Frame structure for mold pressing surface-mounted ceramic dielectric capacitor

Abstract

The utility model discloses a frame structure used for mould pressing of a surface-mounted ceramic dielectric capacitor. The frame structure comprises a substrate, substrate positioning holes and a plurality of lead modules. And the substrate positioning holes and the plurality of lead modules are respectively arranged on the substrate. According to the utility model, through the design of each structure, the multilayer ceramic dielectric capacitor is welded and fixed, and the capacity of the welded capacitor is led out at the same time. The leading-out end of the cathode frame and the leading-out end of the anode frame are bent, the bending depths are consistent, the bending angles of the anode and the cathode are 90 degrees, and the bent leading-out end of the cathode frame and the leading-out end of the anode frame are in the same plane, so that abnormal mechanical stress caused by the fact that welding points are not in the same plane when the molded surface-mounted ceramic dielectric capacitor is welded is avoided. The multilayer chip ceramic dielectric capacitor can be better borne, the service life of the molded surface-mounted ceramic dielectric capacitor is prolonged, and the reliability of the molded surface-mounted ceramic dielectric capacitor is improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of capacitors, and particularly relates to a frame structure for a molded surface-mounted ceramic capacitor. Background Art

[0002] The molded surface-mounted ceramic capacitor has the advantages of large capacitance, non-polarity, all-solid-state molded encapsulation structure, strong resistance to thermal stress and mechanical stress, high reliability, ultra-low ESR, and low dissipation power, and is widely used in various electronic devices.

[0003] The molded surface-mounted ceramic capacitor is obtained by welding a multi-layer ceramic capacitor to a lead frame in parallel or series, and then performing resin molding, lead cutting, and shaping to obtain a capacitor with an all-solid-state molded encapsulation structure, which is suitable for surface mounting. The positive and negative lead-out ends of the lead frame of the traditional molded surface-mounted ceramic capacitor are not on the same plane, resulting in uneven stress on the multi-layer ceramic capacitor during welding, abnormal mechanical stress, cracks, short lifespan, and reduced reliability. Summary of the Utility Model

[0004] To solve the above technical problems, the utility model provides a frame structure for a molded surface-mounted ceramic capacitor.

[0005] The utility model is achieved through the following technical solutions.

[0006] A frame structure for a molded surface-mounted ceramic capacitor provided by the utility model includes a substrate, substrate positioning holes, and a plurality of lead modules; the substrate positioning holes and the plurality of lead modules are respectively arranged on the substrate.

[0007] Preferably, the thickness of the substrate is 0.1 - 0.3 mm.

[0008] Preferably, the substrate is made of iron-nickel alloy, copper strip, or tin-bismuth alloy.

[0009] Preferably, the plurality of lead modules are arranged and distributed at equal intervals along the horizontal center line of the substrate.

[0010] Preferably, one lead module includes an upper positioning hole, a hollow position, a negative stress release point, a positive stress release point, a lower positioning hole, a negative frame lead-out end, and a positive frame lead-out end; the upper positioning hole is arranged at one end of the lead module, the lower positioning hole is arranged at the other end of the lead module, the hollow position is arranged between the upper positioning hole and the lower positioning hole, the negative stress release point and the positive stress release point are respectively arranged inside the hollow position, the negative stress release point is connected to the negative frame lead-out end, and the positive stress release point is connected to the positive frame lead-out end.

[0011] Preferably, the negative electrode stress release point and the positive electrode stress release point are rectangular hollow holes. The connection between the negative electrode stress release point and the negative electrode frame lead-out end is an L-shaped structure, and the connection between the positive electrode stress release point and the positive electrode frame lead-out end is an L-shaped structure.

[0012] Preferably, with the horizontal center line as the axis, the upper positioning hole and the lower positioning hole are symmetrical, the negative electrode stress release point and the positive electrode stress release point are symmetrical, and the negative electrode frame lead-out end and the positive electrode frame lead-out end are symmetrical.

[0013] Preferably, with the vertical center line formed by connecting the centers of the upper positioning hole and the lower positioning hole as the axis, the upper positioning hole and the lower positioning hole are symmetrical, the negative electrode stress release point and the positive electrode stress release point are symmetrical, and the negative electrode frame lead-out end and the positive electrode frame lead-out end are symmetrical.

[0014] Preferably, the negative electrode frame lead-out end and the positive electrode frame lead-out end are bent along the bending line respectively, and the bending angles and depths are the same.

[0015] Preferably, the bending angle of the negative electrode frame lead-out end and the positive electrode frame lead-out end is 90°.

