Chip production and assembly device

Abstract

The utility model relates to the technical field of digital production of semiconductor chips, in particular to a chip production and assembly device which comprises a rack, two supports, two round rods, a sliding seat, an electric telescopic rod, a hydraulic cylinder, a mounting plate, a mold, a fan, an air outlet pipe, an injection molding assembly, a limiting assembly and an adjusting assembly. An electric telescopic rod is started to abut against a sliding seat to slide on a round rod, then a hydraulic cylinder is started to abut against a mounting plate to move downwards, an injection molding assembly is used for conducting injection molding protection on the chip, a draught fan is started to exhaust air from an air outlet pipe, and the injection molding part is cooled, and an adjusting assembly is used for adjusting the position of the chip; the limiting assembly is used for fixing the chip, the shaking condition in the injection molding process is avoided, the chip subjected to injection molding is cooled in the mode, the natural cooling time is shortened, and rapid packaging of the chip is facilitated.

Description

Technical Field

[0001] The utility model relates to the technical field of digital production of semiconductor chips, in particular to a chip production and assembly device. Background Technique

[0002] With the development of modern technology and the increasing progress of semiconductor chip industry technology, the current semiconductor chips have reduced volume and increased flexibility. Semiconductor chips are etched and wired on semiconductor sheets to form semiconductor devices that can achieve certain functions. The main production process of semiconductor chips is silicon wafer manufacturing, chip design, wafer coating, lithography, development and etching, ion implantation, metallization, wafer testing, chip cutting and packaging. During the production and preparation of semiconductor chips, a packaging step is required to prevent the chips from getting damp and accumulating dust, which will affect the quality and lifespan of the chips themselves.

[0003] Currently, when packaging chips, epoxy resin is used to protect the surroundings of components such as chips and leads, and the cooling time is relatively long, which is not conducive to the rapid packaging of chips. Content of the Utility Model

[0004] The purpose of the utility model is to provide a chip production and assembly device, aiming to solve the problem that when packaging chips currently, epoxy resin is used to protect the surroundings of components such as chips and leads, and the cooling time is relatively long, which is not conducive to the rapid packaging of chips.

[0005] To achieve the above purpose, the utility model provides a chip production and assembly device, which includes a frame, two brackets, two round rods, a sliding seat, an electric telescopic rod, a hydraulic cylinder, a mounting plate, a mold, a blower, an air outlet pipe, an injection molding component, a limiting component and an adjusting component. The two brackets are both fixedly connected to the frame and are respectively located above the frame. The two round rods are fixedly connected to the two brackets and are respectively located between the two brackets. The sliding seat is slidably connected to the two round rods and is located on the outer side walls of the two round rods. The electric telescopic rod is fixedly connected to the bracket and is located on one side of the bracket. The output end of the electric telescopic rod is fixedly connected to the sliding seat and is located on one side of the sliding seat. The hydraulic cylinder is fixedly connected to the sliding seat and is located above the sliding seat. The output end of the hydraulic cylinder penetrates through the sliding seat. The mounting plate is fixedly connected to the hydraulic cylinder and is located at the output end of the hydraulic cylinder. The injection molding component is arranged below the mounting plate. The limiting component is arranged below the mounting plate. The blower is fixedly connected to the mounting plate and is located above the mounting plate. The air outlet pipe is communicated with the blower and is located at the output end of the blower. The mold is arranged above the frame. The adjusting component is arranged below the mold.

[0006] Among them, the injection molding assembly includes an injection molding machine, an injection molding pipe, and an injection molding head. The injection molding machine is fixedly connected to the mounting plate and is located above the mounting plate. The injection molding pipe is communicated with the injection molding machine and is located at the output end of the injection molding machine. The injection molding head is communicated with the injection molding pipe and is located at one end of the injection molding pipe away from the injection molding machine.

[0007] Among them, the limiting assembly includes a slide bar, a rubber plate, and a spring. The mounting plate has a slide hole, and the slide hole is slidably matched with the slide bar. The rubber plate is fixedly connected to the slide bar and is located below the slide bar. The spring is sleeved on the outer side wall of the slide bar. One end of the spring is fixedly connected to the rubber plate and is located above the rubber plate. The other end of the spring is fixedly connected to the mounting plate and is located below the mounting plate.

[0008] Among them, the adjusting assembly includes a motor, a bottom plate, and a plug pin column. The motor is fixedly connected to the frame and is located below the frame. The bottom plate is fixedly connected to the motor and is located at the output end of the motor. The output end of the motor penetrates through the frame. The plug pin column is fixedly connected to the bottom plate and is located above the bottom plate. The mold has a plug pin hole, and the plug pin hole is slidably matched with the plug pin column.

