Multi-level wafer bearing box

Abstract

The utility model discloses a multi-level wafer bearing box, which comprises a bearing box main body, the bearing box main body comprises a main box body, seven bearing plates are fixedly arranged in the main box body through screws, the front surface of the main box body is provided with a protective door, and the bearing box main body is also provided with a drying and dehumidifying mechanism; through the design of the drying and dehumidifying mechanism, a proper amount of drying agent can be placed in the drying agent storage groove through the inlet and outlet, and the cover plate is sealed and fixed in the inlet and outlet. The drying agent is arranged in the ventilation mesh holes to dry and dehumidify internal moisture, so that the wafers are not prone to being affected with damp and damaged after being placed, the drying agent can be replaced through reverse operation after long-time use, and the drying treatment effect of the bearing box body when the wafers are borne is improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of carrier boxes, and particularly relates to a multi-level wafer carrier box. Background Technique

[0002] A wafer refers to a silicon wafer used for manufacturing silicon semiconductor integrated circuits. Since its shape is circular, it is called a silicon wafer. After wafer processing and production, it needs to be stored and processed. Usually, a carrier box is used to carry and place the wafers. The existing carrier box is a combination for carrying and placing wafers after wafer processing and production. It is convenient for multi-layer stacking and placing of wafers, convenient for subsequent convenient extraction, and at the same time, it is convenient for internal drying and dehumidification treatment during carrying and placing. The wafers are not easily affected by moisture, and the drying treatment effect of the carrier box body on the wafers during carrying is improved;

[0003] When the existing carrier box places wafers, the wafers are directly clamped on the surface of the carrier plate and the protective door is closed and placed. Then, the carrier box is placed at the storage location. When the location where the carrier box is placed is dark and humid, when the carrier box is affected by moisture for a long time and becomes humid inside, it is not convenient to perform drying and dehumidification treatment on the inside of the carrier box. And when the moisture is relatively large, it may even damage the wafers, thus affecting the drying and dehumidification effect when the carrier box is used to place wafers. For this reason, the utility model proposes a multi-level wafer carrier box. Summary of the Utility Model

[0004] The purpose of the utility model is to provide a multi-level wafer carrier box to solve the problem that when the location where the carrier box is placed is dark and humid, when the carrier box is affected by moisture for a long time and becomes humid inside, it is not convenient to perform drying and dehumidification treatment on the inside of the carrier box. And when the moisture is relatively large, it may even damage the wafers, thus affecting the drying and dehumidification effect when the carrier box is used to place wafers as described in the above background technique.

[0005] To achieve the above purpose, the utility model provides the following technical solution: A multi-level wafer carrier box, including a carrier box body, the carrier box body includes a main box body, seven carrier plates are fixedly installed inside the main box body by screws, a protective door is arranged on the front surface of the main box body, and the following are further arranged on the carrier box body:

[0006] A drying and dehumidification mechanism, and this drying and dehumidification mechanism includes a drying and dehumidification component arranged inside the rear surface of the main box body, and an access component is arranged on the rear surface of the main box body;

[0007] A pulling and extracting mechanism, and this pulling and extracting mechanism includes a pushing and connecting component arranged at the tail end of the upper surface of the carrier plate, and a pulling component is arranged at the end of the pushing and connecting component inside the carrier plate.

[0008] Preferably, the drying and dehumidifying component includes a desiccant storage tank opened inside the rear surface of the main box body, and one side of the desiccant storage tank is provided with ventilation mesh holes on the inner rear surface of the main box body.

[0009] Preferably, the ventilation mesh holes are communicated with the inside of the desiccant storage tank, and the desiccant storage tank and the inside of the main box body are of an integral structure.

[0010] Preferably, the inlet and outlet component includes an inlet and outlet opened at the top of the other side of the desiccant storage tank on the rear surface of the main box body. A cover plate is arranged inside the inlet and outlet. Fixing screws are arranged at the edge of the cover plate, and the cover plate and the inside of the inlet and outlet are rotationally fixed through the fixing screws.

[0011] Preferably, a sealing gasket is arranged at the edge of the inner surface of the cover plate, and the inner surface of the desiccant storage tank and the inner surface of the inlet and outlet are sealed and connected through the sealing gasket.

