Pressure stability control structure for reaction cavity of silicon carbide epitaxial equipment

Abstract

The utility model discloses a silicon carbide epitaxial equipment reaction chamber pressure stability control structure, which comprises a heat exchange box and a water tank, a heat exchange tube is arranged in the inner cavity of the heat exchange box, a monitoring alarm mechanism is arranged in the middle of the top of the water tank, and the monitoring alarm mechanism comprises a controller, a front flow sensor and a rear flow sensor. The controller and the flow sensor are both fixed to the top of the water tank, an alarm is arranged on the top of the controller, the flow sensor and the alarm are both electrically connected with the controller through wires, and a water pumping mechanism is arranged on the back face of the top of the water tank. When the device is used, the water pump is turned on, cooling water in the water tank can be pumped into the inner pipe through the water pumping pipe, the water outlet pipe and the water inlet pipe in sequence, the cooling water can exchange heat with the heat exchange box 1 through the bottom of the inner pipe and absorb heat of the heat exchange box so as to cool the heat exchange box, and the heat exchange box is placed in a reaction cavity of the silicon carbide epitaxial equipment during use. After the heat exchange box is cooled, air in the equipment can be cooled so as to control the air pressure in the equipment to be stable.

Description

Technical Field

[0001] The utility model belongs to the technical field of silicon carbide epitaxial technology, and particularly relates to a reaction chamber pressure stable control structure for a silicon carbide epitaxial device. Background Technique

[0002] Silicon carbide (SiC) is a wide-bandgap semiconductor material with excellent electrical, thermal, and mechanical properties, and can be used to manufacture high-power, high-frequency, and high-temperature electronic devices. The silicon carbide epitaxial technology refers to the technology of growing single-crystal silicon carbide thin films on silicon carbide materials, and high-quality, high-crystallinity, and large-size SiC base materials can be obtained.

[0003] Since chemical vapor deposition (CVD) is usually used for silicon carbide epitaxial growth, this process needs to be carried out in an environment with stable pressure, so the stable control of the air pressure in the device is particularly crucial. When the existing silicon carbide epitaxial device is in use, due to the high temperature inside, the air pressure inside it will always remain at a high level, and currently, there is no structure in the silicon carbide epitaxial device for relieving the pressure of high-pressure gas, and the air pressure inside the device cannot be maintained within a stable and appropriate range, which will interfere with the epitaxial reaction of silicon carbide. The utility model provides a reaction chamber pressure stable control structure for a silicon carbide epitaxial device, which can solve the above problems. Summary of the Utility Model

[0004] The purpose of the utility model is to provide a reaction chamber pressure stable control structure for a silicon carbide epitaxial device, which has the advantage of being able to keep the air pressure inside the epitaxial device within a stable and appropriate range, so as to solve the problems that occur in the current silicon carbide epitaxial device.

[0005] The technical solution adopted by the utility model is specifically as follows:

[0006] A reaction chamber pressure stable control structure for a silicon carbide epitaxial device includes a heat exchange box and a water tank. The heat exchange box is in a hollow state, and a heat exchange tube is arranged in the inner cavity of the heat exchange box. A monitoring and alarm mechanism is arranged in the middle of the top of the water tank, and a water pumping mechanism is arranged on the back of the top of the water tank.

[0007] Preferably, the heat exchange tube includes a plurality of U-shaped tubes connected in sequence from left to right. The U-shaped tube includes an inner tube, an outer tube is sleeved outside the inner tube, and a sealing ring is sleeved on the contact surface of two adjacent U-shaped tubes.

[0008] Preferably, the monitoring and alarm mechanism includes a controller and two flow sensors, front and back. The controller and the flow sensors are both fixed on the top of the water tank. An alarm is arranged on the top of the controller. The flow sensors and the alarm are both electrically connected to the controller through wires.

[0009] Preferably, the bottom of the inner tube fits against the bottom of the inner wall of the heat exchange box, and the sealing ring and the U-shaped tube are fixedly connected by bolts.

[0010] Preferably, a positioning mechanism is provided on the U-shaped tube. The positioning mechanism includes a positioning tube that penetrates through the outer wall of the outer tube. One side of the positioning tube close to the inner tube is open, and a sight glass is connected through the top of the positioning tube.