[0009] Among them, the chip production and assembly device further includes a fixing assembly, and the fixing assembly is arranged above the frame.

[0010] Among them, the fixing assembly includes a side plate, a cylinder, and a frosted pad. The side plate is fixedly connected to the frame and is located above the frame. The cylinder is fixedly connected to the side plate and is located on one side of the side plate. The output end of the cylinder penetrates through the side plate. The frosted pad is fixedly connected to the cylinder and is located at the output end of the cylinder, and the frosted pad contacts the bottom plate.

[0011] For a chip production and assembly device of the present utility model, the chip is placed into the mold, the electric telescopic rod is started to make it abut against the sliding seat and slide on the round rod, and then the hydraulic cylinder is started to make it abut against the mounting plate and move downward. The injection molding assembly is used to perform injection molding protection on the chip. The air blower is turned on to discharge the air from the air outlet pipe to cool the injection molding part. The adjusting assembly is used to adjust the position of the chip, and the limiting assembly is used to fix the chip to avoid shaking during the injection molding process. By this way, the injected and molded chip is cooled, reducing the natural cooling time, which is beneficial to the rapid encapsulation of the chip. Description of the Drawings

[0012] To more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the accompanying drawings required for the description of the embodiments or the prior art.

[0013] Figure 1 It is a schematic structural diagram of the whole of the first embodiment of the present utility model.

[0014] Figure 2 It is a front view of the whole of the first embodiment of the present utility model.

[0015] Figure 3 It is of the present utility model Figure 2 A-A line sectional view.

[0016] Figure 4 It is a schematic structural diagram of the whole of the second embodiment of the present utility model.

[0017] Figure 5 It is a front view of the whole of the second embodiment of the present utility model.

[0018] 101 - Frame, 102 - Bracket, 103 - Round rod, 104 - Slide seat, 105 - Electric telescopic rod, 106 - Hydraulic cylinder, 107 - Mounting plate, 108 - Mold, 109 - Fan, 110 - Air outlet pipe, 111 - Injection molding assembly, 112 - Limiting assembly, 113 - Adjusting assembly, 114 - Injection molding machine, 115 - Injection molding pipe, 116 - Injection molding head, 117 - Slide bar, 118 - Rubber plate, 119 - Spring, 120 - Motor, 121 - Base plate, 122 - Plug post, 123 - Slide hole, 124 - Plug hole, 201 - Fixing assembly, 202 - Side plate, 203 - Cylinder, 204 - Frosted pad. Detailed implementation manners

[0019] The following will describe in detail the embodiments of the present utility model. The examples of the embodiments are shown in the accompanying drawings. The embodiments described below by referring to the accompanying drawings are exemplary and are intended to explain the present utility model, and should not be construed as a limitation to the present utility model.

[0020] First embodiment:

[0021] Please refer to Figures 1 to 3 , wherein, Figure 1 is a schematic structural diagram of the whole of the first embodiment of the present utility model, Figure 2 is a front view of the whole of the first embodiment of the present utility model, Figure 3 is of the present utility model Figure 2 A-A line sectional view.

[0022] The utility model provides a chip production and assembly device, which includes a frame 101, two brackets 102, two round rods 103, a sliding seat 104, an electric telescopic rod 105, a hydraulic cylinder 106, a mounting plate 107, a mold 108, a blower 109, an air outlet pipe 110, an injection molding assembly 111, a limiting assembly 112 and an adjusting assembly 113. The injection molding assembly 111 includes an injection molding machine 114, an injection molding pipe 115 and an injection molding head 116. The limiting assembly 112 includes a sliding rod 117, a rubber plate 118 and a spring 119. The adjusting assembly 113 includes a motor 120, a bottom plate 121 and a pin column 122. The mounting plate 107 has a sliding hole 123, and the mold 108 has a pin hole 124.