[0012] Preferably, the pushing and connecting component includes a sliding groove opened at the middle position inside the bearing plate. A slider is arranged inside the sliding groove, and a pulling block is fixedly installed on the upper surface of the bearing plate through a screw at the end of the slider.

[0013] Preferably, the pulling component includes a pull rope fixed to the end of the slider inside the sliding groove through a screw. A pull ball is arranged on the front surface of the bearing plate at the end of the pull rope. Two elastic clamping blocks are fixedly bonded through glue at the middle position of the front surface of the bearing plate.

[0014] Compared with the prior art, the beneficial effects of the present utility model are:

[0015] By designing a drying and dehumidifying mechanism, an appropriate amount of desiccant can be placed into the desiccant storage tank through the inlet and outlet. The cover plate is sealed and fixed inside the inlet and outlet. When the main box body is in a dark and humid position after the carrier box body carries the wafer and causes moisture inside the main box body, the desiccant can dry and dehumidify the internal moisture through the ventilation mesh holes, so that the wafer is not easily damaged by moisture after being placed. When used for a long time, the opposite operation can be performed to replace the desiccant, improving the drying treatment effect of the carrier box body when carrying the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 is a schematic structural diagram of the present utility model;

[0017] Figure 2 is a partial side cross-sectional structural diagram of the main box body, desiccant storage tank and ventilation mesh holes of the present utility model;

[0018] Figure 3 is the present utility model Figure 2 the enlarged structural diagram of part A therein;

[0019] Figure 4 Schematic diagram of the main box body, bearing plate and pulling block of the present utility model;

[0020] Figure 5 Schematic diagram of the bearing plate, pulling block and sliding block of the present utility model;

[0021] Figure 6 For the present utility model Figure 5 Enlarged structural schematic diagram of part B in;

[0022] Figure 7 For the present utility model Figure 5 Enlarged structural schematic diagram of part C in;

[0023] In the figure: 100, bearing box main body; 101, main box body; 1011, desiccant storage tank; 1012, breathable mesh holes; 1013, cover plate; 1014, fixing screw; 1015, inlet and outlet; 1016, sealing gasket; 102, protective door; 103, bearing plate; 1031, pulling block; 1032, sliding groove; 1033, sliding block; 1034, pulling rope; 1035, elastic clamping block; 1036, pulling ball. Specific embodiments

[0024] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0025] Embodiment 1

[0026] Please refer to Figures 1 to 4 , the present utility model provides a technical solution: a multi-level wafer bearing box, including a bearing box main body 100, the bearing box main body 100 includes a main box body 101, seven bearing plates 103 are fixedly installed inside the main box body 101 by screws, push the wafer inward on the surface of the bearing plate 103, and drive the pulling block 1031 to push inward when pushing the wafer until the wafer is completely clamped and placed inside the bearing plate 103. The pulling block 1031 can be at the tail end of the upper surface of the bearing plate 103, and it is convenient to place multiple layers inside the main box body 101. A protective door 102 is provided on the front surface of the main box body 101, and the following are provided on the bearing box main body 100:

[0027] A drying and dehumidifying mechanism, and the drying and dehumidifying mechanism includes a drying and dehumidifying component arranged inside the rear surface of the main box body 101. An inlet and outlet component is arranged on the rear surface of the main box body 101. When the storage place is dark and humid after the carrier box body 100 is placed with wafers, and the drying and dehumidifying mechanism performs drying treatment on the inside of the main box body 101, the wafers are not easily damaged by moisture absorption after being placed, and the drying treatment effect of the carrier box body 100 when carrying the wafers is improved.

[0028] In order to facilitate the drying and dehumidifying treatment of the inside of the main box body 101 through the drying and dehumidifying component and prevent the wafers from being affected by moisture, in this embodiment, preferably, the drying and dehumidifying component includes a desiccant storage tank 1011 opened inside the rear surface of the main box body 101, which is convenient for storing desiccant inside the desiccant storage tank 1011. On one side of the desiccant storage tank 1011, an air permeable mesh hole 1012 is opened on the inner rear surface of the main box body 101. The air permeable mesh hole 1012 is communicated with the inside of the desiccant storage tank 1011. After storing desiccant inside the desiccant storage tank 1011, the moisture inside the main box body 101 permeates through the air permeable mesh hole 1012 and is dried and dehumidified by the desiccant.