[0011] Preferably, the water pumping mechanism includes a water pump. The water inlet of the water pump is connected to a water suction pipe. The water inlet of the water suction pipe penetrates through the front of the water tank. An outlet pipe is connected between the water inlet of the water pump and the water inlet of the flow sensor located on the front.

[0012] Preferably, an inlet pipe is connected between the water outlet of the flow sensor located on the front and the water inlet of the inner tube located on the left. A drain pipe is connected between the water inlet of the flow sensor located on the back and the water outlet of the inner tube located on the right. The water outlet of the flow sensor located on the back is connected to a return pipe. The water outlet of the return pipe penetrates through the top of the water tank.

[0013] The technical effects achieved by the present utility model are as follows:

[0014] 1. When the device is in use, turn on the water pump, which can pump the cooling water in the water tank into the inner tube successively through the water suction pipe, the outlet pipe and the inlet pipe. The cooling water can generate heat exchange with the heat exchange box through the bottom of the inner tube, absorb the heat of the heat exchange box to cool it. The heat exchange box is placed in the reaction chamber of the silicon carbide epitaxial equipment during use. After the heat exchange box is cooled, it can cool the air in the equipment, keep the air pressure in the equipment within a stable and appropriate range, and ensure the normal progress of the silicon carbide epitaxial reaction.

[0015] 2. When the device is in use, if the difference between the inflow and outflow water flow rates is too large and exceeds the preset limit value, it means that the cooling water leaks. At this time, the controller can control the alarm to sound an alarm and give a reminder, so as to timely repair the U-shaped tube. If the U-shaped tube leaks, water will enter the corresponding positioning tube. By observing whether there is residual water in the positioning tube through the sight glass, it can be known which U-shaped tube leaks, so as to timely repair or replace it, which is time-saving and labor-saving, can quickly find the leakage point, and has higher maintenance efficiency. Description of the Drawings

[0016] Figure 1 is the overall structural schematic diagram of the present utility model;

[0017] Figure 2 is the three-dimensional structural schematic diagram of the heat exchange tube of the present utility model;

[0018] Figure 3 is the planar structural schematic diagram of the heat exchange tube of the present utility model;

[0019] Figure 4 is a three-dimensional structural schematic diagram of the positioning mechanism of the present utility model;

[0020] Figure 5 is a planar structural schematic diagram of the positioning mechanism of the present utility model.

[0021] In the attached drawings, the list of components represented by each reference numeral is as follows:

[0022] 1. Heat exchange box; 2. Water tank; 3. Heat exchange tube; 31. U-shaped tube; 311. Inner tube; 312. Outer tube; 33. Sealing ring; 4. Monitoring and alarm mechanism; 41. Controller; 42. Flow sensor; 43. Alarm; 44. Wire; 5. Water pumping mechanism; 51. Water pump; 52. Water suction pipe; 53. Water outlet pipe; 6. Water inlet pipe; 7. Drain pipe; 8. Return pipe; 9. Positioning mechanism; 91. Positioning tube; 92. Sight glass. Specific embodiments

[0023] In order to make the purpose and advantages of the present utility model more clear and understandable, the present utility model will be specifically described below in conjunction with embodiments. It should be understood that the following text is only used to describe one or several specific implementation manners of the present utility model, and does not strictly limit the specific protection scope claimed by the present utility model.

[0024] As Figures 1-5 shown, a reaction chamber pressure stability control structure of a silicon carbide epitaxial device includes a heat exchange box 1 and a water tank 2. The heat exchange box 1 is in a hollow state and has an opening at the top. A sealing plate is provided at the top of the heat exchange box 1. Cooling water is contained in the water tank 2. A heat exchange tube 3 is provided in the inner cavity of the heat exchange box 1. By opening the sealing plate, the heat exchange tube 3 can be repaired. A monitoring and alarm mechanism 4 is provided in the middle of the top of the water tank 2. The monitoring and alarm mechanism 4 includes a controller 41 and two flow sensors 42, one in the front and the other in the back. A water pumping mechanism 5 is provided on the back of the top of the water tank 2.

