Step-by-step positioning structure

Abstract

The utility model relates to a step-by-step positioning structure, which belongs to the technical field of chip production equipment and comprises a lifting base, a first spring push rod structure, a first S-shaped curved surface structure, a first spring telescopic rod, a second spring push rod structure, a second S-shaped curved surface structure and a second spring telescopic rod. The first spring push rod structure penetrates through the lifting base in the first horizontal direction to do reciprocating rectilinear motion, the second spring push rod structure penetrates through the lifting base in the second horizontal direction to do reciprocating rectilinear motion, and the first spring telescopic rod is arranged on the first spring push rod structure to push a chip. And the second spring telescopic rod is arranged on the second spring push rod structure to push the chip. According to the step-by-step positioning structure provided by the invention, the first spring telescopic rod and the second spring telescopic rod repeatedly push the chip to realize a multi-time positioning function, so that the position of the chip is more accurate, and the spring telescopic rods can prevent the chip from being damaged due to extrusion on the chip in the chip positioning process.

Description

Technical Field

[0001] This application relates to the technical field of chip production equipment, and particularly to a step-by-step positioning structure. Background Art

[0002] At present, the process of testing a chip by a chip tester is as follows: Fix the chip at a specific position and align it with the testing device to test the chip. In this process, precise positioning of the chip is required to obtain accurate detection and analysis results of the chip. If the chip is not accurately positioned, the test results will be affected. Due to the small size and easy damage of the chip, the positioning requirements for the chip are relatively high.

[0003] However, most traditional chip positioning devices are in hard contact without a buffer device, which is easy to damage the chip. At the same time, the positioning device can only complete one positioning function, ignoring the influence that the chip position may shift due to the friction between the chip and the positioning element during this process, resulting in inaccurate chip positioning. Utility Model Content

[0004] Based on this, it is necessary to provide a step-by-step positioning structure to solve the technical problem that chip positioning in the prior art is prone to inaccuracy.

[0005] To achieve the above object, this application provides a step-by-step positioning structure, which includes:

[0006] A lifting base, on the top surface of which there is a working surface for carrying the chip. On the working surface, a first retaining edge and a second retaining edge are convexly provided. The first retaining edge extends along a first horizontal direction, and the second retaining edge extends along a second horizontal direction. The first horizontal direction and the second horizontal direction are perpendicular. The first retaining edge, the second retaining edge and the top surface of the lifting base enclose a working area with a right-angle corner;

[0007] A first spring push rod structure, which penetrates and is installed on the lifting base along the first horizontal direction. The movement trend of the first spring push rod structure is to move vertically towards the second retaining edge within the working area;

[0008] A first S-shaped curved surface structure, which has a first S-shaped curved surface. The first S-shaped curved surface is always in contact with the end of the first spring push rod structure. During the lifting and lowering process of the lifting base, the first S-shaped curved surface makes the first spring push rod structure perform a reciprocating linear motion along the first horizontal direction;

[0009] A first spring telescopic rod, which is arranged on the first spring push rod structure. The first spring telescopic rod follows the first spring push rod structure to perform a reciprocating linear motion to push the chip within the working area against the second retaining edge;

[0010] A second spring push rod structure, which penetrates and is installed on the lifting base along the second horizontal direction. The movement trend of the second spring push rod structure is to move vertically towards the first retaining edge within the working area;

[0011] The second S-shaped surface structure has a second S-shaped surface that always abuts against the end of the second spring push rod structure. During the lifting and lowering of the lifting base, the second S-shaped surface causes the second spring push rod structure to perform reciprocating linear motion along the second horizontal direction;

[0012] The second spring telescopic rod is arranged on the second spring push rod structure and follows the second spring push rod structure to perform reciprocating linear motion to push the chip in the working area to the first baffle.

[0013] Optionally, the first spring push rod structure includes:

[0014] The first push rod is movably penetrated through the lifting base along the first horizontal direction;

[0015] The first fixed seat is fixed on the side surface of the lifting base, and the first fixed seat and the second baffle are respectively located at the opposite ends of the working area; and

[0016] The first compression spring has two ends respectively connected to the first push rod and the first fixed seat.

[0017] Optionally, a first roller is provided at the end of the first push rod pointing to the first S-shaped surface structure.

[0018] Optionally, the first spring telescopic rod is arranged on the first spring push rod structure with adjustable position along the first horizontal direction.