[0023] For this specific embodiment, the two brackets 102 are both fixedly connected to the frame 101 and are respectively located above the frame 101. The two round rods 103 are fixedly connected to the two brackets 102 and are respectively located between the two brackets 102. The sliding seat 104 is slidably connected to the two round rods 103 and is located on the outer side walls of the two round rods 103. The electric telescopic rod 105 is fixedly connected to the bracket 102 and is located on one side of the bracket 102. The output end of the electric telescopic rod 105 is fixedly connected to the sliding seat 104 and is located on one side of the sliding seat 104. The hydraulic cylinder 106 is fixedly connected to the sliding seat 104 and is located above the sliding seat 104. The output end of the hydraulic cylinder 106 penetrates through the sliding seat 104. The mounting plate 107 is fixedly connected to the hydraulic cylinder 106 and is located at the output end of the hydraulic cylinder 106. The injection molding assembly 111 is arranged below the mounting plate 107. The limiting assembly 112 is arranged below the mounting plate 107. The blower 109 is fixedly connected to the mounting plate 107 and is located above the mounting plate 107. The air outlet pipe 110 is communicated with the blower 109 and is located at the output end of the blower 109. The mold 108 is arranged above the frame 101. The adjusting assembly 113 is arranged below the mold 108. Place the chip into the mold 108, start the electric telescopic rod 105 to make it abut against the sliding seat 104 and slide on the round rod 103, and then start the hydraulic cylinder 106 to make it abut against the mounting plate 107 and move downward. Use the injection molding assembly 111 to perform injection molding protection on the chip. Open the blower 109 to discharge air from the air outlet pipe 110 to cool the injection molding part. The adjusting assembly 113 is used to adjust the position of the chip, and the limiting assembly 112 is used to fix the chip to avoid shaking during the injection molding process. Cool the injection molded chip in this way to reduce the natural cooling time, which is beneficial to the rapid encapsulation of the chip.

[0024] Among them, the injection molding machine 114 is fixedly connected to the mounting plate 107 and is located above the mounting plate 107. The injection molding pipe 115 is communicated with the injection molding machine 114 and is located at the output end of the injection molding machine 114. The injection molding head 116 is communicated with the injection molding pipe 115 and is located at one end of the injection molding pipe 115 away from the injection molding machine 114. Open the injection molding machine 114 to make the heated injection molding material spray out from the injection molding head 116 through the injection molding pipe 115 to perform injection molding protection on the chip.

[0025] Secondly, the mounting plate 107 has a sliding hole 123 which is slidably matched with the sliding rod 117. The rubber plate 118 is fixedly connected to the sliding rod 117 and is located below the sliding rod 117. The spring 119 is sleeved on the outer side wall of the sliding rod 117. One end of the spring 119 is fixedly connected to the rubber plate 118 and is located above the rubber plate 118. The other end of the spring 119 is fixedly connected to the mounting plate 107 and is located below the mounting plate 107. The rubber plate 118 contacts the edge of the chip, causing the spring 119 to be compressed. At this time, the sliding rod 117 moves in the sliding hole 123 to avoid shaking during the injection molding process.

[0026] Meanwhile, the motor 120 is fixedly connected to the frame 101 and is located below the frame 101. The bottom plate 121 is fixedly connected to the motor 120 and is located at the output end of the motor 120. The output end of the motor 120 penetrates through the frame 101. The plug pin column 122 is fixedly connected to the bottom plate 121 and is located above the bottom plate 121. The mold 108 has a plug pin hole 124 which is slidably matched with the plug pin column 122. Start the motor 120 to drive the bottom plate 121 to rotate and adjust the position of the chip to facilitate the operation of the staff.

[0027] When using the chip production and assembly device of the present utility model, place the chip into the mold 108, start the electric telescopic rod 105 to make it abut against the sliding seat 104 and slide on the round rod 103, and then start the hydraulic cylinder 106 to make it abut against the mounting plate 107 and move downward. Open the injection molding machine 114 to make the heated injection plastic spray out from the injection head 116 through the injection pipe 115 to perform injection protection on the chip. Open the blower 109 to discharge air from the air outlet pipe 110 to cool the injection part. Start the motor 120 to drive the bottom plate 121 to rotate and adjust the position of the chip. The rubber plate 118 contacts the edge of the chip, causing the spring 119 to be compressed. At this time, the sliding rod 117 moves in the sliding hole 123 to avoid shaking during the injection process. Cool the injection-completed chip in this way, reduce the natural cooling time, and facilitate the rapid encapsulation of the chip.

[0028] Second Embodiment:

[0029] Based on the first embodiment, please refer to Figure 4 and Figure 5 , where Figure 4 is the overall structural schematic diagram of the second embodiment of the present utility model, Figure 5 is the front view of the overall of the second embodiment of the present utility model.

[0030] The present utility model provides a chip production and assembly device, which further includes a fixing component 201. The fixing component 201 includes a side plate 202, a cylinder 203, and a frosted pad 204.