[0029] In order to facilitate the storage of desiccant inside the desiccant storage tank 1011 through the inlet and outlet component and, conversely, facilitate regular replacement, in this embodiment, preferably, the inlet and outlet component includes an inlet and outlet 1015 opened at the top of the other side of the desiccant storage tank 1011 on the rear surface of the main box body 101, which is convenient for regularly taking and placing desiccant inside the desiccant storage tank 1011 for replacement through the inlet and outlet 1015. A cover plate 1013 is arranged inside the inlet and outlet 1015. A sealing gasket 1016 is arranged at the edge of the inner surface of the cover plate 1013. Fixing screws 1014 are arranged at the edge of the cover plate 1013. The cover plate 1013 and the inside of the inlet and outlet 1015 are rotationally fixed by the fixing screws 1014. After the cover plate 1013 is hermetically placed inside the inlet and outlet 1015 through the sealing gasket 1016, the fixing screws 1014 are rotated to fixedly install it, which is convenient for hermetically fixing the cover plate 1013.

[0030] Embodiment 2

[0031] Please refer to Figure 1 、 Figure 4 、 Figure 5 、 Figure 6 and Figure 7, the present utility model provides a technical solution: a multi-level wafer carrier box, including a carrier box main body 100, the carrier box main body 100 includes a main box body 101, and seven carrier plates 103 are fixedly installed inside the main box body 101 by screws. Push the wafer towards the inside on the surface of the carrier plate 103. When pushing the wafer, drive the pulling block 1031 to push towards the inside until the wafer is completely clamped and placed inside the carrier plate 103. The pulling block 1031 is located at the end of the upper surface of the carrier plate 103, and it is convenient to place multiple layers inside the main box body 101. A protective door 102 is provided on the front surface of the main box body 101. The carrier box main body 100 is also provided with:

[0032] A pulling and removing mechanism, and the pulling and removing mechanism includes a pushing and connecting component arranged at the end of the upper surface of the carrier plate 103. At the end of the pushing and connecting component located inside the carrier plate 103, a pulling component is provided. When the carrier box main body 100 places the wafer and needs to remove it, the pulling and removing mechanism can push the wafer towards the outside and open it on the surface of the carrier plate 103, making it more convenient and faster to remove the wafer from the inside of the carrier box main body 100, and improving the convenience of removing the wafer after the carrier box main body 100 carries and places the wafer.

[0033] In order to facilitate the removal of the wafer more conveniently through the pushing and connecting component, in this embodiment, preferably, the pushing and connecting component includes a chute 1032 opened at the middle position inside the carrier plate 103. A slider 1033 is arranged inside the chute 1032. At the end of the slider 1033 located on the upper surface of the carrier plate 103, a pulling block 1031 is fixedly installed by screws. When the slider 1033 slides inside the chute 1032, it can drive the pulling block 1031 to move. When the pulling block 1031 moves, it pushes the wafer towards the outside and opens it, which is convenient for removal.

[0034] In order to facilitate the movement of the slider 1033 and the pulling block 1031 through the pulling component and facilitate the pushing of the wafer during movement, in this embodiment, preferably, the pulling component includes a pull rope 1034 fixed to the end of the slider 1033 inside the chute 1032 by screws. At the end of the pull rope 1034 located on the front surface of the carrier plate 103, a pull ball 1036 is provided. It is convenient to hold the pull ball 1036 and pull the pull rope 1034 to drive the slider 1033 and the pulling block 1031 to move, which is easy to move and drive the wafer to open. Two elastic clamping blocks 1035 are adhesively fixed at the middle position of the front surface of the carrier plate 103. When not in use, when the pull ball 1036 is on the front surface of the carrier plate 103, it is clamped and fixedly installed by the elastic clamping blocks 1035.

[0035] Working principle and usage process of the present utility model: For this multi-level wafer carrier box, when in use, directly open the protective door 102, push the wafer onto the surface of the carrier plate 103 towards the inside. When pushing the wafer, drive the pulling block 1031 towards the inside until the wafer is completely clamped and placed inside the carrier plate 103, and the pulling block 1031 is at the end of the upper surface of the carrier plate 103. Moreover, it is convenient to place multiple layers inside the main box body 101, and then close the protective door 102 to place the wafer in the carrier box body 100;