[0019] Optionally, a first groove is arranged along the first horizontal direction on the working surface in the working area. The first spring telescopic rod is located in the first groove, and part of the first spring telescopic rod protrudes from the working surface.

[0020] Optionally, the second spring push rod structure includes:

[0021] The second push rod is movably penetrated through the lifting base along the second horizontal direction;

[0022] The second fixed seat is fixed on the side surface of the lifting base, and the second fixed seat and the first baffle are respectively located at the opposite ends of the working area; and

[0023] The second compression spring has two ends respectively connected to the second push rod and the second fixed seat.

[0024] Optionally, a second roller is provided at the end of the second push rod pointing to the second S-shaped surface structure.

[0025] Optionally, the second spring telescopic rod is arranged on the second spring push rod structure with adjustable position along the second horizontal direction.

[0026] Optionally, a second groove is provided along the second horizontal direction on the working surface within the working area. The second spring telescopic rod is located within the second groove, and a part of the second spring telescopic rod protrudes from the working surface.

[0027] Optionally, the step-by-step positioning structure further includes a vacuum adsorption structure disposed within the lifting base, and the vacuum adsorption structure is used to adsorb the chip on the working surface.

[0028] The beneficial effects of the step-by-step positioning structure provided in this application are as follows: Compared with the prior art, the step-by-step positioning structure of this application includes a lifting base, a first spring push rod structure, a first S-shaped curved surface structure, a first spring telescopic rod, a second spring push rod structure, a second S-shaped curved surface structure, and a second spring telescopic rod. The first spring push rod structure and the second spring push rod structure penetrate the lifting base along the first horizontal direction and the second horizontal direction respectively. The first spring push rod structure and the second spring push rod structure perform reciprocating linear motions respectively. The first spring telescopic rod on the first spring push rod structure repeatedly pushes the chip to make it approach the second edge, and the second spring telescopic rod on the second spring push rod structure repeatedly pushes the chip to make it approach the first edge, realizing the multiple positioning function, making the position of the chip more accurate. The spring telescopic rod can prevent the chip from being damaged due to extrusion during the process of positioning the chip. Description of the Drawings

[0029] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0030] Figure 1 It is a schematic three-dimensional structure diagram of the step-by-step positioning structure provided by the embodiment of the present application;

[0031] Figure 2 It is a schematic cross-sectional structure diagram of the step-by-step positioning structure provided by the embodiment of the present application.

[0032] Explanation of the Reference Numerals in the Drawings:

[0033] 1. Lifting base; 110. Working surface; 120. First edge; 130. Second edge; 140. Working area; 150. First groove; 160. Second groove;

[0034] 2. First spring push rod structure; 210. First push rod; 220. First fixed seat; 230. First compression spring; 240. First roller;

[0035] 3. First S-shaped curved surface structure; 310. First S-shaped curved surface;

[0036] 4. First telescopic spring rod

[0037] 5. Second spring push rod structure; 510. Second push rod; 520. Second fixed seat

[0038] 6. Second S-shaped curved surface structure

[0039] 7. Second telescopic spring rod Detailed implementation manners

[0040] To make the above objects, features, and advantages of the present application more obvious and understandable, the following will describe the detailed implementation manners of the present application in conjunction with the accompanying drawings. Many specific details are set forth in the following description to fully understand the present application. However, the present application can be implemented in many other ways different from those described herein. Those skilled in the art can make similar improvements without departing from the connotation of the present application. Therefore, the present application is not limited by the specific embodiments disclosed below.

[0041] In the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. They are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation of the present application.

[0042] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one such feature. In the description of the present application, the meaning of "a plurality" is at least two, such as two, three, etc., unless otherwise specifically defined.

[0043] In the present application, unless otherwise clearly defined and limited, the terms "installed", "connected", "connected to", "fixed", etc. should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise clearly limited. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0044] In this application, unless otherwise clearly specified and defined, the first feature being "on" or "under" the second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on top of" the second feature may mean that the first feature is directly above or obliquely above the second feature, or merely indicates that the first feature has a higher horizontal height than the second feature. The first feature being "under", "below" and "beneath" the second feature may mean that the first feature is directly below or obliquely below the second feature, or merely indicates that the first feature has a lower horizontal height than the second feature.