[0016] The beneficial effects of the present utility model are as follows:

[0017] Through the design of each structure, the present utility model realizes the welding and fixing of multi-layer ceramic capacitors, and at the same time leads out the capacitance of the welded capacitors. The negative electrode frame lead-out end and the positive electrode frame lead-out end are bent, and the bending depths are the same. The bending angles of the positive and negative electrodes are both 90°. After bending, the negative electrode frame lead-out end and the positive electrode frame lead-out end of the lead frame are in the same plane, avoiding abnormal mechanical stress caused by the welding points not being in the same plane during the welding of the molded surface-mounted ceramic capacitors, better carrying the multi-layer chip ceramic capacitors, extending the service life of the molded surface-mounted ceramic capacitors, and improving the reliability of the molded surface-mounted ceramic capacitors. Description of the Drawings

[0018] Figure 1 is a schematic diagram of the frame structure provided by the embodiment of the present utility model;

[0019] Figure 2 is a schematic diagram of the frame structure after bending provided by the embodiment of the present utility model;

[0020] Figure 3 is a schematic side view of the groove structure provided by the embodiment of the present utility model.

[0021] In the figure: 1 - substrate, 2 - upper positioning hole, 3 - hollow position, 4 - negative electrode stress release point, 5 - positive electrode stress release point, 6 - lower positioning hole, 7 - negative electrode frame lead-out end, 8 - positive electrode frame lead-out end, 9 - lead module, 10 - substrate positioning hole, 11 - horizontal center line, 12 - vertical center line, 13 - bending line. Detailed implementation manners

[0022] The technical solutions of the present utility model will be further described below, but the scope of protection claimed is not limited thereto.

[0023] As Figure 1 shown, a frame structure for a molded surface-mounted ceramic capacitor includes a substrate 1, a substrate positioning hole 10, and a plurality of lead modules 9; the substrate positioning hole 10 and the plurality of lead modules 9 are respectively arranged on the substrate 1.

[0024] The thickness of the substrate 1 is 0.1 - 0.3 mm.

[0025] The substrate 1 is supported to be made of iron-nickel alloy, copper strip or tin-bismuth alloy.

[0026] A substrate material with certain hardness, processability, conductivity, and weldability can be used as the material for making the substrate 1. In this embodiment, the substrate 1 is made of tin-bismuth alloy.

[0027] The plurality of lead modules 9 are arranged and distributed at equal intervals along the horizontal center line 11 of the substrate 1.

[0028] By reasonably setting the thickness and material of the substrate 1 and the arrangement and distribution of the lead modules 9, the overall frame structure is made more stable and reliable.

[0029] One lead module 9 includes an upper positioning hole 2, a hollow position 3, a negative stress release point 4, a positive stress release point 5, a lower positioning hole 6, a negative frame lead-out end 7, and a positive frame lead-out end 8; the upper positioning hole 2 is arranged at one end of the lead module 9, the lower positioning hole 6 is arranged at the other end of the lead module 9, the hollow position 3 is arranged between the upper positioning hole 2 and the lower positioning hole 6, the negative stress release point 4 and the positive stress release point 5 are respectively arranged inside the hollow position 3, the negative stress release point 4 is connected to the negative frame lead-out end 7, and the positive stress release point 5 is connected to the positive frame lead-out end 8.

[0030] The negative frame lead-out end 7 is welded to the negative electrode of the multi-layer ceramic capacitor, and the positive frame lead-out end 8 is welded to the positive electrode of the multi-layer ceramic capacitor.

[0031] By setting the negative stress release point 4 and the positive stress release point 5, the stress influence is reduced.

[0032] The negative stress release point 4 and the positive stress release point 5 are rectangular hollow holes, the connection between the negative stress release point 4 and the negative frame lead-out end 7 is an L-shaped structure, and the connection between the positive stress release point 5 and the positive frame lead-out end 8 is an L-shaped structure.

[0033] Set as an L-shaped structure, enabling the multilayer ceramic capacitor to be welded vertically and horizontally, so that the frame structure can adapt to more models of multilayer ceramic capacitors.

[0034] Taking the horizontal center line 11 as the axis, the upper positioning hole 2 and the lower positioning hole 6 are symmetrical, the negative stress release point 4 and the positive stress release point 5 are symmetrical, and the negative frame lead-out end 7 and the positive frame lead-out end 8 are symmetrical.

[0035] Taking the vertical center line 12 formed by connecting the centers of the upper positioning hole 2 and the lower positioning hole 6 as the axis, the upper positioning hole 2 and the lower positioning hole 6 are symmetrical, the negative stress release point 4 and the positive stress release point 5 are symmetrical, and the negative frame lead-out end 7 and the positive frame lead-out end 8 are symmetrical.

[0036] After the multilayer ceramic capacitor is welded, it needs to be encapsulated and molded with epoxy resin. The symmetrical structural design enables the multilayer ceramic capacitor to be guaranteed at the center point of the epoxy resin after the encapsulation and molding are completed.