[0036] Then, before the carrier box body 100 is placed and used, place an appropriate amount of desiccant into the desiccant storage tank 1011 through the inlet / outlet 1015, and seal and close the cover plate 1013 in the inlet / outlet 1015 through the gasket 1016. Then rotate the fixing screw 1014 again to fix the cover plate 1013. When the carrier box body 100 is placed in a dark and humid place after carrying the wafer and causes moisture to appear inside the main box body 101, the desiccant can dehumidify the internal moisture through the breathable mesh holes 1012, so that the wafer is not easily damaged by moisture after being placed. When used for a long time, the opposite operation can be performed to replace the desiccant, improving the drying treatment effect when the carrier box body 100 carries the wafer;

[0037] Finally, when the carrier box body 100 needs to be taken out after carrying, you can directly hold the pulling ball 1036 and pull the pulling rope 1034. When the pulling rope 1034 is pulled, drive the slider 1033 to slide inside the chute 1032. When the slider 1033 slides, drive the pulling block 1031 to slide stably on the surface of the carrier plate 103, so that when the pulling block 1031 slides, move the wafer outwards and take it out, making it more convenient and fast to take out the wafer from the inside of the carrier box body 100, improving the convenience of taking out the wafer after the carrier box body 100 carries and places the wafer. When not in use, restore the pulling rope 1034 and the pulling ball 1036 to their original positions, and the pulling ball 1036 is clamped and fixed through the elastic clamping block 1035.

[0038] Although the embodiments of the present utility model have been shown and described (see the above detailed description), for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principle and spirit of the present utility model. The scope of the present utility model is defined by the appended claims and their equivalents.

Claims

1. A multi-level wafer carrier box, comprising a carrier box body (100), wherein the carrier box body (100) comprises a main box body (101), seven carrier plates (103) are fixedly mounted inside the main box body (101) by screws, and a protective door (102) is arranged on the front surface of the main box body (101), characterized in that: The carrier box body (100) is also provided with: A drying and dehumidifying mechanism, wherein the drying and dehumidifying mechanism comprises a drying and dehumidifying component arranged inside the rear surface of a main box body (101), and an inlet and outlet component is arranged on the rear surface of the main box body (101); A pulling and taking out mechanism comprises a pushing connection component arranged at the tail end of the upper surface of the carrying plate (103), wherein the end of the pushing connection component is located inside the carrying plate (103) and a pulling component is arranged.

2. The multi-level wafer carrier according to claim 1, characterized in that: The desiccant dehumidification component comprises a desiccant storage slot (1011) provided inside the rear surface of the main box body (101), and a ventilation mesh hole (1012) is provided on one side of the desiccant storage slot (1011) located on the inner rear surface of the main box body (101).

3. The multi-level wafer carrier according to claim 2, characterized in that: The air-permeable mesh (1012) is connected to the interior of the desiccant storage tank (1011), and the desiccant storage tank (1011) and the interior of the main box body (101) are an integrated structure.

4. The multi-level wafer carrier according to claim 2, characterized in that: The inlet and outlet assembly comprises an inlet and outlet (1015) opened at the top of the other side of the desiccant storage slot (1011) and located on the rear surface of the main box body (101); a cover plate (1013) is arranged inside the inlet and outlet (1015); fixing screws (1014) are arranged at the edge of the cover plate (1013); the cover plate (1013) and the inside of the inlet and outlet (1015) are rotatably fixed by the fixing screws (1014).

5. The multi-level wafer carrier according to claim 4, characterized in that: A sealing gasket (1016) is provided at the edge of the inner surface of the cover plate (1013), and the inner surface of the desiccant storage tank (1011) and the inner surface of the inlet and outlet (1015) are sealed and connected via the sealing gasket (1016).

6. The multi-level wafer carrier according to claim 1, characterized in that: The push connection assembly comprises a slide groove (1032) opened at a middle position inside the bearing plate (103), a slider (1033) is arranged inside the slide groove (1032), and a pulling block (1031) is fixedly installed on the upper surface of the bearing plate (103) at the end of the slider (1033) by screws.

7. The multi-level wafer carrier according to claim 6, characterized in that: The pulling assembly comprises a pull rope (1034) fixed to the end of the slider (1033) by screws and located inside the slide groove (1032); the end of the pull rope (1034) is located on the front surface of the supporting plate (103) and is provided with a pull ball (1036); and two elastic blocks (1035) are fixed at the middle position of the front surface of the supporting plate (103) by glue.

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