[0045] It should be noted that when an element is referred to as "fixed to" or "disposed on" another element, it can be directly on the other element or there may also be an intermediate element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intermediate element at the same time. The terms "vertical", "horizontal", "up", "down", "left", "right" and similar expressions used herein are for illustrative purposes only and do not represent the only implementation.

[0046] An embodiment of the present application provides a step-by-step positioning structure. Please refer to Figure 1 and Figure 2 , and the step-by-step positioning structure includes a lifting base 1, a first spring push rod structure 2, a first S-shaped curved surface structure 3, a first spring telescopic rod 4, a second spring push rod structure 5, a second S-shaped curved surface structure 6 and a second spring telescopic rod 7.

[0047] The top surface of the lifting base 1 is provided with a working surface 110 for carrying a chip. The working surface 110 is convexly provided with a first stop edge 120 and a second stop edge 130. The first stop edge 120 extends along a first horizontal direction, and the second stop edge 130 extends along a second horizontal direction. The first horizontal direction and the second horizontal direction are perpendicular. The first stop edge 120, the second stop edge 130 and the top surface of the lifting base 1 enclose a working area 140 with a right-angle corner.

[0048] The first spring push rod structure 2 penetrates and is installed on the lifting base 1 along the first horizontal direction, and the movement trend of the first spring push rod structure 2 is to move vertically towards the second edge 130 within the working area 140; the first S-shaped surface structure 3 has a first S-shaped surface 310, and the first S-shaped surface 310 always abuts against the end of the first spring push rod structure 2. During the lifting and lowering of the lifting base 1, the first S-shaped surface 310 causes the first spring push rod structure 2 to perform a reciprocating linear motion along the first horizontal direction; the first spring telescopic rod 4 is arranged on the first spring push rod structure 2, and the first spring telescopic rod 4 follows the first spring push rod structure 2 to perform a reciprocating linear motion to push and press the chip within the working area 140 against the second edge 130. In this way, even if the chip is offset due to friction with the first spring push rod structure 2 during the first push of the chip by the first spring push rod structure 2 to abut against the second edge 130, the subsequent several pushing and positioning operations of the first spring push rod structure 2 can also make the chip lean against the second edge 130 again, improving the positioning accuracy of the chip.

[0049] The second spring push rod structure 5 penetrates and is installed on the lifting base 1 along the second horizontal direction, and the movement trend of the second spring push rod structure 5 is to move vertically towards the first edge 120 within the working area 140; the second S-shaped surface structure 6 has a second S-shaped surface, and the second S-shaped surface always abuts against the end of the second spring push rod structure 5. During the lifting and lowering of the lifting base 1, the second S-shaped surface causes the second spring push rod structure 5 to perform a reciprocating linear motion along the second horizontal direction; the second spring telescopic rod 7 is arranged on the second spring push rod structure 5, and the second spring telescopic rod 7 follows the second spring push rod structure 5 to perform a reciprocating linear motion to push and press the chip within the working area 140 against the first edge 120. In this way, even if the chip is offset due to friction with the second spring push rod structure 5 during the first push of the chip by the second spring push rod structure 5 to abut against the first edge 120, the subsequent several pushing and positioning operations of the second spring push rod structure 5 can also make the chip lean against the first edge 120 again, improving the positioning accuracy of the chip.

[0050] It can be understood that in order to avoid interference between the first spring push rod structure 2 and the second spring push rod structure 5, the first spring push rod structure 2 and the second spring push rod structure 5 are arranged in a staggered manner in the vertical direction, that is, the horizontal heights of the first spring push rod structure 2 and the second spring push rod structure 5 are inconsistent.

[0051] Correspondingly, the horizontal height of the first S-shaped surface 310 corresponds to the horizontal height of the first spring push rod structure 2, and the horizontal height of the second S-shaped surface corresponds to the horizontal height of the second spring push rod structure 5, that is, the horizontal height of the first S-shaped surface 310 and the horizontal height of the second S-shaped surface are inconsistent.

[0052] It can also be understood that if the chip is square, the movement strokes of the first spring push rod structure 2 and the second spring push rod structure 5 are the same, that is, the bending changes of the first S-shaped surface 310 and the second S-shaped surface are the same; if the chip is rectangular, the movement strokes of the first spring push rod structure 2 and the second spring push rod structure 5 are different, that is, the bending changes of the first S-shaped surface 310 and the second S-shaped surface are different.

