad 12 in the radial direction can be: 0.05 mm ≤ d ≤ 1.5 mm. For example, when the pad 12 is a cylinder, the diameter of the pad 12 is d.

[0079] It can be understood that the depth of the recess 113 and the size of the pad 12 can be specifically designed according to the size of the ceramic matrix 11.

[0080] Please refer to Figure 11, Exemplarily, the recess 113 is a conical blind hole, and the cross-sectional dimension of the recess 113 gradually decreases in the direction close to the heating wire 20 (direction A in the figure). Correspondingly, the pad 12 is also a cone. In this way, the pad 12 is embedded in the recess 113 and abuts against the side wall of the recess 113 in the direction close to the heating wire 20, and the connection stability between the pad 12 and the ceramic substrate 11 is better, which can further improve the structural strength of the ceramic substrate assembly 10 and is beneficial to further improving the service life of the atomization core 100.

[0081] It can be understood that the positional relationship between the second connection surface 122 of the pad 12 of the atomization core 100 provided in the embodiment of the present application and the heating surface 112 does not need to be precisely required, and the processing requirements for the ceramic substrate assembly 10 and the heating wire 20 are low, which can reduce the processing difficulty and cost.

[0082] Please continue to refer to Figure 10 and Figure 11 , for example, in some embodiments, the second connection surface 122 may be flush with the heating surface 112. Correspondingly, the connection portion 24 is flush with the heating surface 112.

[0083] Please refer to Figure 12 , for example, in some embodiments, the second connection surface 122 may be lower than the heating surface 112. Correspondingly, a part of the connection portion 24 extends into the recess 113.

[0084] Please refer to Figure 13 , for example, in some embodiments, the second connection surface 122 is higher than the heating surface 112, and the connection portion 24 is spaced apart from the heating surface 112.

[0085] In this way, the positional relationship between the second connection surface 122 of the pad 12 and the heating surface 112 can correspond to the position of the connection portion 24 of the heating wire 20, so that the pad 12 can meet different heating wires 20. When the pad 12 is welded to the heating wire 20, the requirements for the heating wire 20 are reduced, which is beneficial to further reducing the design limitations of the heating wire 20.

[0086] In some embodiments, the second connection surface 122 is a plane, or the second connection surface 122 is a curved surface. In this way, the second connection surface 122 of the pad 12 can be a plane or a curved surface, the universality of the pad 12 is good, and it can be specifically selected according to the shape of the heating wire, and the requirements for the heating wire 20 are reduced, which is beneficial to further reducing the design limitations of the heating wire 20.

[0087] It can be understood that the connection portion 24 includes a third connection surface 241, and the connection portion 24 is welded to the second connection surface 122 through the third connection surface 241, and the shape of the third connection surface 241 is adapted to that of the second connection surface 122.

[0088] Please refer toFigure 14 , Exemplarily, the second connecting surface 122 can be a convex arc surface. Correspondingly, the third connecting surface 241 is a concave arc surface.

[0089] Please refer to Figure 15 , Exemplarily, the second connecting surface 122 can be a concave arc surface. Correspondingly, the third connecting surface 241 is a convex arc surface.

[0090] In some embodiments, the area of the second connecting surface 122 is less than or equal to the area of the third connecting surface 241, and the second connecting surface 122 is located within the third connecting surface 241.

[0091] It can be understood that when the heating wire 20 is welded to the pad 12, the heating wire 20 covers the pad 12, so that the heating wire 20 and the pad 12 are fully welded, and the connection stability is good and it is not easy to fall off.

[0092] Please refer to Figure 16 , Exemplarily, the area of the second connecting surface 122 is less than the area of the third connecting surface 241, and the second connecting surface 122 is located within the third connecting surface 241.

[0093] The above are only the preferred embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A ceramic matrix component, characterized in that: For the atomizer core, the ceramic substrate component comprises: A ceramic substrate, wherein the ceramic substrate comprises a heating surface, and the heating surface is provided with a recessed portion; A soldering pad is arranged on the heating surface, and at least a part of the soldering pad is embedded in the recessed portion. The soldering pad is integrally formed with the ceramic substrate and is used for soldering the heating wire.

2. The ceramic matrix component according to claim 1, characterized in that The pad and the ceramic substrate are sintered as a whole; or, the pad and the ceramic substrate are injection molded as a whole.

3. The ceramic matrix component according to claim 1 or 2, characterized in that: The soldering pad comprises a first connecting surface and a second connecting surface opposite to each other, the first connecting surface is connected to the recessed portion, and the second connecting surface is used for soldering the heating wire; The second connection surface is flush with the heat-generating surface, or the second connection surface is lower than the heat-generating surface, or the second connection surface is higher than the heat-generating surface.

4. The ceramic matrix component according to claim 3, characterized in that The second connecting surface is a plane, or the second connecting surface is a curved surface.

5. An atomizer core, characterized in that: include: The ceramic matrix component according to any one of claims 1 to 4; A heating wire is connected to the pad and in contact with the heating surface.

6. The atomizer core according to claim 5, characterized in that: The heating wire includes a plurality of connection parts arranged at intervals, the ceramic base component includes a plurality of welding pads arranged at intervals, and one of the connection parts is welded to one of the welding pads.

7. The atomizer core according to claim 6, characterized in that: The pad comprises a first connecting surface and a second connecting surface opposite to each other, the first connecting surface is connected to the recessed portion, and the second connecting surface is welded to the connecting portion; The second connecting surface is flush with the heating surface, and the connecting portion is flush with the heating surface; or, the second connecting surface is lower than the heating surface, and part of the connecting portion extends into the recessed portion; or, the second connecting surface is higher than the heating surface, and the connecting portion is spaced apart from the heating surface.

8. The atomizer core according to claim 7, characterized in that: The connecting portion includes a third connecting surface, the connecting portion is welded to the second connecting surface through the third connecting surface, the area of ​​the second connecting surface is smaller than or equal to the area of ​​the third connecting surface, and the second connecting surface is located inside the third connecting surface.

9. An atomizer, characterized in that: Comprising the atomizer core as described in any one of claims 5-8.

10. An atomizing device, characterized in that: Comprising the atomizer as claimed in claim 9.

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