[0025] Specifically, the heat exchange tube 3 includes a plurality of U-shaped tubes 31 connected in sequence from left to right. The U-shaped tube 31 includes an inner tube 311, and an outer tube 312 is sleeved outside the inner tube 311. A sealing ring 33 is sleeved on the contact surface between two adjacent U-shaped tubes 31. The bottom of the inner tube 311 is attached to the bottom of the inner wall of the heat exchange box 1. The sealing ring 33 is fixedly connected to the U-shaped tube 31 by bolts. The water pumping mechanism 5 includes a water pump 51. The water inlet of the water pump 51 is connected to a water suction pipe 52. The water inlet of the water suction pipe 52 penetrates through the front surface of the water tank 2. A water outlet pipe 53 is connected between the water inlet of the water pump 51 and the water inlet of the flow sensor 42 located on the front surface. An inlet pipe 6 is connected between the water outlet of the flow sensor 42 located on the front surface and the water inlet of the inner tube 311 located on the left side. During use, when the water pump 51 is turned on, it can pump the cooling water in the water tank 2 into the inner tube 311 in sequence through the water suction pipe 52, the water outlet pipe 53, and the inlet pipe 6. The cooling water can generate heat exchange with the heat exchange box 1 through the bottom of the inner tube 311, absorb the heat of the heat exchange box 1, and cool it. When the heat exchange box 1 is used, it is placed in the reaction chamber of the silicon carbide epitaxial equipment. After the heat exchange box 1 is cooled, it can cool the air in the equipment, so that the air pressure in the equipment is within a stable and appropriate range, ensuring the normal progress of the silicon carbide epitaxial reaction.

[0026] Specifically, both the controller 41 and the flow sensor 42 are fixed on the top of the water tank 2. An alarm 43 is arranged on the top of the controller 41. Both the flow sensor 42 and the alarm 43 are electrically connected to the controller 41 through wires 44. A drain pipe 7 is connected between the water inlet of the flow sensor 42 located on the back surface and the water outlet of the inner tube 311 located on the right side. The water outlet of the flow sensor 42 located on the back surface is connected to a return pipe 8. The water outlet of the return pipe 8 penetrates through the top of the water tank 2. The heated water can be drained back into the water tank 2 through the drain pipe 7 and the return pipe 8. In this way, the cooling water can be recycled. The front and rear flow sensors 42 can respectively detect the inlet flow and outlet flow of the inner tube 311, and transmit the data to the controller 41 through the wire 44. If the difference between the inlet and outlet water flows is too large and exceeds the preset limit value, it means that the cooling water leaks. At this time, the controller 41 can control the alarm 43 to be turned on to issue an alarm and give a reminder, so as to perform timely maintenance on the U-shaped tube 31.

[0027] Specifically, a positioning mechanism 9 is arranged on the U-shaped tube 31. The positioning mechanism 9 includes a positioning tube 91. The positioning tube 91 penetrates through the outer wall of the outer tube 312. One side of the positioning tube 91 close to the inner tube 311 is open. A sight glass 92 is connected through the top of the positioning tube 91. If the U-shaped tube 31 leaks, water will enter the corresponding positioning tube 91. By observing whether there is residual water in the positioning tube 91 through the sight glass 92, it can be known which U-shaped tube 31 leaks, so as to perform timely repair or replacement on it.

[0028] Working principle of the utility model: When in use, turn on the water pump 51, which can pump the cooling water in the water tank 2 into the inner tube 311 successively through the water suction pipe 52, the water outlet pipe 53 and the water inlet pipe 6. The cooling water can generate heat exchange with the heat exchange box 1 through the bottom of the inner tube 311, absorb the heat of the heat exchange box 1 to cool it. The heat exchange box 1 is placed in the reaction chamber of the silicon carbide epitaxial equipment during use. After the heat exchange box 1 is cooled, it can cool the air in the equipment, keep the air pressure in the equipment within a stable and appropriate range, and ensure the normal progress of the silicon carbide epitaxial reaction. The water after absorbing heat can be discharged back to the water tank 2 through the drain pipe 7 and the return pipe 8, so that the cooling water can be recycled. The front and rear flow sensors 42 can respectively detect the water inlet flow and the water outlet flow of the inner tube 311, and transmit the data to the controller 41 through the wire 44. If the difference between the inlet and outlet water flows is too large and exceeds the preset limit value, it means that the cooling water leaks. At this time, the controller 41 can control the alarm 43 to be turned on to issue an alarm and remind, so as to timely repair the U-shaped tube 31. If the U-shaped tube 31 leaks, the water will enter the corresponding positioning tube 91. By observing through the sight glass 92 whether there is residual water in the positioning tube 91, it can be known which U-shaped tube 31 leaks, so as to timely repair or replace it.