[0053] In the embodiment of the present application, the step-by-step positioning structure includes a lifting base 1, a first spring push rod structure 2, a first S-shaped surface structure 3, a first spring telescopic rod 4, a second spring push rod structure 5, a second S-shaped surface structure 6, and a second spring telescopic rod 7. The first spring push rod structure 2 and the second spring push rod structure 5 respectively penetrate the lifting base 1 along the first horizontal direction and the second horizontal direction. The first spring push rod structure 2 and the second spring push rod structure 5 respectively perform reciprocating linear motions. The first spring telescopic rod 4 on the first spring push rod structure 2 repeatedly pushes the chip to approach the second side 130, and the second spring telescopic rod 7 on the second spring push rod structure 5 repeatedly pushes the chip to approach the first side 120, realizing the multiple positioning function, making the position of the chip more accurate. The spring telescopic rod can prevent the chip from being damaged due to extrusion during the chip positioning process.

[0054] In one embodiment, please refer to Figure 1 and Figure 2 , the first spring push rod structure 2 includes a first push rod 210, a first fixed seat 220, and a first compression spring 230. The first push rod 210 is movably penetrated through the lifting base 1 along the first horizontal direction. The first fixed seat 220 is fixed on the side surface of the lifting base 1. The first fixed seat 220 and the second side 130 are respectively at opposite ends of the working area 140. The two ends of the first compression spring 230 are respectively connected to the first push rod 210 and the first fixed seat 220.

[0055] In this way, the first compression spring 230 always makes the first push rod 210 tend to be away from the first fixed seat 220, that is, makes the first push rod 210 always press against the first S-shaped surface 310. During the lifting process of the lifting base 1, the first S-shaped surface 310 cooperates with the first compression spring 230 to drive the first push rod 210 to perform reciprocating linear motion.

[0056] In one embodiment, please refer to Figure 1 and Figure 2 , a first roller 240 is provided at the end of the first push rod 210 pointing to the first S-shaped surface structure 3, so that the first push rod 210 can move smoothly on the first S-shaped surface 310.

[0057] In one embodiment, please refer to Figure 1 andFigure 2 The first spring telescopic rod 4 is disposed on the first spring push rod structure 2 in a position-adjustable manner along the first horizontal direction.

[0058] Alternatively, by adjusting the horizontal distance between the first S-shaped curved surface structure 3 and the lifting base 1, the movement stroke of the first spring telescopic rod 4 can also be adjusted.

[0059] In one embodiment, please refer to Figure 1 and Figure 2 . A first groove 150 is provided on the working surface 110 in the working area 140 along the first horizontal direction. The first spring telescopic rod 4 is located in the first groove 150, and a part of the first spring telescopic rod 4 protrudes from the working surface 110.

[0060] Specifically, the first groove 150 can guide the movement of the first spring telescopic rod 4, prevent the first spring telescopic rod 4 from shifting in position, and improve the positioning accuracy of the chip.

[0061] In one embodiment, the second spring push rod structure 5 includes a second push rod 510, a second fixed seat 520, and a second compression spring. The second push rod 510 penetrates through the lifting base 1 movably along the second horizontal direction. The second fixed seat 520 is fixed on the side surface of the lifting base 1. The second fixed seat 520 and the first stop edge 120 are respectively located at opposite ends of the working area 140. The two ends of the second compression spring are respectively connected to the second push rod 510 and the second fixed seat 520.

[0062] In one embodiment, a second roller is provided at the end of the second push rod 510 pointing to the second S-shaped curved surface structure 6.

[0063] In one embodiment, the second spring telescopic rod 7 is disposed on the second spring push rod structure 5 in a position-adjustable manner along the second horizontal direction.

[0064] In one embodiment, please refer to Figure 1 and Figure 2 . A second groove 160 is provided on the working surface 110 in the working area 140 along the second horizontal direction. The second spring telescopic rod 7 is located in the second groove 160, and a part of the second spring telescopic rod 7 protrudes from the working surface 110.

[0065] It can be understood that for the structures, functions, and working principles of the second spring push rod structure 5, the second roller, and the second groove 160, reference can be made to the above-mentioned first spring push rod, the first roller 240, and the first groove 150, and details will not be elaborated herein.