[0031] For this specific embodiment, the fixing component 201 is arranged above the frame 101. The addition of the fixing component 201 is to prevent the bottom plate 121 from rotating during the chip injection process and ensure the efficiency and quality of chip injection protection.

[0032] Among them, the side plate 202 is fixedly connected to the frame 101 and is located above the frame 101. The cylinder 203 is fixedly connected to the side plate 202 and is located on one side of the side plate 202. The output end of the cylinder 203 penetrates the side plate 202. The frosted pad 204 is fixedly connected to the cylinder 203 and is located at the output end of the cylinder 203, and the frosted pad 204 contacts the bottom plate 121. Start the cylinder 203 to make it abut against the frosted pad 204 and approach the bottom plate 121. Using this method is to prevent the bottom plate 121 from rotating during the chip injection process and ensure the efficiency and quality of chip injection protection.

[0033] When using a chip production and assembly device of the present utility model, start the cylinder 203 to make it abut against the abrasive pad 204 and approach the bottom plate 121. In this way, it is to avoid the rotation of the bottom plate 121 during the chip injection molding process and ensure the efficiency and quality of chip injection molding protection.

[0034] The above-disclosed are only one or more preferred embodiments of the present application, and the scope of rights of the present application cannot be limited thereby. Those of ordinary skill in the art can understand all or part of the processes of implementing the above embodiments, and the equivalent changes made according to the claims of the present application still fall within the scope covered by the present application.

Claims

1. A chip production and assembly device, characterized in that: It includes a frame, two brackets, two round rods, a slide, an electric telescopic rod, a hydraulic cylinder, a mounting plate, a mold, a fan, an air outlet pipe, an injection molding component, a limit component and an adjustment component. The two brackets are fixedly connected to the frame and are respectively located above the frame. The two round rods are fixedly connected to the two brackets and are respectively located between the two brackets. The slide is slidably connected to the two round rods and is located on the outer side walls of the two round rods. The electric telescopic rod is fixedly connected to the bracket and is located on one side of the bracket. The output end of the electric telescopic rod is fixedly connected to the slide and is located On one side of the slide, the hydraulic cylinder is fixedly connected to the slide and is located above the slide, the output end of the hydraulic cylinder passes through the slide, the mounting plate is fixedly connected to the hydraulic cylinder and is located at the output end of the hydraulic cylinder, the injection molding component is arranged below the mounting plate, the limit assembly is arranged below the mounting plate, the fan is fixedly connected to the mounting plate and is located above the mounting plate, the air outlet pipe is communicated with the fan and is located at the output end of the fan, the mold is arranged above the frame, and the adjustment assembly is arranged below the mold.

2. The chip production and assembly device according to claim 1, characterized in that: The injection molding assembly includes an injection molding machine, an injection molding tube and an injection molding head. The injection molding machine is fixedly connected to the mounting plate and is located above the mounting plate. The injection molding tube is connected to the injection molding machine and is located at the output end of the injection molding machine. The injection molding head is connected to the injection molding tube and is located at one end of the injection molding tube away from the injection molding machine.

3. The chip production and assembly device according to claim 2, characterized in that: The limiting assembly includes a slide rod, a rubber plate and a spring. The mounting plate has a slide hole, and the slide hole is slidably matched with the slide rod. The rubber plate is fixedly connected to the slide rod and is located below the slide rod. The spring is sleeved on the outer side wall of the slide rod. One end of the spring is fixedly connected to the rubber plate and is located above the rubber plate. The other end of the spring is fixedly connected to the mounting plate and is located below the mounting plate.

4. The chip production and assembly device according to claim 3, characterized in that: The adjustment assembly includes a motor, a base plate and a latch column. The motor is fixedly connected to the frame and is located below the frame. The base plate is fixedly connected to the motor and is located at the output end of the motor. The output end of the motor passes through the frame. The latch column is fixedly connected to the base plate and is located above the base plate. The mold has a latch hole, and the latch hole is slidably matched with the latch column.

5. The chip production and assembly device according to claim 4, characterized in that: The chip production and assembly device also includes a fixing component, which is arranged above the frame.

6. The chip production and assembly device according to claim 5, characterized in that: The fixing assembly includes a side plate, a cylinder and a sanding pad. The side plate is fixedly connected to the frame and is located above the frame. The cylinder is fixedly connected to the side plate and is located on one side of the side plate. The output end of the cylinder passes through the side plate. The sanding pad is fixedly connected to the cylinder and is located at the output end of the cylinder, and the sanding pad is in contact with the bottom plate.

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