[0029] The above is only the preferred embodiment of the utility model. It should be pointed out that for those of ordinary skill in the art of this technology, without departing from the principle of the utility model, several improvements and retouches can be made, and these improvements and retouches should also be regarded as the protection scope of the utility model. The structures, devices and operation methods not specifically described and explained in the utility model, without special explanation and limitation, are implemented according to the conventional means in the art.

Claims

1. A pressure stabilization control structure for a reaction chamber of a silicon carbide epitaxial device, comprising a heat exchange box (1) and a water tank (2), characterized in that: The heat exchange box (1) is in a hollow state, the inner cavity of the heat exchange box (1) is provided with a heat exchange tube (3), a monitoring alarm mechanism (4) is provided in the middle of the top of the water tank (2), and a pumping mechanism (5) is provided on the back of the top of the water tank (2).

2. The pressure stabilization control structure for the reaction chamber of the silicon carbide epitaxial equipment according to claim 1, characterized in that: The heat exchange tube (3) comprises a plurality of U-shaped tubes (31) connected in sequence from left to right, the U-shaped tube (31) comprising an inner tube (311), the outer ring of the inner tube (311) being sleeved with an outer tube (312), and the contact surfaces of two connected U-shaped tubes (31) being sleeved with sealing rings (33).

3. The pressure stabilization control structure for the reaction chamber of the silicon carbide epitaxial equipment according to claim 2, characterized in that: The monitoring alarm mechanism (4) comprises a controller (41) and two front and rear flow sensors (42); the controller (41) and the flow sensor (42) are both fixed to the top of the water tank (2); an alarm (43) is provided on the top of the controller (41); the flow sensor (42) and the alarm (43) are both electrically connected to the controller (41) via a wire (44).

4. The pressure stabilization control structure for the reaction chamber of the silicon carbide epitaxial equipment according to claim 2, characterized in that: The bottom of the inner tube (311) fits into the bottom of the inner wall of the heat exchange box (1), and the sealing ring (33) and the U-shaped tube (31) are fixedly connected by bolts.

5. The pressure stabilization control structure for the reaction chamber of the silicon carbide epitaxial equipment according to claim 2, characterized in that: The U-shaped tube (31) is provided with a positioning mechanism (9), the positioning mechanism (9) comprising a positioning tube (91), the positioning tube (91) passing through the outer wall of the outer tube (312), the positioning tube (91) having an opening on one side close to the inner tube (311), and a sight glass (92) passing through the top of the positioning tube (91).

6. The pressure stabilization control structure for the reaction chamber of the silicon carbide epitaxial equipment according to claim 3, characterized in that: The water pumping mechanism (5) comprises a water pump (51), the water inlet of the water pump (51) is connected to a water pumping pipe (52), the water inlet of the water pump (52) passes through the front of the water tank (2), and a water outlet pipe (53) is connected between the water inlet of the water pump (51) and the water inlet of a flow sensor (42) located at the front.

7. The pressure stabilization control structure for the reaction chamber of the silicon carbide epitaxial equipment according to claim 3, characterized in that: A water inlet pipe (6) is connected between the water outlet of the flow sensor (42) located at the front and the water inlet of the inner tube (311) located at the left, a drain pipe (7) is connected between the water inlet of the flow sensor (42) located at the back and the water outlet of the inner tube (311) located at the right, and a return pipe (8) is connected to the water outlet of the flow sensor (42) located at the back, and the water outlet of the return pipe (8) passes through the top of the water tank (2).

Images