[0066] In one embodiment, the step-by-step positioning structure further includes a vacuum adsorption structure disposed in the lifting base 1, and the vacuum adsorption structure is used to adsorb the chip on the working surface 110.

[0067] The technical features of the above-described embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the various technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered to be within the scope described in this specification.

[0068] The above-described embodiments merely represent several implementation manners of the present application. The description thereof is relatively specific and detailed, but it should not be construed as a limitation to the scope of the patent application. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present application, several modifications and improvements can still be made, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application shall be subject to the appended claims.

Claims

1. A step-by-step positioning structure, characterized in that: include: A lifting base, the top surface of which is provided with a working surface for carrying chips, the working surface is convexly provided with a first rib and a second rib, the first rib extends along a first horizontal direction, the second rib extends along a second horizontal direction, the first horizontal direction is perpendicular to the second horizontal direction, the first rib, the second rib and the top surface of the lifting base enclose a working area with a right-angle corner; A first spring push rod structure is installed on the lifting base and penetrates along the first horizontal direction, and the movement trend of the first spring push rod structure is to move vertically toward the second rib in the working area; A first S-shaped curved surface structure, comprising a first S-shaped curved surface, wherein the first S-shaped curved surface is always in contact with an end of the first spring push rod structure, and during the lifting process of the lifting base, the first S-shaped curved surface causes the first spring push rod structure to perform reciprocating linear motion along the first horizontal direction; a first spring telescopic rod, disposed on the first spring push rod structure, the first spring telescopic rod follows the first spring push rod structure to perform reciprocating linear motion to push the chip in the working area to the second retaining edge; A second spring push rod structure is installed on the lifting base and penetrates along the second horizontal direction, and the movement trend of the second spring push rod structure is to move vertically toward the first rib in the working area; a second S-shaped curved surface structure, having a second S-shaped curved surface, the second S-shaped curved surface always abutting against the end of the second spring push rod structure, and during the lifting process of the lifting base, the second S-shaped curved surface causes the second spring push rod structure to perform reciprocating linear motion along the second horizontal direction; The second spring telescopic rod is arranged on the second spring push rod structure. The second spring telescopic rod follows the second spring push rod structure to perform reciprocating linear motion to push the chip in the working area to the first retaining edge.

2. The step-by-step positioning structure according to claim 1, characterized in that: The first spring push rod structure comprises: A first push rod, movably passing through the lifting base along the first horizontal direction; A first fixing seat is fixed on a side surface of the lifting base, wherein the first fixing seat and the second retaining edge are respectively located at two opposite ends of the working area; and The first compression spring has two ends connected to the first push rod and the first fixing seat respectively.

3. The step-by-step positioning structure according to claim 2, characterized in that: A first roller is disposed at the end of the first push rod pointing to the first S-shaped curved surface structure.

4. The step-by-step positioning structure according to claim 1, characterized in that: The first spring telescopic rod is arranged on the first spring push rod structure in an adjustable manner along the first horizontal direction.

5. The step-by-step positioning structure according to claim 1, characterized in that: A first groove is arranged on a working surface in the working area along the first horizontal direction, the first spring telescopic rod is located in the first groove, and a portion of the first spring telescopic rod protrudes from the working surface.

6. The step-by-step positioning structure according to claim 1, characterized in that: The second spring push rod structure comprises: A second push rod, movably passing through the lifting base along the second horizontal direction; a second fixing seat, fixed on a side surface of the lifting base, wherein the second fixing seat and the first retaining edge are respectively located at two opposite ends of the working area; and The second compression spring has two ends respectively connected to the second push rod and the second fixing seat.

7. The step-by-step positioning structure according to claim 6, characterized in that: A second roller is disposed at the end of the second push rod pointing to the second S-shaped curved surface structure.

8. The step-by-step positioning structure according to claim 1, characterized in that: The second spring telescopic rod is arranged on the second spring push rod structure in an adjustable manner along the second horizontal direction.

9. The step-by-step positioning structure according to claim 1, characterized in that: A second groove is arranged on the working surface in the working area along the second horizontal direction, the second spring telescopic rod is located in the second groove, and a part of the second spring telescopic rod protrudes from the working surface.

10. The step-by-step positioning structure according to claim 1, characterized in that: The step-by-step positioning structure further includes a vacuum adsorption structure disposed in the lifting base, and the vacuum adsorption structure is used to adsorb the chip on the working surface.

Images