[0037] Such as Figure 2 shown, the negative frame lead-out end 7 and the positive frame lead-out end 8 are bent along the bending line 13 respectively, and the bending angles and depths are the same.

[0038] The bending depths are consistent, and the bending angles of the positive and negative poles are both 90°. After bending, the negative frame lead-out end 7 and the positive frame lead-out end 8 are on the same plane, avoiding abnormal mechanical stress suffered by the multilayer ceramic capacitor during welding due to the welding points not being on the same plane.

[0039] The bending angle of the negative frame lead-out end 7 and the positive frame lead-out end 8 is 90°.

[0040] Such as Figure 3 shown, when viewed from the side after the negative frame lead-out end 7 and the positive frame lead-out end 8 are bent, a groove shape is formed, which is convenient for welding the multilayer ceramic capacitor.

[0041] Through the design of each structure of the present utility model, the welding and fixing of the multilayer ceramic capacitor are realized, and at the same time, the capacitance of the multilayer ceramic capacitor is led out. The negative frame lead-out end 7 and the positive frame lead-out end 8 are bent, the bending depths are consistent, and the bending angles of the positive and negative poles are both 90°. After bending, the lead frame negative frame lead-out end 7 and the positive frame lead-out end 8 are on the same plane, avoiding abnormal mechanical stress suffered by the multilayer ceramic capacitor during welding due to the welding points not being on the same plane, better carrying the multilayer ceramic chip capacitor, prolonging the life of the molded surface-mount ceramic capacitor, and improving the reliability of the molded surface-mount ceramic capacitor.

Claims

1. A frame structure for molded surface mount ceramic capacitors, characterized in that: The invention comprises a substrate (1), a substrate positioning hole (10) and a plurality of lead modules (9); the substrate positioning hole (10) and the plurality of lead modules (9) are respectively arranged on the substrate (1); one of the lead modules (9) comprises an upper positioning hole (2), a hollow position (3), a negative electrode stress release point (4), a positive electrode stress release point (5), a lower positioning hole (6), a negative electrode frame lead-out terminal (7) and a positive electrode frame lead-out terminal (8); the upper positioning hole (2) is arranged at one end of the lead module (9), the lower positioning hole (6) is arranged at the other end of the lead module (9), the hollow position (3) is arranged between the upper positioning hole (2) and the lower positioning hole (6), the negative electrode stress release point (4) and the positive electrode stress release point (5) are respectively arranged inside the hollow position (3), the negative electrode stress release point (4) is connected to the negative electrode frame lead-out terminal (7), and the positive electrode stress release point (5) is connected to the positive electrode frame lead-out terminal (8).

2. The frame structure according to claim 1, characterized in that: The thickness of the substrate (1) is 0.1-0.3 mm.

3. The frame structure according to claim 1, characterized in that: The substrate (1) is made of iron-nickel alloy, copper strip or tin-bismuth alloy.

4. The frame structure according to claim 1, characterized in that: The plurality of lead modules (9) are arranged and distributed at equal intervals along a horizontal center line (11) of the substrate (1).

5. The frame structure according to claim 1, characterized in that: The negative electrode stress release point (4) and the positive electrode stress release point (5) are rectangular hollow holes, the connection between the negative electrode stress release point (4) and the negative electrode frame lead-out terminal (7) is an L-shaped structure, and the connection between the positive electrode stress release point (5) and the positive electrode frame lead-out terminal (8) is an L-shaped structure.

6. The frame structure according to claim 1, characterized in that: With the horizontal center line (11) as the axis, the upper positioning hole (2) and the lower positioning hole (6) are symmetrical, the negative electrode stress release point (4) and the positive electrode stress release point (5) are symmetrical, and the negative electrode frame lead-out terminal (7) and the positive electrode frame lead-out terminal (8) are symmetrical.

7. The frame structure according to claim 1, characterized in that: The vertical center line (12) formed by connecting the centers of the upper positioning hole (2) and the lower positioning hole (6) is used as an axis, the upper positioning hole (2) and the lower positioning hole (6) are symmetrical, the negative electrode stress release point (4) and the positive electrode stress release point (5) are symmetrical, and the negative electrode frame lead-out terminal (7) and the positive electrode frame lead-out terminal (8) are symmetrical.

8. The frame structure according to claim 1, characterized in that: The negative electrode frame lead-out terminal (7) and the positive electrode frame lead-out terminal (8) are respectively bent along a bending line (13), and the bending angles and depths are the same.

9. The frame structure according to claim 8, characterized in that: The bending angles of the negative electrode frame lead-out terminal (7) and the positive electrode frame lead-out terminal (8) are 90°.

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